JP2001044064A - Manufacture of ceramic electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a ceramic electronic component which is free of deformation and breakage of a conductor layer during the formation of a laminate. SOLUTION: After a conductor layer 12 is formed in the surface of a base film 10, a conductor layer 12 is rolled together with the base film 10, and a conductor layer roll is prepared. A release layer 11 is formed in a front and the rear surface of the base film 10, and a ceramic sheet 13 is prepared in a surface of the base film 10, the ceramic sheet 13 is rolled together with the base film 10 for each base film 10 by a roll 14, a ceramic sheet roll is prepared, and the release layer 11 is also formed in the front and the rear of the base film 10. Then, the conductor layer 12 and the ceramic sheet 13 are wound off from a conductor layer roll and a ceramic sheet roll and cut to a proper size together with the base film 10. Then, the ceramic sheet 13 and the conductor layer 12 are laminated alternately and a laminate is formed, and an external electrode 3 is formed after baking.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic electronic component such as a multilayer ceramic capacitor.

[0002]

2. Description of the Related Art FIG. 4 is a partially sectional perspective view of a multilayer ceramic capacitor which is one of ceramic electronic components.
Is a ceramic dielectric layer, 2 is a conductor layer, 3 is an external electrode, and the conductor layer 2 is connected to the external electrode 3 at opposing end faces.

Hereinafter, a method for manufacturing a conventional multilayer ceramic capacitor will be described.

[0004] First, a metal paste to be a conductive layer is continuously printed in a desired shape on the surface of a long base film.
The conductor layer roll is manufactured by winding the entire base film. This base film has a release layer formed on the surface. Next, the conductor layer rolls are respectively unwound and cut into a desired shape together with the base film, then the conductor layer is transferred together with the base film onto the ceramic sheet, the base film is peeled off, and the ceramic sheet is laminated thereon. Then, the conductive layer is similarly transferred onto this. A laminate is obtained by alternately laminating ceramic sheets and conductor layers. Next, the laminate is fired to form the conductor layer 2.
The external electrodes 3 were formed on both exposed end faces of the device to obtain a multilayer ceramic capacitor.

[0005]

According to the above-mentioned method, when the conductor layer is wound together with the base film, it comes into contact with the back surface of the base film. Since the release layer is not formed on the back surface, the conductor layer 2 adheres to the back surface of the base film when unwinding when forming the laminate, and a conductor layer of a desired shape cannot be obtained. Had.

Accordingly, an object of the present invention is to provide a method of manufacturing a ceramic electronic component in which a conductive layer is not deformed or damaged when a laminate is formed.

[0007]

In order to achieve this object, a method of manufacturing a ceramic electronic component according to the present invention comprises forming a plurality of conductor layers on the surface of a base film and winding the conductor layers together with the base film. A first step of forming a conductive layer roll, and a second step of unwinding the conductive layer roll and transferring the conductive layer onto a ceramic sheet and then peeling the base film; and A third step of laminating a ceramic sheet on the conductor layer, and a fourth step of alternately repeating the second step and the third step a desired number of times to form a laminate; And a fifth step of firing the laminate, wherein the base film in the first step uses a release film formed on the front and back surfaces, and a release layer is also provided on the back surface of the base film. Establishment It is thereby possible to achieve the above object because the adhesion to the back surface of the base film of the conductor layer can be prevented.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, a plurality of conductor layers are formed on the surface of a base film, and then the conductor layers are wound together with the base film to form a conductor layer roll. A first step, a second step of unwinding the conductor layer roll, transferring the conductor layer onto the ceramic sheet and then peeling the base film, and then a ceramic sheet on the conductor layer 3rd stacking
And a fourth step of alternately repeating the second step and the third step a desired number of times to form a laminate, and then a fifth step of firing the laminate. Prepared,
This is a method for manufacturing a ceramic electronic component using a base film having a release layer formed on the front and back surfaces in the first step. Since a release layer is also formed on the back surface of the base film, a conductor is formed on the back surface of the base film. It is possible to prevent the conductive layer from being deformed due to the adhesion of the layer.

According to the second aspect of the present invention, the ceramic sheet used in the second step is also formed on the surface of a base film having release layers formed on both sides, and then the ceramic sheet roll wound up with the base film is unwound. The method for manufacturing a ceramic electronic component according to claim 1, wherein the adhesion of the ceramic sheet to the back surface of the base film can be prevented.

According to a third aspect of the present invention, there is provided the method of manufacturing a ceramic electronic component according to the first aspect, wherein the ceramic sheet used in the second step contains at least a ceramic component and polyethylene. Therefore, the above problem does not occur.

According to a fourth aspect of the present invention, there is provided the method for manufacturing a ceramic electronic component according to the first aspect, wherein the base film has a lower peel strength on the back surface than on the front surface. Adhesion to the back surface can be further suppressed.

According to a fifth aspect of the present invention, the release layer is formed using at least one of an acrylic resin, a melamine resin, an epoxy resin, and a silicone resin.
It has high release properties.

The invention according to claim 6 is a first step of forming a plurality of conductor layers on the surface of the base film, winding the conductor layer together with the base film to form a conductor layer roll, and A second step of unwinding the conductor layer roll to transfer the conductor layer onto a ceramic sheet, and then peeling the base film to form a plurality of ceramic sheets with conductor layers, and then the conductor A third step of laminating the layered ceramic sheets so that the conductor layers face each other with the ceramic sheet interposed therebetween to obtain a laminate, and a fifth step of subsequently firing the laminate, The base film in the step is a method for manufacturing a ceramic electronic component using a release film formed on the front and back surfaces, and a release layer is also formed on the back surface of the base film. Conductive layer conductor layer on the back surface of the arm is attached can be prevented from being deformed.

In the invention according to claim 7, the ceramic sheet used in the second step is also formed on the surface of the base film having the release layers formed on both surfaces, and then the ceramic sheet roll wound up together with the base film is unwound. The method for manufacturing a ceramic electronic component according to claim 6, wherein the adhesion of the ceramic sheet to the back surface of the base film can be prevented.

The invention according to claim 8 is the method for manufacturing a ceramic electronic component according to claim 6, wherein the ceramic sheet used in the second step contains at least a ceramic component and polyethylene. Therefore, the above problem does not occur.

According to a ninth aspect of the present invention, there is provided the method of manufacturing a ceramic electronic component according to the sixth aspect, wherein the base film has a lower peel strength on the back surface than on the front surface. Adhesion to the back surface can be further suppressed.

In a tenth aspect of the present invention, the release layer is formed by using at least one of an acrylic resin, a melamine resin, an epoxy resin, and a silicone resin. This is a method for manufacturing parts and has high mold release properties.

Hereinafter, embodiments of the present invention will be described with reference to the drawings, taking a multilayer ceramic capacitor as an example.

(Embodiment 1) FIGS. 1 (a) to 1 (c) and 2 (a) to 2 (c) are cross-sectional views showing steps of manufacturing a multilayer ceramic capacitor according to Embodiment 1 of the present invention.
Reference numeral 10 denotes a base film, 11 denotes a release layer, 12 denotes a conductor layer, 13 denotes a ceramic sheet, and 14 denotes a roll.

First, as shown in FIGS. 1A and 1B, a metal paste obtained by mixing a nickel powder, a solvent, an organic binder, and a plasticizer is printed in a desired shape on the surface of a long base film 10 and dried. After forming a large number of the conductor layers 12, the conductor layers 12 are wound up together with the base film 10 by the rolls 14 to produce a conductor layer roll as shown in FIG. This base film 10 has a release layer 1
1 is formed.

As shown in FIGS. 2A and 2B, an organic binder, a plasticizer, and a solvent are added to a dielectric powder containing barium titanate as a main component to prepare a slurry, and the slurry is prepared by a doctor blade method. A ceramic sheet 13 is formed on the surface of the base film 10, and the ceramic sheet 1 is rolled for each base film 10 as shown in FIG.
3 is rolled up to produce a ceramic sheet roll. This base film 10 also has a release layer 11 formed on the front and back surfaces.

Next, the conductor layer 12 and the ceramic sheet 13 are unwound from the conductor layer roll and the ceramic sheet roll, and cut together with the base film 10 into an appropriate size.

Next, the ceramic sheets 13 and the conductor layers 12 are alternately laminated on the ineffective layer formed by laminating a plurality of ceramic sheets 13, and the ineffective layer is formed again to form a laminate block.

Here, the base film 10 can be peeled off before or after lamination on the conductor layer 12 if the ceramic sheet 13 is thick. However, when it is thin, it is difficult to handle it, so it is preferable to peel it off after pressing it on the conductor layer 12.
In the case of the conductor layer 12, it is peeled after being pressed on the ceramic sheet 13.

Thereafter, the laminate block is cut into a laminate of a desired size, degreased and fired to obtain a sintered body.

Next, external electrodes 3 made of copper or the like are baked on the exposed both end surfaces of the conductor layer 2 of the sintered body, and after plating thereon, the finished product shown in FIG. 4 is obtained.

(Embodiment 2) Hereinafter, Embodiment 2 of the present invention will be described with reference to the drawings.

FIGS. 3A to 3D are cross-sectional views showing the steps of manufacturing the multilayer ceramic capacitor according to the second embodiment. The same components as those in FIGS. Omitted.

Only the differences from the first embodiment will be described.

In the second embodiment, FIGS. 3 (a) to 3 (c)
As shown in FIG. 3, the conductor layer roll and the ceramic sheet roll shown in the first embodiment are unwound and the ceramic sheet 13 is pressed on the conductor layer 12 to form the base film 10.
After forming a ceramic sheet with a conductor layer thereon, FIG.
As shown in (d), the roll is wound up with a roll to form a ceramic sheet roll with a conductor layer.

Next, the ceramic sheet roll with the conductor layer is unwound, cut into a desired shape together with the base film 10, and then the ceramic sheet with the conductor layer is laminated on the ineffective layer to form a laminate block. To form
Subsequent steps are the same as in the first embodiment.

Here, when the ceramic sheet roll with the conductor layer is laminated, the base film 10 is peeled off when the ceramic sheet 13 is thick as described in the first embodiment. Either before or after lamination may be used. However, when it is thin, it is difficult to handle it, so it is preferable to peel it off after pressing it on the conductor layer 12.

Further, the ceramic sheet 13 was transferred to the conductor layer 12 side, the base film 10 on the ceramic sheet 13 side was peeled off, and the ceramic sheet with the conductor layer was wound up. The base film 10 on the conductor layer 12 side may be peeled off by transferring the layer 12.

Hereinafter, the points of the present invention will be described.

(1) Since the release layer 11 is provided not only on the front surface but also on the back surface of the base film 10, even if a large amount of the ceramic sheet 13 and the conductor layer 12 are formed at one time and stored in a roll shape, Next, when unwinding and using,
Since the adhesion of the ceramic sheet 13 and the conductor layer 12 to the back surface of the base film 10 can be suppressed, the productivity of the multilayer ceramic capacitor can be improved.

The release layers 1 are provided on both sides of the base film 10.
In the case where the conductive layer 12 or the ceramic sheet 13 is provided, the surface on which the conductive layer 12 or the ceramic sheet 13 is not formed (the back surface) has a smaller peel strength than the surface on which the conductive layer 12 or the ceramic sheet 13 is formed. It is desirable to prevent the 13 from moving.

(2) In the first and second embodiments, the ceramic sheet 13 formed on the surface of the base film 10 is used. For example, the ceramic sheet 13 is manufactured by mixing a ceramic component with polyethylene as a binder. In this case, since the base film 10 as the support is unnecessary, there is no problem that the ceramic sheet 13 adheres to the back surface of the base film 10.

(3) By forming the release layer 11 using at least one of an acrylic resin, a melamine resin, an epoxy resin, and a silicone resin, high release properties can be obtained, and peeling of the base film 10 can be achieved. In this case, the deformation of the ceramic sheet 13 or the conductor layer 12 can be prevented.

(4) In the above embodiment, a multilayer ceramic capacitor has been described as an example. However, for example, a multilayer thermistor, a multilayer varistor, a multilayer inductor, a ceramic multilayer substrate, and a ceramic sheet and a conductor layer are formed by lamination. A similar effect can be obtained in a ceramic electronic component such as a multilayer filter.

[0040]

According to the present invention, since the release layer is formed not only on the front surface but also on the back surface of the base film, a method for manufacturing a ceramic electronic component without deformation or breakage of the conductor layer at the time of forming a laminate. The purpose is to provide. Therefore, it is possible not only to improve the productivity but also to obtain a ceramic electronic component having excellent characteristics.

The occurrence of short-circuit defects can be extremely suppressed, and the yield can be improved. In particular, the ceramic sheet is thin and has a tremendous effect on the improvement of the yield of the multilayer chip capacitor which requires high lamination.

[Brief description of the drawings]

FIGS. 1A to 1C are cross-sectional views illustrating manufacturing steps of a multilayer ceramic capacitor according to an embodiment of the present invention.

FIGS. 2A to 2C are cross-sectional views illustrating manufacturing steps of a multilayer ceramic capacitor according to an embodiment of the present invention.

FIGS. 3A to 3D are cross-sectional views illustrating manufacturing steps of a multilayer ceramic capacitor according to an embodiment of the present invention.

FIG. 4 is a partially cutaway perspective view of a general multilayer ceramic capacitor.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Ceramic dielectric layer 2 Conductor layer 3 External electrode 10 Base film 11 Release layer 12 Conductor layer 13 Ceramic sheet 14 Roll

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Katsuyuki Miura 1006 Kazuma Kadoma, Osaka Pref. Matsushita Electric Industrial Co., Ltd. Terms (reference) 5E001 AB03 AC04 AC09 AE02 AE03 AF00 AF06 AH01 AH05 AH06 AH09 AJ01 5E082 AA01 AB03 BC38 BC40 EE04 EE23 EE35 FF14 FG06 FG26 FG27 FG35 FG54 GG10 GG11 GG26 GG12 JJ23 JJ03 JJ03 JJ03 JJ03

Claims (10)

[Claims] 1. A first step of forming a plurality of conductor layers on the surface of a base film, winding the conductor layer together with the base film to form a conductor layer roll, and then forming the conductor layer roll. A second step of unwinding and transferring the conductor layer onto the ceramic sheet and then peeling off the base film, a third step of laminating a ceramic sheet on the conductor layer, and then the second step Step and the third
And a fifth step of alternately repeating the steps a desired number of times to form a laminate, and then firing the laminate, wherein the base film in the first step has a front surface and a back surface. A method for producing a ceramic electronic component using a release layer formed on a substrate. 2. The ceramic sheet used in the second step is formed by forming a release layer on both sides of a base film and then unwinding a ceramic sheet roll wound together with the base film. The manufacturing method of the ceramic electronic component described in the above. 3. The method according to claim 1, wherein the ceramic sheet used in the second step contains at least a ceramic component and polyethylene. 4. The method for manufacturing a ceramic electronic component according to claim 1, wherein the base film has a lower peel strength on the back surface than on the front surface. 5. The method according to claim 1, wherein the release layer is formed using at least one of an acrylic resin, a melamine resin, an epoxy resin, and a silicone resin. 6. A first step of forming a plurality of conductor layers on the surface of a base film, winding the conductor layer together with the base film to form a conductor layer roll, and then forming the conductor layer roll. A second step of unwinding and transferring the conductor layer onto a ceramic sheet and then peeling the base film to form a plurality of ceramic sheets with a conductor layer; A third step of obtaining a laminate by laminating body layers so as to face each other with a ceramic sheet interposed therebetween, and a fifth step of thereafter firing the laminate, wherein the base film in the first step has a surface. And a method of manufacturing a ceramic electronic component using a release layer formed on the back surface. 7. The ceramic sheet used in the second step is also formed on a surface of a base film having release layers formed on both sides thereof, and then unwinds a ceramic sheet roll wound together with the base film. The manufacturing method of the ceramic electronic component described in the above. 8. The method according to claim 6, wherein the ceramic sheet used in the second step contains at least a ceramic component and polyethylene. 9. The method for manufacturing a ceramic electronic component according to claim 6, wherein a base film having a lower peel strength on the back surface than on the front surface is used. 10. The method according to claim 6, wherein the release layer is formed using at least one of an acrylic resin, a melamine resin, an epoxy resin, and a silicone resin.