CN201571254U - Metal coating film covering film for printed circuit board - Google Patents
Metal coating film covering film for printed circuit board Download PDFInfo
- Publication number
- CN201571254U CN201571254U CN2009201343588U CN200920134358U CN201571254U CN 201571254 U CN201571254 U CN 201571254U CN 2009201343588 U CN2009201343588 U CN 2009201343588U CN 200920134358 U CN200920134358 U CN 200920134358U CN 201571254 U CN201571254 U CN 201571254U
- Authority
- CN
- China
- Prior art keywords
- metal coating
- circuit board
- coverlay
- printed circuit
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
- F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model relates to a metal coating film covering film for a printed circuit board, which comprises a metal coating film layer (1), an insulation film layer (2), an adhesive layer (3) and release paper (4), wherein one side of the insulation film layer (2) is plated with the metal coating film layer (1), and the other side of the insulation film layer (2), which is opposite to the side of the insulation film layer (2) plated with the metal coating film layer (1), is coated with the adhesive layer (3) which is combined with the release paper (4). The metal coating film covering film of the utility model can greatly improve glossness and anti-electromagnetic interference of the printed circuit board, and at the same time, has the functions of reflection and intensifying to a lighting circuit substrate. The utility model also relates to the printed circuit board coated with the metal coating film covering film, and an LED rope light with the printed circuit board.
Description
Technical field
The utility model relates to printed substrate.Particularly, the utility model relates to and has heat dispersion preferably, and has good electromagnetic wave shielding and illuminating lamp is had the metal coating coverlay (coverlay) of reflection light enhancing effect.
Background technology
The employed coverlay of traditional printed circuit board (PCB) generally is to adopt nonmetallic polyimides or polyester film coating thermosetting type adhesion agent; Make by enclosing release liners after the dry out solvent, employed thermosetting type adhesion agent is generally acrylic compounds or epoxies.Traditional coverlay generally uses on flexible circuit board, plays protection circuit and anti-welding function.
Traditional wiring board welding resistance mode is except with the coverlay, and the most generally the mode of Cai Yonging is to use welding resistance printing ink.No matter be coverlay or welding resistance printing ink, use in the process of wiring board, all be that optionally covering protection is lived circuit, and expose solder joint.
It is nonmetal that these two kinds of protected modes make it be all on the surface that the finished product wiring board shows, and generally the online road surfaces of the nonmetallic materials of this type does not possess good heat-sinking capability and anti-electromagnetic interference capability; Do not possess the reflection enhanced shine that the metal surface can possess yet.The circuit board of traditional subsides thin-film against electromagnetic interference also is after the circuit board solder mask completes; Local surfaces at solder mask is sticked one deck electromagnetic membrane again; This type also only is confined to local anti-electromagnetic-radiation, and the cost height, and heat dispersion is poor; Do not possess good heat sinking function and reflection function; And efficient is low.
Therefore, in the art, need to overcome the metal coating coverlay that is used for printed circuit board (PCB) of above defective.
Summary of the invention
According to the utility model, the metal coating welding resistance coverlay and the manufacturing technology thereof of the wiring board that a kind of follow-on surface is provided is metal covering.This type of metal coating coverlay overcome above-mentioned prior art nonmetal welding resistance the heat sinking function that can't realize and the function of anti-electromagnetic interference, the reflection light enhancing effect that this metal coating coverlay of while also has its uniqueness is very suitable for the lamplight brightness that opto-electronics increases the LED photovoltaic.This metal coating coverlay not only can use on flexible board, is applicable to the traditional welding resistance printing ink of replacement on the rigid plate too.
According to the utility model, a kind of metal coating coverlay that is used for printed circuit board (PCB) is provided, comprise metal-plated rete, insulating thin layer, adhesive layer and release liners, wherein, side at described insulating thin layer plates described metal-plated rete, opposite opposite side at described insulating thin layer is covered with described adhesive layer, and is laminated with described release liners on described adhesive layer.
According on the other hand of the present utility model, the thickness of described metal-plated rete is the 1-10 micron.
According on the other hand of the present utility model, the material of described metal-plated rete is selected from aluminium, silver, copper, zinc, chromium or its combination in any, perhaps other metal or metal alloy.
According on the other hand of the present utility model, described insulating thin layer is polyimide film or polyester film.
According on the other hand of the present utility model, described adhesive layer is the hot-setting adhesive binding agent.
According on the other hand of the present utility model, described metal-plated rete is plated on the described insulating thin layer by evaporation.
According on the other hand of the present utility model, the thickness of described insulating thin layer is the 12.5-35 micron.
The utility model also provides a kind of printed circuit board (PCB), is coated with on described printed circuit board (PCB) according to as above each described metal coating coverlay of the present utility model.
The utility model also provides a kind of LED lamp band, comprises aforesaid printed circuit board (PCB) and is installed in one or more LED on the described printed circuit board (PCB).
According on the other hand of the present utility model, chromium plating on described insulation film.The purpose of chromium plating and the effect that is realized are to have strengthened anticorrosive property and increased reflecting effect.
According to another one execution mode of the present utility model, adopt behind metallic film on the high temperature deposition on the insulation film, the insulation film another side applies the heat curing-type dielectric adhesive, and dry out solvent is laminated with release film and has promptly made the metal coating coverlay.This metal coating coverlay can get out the element window by die punching or drilling machine, and hot pressing replaces conventional solder mask hot pressing to wiring board to wiring board.
This metal coating coverlay can improve the thermal diffusivity and the anti-electromagnetic interference capability of wiring board significantly.Have for the lighting circuit substrate simultaneously and reflect enhanced shine preferably.
Description of drawings
Fig. 1 has shown the base material as plated film and adhesive stripe-coating;
Fig. 2 has shown through behind the high temperature deposition, the structure of evaporation last layer metallic diaphragm on insulating thin layer;
Fig. 3 has shown that the insulation film opposite side of metal film on evaporation is coated with the structure that applies binding agent;
Fig. 4 has shown release liners 4 has been laminated with structure on the glue face.
Embodiment
To come the utility model is described in detail with some concrete manufacture methods of metal coating coverlay below in conjunction with accompanying drawing.It will be appreciated by those skilled in the art that the following stated only is to illustrate and describe some embodiments, to scope of the present utility model, especially the scope of claim does not have any restriction.
Fig. 1 has shown the insulating thin layer 2 as the base material of plated film and adhesive stripe-coating, and its material for example is the dielectric polyimide film.But, it will be understood by those skilled in the art that and adopt other material of this area also to be fine.Fig. 2 has shown the structure by evaporation coating technique evaporation last layer metallic diaphragm 1 on insulating thin layer 2.Fig. 3 has shown that the opposite opposite side of the insulation film 2 of metal film 1 on evaporation is coated with the structure that applies binding agent 3 (or adhesive).Fig. 4 has shown release liners 4 has been laminated with structure on adhesive layer 3.
Concrete manufacture method is described below.
1, metal evaporation
Polyimide insulative film 2 is positioned in the vacuum chamber metal of film to be formed, for example aluminium in the heating evaporation container, its atom or molecule are overflowed from the surface gasification, form vapor stream, incide the surface of polyimide insulative film 2, condensing forms the solid metallic aluminium film 1 of 1-10 micron.Because this process is the known traditional vapor-deposited film technologies of evaporation those skilled in the art, just no longer carefully state at this.
Fig. 1 has shown the aluminium film as evaporation on the insulation film of metal coating coverlay, and still, obviously, metal coating also can be selected from silver, copper, zinc or it makes up or alloy arbitrarily, perhaps other metal or metal alloy.And, but on the metal coating coverlay alloy of chromium plating or chromium also, to strengthen anticorrosive property and to increase reflecting effect.
2, coating binding agent
For example, it with the thickness of rolling the metal coating base material 2 of metal (as aluminium) on the evaporation of 12.5-35 micron, adopt the GF600-1000 type coating machine (this coating machine has the function of oven dry) of south of the River machinery, speed with 2-5m/min, bake out temperature is 75-100 degree centigrade, for example on its another side opposite with that face of evaporation metal equably in the coating thickness be preferably the flexible insulation adhesive 3 of OA-2013 type heat curing-type of development voluntarily of 15-45 micron, after treating the volatilization fully of binding agent solvent drying, obtain structure as shown in Figure 3.
Certainly, it will be appreciated by those skilled in the art that, the heat curing-type flexible adhesive that uses in the utility model only illustrates, but also can adopt the adhesive that can realize this purpose of any other type, also is not limited to the flexible adhesive of heat curing-type.For example, can adopt at any adhesive described in the summary of the invention part, perhaps any other adhesive of habitually practising in this area.
3, be laminated with release liners
With thickness is the release liners 4 of 0.1mm-0.2mm, make release glue face of release liners 4, on new grand beneficial FM-840 laminating machine, with the pressure of 1.5MPa towards adhesive layer 3, the speed of 10m/min overlays on the glue face of adhesive layer 3 of metal coating coverlay as shown in Figure 3.Promptly made metal coating coverlay of the present utility model (for example as shown in Figure 4).
Claims (9)
1. metal coating coverlay that is used for printed circuit board (PCB), comprise metal-plated rete (1), insulating thin layer (2), adhesive layer (3) and release liners (4), wherein, side at described insulating thin layer (2) plates described metal-plated rete (1), opposite opposite side at described insulating thin layer (2) is covered with described adhesive layer (3), and is laminated with described release liners (4) on described adhesive layer (3).
2. metal coating coverlay according to claim 1 is characterized in that, the thickness of described metal-plated rete (1) is the 1-10 micron.
3. according to each described metal coating coverlay among the claim 1-2, it is characterized in that the material of described metal-plated rete is selected from aluminium, silver, copper, zinc, chromium or its combination in any, perhaps other metal or metal alloy.
4. according to each described metal coating coverlay among the claim 1-2, it is characterized in that described insulating thin layer is polyimide film or polyester film.
5. according to each described metal coating coverlay among the claim 1-2, it is characterized in that described adhesive layer (3) is the hot-setting adhesive binding agent.
6. according to each described metal coating coverlay among the claim 1-2, it is characterized in that described metal-plated rete (1) is plated on the described insulating thin layer (2) by evaporation.
7. according to each described metal coating coverlay among the claim 1-2, it is characterized in that the thickness of described insulating thin layer is the 12.5-35 micron.
8. a printed circuit board (PCB) is coated with on described printed circuit board (PCB) according to each described metal coating coverlay among the claim 1-7.
9. LED lamp band comprises printed circuit board (PCB) as claimed in claim 8 and is installed in one or more LED on the described printed circuit board (PCB).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201343588U CN201571254U (en) | 2009-07-31 | 2009-07-31 | Metal coating film covering film for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201343588U CN201571254U (en) | 2009-07-31 | 2009-07-31 | Metal coating film covering film for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201571254U true CN201571254U (en) | 2010-09-01 |
Family
ID=42663552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201343588U Expired - Lifetime CN201571254U (en) | 2009-07-31 | 2009-07-31 | Metal coating film covering film for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201571254U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103200771A (en) * | 2012-01-05 | 2013-07-10 | 松扬电子材料(昆山)有限公司 | Non-glue single face copper clad laminate with bonding function and manufacturing method thereof |
| CN105757537A (en) * | 2016-03-25 | 2016-07-13 | 京东方科技集团股份有限公司 | Backlight module and display device |
| CN107592744A (en) * | 2017-09-15 | 2018-01-16 | 赣州明高科技股份有限公司 | A kind of FPC flexible PCBs coating process |
| CN110628354A (en) * | 2019-10-16 | 2019-12-31 | 深圳市弘海电子材料技术有限公司 | High-light-reflection cover film and manufacturing method thereof |
| US10520664B2 (en) | 2016-03-25 | 2019-12-31 | Boe Technology Group Co., Ltd. | Backlight module and display device |
| CN110699003A (en) * | 2019-10-16 | 2020-01-17 | 深圳市弘海电子材料技术有限公司 | High-light-reflection cover film and manufacturing method thereof |
| CN111076108A (en) * | 2019-09-06 | 2020-04-28 | 深圳科诺桥科技股份有限公司 | Light reflecting structure and preparation method thereof |
-
2009
- 2009-07-31 CN CN2009201343588U patent/CN201571254U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103200771A (en) * | 2012-01-05 | 2013-07-10 | 松扬电子材料(昆山)有限公司 | Non-glue single face copper clad laminate with bonding function and manufacturing method thereof |
| CN103200771B (en) * | 2012-01-05 | 2016-12-14 | 松扬电子材料(昆山)有限公司 | There is glue-free single sided copper clad substrate and the manufacture method thereof of paste functionality |
| CN105757537A (en) * | 2016-03-25 | 2016-07-13 | 京东方科技集团股份有限公司 | Backlight module and display device |
| US10234124B2 (en) | 2016-03-25 | 2019-03-19 | Boe Technology Group Co., Ltd. | Backlight module and display device |
| US10520664B2 (en) | 2016-03-25 | 2019-12-31 | Boe Technology Group Co., Ltd. | Backlight module and display device |
| CN107592744A (en) * | 2017-09-15 | 2018-01-16 | 赣州明高科技股份有限公司 | A kind of FPC flexible PCBs coating process |
| CN111076108A (en) * | 2019-09-06 | 2020-04-28 | 深圳科诺桥科技股份有限公司 | Light reflecting structure and preparation method thereof |
| CN110628354A (en) * | 2019-10-16 | 2019-12-31 | 深圳市弘海电子材料技术有限公司 | High-light-reflection cover film and manufacturing method thereof |
| CN110699003A (en) * | 2019-10-16 | 2020-01-17 | 深圳市弘海电子材料技术有限公司 | High-light-reflection cover film and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201571254U (en) | Metal coating film covering film for printed circuit board | |
| CN101448362B (en) | Ultra-thin shielding film and circuit board capable of changing circuit impedance, and method for preparing same | |
| PH12015500087A1 (en) | Halo-hydrocarbon polymer coating | |
| CN202697035U (en) | LED circuit board with conducting adhesive lines, and LED lamp band | |
| CN105246313B (en) | A kind of electromagnetic shielding film, the preparation method containing the printed wiring board of the screened film and the wiring board | |
| CN102711428A (en) | Ultrathin shielding film with high shielding efficiency and production method thereof | |
| CN201491371U (en) | Metal base cover layer used for printed circuit board | |
| CN101699931B (en) | Method for manufacturing high-heat conduction ceramic circuit board | |
| JP2020510985A (en) | Electromagnetic wave shielding film, its manufacturing method and application | |
| CN103668094A (en) | Method for making five-layer flexible non-glued double-sided copper clad by adopting sputtering process | |
| CN202262031U (en) | Heat dissipation type led flexible circuit board | |
| CN103237410A (en) | Non-etched aluminum substrate and manufacturing method thereof | |
| CN203072249U (en) | Aluminum substrate used for mounting LED lamps | |
| JPH0153632B2 (en) | ||
| CN108834337A (en) | A kind of production method and PCB of PCB | |
| CN202773173U (en) | Cover film having advantages of thermal conductivity and electromagnetic shielding | |
| CN201332571Y (en) | Super-thin screened film capable of changing circuit impedance and circuit board | |
| KR20140082599A (en) | Method for manufacturing metal printed circuit board | |
| CN200994224Y (en) | Printed circuit board medium structure | |
| CN102612254A (en) | Heat radiation type LED (Light-Emitting Diode) flexible circuit board | |
| CN208509359U (en) | A kind of thermally conductive double-layer circuit board | |
| CN203912306U (en) | Laminating protective ink for circuit board | |
| CN206164973U (en) | Use thermosetting green oil's resistant flexible circuit board who buckles | |
| CN201501140U (en) | Prepreg with resin beds of asymmetric thicknesses | |
| CN110300489A (en) | A kind of thermally conductive double-layer circuit board and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100901 |
|
| CX01 | Expiry of patent term |