JPH05217797A - Manufacture of laminated capacitor component - Google Patents

Abstract

PURPOSE:To obtain a method for manufacturing a laminated capacitor component which has excellent uniformity of thinness and thickness of a ceramic dielectric layer, excellent handling properties and does not generate decomposed gas even in the case of baking. CONSTITUTION:A method for manufacturing a laminated capacitor component is a type for transferring a conductor film 2 and a ceramic dielectric film 3 transferably provided on an easily peelable sheet 1 and has the step of sequentially laminating the conductor film and the dielectric film as a laminate 5. Thus, an ultrathin ceramic dielectric film, etc., which is difficult to be handled due to its own weight rupture, etc., by itself can be easily laminated by the simple transfer type having and excellent operability, and the component can be manufactured by a mass production in high manufacturing efficiency. Further, a ceramic dielectric film containing no organic binder can be easily formed, and even if a laminate is baked, decomposing gas of the binder is not generated, and warpage scarcely occurs.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer capacitor component suitable for forming a multilayer ceramic chip capacitor and the like, which is excellent in thinness and mass productivity.

[0002]

2. Description of the Related Art Heretofore, there has been known a method of manufacturing a laminated capacitor component in which ceramic green sheets provided with internal electrodes made of palladium or the like are laminated and then fired. Such a multilayer capacitor component is used for forming a multilayer ceramic chip capacitor and the like. In the obtained capacitor, the thinner the dielectric layer formed by the ceramic is, the more preferable it is from the standpoint of capacitance and the like.

However, the required strength during lamination,
The thickness of the ceramic green sheet used is restricted from the viewpoints of handleability and formability of a uniformly thick sheet, and the thickness is limited to 10 μm based on the ceramic layer after firing, and it cannot be made thinner than that. There was a problem. There is also a problem that the organic binder in the ceramic green sheet is burnt out during firing, and the generated gas causes warpage and layer separation.

[0004]

DISCLOSURE OF THE INVENTION The present invention provides a method for manufacturing a multilayer capacitor component which is excellent in thinness and thickness uniformity of a ceramic dielectric layer, is easy to handle, and does not generate decomposition gas even when fired. Is the development of.

[0005]

SUMMARY OF THE INVENTION According to the present invention, a conductor film and a ceramic dielectric film, which are transferably provided on an easily peelable sheet, are transferred so that the conductor film and the ceramic dielectric film are sequentially laminated. The present invention provides a method for manufacturing a multilayer capacitor component characterized by the above.

[0006]

[Function] A ceramic dielectric film excellent in thinness and thickness uniformity can be easily formed on an easily peelable sheet by a vapor deposition method or the like without containing an organic binder,
A film having a thickness of 5 μm or less can be easily formed. On the other hand, by the method of providing a transferable ceramic dielectric film or the like on the easily peelable sheet and laminating it, the ceramic dielectric film or the like which is difficult to handle by itself due to its own weight or the like can be easily processed. Can be stacked and has excellent handleability. Therefore, the lamination process can be performed by a simple process of pressing and transferring the ceramic dielectric film or the like on the easily peelable sheet, and the laminated capacitor component can be mass-produced with high manufacturing efficiency.

[0007]

EXAMPLE The present invention is to manufacture a multilayer capacitor part by sequentially transferring and laminating a conductor film and a ceramic dielectric film on an easily peelable sheet. The method is illustrated in FIG. Reference numeral 1 is an easily peelable sheet, 2 is a conductor film, and 3 is a ceramic dielectric film, which form a transfer sheet 4. 5
Is a laminated capacitor component formed by laminating such a superposed film of the conductor film 2 and the ceramic dielectric film 3. In the transfer sheet, the vertical relationship between the conductor film and the ceramic dielectric film is arbitrary.

As the easily peelable sheet of the transfer sheet, for example, an appropriate one known as a separator in an adhesive sheet or the like can be used. Generally, from a fluororesin such as polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene / hexafluoropropylene copolymer, chlorotrifluoroethylene / vinylidene fluoride copolymer. Sheet, a sheet made of a polyolefin resin such as polyethylene or polypropylene, or a sheet made of a usual plastic such as polyester, polyamide, polyvinyl chloride or polystyrene, or a thin foil such as a metal foil, for example, a silicone release agent or a fluorine-based release agent. Release agent, long-chain acrylic release agent,
For example, those surface-treated with a peelability-imparting agent such as molybdenum sulfide are used. The thickness of the easily peelable sheet may be appropriately determined, but is generally 1 to 600 μm in view of transferability of the ceramic dielectric film or the like. The easily peelable sheet may have a deformability such as elongation controlled by a stretching treatment or the like.

The conductor film and the ceramic dielectric film, which are provided on the easily peelable sheet in a transferable manner, may be made of appropriate materials and are not particularly limited. The conductor film serves as an internal electrode,
A noble metal such as palladium, platinum, palladium / silver, or an alloy thereof is generally used for its formation. For forming the ceramic dielectric film, a barium titanate-based material, a strontium titanate-based material, or the like having an excellent dielectric constant can be preferably used.

The conductor film and the ceramic dielectric film can be formed by a thin film forming method such as a vacuum vapor deposition method, a sputtering method and an ion plating method. From the standpoint of transferability and thinness, the thickness of the conductor film to be formed is 1 μm or less, preferably 50 to 800 Å, and the thickness of the ceramic dielectric film is 10 μm or less, especially 1 to 5 μm. The conductor film and the ceramic dielectric film may each be formed as a laminated film of different materials for the purpose of improving electrostatic capacity and laminating workability.

The transfer sheet may be provided with an adhesive layer, if necessary, on the superposed film composed of the conductor film and the ceramic dielectric film. The adhesive layer is provided for the purpose of improving the shape retention of the laminate.

For forming the adhesive layer, an appropriate adhesive substance such as various pressure-sensitive adhesives such as rubber-based or acrylic-based adhesives, and heat-sensitive adhesives made of thermoplastic resin may be used. Specific examples of the thermoplastic resin for the heat-sensitive adhesive include polyethylene,
Polyalkylene such as polypropylene, ethylene / vinyl acetate copolymer, ethylene / ethyl acrylate copolymer, ethylene / acrylic acid copolymer, polyvinyl acetate,
Acrylic polymer, polyamide, polyurethane, polyester, polyvinyl ether, polyvinyl alcohol,
Or a mixture thereof or the like.

The adhesive layer is formed, for example, by a method of laminating while extruding a film, a method of coating a liquid,
It may be performed by an appropriate method such as a laminating method of the formed film. The thickness of the adhesive layer is preferably as thin as possible within the range where the necessary adhesive force is exhibited, and is preferably 20 μm or less. The transfer sheet may be in a form such that a long roll body or the like can be continuously supplied, which is advantageous for continuous manufacture of laminated capacitor parts.

On the other hand, in forming the adhesive layer, a low melting point metal such as indium, tin, zinc, lead, bismuth, or the like, which has excellent transfer adhesion by pressure or pressure heating at a low temperature, or a metal thereof is used. An alloy containing the same can be used. When the ceramic dielectric film or the like is transferred and laminated and then baked and integrated, it is not desirable because decomposition gas is generated in the above organic adhesive layer, but such a problem does not occur in the metal adhesive layer. .. Further, in the case of the metal-based adhesive layer, since it has conductivity, it can also serve as the conductor film as the above-mentioned internal electrode.

The metal-based adhesive layer is formed by, for example, a vacuum deposition method, a sputtering method, an ion plating method,
It can be performed by a thin film forming method such as electrolytic plating or electroless wet plating. The thickness of the metal-based adhesive layer to be formed is usually 100 μm or less in terms of transferability and adhesiveness,
Especially, it is 0.1 to 10 μm. The metal adhesive layer is
It may be formed as a superposed layer of different metals for the purpose of improving transferability, adhesiveness and conductivity.

From the standpoint of transferability, the transfer sheet is preferably one in which the interfacial adhesion of the film to be transferred to the easily peelable sheet is greater than the tensile strength of the film to be transferred, especially 1
It is larger than 0 g, especially larger than 50 g. As a result, the force required to peel the film to be transferred from the easily peelable sheet becomes larger than the film strength of the film to be transferred, and the film to be transferred can be cut by the pressing force at the time of the transfer. ..

The lamination process by transfer of the ceramic dielectric film or the like is performed, for example, by stacking a ceramic dielectric film or the like of an easily peelable sheet on the ceramic dielectric film or the like previously transferred on a support base or the like and pressing it. Then, the operation of peeling the easily peelable sheet while transferring the ceramic dielectric film or the like can be repeated.

The pressing process can be carried out by an appropriate system such as a roll system or a press system. Pressing force required for the transfer, but are not limited to commonly 30kg / cm ² or less, especially 0.5 to 10 / cm ² approximately. It should be noted that the pressing process can adopt an appropriate method such as a heating pressing method, a vibration pressing method using ultrasonic waves, or a combination thereof, if necessary.

In the present invention, since the ceramic dielectric film or the like is excellent in the cutting property at the interface between the transfer portion and the non-transfer portion, it is possible to simply separate the easily peelable sheet after the pressing treatment, for example, a pressing plate or the like. It is also possible to partially transfer by means of such partial pressing means.

As described above, in the present invention, the multilayer capacitor component is manufactured by laminating the ceramic dielectric films and the like by the transfer method, but the number of the laminated ceramic dielectric films and the like is arbitrary. In the present invention, a ceramic dielectric film having a thickness of several μm, which is difficult to form by the ceramic green sheet method, can be easily formed, so that a multilayer capacitor component having an extremely thin ceramic dielectric film can be obtained.

The laminated capacitor component obtained in the present invention does not need to be fired because the ceramic dielectric film has already formed a continuous film, but it may be fired for the purpose of joining the laminated layers. ..

[0022]

According to the present invention, since a ceramic dielectric film or the like on a sheet is transferred and laminated, it is possible to easily laminate an extremely thin ceramic dielectric film or the like which is difficult to handle due to its own weight rupture or the like. Excellent handleability. Further, a ceramic dielectric film which is excellent in thinness and thickness uniformity and does not contain an organic binder can be easily formed on the easily peelable sheet by a vapor deposition method or the like. Therefore, it is possible to mass-produce multilayer capacitor parts with a transfer method that is simple and has excellent workability with high manufacturing efficiency.
Even when the obtained multilayer capacitor part is fired, decomposition gas of the organic binder is not generated and warpage is unlikely to occur.

[Brief description of drawings]

FIG. 1 is a cross-sectional view illustrating a transfer stacking process.

[Explanation of symbols]

 4: Transfer sheet 1: Easy peeling sheet 2: Conductor film 3: Ceramic dielectric film 5: Multilayer capacitor parts

Claims (1)

[Claims] 1. A multilayer capacitor component characterized in that a conductor film and a ceramic dielectric film, which are transferably provided on an easily peelable sheet, are sequentially laminated by a method of transferring the conductor film and the ceramic dielectric film. Production method.