CN103571267A - Printing ink with high adhesive force - Google Patents
Printing ink with high adhesive force Download PDFInfo
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- CN103571267A CN103571267A CN201210253619.4A CN201210253619A CN103571267A CN 103571267 A CN103571267 A CN 103571267A CN 201210253619 A CN201210253619 A CN 201210253619A CN 103571267 A CN103571267 A CN 103571267A
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- resin
- adhesive force
- high adhesive
- ink according
- force ink
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Abstract
The invention relates to a printing ink with high adhesive force. The printing ink comprises following ingredients, by weight, 30 to 50 parts of a base resin, 5 to 15 parts of an auxiliary resin, 0.5 to 2.0 parts of an adhesive, 0.5 to 2.0 parts of a thickening agent, and 21 to 44 parts of an organic solvent. Compared with existing products, adhesive force of the printing ink is excellent high.
Description
Technical field
The present invention relates to a kind of ink, especially relate to a kind of being coated on metallic surface, and the direct high adhesive force ink of printed electronic circuit (electronic devices and components) in coating.
Background technology
The development of electronic product is now maked rapid progress, function from strength to strength, and product is more and more less, more and more thinner, antenna is as one of important original paper of electronic product, the size of its performance and size is directly connected to the quality of electronic product, along with the miniaturization development built-in aerial of wireless communications products replaces external antenna gradually, become the main flow of Antenna Design.
For example, existing antenna for mobile phone is preparation by the following method conventionally: an utilizes flexible print wiring board (Flexible Printed Circuit Board) technique, be called for short FPCB or FPC, it is a kind of printed circuit board (PCB) with figure that utilizes flexible parent metal to make, by insulating substrate and conductive layer, formed, between insulating substrate and conductive layer, can there is binding agent, be pasted on the position that antenna need to be set.The 2nd .LDS (laser-direct-structuring) technique, is the product electroless copper again under the activation of laser machine that adopts special plastic particles injection moulding, after copper plating, then carries out nickel plating again.Three, double-shot moulding, is the fixedly pattern according to antenna, adopts bi-material: the material that can be plated and the material that can not be plated, by the laggard electroplating of dijection forming mould moulding, in the material that can be plated, by copper, plate and nickel plating formation antenna.The plastic cement material of general mobile phone is to use PC (Polycabonate), because PC material can not be by the reason of electroless plating, use can, by the ABS material of electroless plating according to the pattern of antenna, be carried out injection moulding, in ABS material, press the plating of antenna pattern copper and nickel plating, manufacture antenna.The 4th .PDS (Printing Direct Structuring) technique, is the ink that printing can be plated on the fixing pattern of antenna, by glue head pad printer, prints, and the part being printed is carried out copper plating and nickel plating again.The 5th .SPA (Silver Paste Antena) technique according to the pattern of antenna, is used conductive ink to pass through glue head pad printer and is printed on plastic casing surface, manufactures antenna.Yet electronic product is more and more thinner now, function is more and more, and the usually unfairness of place of antenna can be set, occupy a narrow space, be difficult to adopt three kinds of methods above, and existing typography exist antenna and metallic surface bonding insecure, drop to and on pcb board, cause the defects such as short circuit.
Summary of the invention
Object of the present invention is exactly in order to overcome the defect that above-mentioned prior art exists, to provide a kind of to be coated on metallic surface, and the direct high adhesive force ink of printed electronic circuit (electronic devices and components) in coating.
Object of the present invention can be achieved through the following technical solutions: a kind of high adhesive force ink, it is characterized in that, and this ink comprises the component of following weight part content:
Basic resin 30～50;
Assisted resin 5～15;
Cementing agent 0.5～2.0;
Thickening material 0.5～2.0;
Organic solvent 21～44.
Described ink comprises the component of following weight part content: basic resin 35～45; Assisted resin 8～10; Cementing agent 1～1.5; Thickening material 1～1.5; Organic solvent 30～40.
Described basic resin comprises acrylic resin, Synolac or polyester acrylate resin.
Described assisted resin comprises isocyanate resin, aminoresin or benzoguanamine formaldehyde resin.
Described cementing agent is commercially available prod, can be any commercially available cementing agent, as selected Korea S ENE Technology Co., and the cementing agent that Ltd produces.
Described thickening material is commercially available thickening material, can select water-based thickener of Guangzhou Si Huote Chemical Co., Ltd. production etc.
Described organic solvent comprises aromatic hydrocarbon solvent, acetic acid or ketone,
Described aromatic hydrocarbon solvent comprises benzene,toluene,xylene, propyl benzene or isopropyl benzene.
Above-mentioned ink can make by conventional method.Can adopt following methods, be equipped with in proportion raw material, then each raw material be mixed, after high-speed stirring is fully mixed, grind and make fineness reach requirement.
Compared with prior art, ink adaptability of the present invention is good, can under different seasons, humidity, temperature condition, obtain more consistent printing effect, and printing effect is also fairly good; The binding property of ink of the present invention and various materials is all better, and can become reconciled with antenna material bonding, antenna can be bonded on metallic surface securely, be difficult for occurring antenna and drop, cause the phenomenon of short circuit.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in detail.
Embodiment 1
An ink, this ink comprises the component of following weight part content: basic resin acrylic resin (Acryl resin) 30; Assisted resin isocyanate resin (Isocyanate resin) 5; Cementing agent 0.5; Thickening material 0.5; Organic solvent-benzene 21.
Above-mentioned ink can make by conventional method.Can adopt following methods, be equipped with according to the above ratio raw material, then each raw material be mixed, after high-speed stirring is fully mixed, grinding makes fineness reach 15um and obtains below product.
Gained ink can be coated on metallic surface, and direct printed electronic circuit (electronic devices and components) in coating, as by gained ink coats in mobile phone frame, printed antenna etc. in coating then.
Embodiment 2
An ink, this ink comprises the component of following weight part content: basic resin acrylic resin (Acryl resin) 50; Assisted resin isocyanate resin (Isocyanate resin) 15; Cementing agent 2.0; Thickening material 2.0; Organic solvent dimethylbenzene 21.
Above-mentioned ink can make by conventional method.Can adopt following methods, be equipped with according to the above ratio raw material, then each raw material be mixed, after high-speed stirring is fully mixed, grinding makes fineness reach 15um and obtains below product.
Embodiment 3
An ink, this ink comprises the component of following weight part content: basic resin Synolac (Alkyd resin) 35; Assisted resin aminoresin (Amino resin) 8; Cementing agent 1; Thickening material 1; Organic solvent acetic acid 30.
Above-mentioned ink can make by conventional method.Can adopt following methods, be equipped with according to the above ratio raw material, then each raw material be mixed, after high-speed stirring is fully mixed, grinding makes fineness reach 15um and obtains below product.
Embodiment 4
An ink, this ink comprises the component of following weight part content: basic resin polyester acrylate resin (Polyester Resin) 45; Assisted resin benzoguanamine formaldehyde resin (Benzoguanamine resin) 10; Cementing agent 1.5; Thickening material 1.5; Organic solvent ketone 40.
Above-mentioned ink can make by conventional method.Can adopt following methods, be equipped with according to the above ratio raw material, then each raw material be mixed, after high-speed stirring is fully mixed, grinding makes fineness reach 15um and obtains below product.
Claims (8)
1. a high adhesive force ink, is characterized in that, this ink comprises the component of following weight part content:
Basic resin 30～50;
Assisted resin 5～15;
Cementing agent 0.5～2.0;
Thickening material 0.5～2.0;
Organic solvent 21～44.
2. a kind of high adhesive force ink according to claim 1, is characterized in that, described ink comprises the component of following weight part content: basic resin 35～45; Assisted resin 8～10; Cementing agent 1～1.5; Thickening material 1～1.5; Organic solvent 30～40.
3. a kind of high adhesive force ink according to claim 1, is characterized in that, described basic resin comprises acrylic resin, Synolac or polyester acrylate resin.
4. a kind of high adhesive force ink according to claim 1, is characterized in that, described assisted resin comprises isocyanate resin, aminoresin or benzoguanamine formaldehyde resin.
5. a kind of high adhesive force ink according to claim 1, is characterized in that, described cementing agent is commercially available cementing agent.
6. a kind of high adhesive force ink according to claim 1, is characterized in that, described thickening material is commercially available thickening material.
7. a kind of high adhesive force ink according to claim 1, is characterized in that, described organic solvent comprises aromatic hydrocarbon solvent, acetic acid or ketone,
8. a kind of high adhesive force ink according to claim 7, is characterized in that, described aromatic hydrocarbon solvent comprises benzene,toluene,xylene, propyl benzene or isopropyl benzene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210253619.4A CN103571267A (en) | 2012-07-20 | 2012-07-20 | Printing ink with high adhesive force |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210253619.4A CN103571267A (en) | 2012-07-20 | 2012-07-20 | Printing ink with high adhesive force |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103571267A true CN103571267A (en) | 2014-02-12 |
Family
ID=50044009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210253619.4A Pending CN103571267A (en) | 2012-07-20 | 2012-07-20 | Printing ink with high adhesive force |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103571267A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105176183A (en) * | 2015-09-17 | 2015-12-23 | 苏州市鼎立包装有限公司 | Ink for metal packaging containers and preparation method thereof |
| CN106459628A (en) * | 2015-08-28 | 2017-02-22 | 刘志忠 | Plastic waterborne gravure ink and preparation method thereof |
| CN108047815A (en) * | 2018-01-26 | 2018-05-18 | 深圳市美丽华科技股份有限公司 | A kind of ink for screen printing and preparation method thereof |
| CN108574139A (en) * | 2017-03-13 | 2018-09-25 | 上海德门电子科技有限公司 | Antenna made of antenna manufacturing method and use this method based on PDS techniques |
| CN109021704A (en) * | 2018-05-25 | 2018-12-18 | 安徽猛牛彩印包装有限公司 | A kind of printing ink for the fluorescence falsification preventing performance that adhesive force is strong |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102453379A (en) * | 2010-10-22 | 2012-05-16 | 深圳市汉龙科技开发有限公司 | Water-soluble thermosetting silicone acrylic resin silk-screen printing ink and preparation method thereof |
-
2012
- 2012-07-20 CN CN201210253619.4A patent/CN103571267A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102453379A (en) * | 2010-10-22 | 2012-05-16 | 深圳市汉龙科技开发有限公司 | Water-soluble thermosetting silicone acrylic resin silk-screen printing ink and preparation method thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106459628A (en) * | 2015-08-28 | 2017-02-22 | 刘志忠 | Plastic waterborne gravure ink and preparation method thereof |
| WO2017035693A1 (en) * | 2015-08-28 | 2017-03-09 | 刘志忠 | Plastic aqueous gravure ink and preparation method therefor |
| CN105176183A (en) * | 2015-09-17 | 2015-12-23 | 苏州市鼎立包装有限公司 | Ink for metal packaging containers and preparation method thereof |
| CN108574139A (en) * | 2017-03-13 | 2018-09-25 | 上海德门电子科技有限公司 | Antenna made of antenna manufacturing method and use this method based on PDS techniques |
| CN108047815A (en) * | 2018-01-26 | 2018-05-18 | 深圳市美丽华科技股份有限公司 | A kind of ink for screen printing and preparation method thereof |
| CN109021704A (en) * | 2018-05-25 | 2018-12-18 | 安徽猛牛彩印包装有限公司 | A kind of printing ink for the fluorescence falsification preventing performance that adhesive force is strong |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140212 |