CN105357868A - Dual-face circuit board and processing method thereof - Google Patents
Dual-face circuit board and processing method thereof Download PDFInfo
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- CN105357868A CN105357868A CN201510812240.6A CN201510812240A CN105357868A CN 105357868 A CN105357868 A CN 105357868A CN 201510812240 A CN201510812240 A CN 201510812240A CN 105357868 A CN105357868 A CN 105357868A
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- line layer
- wiring board
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- adhesive layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a dual-face circuit board and a processing method thereof. The dual-face circuit board comprises a carrier layer, a first adhesive layer, a first circuit layer, a second adhesive layer, a second circuit layer and an outer insulation layer, wherein one side face of the carrier layer is combined with the first circuit layer through the first adhesive layer, the outer side face of the first circuit layer is combined with the second circuit layer through the second adhesive layer, and the insulation layer is arranged at the outer side face of the second circuit layer. Through the dual-face circuit board, a purpose of taking an outer surface protection layer as the carrier layer of the circuit board is realized, operation is precise and simple, the structure is simple, time and cost are saved, and damage to the environment is reduced.
Description
Technical field
The present invention relates to a kind of LED soft-circuit board, more particularly, particularly relate to a kind of double-sided wiring board and processing method.
Background technology
As shown in Figure 1, traditional double-sided wiring board (claiming FPC in industry), its composition structure is all by the two-sided coated with adhesive b of the polyimide film a (industry claims PI) designed in the middle of double-sided wiring board, c, and then laminating upper Copper Foil d on pressure sensitive adhesive double coated adhesion coating, e, be made into the substrate of double-sided wiring board, the naked wiring board of Double-side line layer is processed into again on the substrate of double-sided copper-clad, and then respectively press one deck to coat adhesive f in advance on the two sides of naked wiring board, g's and process by the design of wiring board polyimides coverlay (the insulating barrier h that electronic devices and components welding position windows, i), at making word icon and copper face conservation treatment, form complete wiring board, its fundamental mechanism is by three layers of PI film, four layers of adhesive layer, two-layer Copper Foil is totally nine layers of composition, it is positioned at the polyimide film in the middle of wiring board, just play the effect of carrier, carry the structure of whole wiring board, ensure that the size of wiring board does not change, wiring board is not shifted, accurate positioning, entirety is not broken and surface steadily effect such as grade, as cancelled, then whole wiring board just cannot continue in its process of manufacture, size will be there is, harmomegathus, circuit is shifted, whole plate breaks and the situation such as warpage, allow wiring board is not up to standard maybe cannot be used, so in traditional circuit plate, the middle PI layer playing carrier function is just extremely important, lacking can not.Respectively upper and lower line layer is combined in the upper and lower side of the middle PI layer to play carrier function during processing.As shown in Figure 2, when polyimides coverlay adopts printing-ink insulating barrier, the two sides that can be omitted in naked wiring board respectively presses one deck to coat adhesive in advance, directly printing-ink insulating barrier h, i on naked wiring board, and it is seven layers of composition less that its structure also causes.
The processing technology that the FPC of traditional handicraft is two-sided is as follows: PI film → first surface coating adhesive → laminating Copper Foil → slaking → the second coating adhesive → laminating Copper Foil → slaking → CNC Drilling operation → through hole and Double-side line layer processing → coverlay coating adhesive → slaking → coverlay electronic devices and components leg are windowed processing → Double-face adhesive coverlay → hot pressing → slaking → word icon → surface treatment, from above Making programme, the PI film in wiring board intermediate layer, play carrier function, lacking can not.
In addition, on field, the whole city, also there is the manufacturer of this Flexible Printed Circuit to be made technologic improvement, it is single spreading stick on PI film by traditional process change, coated with adhesive on the another side not having line layer after being processed into the wiring board of one side at single sided board, close with another sandwich circuit lamination and be combined into double-sided wiring board, its production procedure is as follows: the line layer (or reprocessing line layer after covering copper) that PI → coating adhesive → cover copper → slaking → making one side line layer → another side figure adhesive → laminating processes separately → make two-sided coverlay → pressing → slaking.Have again another flow process as follows: on Copper Foil coating adhesive → semi-curing → connect adhesive one with remove the another side coating adhesive → laminating Copper Foil processing line layer (or laminating line layer processed) of unwanted copper part → laminating PI film → PI film → make two-sided coverlay → hot pressing → slaking.Technique after above two kinds of improvement, the carrier of its wiring board is still be arranged at based on the carrier layer in the middle of wiring board, respectively upper and lower line layer is set in two sides up and down of carrier layer, and its feature all, three layers of PI rete and four layers of gluing rete and two-layer copper foil layer totally nine layers of composition.
Polyimide film (PI) is after being reacted by several industrial chemicals one, Shen is drawn and a kind of film become under paper tinsel degree condition between 350 DEG C-450 DEG C through curtain coating, in its production process, energy consumption is large, toxic emission is many, and difficult treatment, the waste material degraded of PI film is very difficult, and cost is also very high, so, application can economize and then economize.
Summary of the invention
The technical problem to be solved in the present invention is the above-mentioned deficiency for prior art, realizes serving as the double-sided wiring board of the carrier layer of wiring board with a wherein appearance protective layer, provides the processing method of this double-sided wiring board simultaneously.Have that operation is simplified, structure is simple, saved time and cost, reduced the destruction to environment.
Technical scheme of the present invention is such: a kind of double-sided wiring board, comprise carrier layer, the first adhesive layer, first line layer, the second adhesive layer and the second line layer, in a side of carrier layer by the first adhesive layer in conjunction with first line layer, and in the another side of first line layer by the second adhesive layer in conjunction with the second line layer.
Above-mentioned a kind of double-sided wiring board, arranges insulating barrier at the second line layer lateral surface.This insulating barrier can be reprocessed after welding electronic original part.
Above-mentioned a kind of double-sided wiring board, line layer adopts corrosion or hardware and cutting-tools cutting or hardware dies is die-cut or the method for die casting moulding or extrusion modling or laser cutting forms circuit or said method combination forms circuit.
Above-mentioned a kind of double-sided wiring board, carrier layer is the carrier layer of glass fabric or polyimide film or polycarbonate film or polyester film formation.
Above-mentioned a kind of double-sided wiring board, first line layer and the second line layer are copper or copper alloy or aluminium or Copper Foil or copper alloy foil or aluminium foil.
Above-mentioned a kind of double-sided wiring board, adhesive layer can be epoxide resin type or acrylic acid type.
Adopt the invention of technique scheme, realize not with intermediate film or base material for carrier layer, save traditional circuit plate and be combined in middle PI layer to play carrier function at upper and lower line layer.Using the protective layer of surface layer line layer lateral surface or coverlay as carrier layer; namely with the coverlay outside a wherein line layer for carrier layer carries plate body, realizing changing traditional nine Rotating fields being carrier with intermediate film or base material is that six Rotating fields coal seven-layer structures form complete double-sided wiring board.Its operation is simplified, structure simple, has saved time and cost, has reduced the destruction to environment.
A processing method for double-sided wiring board, the processing method concrete steps of above-mentioned wiring board are as follows: step (), be coated with the first adhesive layer on a carrier layer, for subsequent use; Step (two), first line layer are combined with carrier layer by the first adhesive layer; Step (three), on first line layer another side, be coated with the second adhesive layer; Step (four), the second line layer to be combined with first line layer by the second adhesive layer; Step (five), insulating barrier is set at the second line layer lateral surface.
The processing method of above-mentioned a kind of double-sided wiring board, in step (), carry out manufacture pad window, in step (two), manufacture first line sandwich circuit, in step (three), manufacture through hole, make the second line layer circuit in step (four).
A processing method for double-sided wiring board, the processing method concrete steps of above-mentioned double-sided wiring board are as follows: step (), be coated with the first adhesive layer on a carrier layer, for subsequent use; Step (two), auxiliary film is set, auxiliary film is coated with the second adhesive layer and on the second adhesive layer compound first line layer, for subsequent use; Step (three), the carrier layer of standby step () and step (two) completed are combined with first line layer by the first adhesive layer; After step (four), removal auxiliary film, the second line layer is combined with first line layer by the second adhesive layer; Step (five), insulating barrier is set at the second line layer lateral surface.
The processing method of above-mentioned a kind of double-sided wiring board, carries out manufacture pad and windows in step (), manufactures through hole and first line sandwich circuit, make the second line layer circuit in step (four) in step (two).
A processing method for double-sided wiring board, the processing method concrete steps of above-mentioned double-sided wiring board are as follows: step (), be on a carrier layer coated with after the first adhesive layer for subsequent use; Step (two), in first line layer lateral surface compound first auxiliary film; Step (three), the second auxiliary film be coated with the second adhesive layer is thereon set; Step (four), the second line layer lateral surface compound the 3rd auxiliary film; Step (five), first line layer are combined with carrier layer by the first adhesive layer; Step (six), remove the first auxiliary film after, the second auxiliary film is compounded on first line layer by the second adhesive layer; Step (seven), remove the second auxiliary film after the second line layer is combined with first line layer by the second adhesive layer; After step (eight), removal the 3rd auxiliary film, insulating barrier is set at the second line layer lateral surface.
The processing method of above-mentioned a kind of double-sided wiring board, in step (), manufacture pad and window, manufacture first line sandwich circuit in step (two), make the second line layer circuit in step (four), in step (six), make via.
Above-mentioned auxiliary film is antiadhesion barrier, to ensure that respective material layer is for adhering to other material when overall compound is prepared, and ensures that composite effect and realization facilitate the object of overall compound.
The present invention is specially adapted to Flexible Printed Circuit, for LED.
Accompanying drawing explanation
Below in conjunction with the embodiment in accompanying drawing, the present invention is described in further detail, but do not form any limitation of the invention.
Fig. 1 be a kind of traditional circuit plate cross-sectional view;
Fig. 2 be another kind of traditional circuit plate cross-sectional view;
Fig. 3 is the cross-sectional view after the specific embodiment of the invention one compound completes;
Fig. 4 is the cross-sectional view after the specific embodiment of the invention two compound completes;
Fig. 5 is in the cross-sectional view of position of windowing after the specific embodiment of the invention two compound completes;
Fig. 6 is the line construction schematic diagram of planar line layer of the present invention;
Fig. 7 is the cross-sectional view of the concrete processing method one of the present invention;
Fig. 8 is the cross-sectional view that the concrete processing method one of the present invention processes external insulation layer further;
Fig. 9 is the cross-sectional view of step one in the concrete processing method two of the present invention;
Figure 10 is the cross-sectional view of step 2 in the concrete processing method two of the present invention;
Figure 11 is the cross-sectional view of step 3 in the concrete processing method two of the present invention;
Figure 12 is the cross-sectional view of step one in the concrete processing method three of the present invention;
Figure 13 is the cross-sectional view of step 2 in the concrete processing method three of the present invention;
Figure 14 is the cross-sectional view of step 3 in the concrete processing method three of the present invention;
Figure 15 is the cross-sectional view of step 4 in the concrete processing method three of the present invention;
Figure 16 is the cross-sectional view of step 5 in the concrete processing method three of the present invention;
Figure 17 is the cross-sectional view of step 6 in the concrete processing method three of the present invention.
Embodiment
As shown in Figures 3 to 6, a kind of double-sided wiring board of the present invention, comprise carrier layer 1, first adhesive layer 2, first line layer 3, second adhesive layer 4 and the second line layer 5, in a side of carrier layer 1 by the first adhesive layer 2 in conjunction with first line layer 3, and in the another side of first line layer 3 by the second adhesive layer 4 in conjunction with the second line layer 5.
As shown in Figure 4, external insulation layer 6 is set at the second line layer 5 lateral surface.
Line layer adopts corrosion or hardware and cutting-tools cutting or hardware dies is die-cut or the method for die casting moulding or extrusion modling or laser cutting forms circuit or said method combination forms circuit.
Carrier layer 1 is the carrier layer of glass fabric or polyimide film or polycarbonate film or polyester film formation.
First line layer 3 and the second line layer 5 are copper or copper alloy or aluminium or Copper Foil or copper alloy foil or aluminium foil.
Adhesive layer can be epoxide resin type or acrylic acid type.
As shown in Fig. 3, Fig. 7, process the processing method one of above-mentioned double-sided wiring board, concrete steps are as follows: step (), in carrier layer 1, be coated with the first adhesive layer 2, for subsequent use; Step (two), first line layer 3 are combined with carrier layer 1 by the first adhesive layer 2; Step (three), on first line layer 3 another side, be coated with the second adhesive layer 4; Step (four), the second line layer 5 to be combined with first line layer 3 by the second adhesive layer 4; Step (five), insulating barrier 6 is set at the second line layer 5 lateral surface.
As shown in Fig. 4, Fig. 5 and Fig. 8, wherein insulating barrier 6 normal conditions be step (four), complete after just process, also can process again after product completes welding electronic elements.
As shown in Figure 5, double-sided wiring board adds man-hour, carries out manufacture pad and window in step (), in step (two), manufacture first line sandwich circuit, in step (three), manufacture through hole, make the second line layer circuit in step (four).
The concrete production stage refinement of the inventive method one is as follows:
Step (one), by selected adhesive (epoxide resin type or acrylic acid type) precoating Fabric on the carrier layer PI sending fortune, adopts that 150 DEG C of conditions of X2-5 minute do precuring process, precuring process is windowed for subsequent use by the pad needed for fabrication data manufacture wiring board after completing.
Step (two), the adhesive layer that selected Copper Foil is made by coating in step ().And manufactured by fabrication data the carrier layer that the pad needed for wiring board windows and post, laminating condition is: 65 DEG C-80 DEG C, linear speed 3-8 is per minute, apply tension force 15-20 newton, by fabrication data after completing, adopt general processing method in wiring board industry or adopt the method for hardware and cutting-tools cutting, mould punching, or adopt the processing methods such as laser cutting engraving to be made into the line layer of needs.
Step (three), the outside of the first line layer made in step (two), the selected adhesive of coating adopts the condition precuring process of 150 DEG C of X2-5 minute or the good tacky film of laminating one deck pre-coating (this tacky film can oneself pre-coating make also can be buy in market) then to adopt the method for CNC boring or mould punching to produce the via of wiring board according to the manufacturing engineering data of wiring board.
Step (four), selected Copper Foil is fitted in gluing aspect manufactured good in step (three), laminating condition is 65 DEG C-80 DEG C, linear speed 3-8 is per minute, apply tension force 15-20 newton, by fabrication data after completing, adopt general processing method in wiring board industry or adopt the method for hardware and cutting-tools cutting, mould punching, or adopt the processing methods such as laser cutting engraving to be made into the line layer of needs.
By above step, just complete complete double-sided wiring board, and make the character of requirement thereon and surface anti-oxidation process just can intactly use.
As shown in Fig. 3, Fig. 9 to Figure 11, process the processing method two of above-mentioned double-sided wiring board, concrete steps are as follows: step (), in carrier layer 1, be coated with the first adhesive layer 2, for subsequent use; Step (two), auxiliary film 4.1 is set, auxiliary film 4.1 is coated with the second adhesive layer 4 and on the second adhesive layer 4 compound first line layer 3, for subsequent use; Step (three), the carrier layer 1 of standby step () and step (two) completed are combined with first line layer 3 by the first adhesive layer 2; After step (four), removal auxiliary film 4.1, second line layer 5 is combined with first line layer 3 by the second adhesive layer 4; Step (five), insulating barrier 6 is set at the second line layer 5 lateral surface.
Double-sided wiring board adds man-hour, carries out manufacture pad and window in step (), manufactures through hole and first line sandwich circuit, make the second line layer circuit in step (four) in step (two).As shown in Figure 6, first line layer and the second line layer are processed with the circuit at N and P the two poles of the earth respectively, and arrange window position and the via A of corresponding UNICOM.
The concrete production stage refinement of the inventive method two is as follows:
Step (one), by selected adhesive (epoxide resin type or acrylic acid type) precoating Fabric on the carrier layer PI sending fortune, adopts that 150 DEG C of conditions of X2-5 minute do precuring process, precuring process is windowed for subsequent use by the pad needed for fabrication data manufacture wiring board after completing.
Step (two), selected adhesive being coated in advance the condition of the diaphragm with acid-alkali-corrosive-resisting function carrying out precuring (diaphragm is commercially available) precuring is 150 DEG C of X2-5 minute, make the auxiliary film 4.1 of band adhesive layer, then on the face of adhesive-layer, selected Copper Foil is posted, laminating condition is 65 DEG C-80 DEG C, linear speed 3-8 is per minute, apply tension force 15-20 newton, according to the engineering data that wiring board makes after completing, adopt the processing method in wiring board industry or adopt hardware and cutting-tools cutting, the method of mould punching, or adopt the processing methods such as laser cutting to be made into line layer or the via of needs, for subsequent use.
Step (three), the half-finished circuit aspect making line layer and via in step (two) being fitted in step () in the half-finished viscose glue aspect made the face of the first adhesive layer 2 (i.e. on) laminating condition is 65 DEG C-80 DEG C, linear speed 3-8 is per minute, apply tension force 15-20 newton
Step (four), then selected Copper Foil is fitted in the gluing aspect removing and expose outside additional film layer (second layer adhesive layer 4) by the additional film layer (4.1) that completing steps (three) uses when removal step (two) manufactures afterwards, laminating condition is 65 DEG C-80 DEG C, linear speed 3-8 is per minute, apply tension force 15-20 newton, by fabrication data after completing, adopt general processing method in wiring board industry or adopt the method for hardware and cutting-tools cutting, mould punching, or adopt the processing methods such as laser cutting to be made into the line layer of needs.
By above step, just complete complete double-sided wiring board, and make the character of requirement thereon and surface anti-oxidation process just can intactly use.
As shown in Fig. 3, Figure 12 to Figure 17, process the processing method three of above-mentioned double-sided wiring board, concrete steps are as follows: step (), for subsequent use after upper coating first adhesive layer 2 of carrier layer (1); Step (two), in first line layer 3 lateral surface compound first auxiliary film 3.1; Step (three), the second auxiliary film 4.1 be coated with the second adhesive layer 4 is thereon set; Step (four), the second line layer 5 lateral surface compound the 3rd auxiliary film 5.1; Step (five), first line layer 3 are combined with carrier layer 1 by the first adhesive layer 2; Step (six), remove the first auxiliary film 3.1 after, the second auxiliary film 4.1 is compounded on first line layer 3 by the second adhesive layer 4; Step (seven), remove the second auxiliary film 4.1 after the second line layer 5 is combined with first line layer 3 by the second adhesive layer 4; After step (eight), removal the 3rd auxiliary film 5.1, insulating barrier 6 is set at the second line layer 5 lateral surface.
Double-sided wiring board adds man-hour, in step (), manufacture pad and window, manufacture first line sandwich circuit in step (two), make the second line layer circuit in step (four), in step (six), make via.
The concrete production stage refinement of the inventive method three is as follows:
As shown in figure 12, step (one), by selected adhesive (epoxide resin type or acrylic acid type) precoating Fabric on the carrier layer PI sending fortune, adopts that 150 DEG C of conditions of X2-5 minute do precuring process, precuring process is windowed for subsequent use by the pad needed for fabrication data manufacture wiring board after completing.
As shown in figure 13, step (two), on the selected cold diaphragm be attached to acid-alkali-corrosive-resisting function of Copper Foil one lateral surface (this diaphragm is commercially available) to make first line layer by the engineering data of wiring board for subsequent use.
As shown in figure 14, step (three), arranges the second auxiliary film, the second auxiliary film of acid-alkali-corrosive-resisting is coated with selected adhesive for subsequent use as the second adhesive layer, and precuring condition is 150 DEG C of X2-5 minute.
As shown in figure 15, step (four), on the selected cold diaphragm be attached to acid-alkali-corrosive-resisting function of Copper Foil one lateral surface (this diaphragm is commercially available) to make the second line layer by the engineering data of wiring board for subsequent use.
As shown in figure 16, step (five), the first adhesive layer that first line layer step (two) made is made by step () and carrier layer fit together, and laminating condition is 65 DEG C-80 DEG C, linear speed 3-8 is per minute, applies tension force 15-20 newton.
As shown in figure 17, step (six), to make in the semi-finished product of step (five) incidental first auxiliary film remove after, the second adhesive layer made in step (three) is fitted on the exposed surface of first line layer, laminating condition is 65 DEG C-80 DEG C, linear speed 3-8 is per minute, applies tension force 15-20 newton, and presses the via of the fabrication data make wiring board of wiring board.
Step (seven), after subsidiary the second auxiliary film on the semi-finished product completing step (six) is removed, the second line layer that step (four) completes is fitted on exposed the second adhesive layer out, laminating condition is 65 DEG C-80 DEG C, linear speed 3-8 is per minute, applies tension force 15-20 newton.
Step (eight), removes subsidiary the 3rd auxiliary film on the semi-finished product completing step (seven), then outside the second line layer, makes insulating barrier.
By above step, just complete complete double-sided wiring board, and make the character of requirement thereon and surface anti-oxidation process just can intactly use.
In sum, the present invention, as specification and diagramatic content, makes actual sample and through repeatedly use test, from the effect of use test, provable the present invention can reach its desired object, and practical value is unquestionable.Above illustrated embodiment is only used for conveniently illustrating the present invention, not any pro forma restriction is done to the present invention, have in any art and usually know the knowledgeable, if do not depart from the present invention carry in the scope of technical characteristic, utilize the Equivalent embodiments that the done local of disclosed technology contents is changed or modified, and do not depart from technical characteristic content of the present invention, all still belong in the scope of the technology of the present invention feature.
Claims (13)
1. a double-sided wiring board, it is characterized in that: comprise carrier layer (1), the first adhesive layer (2), first line layer (3), the second adhesive layer (4) and the second line layer (5), pass through the first adhesive layer (2) in a side of carrier layer (1) in conjunction with first line layer (3), and pass through the second adhesive layer (4) in the another side of first line layer (3) in conjunction with the second line layer (5).
2. a kind of double-sided wiring board according to claim 1, is characterized in that: arrange insulating barrier (6) at the second line layer (5) lateral surface.
3. a kind of double-sided wiring board according to claim 1 and 2, is characterized in that: line layer adopts corrosion or hardware and cutting-tools cutting or hardware dies is die-cut or the method for die casting moulding or extrusion modling or laser cutting forms circuit or said method combination forms circuit.
4. a kind of double-sided wiring board according to claim 1 and 2, is characterized in that: the carrier layer that carrier layer (1) is formed for glass fabric or polyimide film or polycarbonate film or polyester film.
5. a kind of double-sided wiring board according to claim 1, is characterized in that: first line layer (3) and the second line layer (5) are copper or copper alloy or aluminium or Copper Foil or copper alloy foil or aluminium foil.
6. a kind of double-sided wiring board according to claim 1, is characterized in that: adhesive layer can be epoxide resin type or acrylic acid type.
7. a processing method for double-sided wiring board, the processing method concrete steps of the arbitrary described wiring board of claim 1 to 6 are as follows: step (), coating first adhesive layer (2) in carrier layer (1), for subsequent use; Step (two), first line layer (3) are combined by the first adhesive layer (2) and carrier layer (1); Step (three), on first line layer (3) another side, be coated with the second adhesive layer (4); Step (four), the second line layer (5) to be combined by the second adhesive layer (4) and first line layer (3).
8. the processing method of a kind of double-sided wiring board according to claim 7, is characterized in that: step (five), arrange insulating barrier (6) at the second line layer (5) lateral surface.
9. the processing method of a kind of double-sided wiring board according to claim 7, it is characterized in that: in step (), carry out manufacture pad window, first line sandwich circuit is manufactured in step (two), in step (three), manufacture through hole, make the second line layer circuit in step (four).
10. a processing method for double-sided wiring board, the processing method concrete steps of the arbitrary described double-sided wiring board of claim 1 to 6 are as follows: step (), coating first adhesive layer (2) in carrier layer (1), for subsequent use; Step (two), auxiliary film (4.1) is set, compound first line layer (3) at upper coating second adhesive layer (4) of auxiliary film (4.1) and on the second adhesive layer (4), for subsequent use; Step (three), the carrier layer (1) of standby step () and step (two) completed are combined by the first adhesive layer (2) and first line layer (3); After step (four), removal auxiliary film (4.1), the second line layer (5) is combined by the second adhesive layer (4) and first line layer (3); Step (five), insulating barrier (6) is set at the second line layer (5) lateral surface.
The processing method of 11. a kind of double-sided wiring boards according to claim 10, it is characterized in that: in step (), carry out manufacture pad window, in step (two), manufacture through hole and first line sandwich circuit, make the second line layer circuit in step (four).
The processing method of 12. 1 kinds of double-sided wiring boards, the processing method concrete steps of the arbitrary described double-sided wiring board of Claims 1-4 are as follows: step (), for subsequent use afterwards at upper coating first adhesive layer (2) of carrier layer (1); Step (two), in first line layer (3) lateral surface compound first auxiliary film (3.1); Step (three), the second auxiliary film (4.1) is set and is coated with the second adhesive layer (4) thereon; Step (four), the second line layer (5) lateral surface compound the 3rd auxiliary film (5.1); Step (five), first line layer (3) are combined by the first adhesive layer (2) and carrier layer (1); Step (six), remove the first auxiliary film (3.1) after, the second auxiliary film (4.1) is compounded on first line layer (3) by the second adhesive layer (4); Step (seven), remove the second auxiliary film (4.1) after the second line layer (5) is combined by the second adhesive layer (4) and first line layer (3); After step (eight), removal the 3rd auxiliary film (5.1), insulating barrier (6) is set at the second line layer (5) lateral surface.
The processing method of 13. a kind of double-sided wiring boards according to claim 12, it is characterized in that: in step (), manufacture pad and window, first line sandwich circuit is manufactured in step (two), make the second line layer circuit in step (four), in step (six), make via.
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| CN201510812240.6A CN105357868A (en) | 2015-11-19 | 2015-11-19 | Dual-face circuit board and processing method thereof |
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| CN201510812240.6A CN105357868A (en) | 2015-11-19 | 2015-11-19 | Dual-face circuit board and processing method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108391372A (en) * | 2017-02-02 | 2018-08-10 | 长春石油化学股份有限公司 | THIN COMPOSITE electrolytic copper foil and its carrier layer |
| CN113207218A (en) * | 2021-04-16 | 2021-08-03 | 深圳市国盈光电有限公司 | Laser engraving circuit board and production method thereof |
| TWI749923B (en) * | 2020-11-25 | 2021-12-11 | 大陸商碁鼎科技秦皇島有限公司 | Method for preparing circuit board |
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| CN108391372B (en) * | 2017-02-02 | 2020-09-18 | 长春石油化学股份有限公司 | Composite thin electrolytic copper foil and carrier layer thereof |
| TWI749923B (en) * | 2020-11-25 | 2021-12-11 | 大陸商碁鼎科技秦皇島有限公司 | Method for preparing circuit board |
| CN113207218A (en) * | 2021-04-16 | 2021-08-03 | 深圳市国盈光电有限公司 | Laser engraving circuit board and production method thereof |
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Application publication date: 20160224 |