JPH05217800A - Manufacture of film capacitor component - Google Patents

Abstract

PURPOSE:To obtain a method for manufacturing a film capacitor component which has excellent uniformity of thinness and thickness of a dielectric layer and excellent handling properties and in which a forming material of the layer can be variably selected. CONSTITUTION:A method for manufacturing a film capacitor component comprises the steps of winding a conductor film 2 and a dielectric film 3 peelably formed on an easily peelable sheet 1 while peeling it from the sheet. Thus, an ultrathin dielectric film, etc., which is difficult to be handled due to own weight rapture by itself can be easily wound, and the component having excellent handling properties and ultrathin dielectric film can be efficiently manufactured. The dielectric film made of various dielectric material and having excellent uniformity of thinness and thickness can be easily formed on the sheet.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a film capacitor part comprising an extremely thin dielectric film and a conductor film.

[0002]

2. Description of the Related Art Heretofore, there has been known a method for producing a film capacitor component in which a vapor-deposited film made of aluminum or the like is applied to a polymer film made of polyester or the like and the film is wound. In such a film capacitor, the thinner the dielectric layer formed by the polymer film is, the more preferable.
However, there is a problem that the thickness of the polymer film is limited to about 6 μm from the viewpoint of required strength at the time of winding treatment, handleability, formability of a uniform thick film, and the like, and it cannot be made thinner than that. .. Further, the material forming the dielectric layer is limited to a polymer film in view of winding property and the like, and the polymer film has a low dielectric constant, so that there is a problem that the capacitance is poor.

[0003]

DISCLOSURE OF THE INVENTION The present invention provides a method of manufacturing a film capacitor component which is excellent in the thinness and thickness uniformity of the dielectric layer and also in the handling property, and in which various materials for forming the dielectric layer can be selected. Development is an issue.

[0004]

DISCLOSURE OF THE INVENTION The present invention is a film characterized in that a conductor film and a dielectric film, which are formed in a peelable thin film on an easily peelable sheet, are wound while being peeled off from the easily peelable sheet. A method for manufacturing a capacitor part is provided.

[0005]

[Function] A dielectric film excellent in thinness and thickness uniformity can be easily formed on an easily peelable sheet by using various dielectric materials by a vapor deposition method or the like and has a thickness of 5 μm or less. Can also be easily formed. On the other hand, by a method of providing a peelable dielectric film or the like on an easily peelable sheet and winding it, it is possible to easily wind a dielectric film or the like that is difficult to handle by breaking it by its own weight. It can be turned, has excellent handleability, and can manufacture film capacitor parts with good work efficiency.

[0006]

EXAMPLE The present invention is to manufacture a film capacitor component by peeling a conductor film and a dielectric film, which are formed in a peelable thin film on an easily peelable sheet, from the easily peelable sheet while winding them. .. FIG. 1 illustrates the manufacturing process. 1
Is an easily peelable sheet, 2 is a conductor film, and 3 is a dielectric film.
In the present invention, the conductor film may be outside the dielectric film.

As the easily peelable sheet, for example, an appropriate one known as a separator in an adhesive sheet or the like can be used. Generally, from a fluororesin such as polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene / hexafluoropropylene copolymer, chlorotrifluoroethylene / vinylidene fluoride copolymer. Sheet, a sheet made of a polyolefin resin such as polyethylene or polypropylene, or a sheet made of a usual plastic such as polyester, polyamide, polyvinyl chloride or polystyrene, or a thin foil such as a metal foil, for example, a silicone release agent or a fluorine-based release agent. A release agent, a long-chain acrylic release agent, or a material surface-treated with a release property imparting agent such as molybdenum sulfide is used.
The thickness of the easily peelable sheet may be appropriately determined. Generally, it is 5 ~ 600μ from the point of handling such as winding.
It is assumed to be m. The easily peelable sheet may have a deformability such as elongation controlled by a stretching treatment or the like.

The peelable conductor film provided on the easily peelable sheet serves as an electrode and may be formed of an appropriate conductive substance. Generally, aluminum, copper, nickel, etc. are used, but in addition, gold, silver, indium, tin, bismuth, lead, thallium, zinc, chromium, alloys thereof, etc. can also be used. Is not particularly limited. The conductor film can be formed by a thin film forming method such as a vacuum deposition method, a sputtering method, an ion plating method. The thickness of the conductor film to be formed is preferably 1 μm or less from the viewpoint of thinness and the like. The conductor film may be formed as a superposed film of different materials for the purpose of improving the connectivity with external electrodes.

The dielectric film provided on the outside or inside (the side of the easily peelable sheet) of the conductor film may be formed of an appropriate dielectric material according to the purpose of use. An example is PbNb
₂ O ₆ , KNbO ₃ , BaTiO ₃ , PbTa ₂ O ₆ , PbTiO ₃ ,
MgTiO ₃ , TiO ₂ , CaTiO ₃ , SrTiO ₃ , Bi ₂ O ₃ ,
Al ₂ O ₃ , Ta ₂ O ₅ , BaSnO ₄ , CaZrO ₃ , Bi ₂ Sn ₃ O
₉ , other inorganic substances such as rare earth oxides, polytetrafluoroethylene, polychlorotrifluoroethylene, cyanoethylated cellulose, polyvinylidene fluoride, phenol resin, chlorinated polyethylene, polyvinylidene chloride,
Examples include organic materials such as epoxy resin, polyurethane, polyvinyl chloride, polyamide, cellulose acetate, chloroprene, and styrene-butadiene rubber. The dielectric material used in the present invention may be a solid material, and one having an excellent dielectric constant is preferable.

The formation of the dielectric film can be carried out by a thin film forming method such as the above-mentioned vacuum deposition method in the case of an inorganic material. In the case of an organic material, the dielectric film can be formed by an extrusion film forming method, a liquid material coating method, a film laminating method, or the like. The thickness of the dielectric film to be formed is preferably 5 μm or less, or 1 to 3 μm from the viewpoint of thinness and the like. Note that the dielectric film may be formed as a superposed film of different materials for the purpose of adjusting electrostatic capacity.

The winding process of the superposed film of the conductor film and the dielectric film provided on the easily peelable sheet is performed by, for example, passing the conductor film and the dielectric film through a winding rod or the like from the easily peelable sheet. An appropriate method such as a method of peeling and winding may be used. The number of windings is appropriately determined according to the intended film capacitor component. The obtained wound body is adjusted in size by cutting or the like as necessary, and is subjected to necessary treatments such as attachment of external electrodes and outer packaging to obtain a film capacitor.

In the present invention, since the superposed film of the conductor film and the dielectric film on the easily peelable sheet can be easily cut, for example, while forming the conductor film and the dielectric film on the easily peelable sheet, An appropriate continuous manufacturing method, such as a method of forming a necessary wound product in the subsequent step to cut the superposed film and sequentially repeating the winding / cutting process, can be easily adopted.

[0013]

EFFECTS OF THE INVENTION According to the present invention, the method of winding the dielectric film or the like formed on the easily peelable sheet while peeling it off makes it extremely difficult to handle due to its own weight breakage or the like. It is possible to easily wind a dielectric film and the like, and it is possible to efficiently manufacture a film capacitor component having an extremely thin dielectric film with excellent handleability. Further, a film capacitor having an extremely thin dielectric layer made of various materials, which can easily form a dielectric film and a conductive film made of various dielectric materials with excellent thinness and thickness uniformity on an easily peelable sheet. The parts can be easily obtained.

[Brief description of drawings]

FIG. 1 is a cross-sectional explanatory view illustrating a manufacturing process.

[Explanation of symbols]

 1: Easy peelable sheet 2: Conductor film 3: Dielectric film

Claims (1)

[Claims] 1. A method of manufacturing a film capacitor component, wherein a conductor film and a dielectric film, which are thinly formed on an easily peelable sheet so as to be peelable, are wound while being peeled off from the easily peelable sheet.