TW200606968A - Method for manufacturing multilayer electronic component - Google Patents

Method for manufacturing multilayer electronic component

Info

Publication number
TW200606968A
TW200606968A TW094121399A TW94121399A TW200606968A TW 200606968 A TW200606968 A TW 200606968A TW 094121399 A TW094121399 A TW 094121399A TW 94121399 A TW94121399 A TW 94121399A TW 200606968 A TW200606968 A TW 200606968A
Authority
TW
Taiwan
Prior art keywords
electronic component
multilayer electronic
green
electrode layer
layers
Prior art date
Application number
TW094121399A
Other languages
Chinese (zh)
Other versions
TWI260030B (en
Inventor
Shigeki Sato
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corp filed Critical Tdk Corp
Publication of TW200606968A publication Critical patent/TW200606968A/en
Application granted granted Critical
Publication of TWI260030B publication Critical patent/TWI260030B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/308—Stacked capacitors made by transfer techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

Disclosed is a method for manufacturing a multilayer electronic component comprising a step for forming green sheets (10a), a step for forming an electrode layer (12a) on the surface of each green sheet (10a), a step for forming a green chip by arranging the green sheets (10a) in layers which green sheets have been respectively provided with the electrode layer (12a), and a step for firing the green chip. Such a method for manufacturing a multilayer electronic component is characterized in that an adhesive layer (28) is formed on the electrode layer side surface of each green sheet (10a), which has been provided with the electrode layer (12a), before arranging the green sheets (10a) in layers, and then the green sheets (10a) are arranged in layers via the adhesive layers (28).
TW094121399A 2004-06-28 2005-06-27 Method for manufacturing multilayer electronic component TWI260030B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004190242 2004-06-28

Publications (2)

Publication Number Publication Date
TW200606968A true TW200606968A (en) 2006-02-16
TWI260030B TWI260030B (en) 2006-08-11

Family

ID=35781808

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094121399A TWI260030B (en) 2004-06-28 2005-06-27 Method for manufacturing multilayer electronic component

Country Status (5)

Country Link
US (1) US20080053593A1 (en)
JP (1) JP4354993B2 (en)
CN (1) CN101010758A (en)
TW (1) TWI260030B (en)
WO (1) WO2006001358A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7491282B2 (en) * 2003-03-31 2009-02-17 Tdk Corporation Method for manufacturing multi-layered ceramic electronic component
KR100853278B1 (en) * 2003-09-30 2008-08-20 티디케이가부시기가이샤 Method for producing dielectric paste for multilayer ceramic electronic component
JP4487542B2 (en) * 2003-11-27 2010-06-23 Ｔｄｋ株式会社 Conductor paste for multilayer ceramic electronic component and method for manufacturing multilayer unit for multilayer ceramic electronic component
JP4662298B2 (en) * 2003-12-15 2011-03-30 Ｔｄｋ株式会社 Dielectric paste for spacer layer of multilayer ceramic electronic components
JP4487595B2 (en) * 2004-02-27 2010-06-23 Ｔｄｋ株式会社 Method for manufacturing multilayer unit for multilayer ceramic electronic component
JP4487596B2 (en) * 2004-02-27 2010-06-23 Ｔｄｋ株式会社 Method for manufacturing multilayer unit for multilayer ceramic electronic component
JP4412013B2 (en) * 2004-03-16 2010-02-10 Ｔｄｋ株式会社 Dielectric paste for multilayer ceramic electronic component and method for producing multilayer unit for multilayer ceramic electronic component
CN103107110B (en) * 2011-11-10 2016-04-06 北大方正集团有限公司 A kind of chip observation sample production method and system
CN115196978A (en) * 2022-08-09 2022-10-18 广东环波新材料有限责任公司 Ceramic preparation method based on LTCC substrate isostatic pressing lamination

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05217797A (en) * 1992-02-03 1993-08-27 Nitto Denko Corp Manufacture of laminated capacitor component
EP0732735B1 (en) * 1995-03-16 2005-12-14 Murata Manufacturing Co., Ltd. Monolithic ceramic electronic device and method of manufacturing same
TW512653B (en) * 1999-11-26 2002-12-01 Ibiden Co Ltd Multilayer circuit board and semiconductor device
JP2002127117A (en) * 2000-10-30 2002-05-08 Kyocera Corp Method for manufacturing green sheet and method for manufacturing electronic component
TW543052B (en) * 2001-03-05 2003-07-21 Nitto Denko Corp Manufacturing method of ceramic green sheet, manufacturing method of multilayer ceramic electronic components, and carrier sheet for ceramic green sheets
DE10113361A1 (en) * 2001-03-20 2002-09-26 Andreas Roosen Laminated ceramic green body, useful for preparing, e.g. integrated circuits, comprises layers glued together with an adhesive film deposited on a release liner
US7014725B2 (en) * 2001-10-25 2006-03-21 Matsushita Electric Industrial Co., Ltd. Multilayer ceramic electronic component manufacturing method including a sintered adhesive layer with a resin and inorganic powder
JP4035988B2 (en) * 2001-12-06 2008-01-23 株式会社デンソー Ceramic laminate and manufacturing method thereof
JP4305808B2 (en) * 2002-07-03 2009-07-29 太陽誘電株式会社 Multilayer capacitor
JP4261854B2 (en) * 2002-09-18 2009-04-30 日本特殊陶業株式会社 Multilayer ceramic capacitor manufacturing method and ceramic sheet laminating apparatus
JP4116854B2 (en) * 2002-09-30 2008-07-09 京セラ株式会社 Method for manufacturing ceramic laminate
JP2004179348A (en) * 2002-11-26 2004-06-24 Kyocera Corp Method for manufacturing ceramic laminated body
WO2004061880A1 (en) * 2002-12-27 2004-07-22 Tdk Corporation Method for manufacturing multilayer electronic component
KR20060058675A (en) * 2003-07-09 2006-05-30 티디케이가부시기가이샤 Multilayer ceramic component and method for manufacturing same

Also Published As

Publication number Publication date
US20080053593A1 (en) 2008-03-06
CN101010758A (en) 2007-08-01
JPWO2006001358A1 (en) 2008-04-17
TWI260030B (en) 2006-08-11
WO2006001358A1 (en) 2006-01-05
JP4354993B2 (en) 2009-10-28

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees