CN104812166A - Manufacturing method of reflective heat-conducting metal base PCB (Printed Circuit Board) - Google Patents
Manufacturing method of reflective heat-conducting metal base PCB (Printed Circuit Board) Download PDFInfo
- Publication number
- CN104812166A CN104812166A CN201510246224.5A CN201510246224A CN104812166A CN 104812166 A CN104812166 A CN 104812166A CN 201510246224 A CN201510246224 A CN 201510246224A CN 104812166 A CN104812166 A CN 104812166A
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- China
- Prior art keywords
- insulating barrier
- heat conduction
- reflective
- pcb board
- layer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
Abstract
The invention relates to a manufacturing method of a reflective heat-conducting metal base PCB (Printed Circuit Board). By attaching a heat-conducting non-light-absorption insulating layer to a highly-reflective metal base plate, a highly-reflective heat-conducting PCB is obtained, the problems of heat conduction and light reflection of PCBs in an LED (Light Emitting Diode) lighting industry are solved, and the light emitting efficiency of LED products is greatly improved.
Description
Technical field
The present invention relates to the manufacture method of Metal Substrate pcb board, particularly relate to a kind of reflective heat conduction metal-based pcb board manufacture method and use the reflective heat conduction metal-based pcb board manufactured by the method.
Background technology
At present, many high-power LED light sources, because heat dissipation problem all can select the substrate that heat transfer is good, such as specular aluminium pcb board, mirror copper pcb board, ceramics base PCB plate etc.Although ceramics base PCB plate can meet heat radiation, the insulating requirements of high power LED device, its reflectivity is too low.Current domestic ceramic reflecting rate can only accomplish 85%-93%; External ceramic reflecting rate can be accomplished close to 95%, but still does not reach the reflectivity of specular aluminium, mirror copper substrate more than 98%.
Summary of the invention
The technical problem to be solved in the present invention is to provide the manufacture method of the reflective heat conduction metal-based pcb board that a kind of light reflectivity is high, pyroconductivity is high.
A kind of reflective heat-conducting metal pcb board manufacture method, comprises the following steps: 1) prepare reflective
Metal substrate; 2) at the non-extinction insulating barrier of reflecting metal basic unit attachment heat conduction; 3) printed circuit is done on the insulating layer; 4) reflective heat conduction metal-based pcb board is split; 5) coated with thermally conductive insulating barrier.
The reflective heat conduction metal-based pcb board manufacture method of above-mentioned one, wherein: described reflecting metal substrate is specular aluminium, mirror copper or mirror copper aluminum composite plate etc.
The reflective heat conduction metal-based pcb board manufacture method of above-mentioned one, wherein: described reflecting metal
The specular layer of substrate adopts Vacuum Deposition technique to obtain.
The reflective heat conduction metal-based pcb board manufacture method of above-mentioned one, wherein: described substrate is reflective
Layer can be obtained by electroplating technology.
The reflective heat conduction metal-based pcb board manufacture method of above-mentioned one, wherein: there is anti-oxidation protective layer on the minute surface top layer of described reflecting metal substrate.
The reflective heat conduction metal-based pcb board manufacture method of above-mentioned one, wherein: described insulating barrier is the insulating barrier that light transmission, reflective function and heat conductivility are good.
The reflective heat conduction metal-based pcb board manufacture method of above-mentioned one, wherein: described insulating barrier
The techniques such as Vacuum Deposition, spraying, brushing, dip-coating can be passed through obtain.
The reflective heat conduction metal-based pcb board manufacture method of above-mentioned one, wherein: described insulating barrier
For nano ceramic coat or ceramic plated layer.
The reflective heat conduction metal-based pcb board manufacture method of above-mentioned one, wherein: described printing electricity
The conductor on road can be obtained by Vacuum Deposition, chemical plating and barbola work.
The reflective heat conduction metal-based pcb board manufacture method of above-mentioned one, wherein: after described segmentation
Reflective heat conduction metal-based pcb board can coated with thermally conductive insulating coating again.
The present invention is the reflective surface at reflecting metal substrate, the non-extinction insulating barrier of attachment one deck heat conduction, then generates printed circuit on the insulating layer.The reflective surface of reflecting metal substrate can reflect through the light of the non-extinction insulating barrier of exhausted heat conduction, and the reflectivity of reflective heat conduction metal-based pcb board is improved.And technique is simple, easy to operate, can mass production be realized, meet the growing market demand.
accompanying drawing illustrates]
For convenience of explanation, the present invention is described in detail by following preferably case study on implementation and accompanying drawing.
Fig. 1 is the manufacture method flow chart of the reflective heat conduction metal-based pcb board of the embodiment of the present invention one.
It is the front view of the reflective heat conduction metal-based pcb board of the embodiment of the present invention one shown in Fig. 2.
It is the cutaway view of the reflective heat conduction metal-based pcb board of the embodiment of the present invention one shown in Fig. 3.
It is the cutaway view of the reflective heat conduction metal-based pcb board of the embodiment of the present invention three shown in Fig. 4.
Fig. 5 is the manufacture method flow chart of the reflective heat conduction metal-based pcb board of the embodiment of the present invention two, three.
Label declaration in accompanying drawing
21, the insulating barrier of layers of copper 315,416 heat conduction of aluminium lamination 210,310,410 printed circuit 213,311,411 solder mask 211,312,412 heat conduction non-extinction insulating barrier 313,413 antioxidation coating 314, the 414 reflective mirror silver layer 415 reflecting metal substrate of 31 reflecting metal substrate 41 reflecting metal substrates
[embodiment]
Case study on implementation one
Fig. 1 gives the flow chart of a kind of reflective heat conduction metal-based pcb board manufacture method of the present invention, and Fig. 2, Fig. 3 give the structure of the reflective heat conduction metal-based pcb board manufactured by the present invention, are illustrated below in conjunction with accompanying drawing 1,2,3:
As shown in Fig. 1, a kind of manufacture method idiographic flow of reflective heat conduction metal-based pcb board is as follows: 1) prepare reflecting metal substrate 21,31; 2) insulating barrier 211,312 is adhered to; 3) printed circuit 210,310 is formed; 4) split shaping; 5) coated with thermally conductive insulating barrier 315.(see accompanying drawing 2,3)
1) in, reflecting metal substrate is the minute surface aluminium sheet having antioxidation coating, and in order to reach good reflective, heat-conducting effect, metal base reflecting rate reaches the minute surface aluminium sheet of 98%.
2) in, non-in minute surface vacuum evaporation one deck heat conduction of the mirror-surface aluminum base board of reflecting rate 98%
The nano ceramics layer of extinction, THICKNESS CONTROL is between 10-150um; Light some through the non-extinction insulating barrier of heat conduction is reflected back by insulating barrier, and another portions of light, through insulating barrier, is gone back by the mirror-reflection of mirror-surface aluminum base board; The reflectivity of reflective heat conduction metal-based pcb board is improved thus, and reflectivity reaches more than 98%.
3) in, the surface of insulating layer on minute surface does printed circuit.By vacuum splashing and plating work
Skill forms the conductive nickel layer of 200-500 dust, then on nickel dam electro-coppering to 15-20um; Again by Graphic transitions, layers of copper forms the printed circuit of design; Then at the solder mask of printed circuit surface printing 10-15um, finally process at doing of the conductive surface nickel gold of the pcb board forming circuit, the thick plating of nickel dam is 100-150 u ", layer gold thickness is 2-5u ", to ensure the process requirements of LED lamp bead routing and welding.
4) in, by automatic V-CUT machine, segmentation has formed the reflective heat conduction metal-based pcb board of printed circuit, and cutting metal base pcb board severity control is 1/3 of reflective heat conduction metal-based pcb board thickness;
5) in, reflective heat conduction metal-based pcb board metallic portion after dicing, the ceramic coating of coated with thermally conductive excellent performance, to improve the insulation property of reflective heat conduction metal-based pcb board.
The reflective heat conduction metal-based pcb board manufacture method of the one that the present embodiment provides, by adhering to the non-extinction insulating barrier of heat conduction on the metal substrate having reflective good, thus obtaining the good reflective heat conduction metal-based pcb board of reflective function, its reflecting rate reaches more than 98%; Solve the reflective problem of LED illumination industry pcb board, greatly improve the light extraction efficiency of LED product.
Case study on implementation two
Fig. 2,3 gives second concrete case study on implementation of a kind of reflective heat conduction metal-based pcb board manufacture method of the present invention simultaneously, Fig. 5 gives the present invention another manufacturing method thereof flow chart of a kind of reflective heat conduction metal-based pcb board, is specifically described its method below in conjunction with accompanying drawing 2,3,5.
The present embodiment two and the difference of previous embodiment one are that the material of reflecting metal substrate is different:
As shown in Figure 3, reflecting metal substrate is copper plate, and the pyroconductivity of copper plate reaches more than 300W/M.K.Procedure of processing is as follows: step 1) prepares a copper plate 31; Step 2) at the electroplate 314 of copper plate, then do anti-oxidation process 313 at silver surface; Remaining job step identical with the 3-5 step of case study on implementation one (see accompanying drawing 3,5).
In step 1), metal substrate is thick 1.2mm copper plate, and such metal substrate pyroconductivity is fine, improves the heat conductivility of pcb board significantly.
In step 2) in, in order to reach good reflecting effect, the crystal bonding area plating on copper plate
Upper 80-100u " silver layer, silvering district large 0.2mm more monolateral than crystal bonding area, the reflecting rate of silver layer must reach more than 98%; Do anti-oxidation process on silver-colored reflector layer surface again, form the protective layer that one deck protects silver-colored reflector layer, to prevent silver-colored reflector layer oxidized.The material used is 79999 silver protecting agents of Pacific Ocean electroplating anticorrosion raw material Co., Ltd.
Remaining job step is shown in the 3-5 step of case study on implementation one.
The reflective heat conduction metal-based pcb board manufacture method of the one that the present embodiment provides, by adhering to the non-extinction insulating barrier of heat conduction on silver-plated copper plate, thus obtain reflective, that heat conductivility is all good pcb board, its reflecting rate reaches more than 98%; Solve the pcb board heat conduction of LED illumination industry, reflective problem, greatly improve the light extraction efficiency of LED product.
Case study on implementation three
Fig. 4 gives the 3rd specific embodiment of a kind of reflective conductivity printed circuit board (PCB) manufacture method of the present invention, and Fig. 5 gives the manufacturing flow chart of the present embodiment, is specifically described its method below in conjunction with Fig. 4, Fig. 5.
The present embodiment three and the difference of previous embodiment one are that the material of reflective metal layer is different:
As shown in Figure 4, metal substrate is divided into aluminium lamination 41 and layers of copper 415, and procedure of processing is as follows: step 1) prepares a Copper-Aluminum compound substrate 41,415; Step 2) at the copper face of Copper-Aluminum compound substrate silver-plated 414, then do anti-oxidation process 413 at silver surface; Remaining job step identical with the 3-5 step of case study on implementation one (see accompanying drawing 4,5).
In step 1), reflecting metal substrate is thick 1.2mm copper-aluminum composite board, has both improve the pyroconductivity of pcb board, reaches again the object reduced costs.
In step 2) in, in order to reach good reflecting effect, the die bond on copper-aluminum composite board
District plates 80-100u " silver layer, silvering district large 0.2mm more monolateral than crystal bonding area, the reflecting rate of silver layer must reach 98%; Do anti-oxidation process on silver-colored reflector layer surface again, form the protective layer that one deck protects silver-colored reflector layer, to prevent silver-colored reflector layer oxidized.The material used is 79999 silver protecting agents of Pacific Ocean electroplating anticorrosion raw material Co., Ltd.
Remaining job step is shown in the 3-5 step of case study on implementation one.
The reflective heat conduction metal-based pcb board manufactured by method of the present invention shown in Fig. 4, reflecting rate reaches 98%, for LED illumination industry provides the PCB substrate of novel high performance-price ratio.
Above specific embodiments of the invention are described.It is to be appreciated that the present invention is not limited to above-mentioned particular implementation, the equipment wherein do not described in detail to the greatest extent and structure are construed as to be implemented with the common mode in this area; Those skilled in the art can make various distortion or amendment within the scope of the claims, and this does not affect flesh and blood of the present invention.
Claims (8)
1. reflective heat conduction metal-based pcb board manufacture method: utilize the metal reflective face bottom insulating barrier, reflect through the light of the non-extinction insulating barrier of heat conduction, thus the reflecting rate improving pcb board; Comprise reflecting metal basic unit, the non-extinction insulating barrier of heat conduction, printed circuit layer; It is characterized in that: described method is made up of following step:
Step 1) prepares reflecting metal substrate;
Step 2) at the non-extinction insulating barrier of reflecting metal basic unit attachment heat conduction;
Step 3) does printed circuit on the insulating layer;
Step 4) splits reflective heat-conducting metal pcb board;
Step 5) coated with thermally conductive insulating barrier.
2. method according to claim 1, is characterized in that: in step 1), and described reflecting metal substrate is specular aluminium, mirror copper or mirror copper aluminum composite plate.
3. method according to claim 1, is characterized in that: in step 1), and the specular layer of described reflecting metal substrate adopts Vacuum Deposition technique to obtain.
4. method according to claim 1, is characterized in that: in step 1), and the specular layer of described reflecting metal substrate can be obtained by electroplating technology.
5. method according to claim 1, is characterized in that: in step 1), and there is anti-oxidation protective layer on the minute surface top layer of described reflecting metal substrate.
6. method according to claim 1, is characterized in that: in step 2) in, described heat conduction non-extinction insulating barrier is the insulating barrier that light transmission, reflective function and heat conductivility are good.
7. method according to claim 1, is characterized in that: in step 2) in, described insulating barrier can pass through Vacuum Deposition, spraying, brushing, dipping process acquisition.
8. method according to claim 1, is characterized in that: in step 2) in, described insulating barrier is nano ceramic coat or ceramic plated layer.
Priority Applications (1)
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| CN201510246224.5A CN104812166B (en) | 2015-05-15 | 2015-05-15 | A kind of reflective heat conduction metal-based pcb board manufacture method |
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| CN201510246224.5A CN104812166B (en) | 2015-05-15 | 2015-05-15 | A kind of reflective heat conduction metal-based pcb board manufacture method |
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| CN104812166B CN104812166B (en) | 2017-12-22 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105072812A (en) * | 2015-08-06 | 2015-11-18 | 深圳市环基实业有限公司 | Method for manufacturing hole-wall reflecting heat-conducting printed circuit board (PCB) |
| CN106287248A (en) * | 2016-08-24 | 2017-01-04 | 深圳市环基实业有限公司 | A kind of LED batten and manufacture method thereof |
| WO2019205438A1 (en) * | 2018-04-24 | 2019-10-31 | 武汉华星光电技术有限公司 | Drive substrate, preparation method and micro led array light-emitting backlight module |
| US10512159B2 (en) | 2018-04-24 | 2019-12-17 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Driving substrate, manufacturing process, and micro-LED array light-emitting backlight module |
| JP2020004938A (en) * | 2018-06-29 | 2020-01-09 | 同泰電子科技股▲分▼有限公司 | Wiring board structure for high reflection backlight and manufacturing method thereof |
| CN111073539A (en) * | 2019-09-06 | 2020-04-28 | 深圳科诺桥科技股份有限公司 | Light reflecting structure and preparation method thereof |
| CN111076108A (en) * | 2019-09-06 | 2020-04-28 | 深圳科诺桥科技股份有限公司 | Light reflecting structure and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102355796A (en) * | 2011-10-14 | 2012-02-15 | 格瑞电子（厦门）有限公司 | Manufacturing method of novel aluminum substrate |
| EP2571068A1 (en) * | 2010-05-13 | 2013-03-20 | Panasonic Corporation | Mounting board, method for manufacturing same, light emitting module, and illuminating apparatus |
| CN203219616U (en) * | 2013-05-09 | 2013-09-25 | 杭州电子科技大学 | LED paster type aluminous circuit board with high reflective rate |
| CN104113979A (en) * | 2014-02-13 | 2014-10-22 | 美的集团股份有限公司 | Aluminum-based circuit board and preparation method thereof, and full packaging electronic component |
| CN104505448A (en) * | 2014-12-16 | 2015-04-08 | 何忠亮 | Manufacture method of reflective ceramic-based PCB (Printed Circuit Board) |
-
2015
- 2015-05-15 CN CN201510246224.5A patent/CN104812166B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2571068A1 (en) * | 2010-05-13 | 2013-03-20 | Panasonic Corporation | Mounting board, method for manufacturing same, light emitting module, and illuminating apparatus |
| CN102355796A (en) * | 2011-10-14 | 2012-02-15 | 格瑞电子（厦门）有限公司 | Manufacturing method of novel aluminum substrate |
| CN203219616U (en) * | 2013-05-09 | 2013-09-25 | 杭州电子科技大学 | LED paster type aluminous circuit board with high reflective rate |
| CN104113979A (en) * | 2014-02-13 | 2014-10-22 | 美的集团股份有限公司 | Aluminum-based circuit board and preparation method thereof, and full packaging electronic component |
| CN104505448A (en) * | 2014-12-16 | 2015-04-08 | 何忠亮 | Manufacture method of reflective ceramic-based PCB (Printed Circuit Board) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105072812A (en) * | 2015-08-06 | 2015-11-18 | 深圳市环基实业有限公司 | Method for manufacturing hole-wall reflecting heat-conducting printed circuit board (PCB) |
| CN105072812B (en) * | 2015-08-06 | 2018-12-21 | 深圳市环基实业有限公司 | A kind of reflective conductivity printed circuit board (PCB) manufacturing method of hole wall |
| CN106287248A (en) * | 2016-08-24 | 2017-01-04 | 深圳市环基实业有限公司 | A kind of LED batten and manufacture method thereof |
| CN106287248B (en) * | 2016-08-24 | 2019-08-23 | 深圳市环基实业有限公司 | A kind of LED light batten and its manufacturing method |
| WO2019205438A1 (en) * | 2018-04-24 | 2019-10-31 | 武汉华星光电技术有限公司 | Drive substrate, preparation method and micro led array light-emitting backlight module |
| US10512159B2 (en) | 2018-04-24 | 2019-12-17 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Driving substrate, manufacturing process, and micro-LED array light-emitting backlight module |
| JP2020004938A (en) * | 2018-06-29 | 2020-01-09 | 同泰電子科技股▲分▼有限公司 | Wiring board structure for high reflection backlight and manufacturing method thereof |
| CN111073539A (en) * | 2019-09-06 | 2020-04-28 | 深圳科诺桥科技股份有限公司 | Light reflecting structure and preparation method thereof |
| CN111076108A (en) * | 2019-09-06 | 2020-04-28 | 深圳科诺桥科技股份有限公司 | Light reflecting structure and preparation method thereof |
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| CN104812166B (en) | 2017-12-22 |
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Effective date of registration: 20171116 Address after: 518125 third rows and seven rows of Xinfa Industrial Zone, Sha Jing Xinqiao, Baoan District, Shenzhen, Guangdong Applicant after: ACCELERATED PRINTED CIRCUIT INDUSTRIAL CO., LTD Address before: 518125 third rows and seven rows of Xinfa Industrial Zone, Sha Jing Xinqiao, Baoan District, Shenzhen, Guangdong Applicant before: He Zhongliang |
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Address after: 518125 No.9, Xinfa 2nd Road, Xinqiao community, Xinqiao street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Dinghua Xintai Technology Co.,Ltd. Address before: Building 7, row 3, Xinfa Industrial Zone, Shajing Xinqiao, Bao'an District, Shenzhen Patentee before: ACCELERATED PRINTED CIRCUIT BOARD Co.,Ltd. |
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