JP2002198250A - Laminated electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated electronic component, in which an internal electrode layer is made thin and the degree of sintering in a dielectric layer is enhanced, and of which moisture resistance is superior. SOLUTION: This laminated electronic component is provided with external electrodes 3, connecting to internal electrode layers 5 on ends of an electronic component body 1, in which a dielectric layer 7 and an internal electrode layer 5 are laminated alternately. The internal electrode layer 5 is comprised of a mesh-like internal electrode layer 5a and a film-like internal electrode layer 5b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a multilayer electronic component, and more particularly to a multilayer electronic component used for a multilayer ceramic capacitor.

[0002]

2. Description of the Related Art In recent years, as electronic devices have become smaller and denser, multilayer electronic components, for example, multilayer electronic components, have been required to be smaller, have higher capacity, and have higher reliability. Attempts have been made to reduce the thickness of the dielectric layer and increase the number of layers, to reduce the thickness of the internal electrode layer, and to increase the dielectric constant of the dielectric layer. For example, the thickness of the dielectric layer is 5 μm or less, A high-capacity multilayer electronic component having 100 or more layers has been developed.

[0003] Such a laminated electronic component relates to thinning of internal electrode layers, for example, as disclosed in JP-A-2000-243.
The one disclosed in Japanese Patent Publication No. 650 is known.

[0004] The multilayer electronic component disclosed in this publication is
A metal film to be used as an internal electrode layer is formed on a film by a physical thin film forming method such as sputtering or vapor deposition, or a chemical thin film forming method such as electroless plating, and is transferred onto a dielectric green sheet. By forming an internal electrode pattern by doing, a laminated molded body obtained by laminating a plurality of dielectric green sheets on which the internal electrode pattern is formed,
The electronic component main body is manufactured by pressing and cutting and then firing, and thereafter, external electrodes are provided at both ends to produce a multilayer electronic component. The multilayer electronic component manufactured by such a manufacturing method can make the thickness of the internal electrode layer thinner than a conventional multilayer electronic component in which the internal electrode layer is formed by a screen printing method, and the delamination, cracks, etc. Internal structural defects can be suppressed.

[0005]

However, in the multilayer electronic component disclosed in Japanese Patent Application Laid-Open No. 2000-243650, the internal electrode layer is formed by a metal film formed by a manufacturing method such as a plating method or a sputtering method. Therefore, during firing, the laminated molded body is hardly shrunk, so that sintering of the dielectric layer is hindered, voids are generated in the dielectric layer, and not only large capacitance is not obtained, but also moisture resistance is deteriorated. There was a problem of doing.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a laminated electronic component having excellent moisture resistance as well as reducing the thickness of an internal electrode layer and enhancing the sinterability of a dielectric layer.

[0007]

Means for Solving the Problems] multilayer electronic component of the present invention, the end portion of the electronic component body, wherein dielectric layers and internal electrode layers are alternately laminated, the external electrode to which the internal electrode layers are connected It is important that the internal electrode layer is composed of a mesh-like internal electrode layer and a film-like internal electrode layer.

The effective area of the internal electrode layer can be increased by using the film-like internal electrode layer as the internal electrode layer of the laminated electronic component, while the use of the mesh-like internal electrode layer allows the high-density electronic component to be used. Since the main body can be obtained, an electronic component having a film-like internal electrode layer is formed by forming a mesh-like internal electrode layer having a higher firing shrinkage rate together with a film-like internal electrode layer inside a laminated electronic component. The mesh-like internal electrode layer compensates for the insufficient shrinkage of the dielectric layer of the main body by firing, the voids in the dielectric layer can be reduced, the capacitance of the multilayer electronic component can be increased, and the moisture resistance can be improved.

In the above-mentioned laminated electronic component, the relationship of n1 / (n1 + n2) ≧ 0.1 is satisfied, where n1 is the number of mesh-like internal electrode layers and n2 is the number of film-like internal electrode layers. Is desirable.

By satisfying the above relational expression, the effect of the mesh-like internal electrode layer having a higher firing shrinkage can be enhanced, and the firing shrinkage of the dielectric layer of the electronic component body can be increased. The capacitance and the moisture resistance can be further improved.

In the above-mentioned laminated electronic component, the thickness of the mesh-like internal electrode layer is t1, and the thickness of the film-like internal electrode layer is t2.
It is desirable to satisfy the relationship of t2 / t1 ≦ 0.75.

By forming the film-like internal electrode layer inside the laminated electronic component so that the thickness of the film-like internal electrode layer is smaller than the thickness of the mesh-like internal electrode layer, the film-like internal electrode layer resists shrinkage during firing of the dielectric layer. In addition to reducing the influence, the effect of higher firing shrinkage of the mesh-like internal electrode layer can be enhanced. Thus, to fully contract the dielectric layer, it is possible to obtain a high capacitance.

In the above-mentioned laminated electronic component, a plurality of film-like internal electrode layers are provided at the center of the electronic component body in the laminating direction, and a plurality of mesh-like internal electrode layers are respectively provided at both ends in the laminating direction of the electronic component main body. It is desirable to provide.

As described above, by forming a plurality of mesh-like internal electrode layers having higher firing shrinkage at both ends in the stacking direction of the multilayer electronic component, sintering of the outer peripheral portion of the electronic component body is promoted. Thus, the moisture resistance can be improved.

In the above-mentioned multilayer electronic component, it is preferable that two mesh-like internal electrode layers and two film-like internal electrode layers are alternately formed in the stacking direction of the electronic component body.

As described above, by alternately forming two internal electrode layers of the same type alternately, the mesh-like internal electrode layers on both sides compensate for the insufficient shrinkage of the dielectric layer in contact with the film-like internal electrode layers. Can be.

Further, since the film-like internal electrode layers and the mesh-like internal electrode layers can be alternately exposed and formed at both ends of the electronic component main body, the sinterability of both ends of the electronic component main body can be uniformly improved. In addition, deformation of the dielectric layer and deformation of the internal electrode layer due to shrinkage during firing can be reduced. Further, it is possible to make uniform the distribution of the internal stress generated in the dielectric layer,
Sintering of the dielectric layer can be promoted.

In the laminated electronic component, it is preferable that the mesh-like internal electrode layer is formed by applying a conductive paste, and the film-like internal electrode layer is formed by plating.

Since the film-like internal electrode layer is formed by the plating method, the internal electrode layer can be made uniform, so that the effective area increases and the capacitance can be easily increased.

On the other hand, since the mesh-like internal electrode layer is formed by applying a conductive paste containing metal powder, it is possible to easily form the internal electrode layer having a behavior in accordance with the firing shrinkage of the dielectric layer. Therefore, the capacitance can be increased and the moisture resistance can be improved by reducing the voids in the dielectric layer.

Furthermore, by coexisting these internal electrode layers, a laminated electronic component having high capacitance and good moisture resistance can be manufactured.

[0022]

One mode of the embodiment of the invention (Structure) A multilayer ceramic capacitor as multilayer electronic component of the present invention will be described in detail based on the schematic cross-sectional view of FIG.

The multilayer electronic component of the present invention is constructed by forming the external electrodes 3 at both ends of the electronic component body 1 of rectangular shape.

The electronic component body 1 has an internal electrode layer 5 and a dielectric layer 7 alternately laminated, and a dielectric layer 7 is provided on both sides of the laminated body.
And an insulating layer 9 made of the same material as described above.

In the multilayer electronic component of the present invention, the internal electrode layer 5 is composed of a plurality of mesh-like internal electrode layers 5a and a plurality of film-like internal electrode layers 5b. Internal electrode layers 5b are alternately stacked.

The mesh-like internal electrode layer 5a is formed as shown in FIG.
As shown in (2), the portions where the metal is lost are dispersed almost uniformly in a plane, and when viewed in cross section, the metal is formed by being discontinuously arranged and connected. For this reason, since the dielectric layer 7 enters the discontinuous mesh portion of the mesh-like internal electrode layer 5a and forms a connection between the dielectric layers 7, the internal electrode layer 5
And the dielectric layer 7 can be firmly bonded.

On the other hand, the film-like internal electrode layer 5b is formed as shown in FIG.
As shown in (1), the metal is formed in a uniform metal film with almost no metal deficiency in a plane, and when viewed in cross section, the metal is continuously connected and formed.
Therefore, the effective area of the internal electrode layer 5 can be increased, and the capacitance can be increased and stabilized.

Then, by combining the internal electrode layers 5 having the respective characteristics, a laminated electronic component having high capacity and high moisture resistance can be formed.

In the multilayer electronic component of the present invention, when the number of the mesh-like internal electrode layers 5a is n1 and the number of the film-like internal electrode layers 5b is n2, the layer number ratio is n1 / ( n1 + n
2) It is desirable to satisfy ≧ 0.1. In particular, by setting this layer number ratio in the range of 0.15 to 0.5, the contribution of the film-like internal electrode layer 5 b inside the electronic component body 1 is made. As a result, the shrinkage of the dielectric layer 5 of the electronic component body 1 due to firing can be increased by the formation of the mesh-like internal electrode layer 5a, thereby further improving the capacitance and moisture resistance. can do.

Further, the thickness of the mesh-like internal electrode layer 5a is t
1. When the thickness of the film-like internal electrode layer 5b is t2, the thickness ratio desirably satisfies the relationship of t2 / t1 ≦ 0.75, but more preferably, prevents the internal electrode layer 7 from being disconnected. In order to keep the effective area high, the thickness ratio is
It is preferably 0.4 to 0.7.

As described above, the thickness t2 of the film-like internal electrode layer 5b inside the multilayer electronic component is made smaller than the thickness t1 of the mesh-like internal electrode layer 5a, thereby forming a dielectric material. The effect of the film-like internal electrode layer 5b against the firing shrinkage of the layer 7 can be reduced, and the effect of higher firing shrinkage of the mesh-like internal electrode layer 5a can be enhanced.

The thickness t1 of the mesh-like internal electrode layer 5a
Is preferably 2 μm or less from the viewpoint of miniaturization of the multilayer electronic component. In order to prevent delamination by the internal electrode layer 5 and enhance reliability, the thickness is preferably in the range of 0.5 to 1.2 μm. desirable.

The thickness t1 of the mesh-like internal electrode layer 5a
Is preferably 0.2 μm or less in order to stabilize the capacitance and improve and stabilize the insulation resistance.

On the other hand, the thickness t2 of the film-like internal electrode layer 5b
Is desirably 1.5 μm or less. Internal electrode layer 5
From the viewpoint of preventing delamination due to the above, suppressing breakage of the internal electrode layer 5 and formation of holes, and improving reliability, it is particularly preferable that the thickness is in the range of 0.4 to 1.2 μm.

The thickness t of the film-like internal electrode layer 5b
The variation of 2 is preferably 0.15 μm or less for the purpose of stabilizing the capacitance and improving and stabilizing the insulation resistance.

(Production Method) Next, a method for producing the multilayer ceramic capacitor of the present invention will be described.

As the dielectric material, specifically, BaT
_{iO 3 -MnO-MgO-Y 2} O dielectric powder and sintering aid such ₃ can be suitably used. Of these dielectric materials,
BaTiO ₃ powder as a main raw material is synthesized by a solid phase method, a liquid phase method (such as a method passing through oxalate), a hydrothermal synthesis method, etc., of which the particle size distribution is narrow and the crystallinity is high. Hydrothermal synthesis is preferably used. And BaTi
The specific surface area of the O ₃ powder is 1.7~6.6 (m ² / g) are preferable.

As a method for forming a dielectric green sheet using the raw material powder having such a large specific surface area, a doctor blade method, a pulling method, a reverse roll coater method, a gravure coater method, and a screen printing method are preferably used. Used. In particular, a doctor blade method is used to form a thin dielectric green sheet.

Specifically, powders of these dielectric materials,
It is formed by applying a ceramic slurry containing an organic binder and an organic solvent on a carrier film, casting at a high speed, and drying.

The thickness of the dielectric green sheet formed by such a method is 12 μm or less, and particularly 1.5 to 5 μm for the reason of increasing the size and capacity of the multilayer electronic component.
It is desirable to be formed in the range of.

Next, a mesh-like internal electrode pattern to be a mesh-like internal electrode layer 5a is formed on the surface of the thinned dielectric green sheet.

This mesh-like internal electrode pattern is usually formed by screen printing. In addition, a doctor blade method, a reverse roll coater method, a gravure coater method, or the like can also be used.

The thickness of the mesh-like internal electrode pattern is 2.4 μm or less from the viewpoint of miniaturization and high reliability of the capacitor.
In particular, it is desirable to be in the range of 0.6 to 2.4 μm.

The conductor paste for forming the mesh-like internal electrode pattern is prepared by mixing a metal powder, an organic binder and an organic solvent.

As the metal powder used here, for example, a base metal such as Ni, Co, Cu or the like is used, and matching with the firing temperature of the dielectric material constituting the electronic component body,
Ni metal is used in terms of metal conductivity and cost.

The organic binder contained in the conductive paste forming the mesh-like internal electrode pattern has a high chemical solubility with the organic resin and the dielectric powder contained in the dielectric green sheet. Those having high adhesion to the body green sheet are preferred.

Further, the bonding property with the dielectric layer is improved, and
In order to control the firing shrinkage of the mesh-like internal electrode pattern, it is desirable that the conductor paste contains a ceramic powder having the same composition as that of the dielectric layer.

On the other hand, the film-like internal electrode pattern serving as the film-like internal electrode layer 5b is formed on a film that has been subjected to a surface treatment in advance by a chemical film forming method such as electroless plating, or by a physical film forming method such as a sputtering method or a vapor deposition method. A metal film is formed by a method.

In addition, a rolled metal film can be used as a film-like internal electrode pattern, and thus a film-like internal electrode pattern with few voids can be directly formed.

By transferring such a film-like internal electrode pattern to a dielectric green sheet, a dielectric green sheet on which the film-like internal electrode pattern is formed can be formed.

As described above, such a metal film pattern can be formed directly on a dielectric green sheet, instead of being formed on a film and then transferred onto a dielectric ceramic green sheet.

The thickness of the film-like internal electrode pattern is desirably 1.5 μm or less, particularly preferably in the range of 0.4 to 1.2 μm, from the viewpoint of miniaturization and high reliability of the laminated electronic component.

As the metal material, the same metal as used in the case of the mesh-like internal electrode pattern is used.
Base metals such as o and Cu are used, and Ni metal is used in terms of matching with the firing temperature of the dielectric material constituting the electronic component body 1, metal conductivity, and price. It is desirable to use the same metal material for the mesh-like internal electrode pattern and the film-like internal electrode pattern because it matches the firing temperature of the dielectric material.

Further, since the film-like internal electrode pattern does not contain an organic binder as in the case of the mesh-like internal electrode pattern, the adhesiveness with the dielectric green sheet is improved, and the dielectric layer 7 is laminated and pressed after lamination. In order to enable integration with the film-like internal electrode layer 5b, it is desirable that the surface of the film-like internal electrode pattern formed on the film on the metal film side is roughened. The surface roughness is preferably from 0.03 to 0.09 μm.

Further, by applying an adhesion liquid composed of a solvent or an organic resin that dissolves the organic binder contained in the dielectric green sheet to the surface of the film-like internal electrode pattern on the film, the film-like internal electrode pattern is formed. And the dielectric green sheet can also be improved in adhesion.

Further, when the dielectric green sheet on which the mesh-like internal electrode pattern is formed and the dielectric green sheet on which the film-like internal electrode pattern is formed are laminated in combination, the mesh-like internal electrode pattern Is desirably formed to have an effective area larger than that of the film-like internal electrode pattern. Thereby, the mesh-like internal electrode layer 5a formed by high firing shrinkage can be formed so as to have the same effective area as the film-like internal electrode layer 5b, and the deformation of the dielectric layer 7 can be suppressed to manufacture the electronic component body 1. . For the above reason, when the external area of the film-like internal electrode pattern is Af and the external area of the mesh-like internal electrode pattern is Am, the area ratio is Am / A.
It is desirable to form so as to satisfy f> 1.05.

Next, dielectric green sheets on which the mesh-like internal electrode patterns are formed and dielectric green sheets on which the film-like internal electrode patterns are formed are alternately laminated, and the internal electrode patterns are formed on the upper and lower surfaces thereof. A plurality of formed dielectric green sheets are laminated to form a laminated molded body.

Next, the molded laminate is cut into predetermined dimensions to form a molded electronic component body.

Next, this electronic component body molded body was
After de-buying at 500 to 800 ° C. in a low oxygen atmosphere of 0 to 300 ° C. or an oxygen partial pressure of 0.1 to 1 Pa, baking is performed at 1100 to 1300 ° C. for 2 to 3 hours in a non-oxidizing atmosphere, and the electronic component body 1 is to produce. On one end face of the electronic component body 1, an end face of the mesh-like internal electrode layer 5a is formed, and on the other end face, an end of the film-like internal electrode layer 5b is exposed.

Further, in order to obtain desired dielectric properties, the oxygen partial pressure is set to 90.degree. Under a low oxygen partial pressure of about 0.1 to 10.sup.- ⁴ Pa.
Heat treatment may be performed at 0 to 1100 ° C. for 3 to 10 hours.

Next, an external electrode paste is applied to the electronic component body 1, dried and baked to form an external electrode 3. As the external electrode 3, at least one selected from base metal elements and glass as a sintering aid
By using a conductive paste containing 0 to 20% by weight, adhesive bonding between the electronic component body 1 and the external electrode 3 can be improved.

[0062] It is desirable glass is a melting point of 800 ° C. or higher, for _{example, BaO-B 2 O 3 -SiO} 2 -ZnO
A glass frit acid resistance consisting -CaO-Al ₂ O ₃ system, the particle size is 10μm or less, the melting point is between 800 ° C. or higher.

The external electrodes 3 formed by baking are
For example, a Ni plating layer, a Sn plating layer, or a Sn—Pb alloy plating layer is formed in this order on the surface. These are to prevent solder erosion of the external electrode 3 and to supplement solder wettability.

The internal electrode 5 and the external electrode 3 do not necessarily have to be made of the same material.
Is preferably made of Ni and the external electrode 3 is made of Cu.

(Function) In the multilayer electronic component configured as described above, the internal electrode layer 5 is formed at the end of the electronic component body 1 in which the dielectric layers 7 and the internal electrode layers 5 are alternately laminated. In the multilayer electronic component in which external electrodes 3 to be connected are formed, the internal electrode layer 5 is a mesh-shaped internal electrode layer 5.
It is important that it is composed of a and the internal electrode layer 5b.

As described above, since both the mesh-shaped internal electrode layer 5a and the film-shaped internal electrode layer 5b are provided, insufficient firing shrinkage of the dielectric layer 7 of the electronic component body 1 having the film-shaped internal electrode layer 5b is achieved. Is compensated by the mesh-like internal electrode layer 5a, the voids in the dielectric layer 7 can be reduced, the capacitance of the multilayer electronic component can be increased, and the moisture resistance can be improved. In addition, since the deformation of the dielectric layer 7 in the lamination is small, the rate of occurrence of cracks and the rate of short circuits can be reduced.

FIG. 3 shows another embodiment of the multilayer electronic component of the present invention. In this multilayer electronic component, the film-like internal electrode layer 5b is arranged at the center of the electronic component body 1 in the stacking direction. By forming the same number of mesh-like internal electrode layers 5a on both upper and lower ends thereof, the sintering property is equalized above and below the electronic component body 1, and the outer peripheral portion of the electronic component body 1 is sintered. Promotes and improves moisture resistance.

FIG. 4 shows another embodiment of the multilayer electronic component of the present invention, in which two mesh-like internal electrode layers 5a and 5a are provided.
The layered film-like internal electrode layers 5b are alternately stacked. That is, when the mesh-like internal electrode layer 5a is A and the film-like internal electrode layer 5b is B, their arrangement is AABB in the stacking direction.
AABB... Are alternately formed every two layers.

In the multilayer electronic component configured as described above, the same type of internal electrode layers 5 are alternately formed every two layers, so that the firing shrinkage of the dielectric layer 7 in contact with the film-like internal electrode layer 5b is insufficient. Can be supplemented by the mesh-like internal electrode layers 5a on both sides.

Further, since the film-like internal electrode layers 5b and the mesh-like internal electrode layers 5a can be alternately exposed and formed at both ends of the electronic component main body 1, the sinterability of both ends of the electronic component main body 1 is uniformly improved. In addition, the deformation of the dielectric layer 7 and the deformation of the internal electrode layer 5 due to shrinkage during firing can be reduced. Further, the distribution of the internal stress generated in the dielectric layer 7 can be made uniform, and the sintering of the dielectric layer 7 can be promoted.

FIGS. 5 and 6 show still another embodiment of the multilayer electronic component of the present invention. FIG. 5 shows a structure in which the number of mesh-like internal electrode layers 5a is larger than the number of film-like internal electrode layers 5b. In this case, the high-density dielectric layer 7 can be formed even in the electronic component body 1 including the film-like internal electrode layer 5a, and in particular, a highly moisture-resistant laminated electronic component can be obtained. .

FIG. 6 shows a case of the electronic component body 1 having a structure in which the number of the film-like internal electrode layers 5b is larger than the number of the mesh-like internal electrode layers 5a.
A laminated electronic component that is thin and has particularly high capacitance can be obtained.

[0073]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First, BaTiO ₃ , MgCO ₃ , MnCO ₃
And Y ₂ O ₃ powder and CaO, Si as grain boundary phase components
A 9 μm-thick dielectric green sheet was prepared by preparing a ceramic slurry composed of O _{2 and the} like, and butyral resin and toluene as organic components, and applying this on a PET film by a doctor blade method.

Next, this dielectric green sheet is made of PET.
After peeling from the film, ten sheets were laminated to form an end face green sheet layer, and after drying these end face green sheet layers, the end face green sheet layer was placed on a base plate and pressed by a press machine. I glued it on the base plate.

On the other hand, the same ceramic slurry as described above was applied on a PET film by a doctor blade method, and dried to form a dielectric green sheet having a thickness of 3.5 μm.

Next, Ni powder having an average particle size of 0.2 μm, ethyl cellulose, and an organic vehicle were kneaded with three rolls to prepare a conductor paste.

Thereafter, the above-mentioned conductor paste is printed on one main surface of the obtained dielectric green sheet by using a screen printing apparatus, dried, and peeled off to form a dielectric on which a mesh-like internal electrode pattern is formed. A body green sheet was prepared.

On the other hand, a Ni thin film pattern was formed on a PET film by a sputtering method, transferred to a ceramic green sheet, and then peeled off to produce a dielectric green sheet on which a film-like internal electrode pattern was formed. did.

Thereafter, a dielectric green sheet on which a mesh-like internal electrode pattern is formed and a dielectric green sheet on which a film-like internal electrode pattern is formed are laminated in a predetermined order on the end face green sheet layer. Thereafter, an end face green sheet layer was further laminated to produce a temporary laminate.

Next, the temporary laminated body was placed on a mold, and the pressure was increased stepwise from the laminating direction by a pressing plate of a press machine, and the laminated body was produced by pressing. Thereafter, the laminated molded body was cut into a predetermined chip shape to produce an electronic component body molded body.

Next, the substrate was heated to 300 ° C. in the air or 500 ° C. in an oxygen / nitrogen atmosphere of 0.1 Pa to remove the copper. Further, in an oxygen / nitrogen atmosphere of 10 ^-7 Pa, 130
Baking at 0 ° C. for 2 hours, and heat treatment at 1000 ° C. in an oxygen / nitrogen atmosphere of 10 ⁻² Pa, and
I got

[0082] Thereafter, a Cu paste was applied to the end surface of the electronic component body 1, baked at 900 ° C., further Ni / Sn
The external electrodes 3 connected to the internal electrode layers 5 were formed by plating, and laminated electronic components having different layer number ratios and thickness ratios as shown in Table 1 were produced.

The electronic component main body 1 (FIG. 7) manufactured only with the film-like internal electrode layer 5b and the electronic component main body 1 (FIG. 8) manufactured only with the mesh-like internal electrode layer 5a were manufactured as comparative samples. did.

The thickness of the dielectric layer 7 interposed between the internal electrode layers 5 of the multilayer ceramic capacitor thus obtained was 3 μm, and the effective number of the dielectric layers 7 was 199.

Next, the capacitance of each of the 1000 samples thus prepared was measured at a frequency of 1 kHz and an AC voltage of 1 V using a capacitance meter, and the short circuit rate was also evaluated.

After a test was conducted for 1000 hours at a temperature of 65 ° C., a relative humidity of 95% and an applied voltage of 10 V, the insulation resistance was measured with an insulation resistance meter, and the number of failures in the humidity resistance test was counted. Table 1 shows the results.

[0087]

[Table 1]

As is clear from the results shown in Table 1, the sample No. of the present invention having both the mesh-like internal electrode layer 5a and the film-like internal electrode layer 5b. 1, 3, 7 and 9 to 14, the short-circuit rate was 2% or less, the capacitance was 2.2 μF or more, and the number of failures in the humidity resistance test was 1/1000 (0.1%) or less. Could be improved.

Further, the sample No. 1 in which the film-like internal electrode layer 5b was disposed at the center of the electronic component body 1 and the mesh-like internal electrode layers 5a were formed at both ends in the laminating direction. In the samples of Nos. 3 to 7, the capacitance was able to be increased when the layer number ratio of the mesh-like internal electrode layer 5a was up to 0.6.

In the sample No. in which the thickness of the mesh-like internal electrode layer 5a and the thickness of the film-like internal electrode layer 5b were simultaneously changed at the same ratio at the layer number ratio of 0.4. In Nos. 9 to 11, the smaller the thickness of the internal electrode layer 5, the higher the capacitance.

The sample No. 1 was formed by laminating the mesh-like internal electrode layer 5a and the film-like internal electrode layer 5b every two layers. 1
In No. 2, the characteristics of the multilayer capacitor could be improved.

On the other hand, Sample No. containing only the film-like internal electrode layer 5b was used. In sample No. 2, since the sintering of the porcelain was insufficient during firing, the capacitance was low and the number of failures in the moisture resistance test was large.

The sample No. containing only the mesh-like internal electrode layer 5b was used. In No. 8, the effective area of the internal electrode layer 5 was small, the capacitance was small, and the short-circuit rate was large.

[0094]

The multilayer electronic component of the present invention has a film-like internal electrode layer having a higher firing shrinkage rate together with a film-like internal electrode layer inside the multilayer electronic component. The mesh-like internal electrode layer compensates for the insufficient shrinkage of the dielectric layer of the electronic component body provided with the layers, thereby reducing voids in the dielectric layer, increasing the capacitance of the multilayer electronic component, and improving the moisture resistance. Can be improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a multilayer electronic component of the present invention in which a mesh-like internal electrode layer and a film-like internal electrode layer are alternately provided every other layer.

2A is a schematic plan view showing a mesh-like internal electrode layer formed on a dielectric layer, and FIG. 2B is a schematic plan view showing a film-like internal electrode layer formed on a dielectric layer.

FIG. 3 is another laminated electronic component of the present invention in which a film-like internal electrode layer is formed at the center of the electronic component body in the laminating direction, and a mesh-like internal electrode layer is formed above and below the film-like internal electrode layer. FIG.

FIG. 4 shows that a film-like internal electrode layer and a mesh-like internal electrode layer
It is sectional drawing which shows the other laminated electronic component of this invention formed by providing alternately for every layer.

FIG. 5 shows another laminated electronic device according to the present invention in which three mesh-like internal electrode layers and one film-like internal electrode layer are alternately provided, and the number ratio of the mesh-like internal electrode layers is increased. It is sectional drawing which shows a component.

FIG. 6 shows another laminated electronic device according to the present invention in which three film-like internal electrode layers and one mesh-like internal electrode layer are alternately provided, and the number ratio of the film-like internal electrode layers is increased. It is sectional drawing which shows a component.

FIG. 7 is a cross-sectional view showing a conventional multilayer electronic component using only a film-like internal electrode layer.

FIG. 8 is a cross-sectional view showing a conventional multilayer electronic component using only a mesh-like internal electrode layer.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 electronic component main body 3 external electrode 5 internal electrode layer 5 a mesh internal electrode layer 5 b film internal electrode layer 7 dielectric layer 9 insulating layer

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference)

Claims (6)

[Claims] 1. A laminated electronic component comprising an external electrode connected to said internal electrode layer at an end of an electronic component body in which dielectric layers and internal electrode layers are alternately laminated. A multilayer electronic component, wherein the electrode layer is composed of a mesh-like internal electrode layer and a film-like internal electrode layer. 2. When the number of mesh-like internal electrode layers is n1 and the number of film-like internal electrode layers is n2, n1 / (n1 + n2).
2. The multilayer electronic component according to claim 1, wherein a relationship of ≧ 0.1 is satisfied. 3. The thickness ratio when the thickness of the mesh-like internal electrode layer is t1 and the thickness of the film-like internal electrode layer is t2 is t2 / t1.
2. The relationship of .ltoreq.0.75 is satisfied.
Or the laminated electronic component of 2. 4. A plurality of film-like internal electrode layers are provided at the center of the electronic component body in the laminating direction, and a plurality of mesh-like internal electrode layers are provided at both ends in the laminating direction of the electronic component body. The multilayer electronic component according to any one of claims 1 to 3, wherein 5. The electronic device according to claim 1, wherein two mesh-like internal electrode layers and two film-like internal electrode layers are alternately formed in the stacking direction of the electronic component body. The multilayer electronic component according to any one of the above. 6. The method according to claim 1, wherein the mesh-like internal electrode layer is formed by applying a conductive paste, and the film-like internal electrode layer is formed by plating. Laminated electronic components.