CN111076108A - Light reflecting structure and preparation method thereof - Google Patents
Light reflecting structure and preparation method thereof Download PDFInfo
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- CN111076108A CN111076108A CN201911100175.9A CN201911100175A CN111076108A CN 111076108 A CN111076108 A CN 111076108A CN 201911100175 A CN201911100175 A CN 201911100175A CN 111076108 A CN111076108 A CN 111076108A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
- F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
- F21V7/28—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Optical Elements Other Than Lenses (AREA)
Abstract
The invention discloses a preparation method of a light-reflecting structure, which comprises the following steps: providing an insulating layer and a hot melt adhesive, and coating the hot melt adhesive on one surface of the insulating layer; forming a metal reflective layer on the other surface of the insulating layer; and providing an anti-oxidation liquid, coating the anti-oxidation liquid on the surface of the metal reflecting layer far away from the insulating layer, and curing to form an anti-oxidation layer. The present invention also provides a light reflecting structure comprising: the metal reflecting layer is used for reflecting light; the anti-oxidation layer with high light transmittance is formed on one surface of the metal reflecting layer; the insulating layer is arranged on the other surface of the metal reflecting layer and is used for insulating the metal reflecting layer; and the adhesive layer is arranged on one surface of the insulating layer, which is far away from the metal reflecting layer. The light reflecting structure and the preparation method provided by the invention have the advantages of bending resistance, good reflecting effect and long service life.
Description
Technical Field
The invention relates to the technical field of LED lamp belts, in particular to a light reflecting structure and a preparation method thereof.
Background
The LED lamp strip is obtained by assembling LEDs on a strip-shaped flexible circuit board, and the LED lamp strip requires that the surface of the flexible circuit board has a certain reflection effect to meet the requirements of the attached LEDs on being brighter and more energy-saving, so that white ink is required to be printed on the surface of the circuit board when the flexible circuit board of the LED lamp strip is manufactured, and the LED lamp strip achieves a certain reflection effect. However, when the LED is heated in a working state, the white ink gradually turns yellow to affect the reflection effect, and the white oil film has poor bending resistance and is easy to break.
The chinese patent application No. 201510246224.5 discloses a method for manufacturing a reflective and heat-conductive metal PCB, which comprises forming an oxidation-preventing layer on the reflective surface of a reflective metal substrate, attaching a heat-conductive non-light-absorbing insulating layer, and forming a printed circuit on the insulating layer. The problem that the reflectivity is influenced by yellowing of white ink is solved by utilizing the light reflection of the metal substrate, but the reflected light can be reflected back only by passing through the anti-oxidation layer and the insulating layer. Resulting in a limited actual reflection effect and a high transmittance insulating layer further increasing the manufacturing cost.
Disclosure of Invention
The invention aims to provide a light reflecting structure and a preparation method thereof, which are resistant to bending, good in reflection effect and long in service life.
The invention discloses a reflective structure and a preparation method thereof, which adopt the technical scheme that:
a method of making a light reflecting structure comprising the steps of: (1) providing an insulating layer and a hot melt adhesive, and coating the hot melt adhesive on one surface of the insulating layer; (2) forming a metal reflective layer on the other surface of the insulating layer; (3) and providing an anti-oxidation liquid, coating the anti-oxidation liquid on the surface of the metal reflecting layer far away from the insulating layer, and curing to form an anti-oxidation layer.
Preferably, in the step (1), after the hot melt adhesive is coated on one surface of the insulating layer, a protective film is covered on the hot melt adhesive to protect the hot melt adhesive from being polluted.
Preferably, in the step (2), the metal reflective layer is obtained by a metal ion sputtering process.
Preferably, the material of the metal reflecting layer is one or more of nickel, chromium, aluminum, silver, copper, SiO2, stainless steel, ITO, tin, and nickel alloy, chromium alloy, aluminum alloy, silver alloy, copper alloy, and tin alloy.
Preferably, the hot melt adhesive comprises the following components: 30-45% of semi-finished product 1, 10-20% of semi-finished product 2, 10-20% of semi-finished product 3, 0.05-0.1% of semi-finished product 4, 1-0.5% of semi-finished product 5, 1-0.5% of semi-finished product 6, 25-40% of semi-finished product 7 and 10-35% of diluent; wherein the semi-finished product 1 comprises 10-30% of rubber and 70-90% of diluent by mass; the semi-finished product 2 comprises 40-50% of the semi-finished product 1, 20-30% of the flame retardant and 20-40% of the diluent by mass; the semi-finished product 3 comprises 20-40% of curing agent and 60-80% of diluent by mass; the semi-finished product 4 comprises 10-20% of semi-finished product 1, 40-60% of ion capture agent and 20-50% of diluent; the semi-finished product 5 comprises 20-40% of antioxidant and 60-80% of diluent by mass; the semi-finished product 6 comprises 20-30% of accelerator and 70-80% of diluent by mass; the semi-finished product 7 comprises 40-60% of resin and 40-60% of diluent by mass fraction.
Preferably, the preparation of the hot melt adhesive comprises the following steps: providing a rubber component, a flame retardant component, a curing agent component, an ion scavenger component, an antioxidant component, an accelerator component and a resin component, and mixing to obtain a mixed solution; dispersing and emulsifying the mixed solution by using a high-speed dispersion machine; and filtering the dispersed and emulsified mixed solution by using a filter screen to obtain the hot melt adhesive.
Preferably, in the step of dispersing and emulsifying the mixed solution by using a high-speed dispersing machine, the rotating speed of the high-speed dispersing machine is 800-; and in the step of filtering the dispersed and emulsified mixed solution by using a filter screen, the particle size of the hot melt adhesive colloidal particles filtered by the filter screen is not less than 5-10 microns.
Preferably, the oxidation preventing layer comprises the following components: 60-70% of 1-methoxy-2-propanol, 10-20% of silicon dioxide, 10-20% of acrylate monomer, 5-15% of acrylate polymer and 1-5% of photoinitiator; the preparation process of the anti-oxidation layer comprises the following steps: providing 1-methoxy-2-propanol, silicon dioxide, an acrylate monomer, an acrylate polymer and a photoinitiator, mixing and stirring for 2-5 h, and then standing or vacuumizing for 1h to obtain an anti-oxidation liquid; and (3) uniformly coating the anti-oxidation liquid on the metal reflecting layer, and curing by using a yellow light lamp to obtain the anti-oxidation layer.
The invention also discloses a reflective structure, which is attached to the base material of the flexible circuit board and comprises: the metal reflecting layer is used for reflecting light rays emitted by the LED; the anti-oxidation layer is arranged on one surface of the metal reflecting layer, has high light transmittance and is used for protecting the metal reflecting layer from being oxidized; the insulating layer is arranged on the other surface opposite to the metal reflecting layer and is used for insulating the metal reflecting layer; and the adhesive layer is arranged on one surface of the insulating layer, which is far away from the metal reflecting layer.
Preferably, the hot melt adhesive further comprises a protective film, and the protective film is covered on the hot melt adhesive to protect the hot melt adhesive from being polluted.
The light-reflecting structure and the preparation method disclosed by the invention have the beneficial effects that: the light emitted by the LED passes through the anti-oxidation layer and is reflected by the metal reflecting layer, and the reflected light passes through the anti-oxidation layer and is emitted out, so that the reflectivity is high; the metal reflecting layer is protected by the anti-oxidation layer and is not oxidized, so that the reflecting effect is not reduced due to long-term use, and the service life is long; and the metal reflecting layer has better bending resistance and can better adapt to the flexible circuit board.
Drawings
Fig. 1 is a schematic structural view of a light reflecting structure of the present invention.
Detailed Description
The invention will be further elucidated and described with reference to the embodiments and drawings of the specification:
referring to fig. 1, a reflective structure attached to a substrate of a flexible printed circuit board includes a metal reflective layer 20, an anti-oxidation layer 10, an insulating layer 30, an adhesive layer 40, and a protective film 50.
The metal reflective layer 20 serves to reflect light emitted from the LED. The material of the metal reflective layer 20 is one or more of nickel, chromium, aluminum, silver, copper, SiO2, stainless steel, tin, and nickel alloy, chromium alloy, aluminum alloy, silver alloy, copper alloy, and tin alloy.
The material of the metal reflecting layer 20 can also be SiO2 or ITO, wherein SiO2 is generated by injecting oxygen into a silicon target, the bonding force problem can be mainly improved, and the ITO can reflect.
The oxidation preventing layer 10 is provided on one surface of the metal reflective layer 20, has a high light transmittance, and is used to protect the metal reflective layer 20 from being oxidized. The thickness of the oxidation preventing layer 10 is preferably 5-25um to prevent the metal reflecting layer 20 from being oxidized while securing the light transmittance of the oxidation preventing layer 10, and the thickness is easier for the coating work. In this embodiment, the oxidation preventing layer 10 includes the following components: 60-70% of 1-methoxy-2-propanol, 10-20% of silicon dioxide, 10-20% of acrylate monomer, 5-15% of acrylate polymer and 1-5% of photoinitiator. The process comprises mixing the above components to obtain an anti-oxidation liquid, coating the anti-oxidation liquid on the metal reflecting layer 20, and curing with a yellow light lamp to obtain the anti-oxidation layer 20.
The insulating layer 30 is provided on the other side of the metal reflective layer 20 opposite to the metal reflective layer 20 to insulate the metal reflective layer 20. The material of the insulating layer 30 is preferably one or more of PI, PET, PEN, PA, PP.
The glue layer 40 is disposed on a side of the insulating layer 30 away from the metal reflective layer 20 for providing a force for adhering the reflective structure to the substrate. The adhesive layer 40 is a hot melt adhesive.
The protective film 50 covers the adhesive layer 40 to protect the adhesive layer 40 from contamination, and before use, the protective film 50 needs to be removed, and then the adhesive layer 40 is attached to the substrate.
According to the light reflecting structure disclosed by the invention, light rays emitted by the LED are reflected by the metal reflecting layer 20, and the metal reflecting layer 20 is protected by the anti-oxidation layer 10 and is not oxidized, so that the reflecting effect cannot be reduced due to long-term use, and the service life is long; and the metal reflecting layer 20 has better bending resistance and can better adapt to the flexible circuit board.
The invention also provides a preparation method of the light-reflecting structure, which comprises the following steps:
(1) providing an insulating layer 30 and a hot melt adhesive, and coating the hot melt adhesive on one surface of the insulating layer 30 to obtain an adhesive layer 40. Preferably, a protective film 50 is applied over the glue layer 40 to protect the hot melt glue from contamination.
The hot melt adhesive comprises the following components: 30-45% of semi-finished product 1, 10-20% of semi-finished product 2, 10-20% of semi-finished product 3, 0.05-0.1% of semi-finished product 4, 1-0.5% of semi-finished product 5, 1-0.5% of semi-finished product 6, 25-40% of semi-finished product 7 and 10-35% of diluent.
Wherein the semi-finished product 1 comprises 10-30% of rubber and 70-90% of diluent by mass fraction. The rubber is 1072cgj or 1072cgx, and the diluent is MEK or mcs. The semi-finished product 2 comprises 40-50% of the semi-finished product 1, 20-30% of flame retardant and 20-40% of diluent, wherein the flame retardant is OP935, A42M or 101 HRT. The semi-finished product 3 comprises 20-40% of curing agent and 60-80% of diluent by mass. DDS is selected as the curing agent. The semi-finished product 4 comprises 10-20% of the semi-finished product 1, 40-60% of the ion scavenger and 20-50% of the diluent. The ion scavenger is IXE-100. The semi-finished product 5 comprises 20-40% of antioxidant and 60-80% of diluent by mass fraction. The semi-finished product 6 comprises 20-30% of accelerator and 70-80% of diluent by mass. The semi-finished product 7 comprises 40-60% of resin and 40-60% of diluent by mass fraction. The resin is 901 or 128.
The preparation of the hot melt adhesive comprises the following steps:
providing rubber, a flame retardant, a curing agent, an ion capturing agent, an antioxidant, an accelerator, resin and a diluent, and mixing the rubber, the flame retardant, the curing agent, the ion capturing agent, the antioxidant, the accelerator, the resin and the diluent according to a preset ratio to obtain a semi-finished product 1, a semi-finished product 2, a semi-finished product 3, a semi-finished product 4, a semi-finished product 5, a semi-finished product 6 and;
and mixing the semi-finished product 1, the semi-finished product 2, the semi-finished product 3, the semi-finished product 4, the semi-finished product 5, the semi-finished product 6, the semi-finished product 7 and a diluent to obtain a mixed solution.
The mixed solution is dispersed and emulsified by a high-speed dispersion machine. Preferably, the high-speed dispersion machine rotates at the speed of 800-.
And filtering the dispersed and emulsified mixed solution by using a filter screen to obtain the hot melt adhesive. The grain diameter of the hot melt adhesive colloidal particles filtered by the filter screen is not less than 5-10 microns.
(2) A metal reflective layer 20 is formed on the other surface of the insulating layer 30.
The metal reflecting layer 20 is obtained by a metal ion sputtering process, and has strong bonding force and good uniformity. The metal ion sputtering process comprises the following steps: mounting a target and a substrate film; vacuum degassing; injecting argon; sputtering; unwinding materials; precipitating the metal target material; rolling the material; sampling and detecting. Wherein, the vacuum level of the cavity of the sputtering machine reaches below 1.0 x 10-3 pa; argon gas was supplied at a pressure of 2pa in an amount of 30 to 60 ppm.
(3) And providing an anti-oxidation liquid, coating the anti-oxidation liquid on the surface of the metal reflecting layer 20 far away from the insulating layer 30, and curing to form the anti-oxidation layer 10.
The oxidation-preventing layer 10 comprises the following components: 60-70% of 1-methoxy-2-propanol, 10-20% of silicon dioxide, 10-20% of acrylate monomer, 5-15% of acrylate polymer and 1-5% of photoinitiator.
The preparation process of the oxidation preventing layer 10 includes the following steps:
providing 1-methoxy-2-propanol, silicon dioxide, an acrylate monomer, an acrylate polymer and a photoinitiator, mixing and stirring for 2-5 h, and then standing or vacuumizing for 1h to obtain the anti-oxidation liquid. The anti-oxidation liquid is uniformly coated on the metal reflecting layer 20, and then cured by using a yellow light lamp to obtain the anti-oxidation layer 10.
Example 1:
(1) and providing an insulating layer and hot melt adhesive, and coating the hot melt adhesive on one surface of the insulating layer to obtain an adhesive layer.
① providing rubber, flame retardant, curing agent, ion capturing agent, antioxidant, accelerator, resin and diluent, and mixing according to a preset proportion to obtain a semi-finished product 1, a semi-finished product 2, a semi-finished product 3, a semi-finished product 4, a semi-finished product 5, a semi-finished product 6 and a semi-finished product 7;
② mixing 30% of semi-finished product 1, 10% of semi-finished product 2, 10% of semi-finished product 3, 0.05% of semi-finished product 4, 0.5% of semi-finished product 5, 0.5% of semi-finished product 6, 25% of semi-finished product 7 and 23.95% of diluent to obtain a mixed solution.
③ dispersing and emulsifying the mixed solution with a high-speed disperser, and filtering the dispersed and emulsified mixed solution with a filter screen to obtain the hot melt adhesive.
(2) And forming a metal reflecting layer on the other surface of the insulating layer.
The metal reflecting layer is obtained by a metal ion sputtering process, and the metal ion sputtering process comprises the following steps: mounting a target and a substrate film; vacuum degassing; injecting argon; sputtering; unwinding materials; precipitating the metal target material; rolling the material; sampling and detecting.
(3) And providing an anti-oxidation liquid, coating the anti-oxidation liquid on the surface of the metal reflecting layer far away from the insulating layer, and curing to form an anti-oxidation layer.
The preparation process of the anti-oxidation layer comprises the following steps: providing: 64 mass percent of 1-methoxy-2-propanol, 15 mass percent of silicon dioxide, 15 mass percent of acrylate monomer, 5 mass percent of acrylate polymer and 1 mass percent of photoinitiator are mixed and stirred, and then the mixture is stood still or vacuumed to discharge bubbles, so as to obtain the anti-oxidation liquid. And (3) uniformly coating the anti-oxidation liquid on the metal reflecting layer, and curing by using a yellow light lamp to obtain the anti-oxidation layer.
Example 2:
(1) and providing an insulating layer and hot melt adhesive, and coating the hot melt adhesive on one surface of the insulating layer to obtain an adhesive layer.
① providing rubber, flame retardant, curing agent, ion capturing agent, antioxidant, accelerator, resin and diluent, and mixing according to a preset proportion to obtain a semi-finished product 1, a semi-finished product 2, a semi-finished product 3, a semi-finished product 4, a semi-finished product 5, a semi-finished product 6 and a semi-finished product 7;
② mixing a semi-finished product 1 with a mass fraction of 35%, a semi-finished product 2 with a mass fraction of 12%, a semi-finished product 3 with a mass fraction of 12%, a semi-finished product 4 with a mass fraction of 0.1%, a semi-finished product 5 with a mass fraction of 1%, a semi-finished product 6 with a mass fraction of 1%, a semi-finished product 7 with a mass fraction of 28%, and a diluent of 10.9% to obtain a mixed solution.
③ dispersing and emulsifying the mixed solution with a high-speed disperser, and filtering the dispersed and emulsified mixed solution with a filter screen to obtain the hot melt adhesive.
(2) And forming a metal reflecting layer on the other surface of the insulating layer.
The metal reflecting layer is obtained by a metal ion sputtering process, and the metal ion sputtering process comprises the following steps: mounting a target and a substrate film; vacuum degassing; injecting argon; sputtering; unwinding materials; precipitating the metal target material; rolling the material; sampling and detecting.
(3) And providing an anti-oxidation liquid, coating the anti-oxidation liquid on the surface of the metal reflecting layer far away from the insulating layer, and curing to form an anti-oxidation layer.
The preparation process of the anti-oxidation layer comprises the following steps: providing: 70% of 1-methoxy-2-propanol, 10% of silicon dioxide, 10% of acrylate monomer, 5% of acrylate polymer and 5% of photoinitiator by mass, mixing and stirring, and then standing or vacuumizing to discharge bubbles to obtain the anti-oxidation liquid. And (3) uniformly coating the anti-oxidation liquid on the metal reflecting layer, and curing by using a yellow light lamp to obtain the anti-oxidation layer.
Example 3:
(1) and providing an insulating layer and hot melt adhesive, and coating the hot melt adhesive on one surface of the insulating layer to obtain an adhesive layer.
① providing rubber, flame retardant, curing agent, ion capturing agent, antioxidant, accelerator, resin and diluent, and mixing according to a preset proportion to obtain a semi-finished product 1, a semi-finished product 2, a semi-finished product 3, a semi-finished product 4, a semi-finished product 5, a semi-finished product 6 and a semi-finished product 7;
② mixing a semi-finished product 1 with a mass fraction of 25%, a semi-finished product 2 with a mass fraction of 15%, a semi-finished product 3 with a mass fraction of 15%, a semi-finished product 4 with a mass fraction of 0.08%, a semi-finished product 5 with a mass fraction of 0.8%, a semi-finished product 6 with a mass fraction of 0.8%, a semi-finished product 7 with a mass fraction of 32%, and a diluent of 11.32% to obtain a mixed solution.
③ dispersing and emulsifying the mixed solution with a high-speed disperser, and filtering the dispersed and emulsified mixed solution with a filter screen to obtain the hot melt adhesive.
(2) And forming a metal reflecting layer on the other surface of the insulating layer.
The metal reflecting layer is obtained by a metal ion sputtering process, and the metal ion sputtering process comprises the following steps: mounting a target and a substrate film; vacuum degassing; injecting argon; sputtering; unwinding materials; precipitating the metal target material; rolling the material; sampling and detecting.
(3) And providing an anti-oxidation liquid, coating the anti-oxidation liquid on the surface of the metal reflecting layer far away from the insulating layer, and curing to form an anti-oxidation layer.
The preparation process of the anti-oxidation layer comprises the following steps: providing: 60% of 1-methoxy-2-propanol, 15% of silicon dioxide, 15% of acrylate monomer, 8% of acrylate polymer and 2% of photoinitiator by mass, mixing and stirring, and then standing or vacuumizing to discharge bubbles to obtain the anti-oxidation liquid. And (3) uniformly coating the anti-oxidation liquid on the metal reflecting layer, and curing by using a yellow light lamp to obtain the anti-oxidation layer.
The following table is a table of test properties of the light reflecting structure of example 3.
In the scheme, the light emitted by the LED passes through the anti-oxidation layer 10 and is reflected by the metal reflecting layer 20, the reflected light passes through the anti-oxidation layer 10 and is emitted, and the reflectivity is high; the metal reflecting layer 20 is protected from being oxidized by the oxidation preventing layer 10, so that the reflecting effect is not reduced due to long-term use, and the service life is long; and the metal reflecting layer 20 has better bending resistance and can better adapt to the flexible circuit board. .
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (10)
1. The preparation method of the light reflecting structure is characterized by comprising the following steps of:
(1) providing an insulating layer and a hot melt adhesive, and coating the hot melt adhesive on one surface of the insulating layer;
(2) a metal reflecting layer is formed on the other surface of the insulating layer;
(3) and providing an anti-oxidation liquid, coating the anti-oxidation liquid on the surface of the metal reflecting layer, which is far away from the insulating layer, and curing to form an anti-oxidation layer.
2. The method for preparing a light reflecting structure according to claim 1, wherein in the step (1), after the hot melt adhesive is coated on one side of the insulating layer, a protective film is coated on the surface of the hot melt adhesive.
3. The method for preparing a light reflecting structure according to claim 1, wherein in the step (2), the metal reflective layer is formed by performing metal ion sputtering on the surface of the insulating layer.
4. The method of claim 1, wherein the reflective metal layer is made of one or more of nickel, chromium, aluminum, silver, copper, stainless steel, tin, and nickel alloy, chromium alloy, aluminum alloy, silver alloy, copper alloy, and tin alloy.
5. The method of making a retroreflective structure according to claim 1, wherein said hot melt adhesive comprises the following components:
30-45% of semi-finished product 1, 10-20% of semi-finished product 2, 10-20% of semi-finished product 3, 0.05-0.1% of semi-finished product 4, 1-0.5% of semi-finished product 5, 1-0.5% of semi-finished product 6, 25-40% of semi-finished product 7 and 10-35% of diluent;
wherein the semi-finished product 1 comprises 10-30% of rubber and 70-90% of diluent by mass; the semi-finished product 2 comprises 40-50% of the semi-finished product 1, 20-30% of the flame retardant and 20-40% of the diluent by mass; the semi-finished product 3 comprises 20-40% of curing agent and 60-80% of diluent by mass; the semi-finished product 4 comprises 10-20% of semi-finished product 1, 40-60% of ion capture agent and 20-50% of diluent; the semi-finished product 5 comprises 20-40% of antioxidant and 60-80% of diluent by mass; the semi-finished product 6 comprises 20-30% of accelerator and 70-80% of diluent by mass; the semi-finished product 7 comprises 40-60% of resin and 40-60% of diluent by mass fraction.
6. The method of making a retroreflective structure according to claim 5, wherein the preparation of the hot melt adhesive comprises the steps of:
providing and mixing rubber, a flame retardant, a curing agent, an ion scavenger, an antioxidant, an accelerator, resin and a diluent to obtain a mixed solution;
dispersing and emulsifying the mixed solution by using a high-speed dispersion machine;
and filtering the dispersed and emulsified mixed solution by using a filter screen to obtain the hot melt adhesive.
7. The method for preparing a reflective structure as claimed in claim 6, wherein the rotational speed of the high speed dispersion machine is 800-1200r/min, the dispersion and emulsification time lasts 3-5h, and the temperature is controlled within the range of 25-30 ℃ during the step of dispersing and emulsifying the mixed solution by the high speed dispersion machine;
and in the step of filtering the dispersed and emulsified mixed solution by using a filter screen, the particle size of the hot melt adhesive colloidal particles filtered by the filter screen is not less than 5-10 microns.
8. The method for preparing a light reflecting structure according to claim 1, wherein the oxidation preventing liquid comprises the following components:
60-70% of 1-methoxy-2-propanol, 10-20% of silicon dioxide, 10-20% of acrylate monomer, 5-15% of acrylate polymer and 1-5% of photoinitiator.
9. A light reflecting structure according to any one of claims 1 to 8, comprising:
the metal reflecting layer is used for reflecting light;
the anti-oxidation layer with high light transmittance is formed on one surface of the metal reflecting layer;
the insulating layer is arranged on the other surface of the metal reflecting layer and is used for insulating the metal reflecting layer; and
and the adhesive layer is arranged on one surface of the insulating layer, which is far away from the metal reflecting layer.
10. The retroreflective structure of claim 8 further comprising a protective film applied over the hot melt adhesive.
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| CN201910843907 | 2019-09-06 | ||
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| CN111076108A true CN111076108A (en) | 2020-04-28 |
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