CN1960604A

CN1960604A - Method for handling electric circuitry, and structure

Info

Publication number: CN1960604A
Application number: CN 200510117511
Authority: CN
Inventors: 何建汉
Original assignee: Individual
Current assignee: Individual
Priority date: 2005-11-02
Filing date: 2005-11-02
Publication date: 2007-05-09

Abstract

The method comprises: in the first, providing an insulated baseboard; etching a groove of circuit on the insulated baseboard; filling in a first colloid in the groove of circuit used for generating bridge-erecting action with the insulated colloid; finally, filling in a second colloid capable of generating chemical reaction with the first colloid to form a wire colloid in the groove of circuit.

Description

The manufacture method of conducting wire and structure

Technical field

The present invention refers to the conducting wire by first colloid and the formed lead colloid of second colloid especially about a kind of manufacture method and structure of conducting wire.

Background technology

Printed circuit board (PCB) is according to circuit design, and the electric wiring of connecting circuit part is depicted as wiring figure, and then in modes such as the machining of designing institute appointment, surface treatments, makes electric conductor reappear the circuit board that is constituted on insulator.In other words, printed circuit board (PCB) promptly is meant collocation electronic component substrate before.

Known printed circuit board (PCB) is by after sticking in copper foil layer on the insulated baseboard earlier, utilizes as boring, development etching supervisor, and forms the conducting wire.

Yet this kind well known practice because a good insulation performance body is not isolated between circuit and the circuit, causes the insulation values between circuit not high enough easily, easily produces interference phenomenon.When if the insulation values between circuit is not high enough, have to strengthens spacing distance between circuit in order to keep away interference, but so just can't improve the density of configuration, the overall volume that also can't dwindle finished product.Moreover, since known only be Copper Foil to be sticked on the insulated substrate by emplastic, so, be easy to because time one is long or other factors, the Copper Foil that causes being attached on the insulated baseboard comes off, and then causes opening circuit of conducting wire.In addition, employed etching solution during for the making conducting wire is also made public hazards easily.

Summary of the invention

Main purpose of the present invention is in manufacture method that a kind of conducting wire is provided and structure, groove by the conducting wire of in insulated baseboard, being carved out, in the conducting wire that wherein forms the lead colloid, be replaced in the wire line that forms Copper Foil on the insulated baseboard, and improve the insulation values between circuit.

Another object of the present invention improves the density of configuration in manufacture method that a kind of conducting wire is provided and structure.

Another object of the present invention avoids the conducting wire to open circuit because of Copper Foil comes off in manufacture method that a kind of conducting wire is provided and structure.

Another object of the present invention avoids using etching solution to make public hazards in manufacture method that a kind of conducting wire is provided and structure.

Another object of the present invention by the minimizing fabrication steps, and reduces cost of manufacture in manufacture method that a kind of conducting wire is provided and structure.

Based on above-mentioned purpose, the invention provides a kind of manufacture method and structure of conducting wire.Manufacture method disclosed in this invention is: at first, provide an insulated baseboard; Then, in insulated baseboard, carve out the groove of conducting wire; Then, insert and to produce first colloid of bridging action in the groove of conducting wire with insulated baseboard; At last, insert and to produce second colloid of chemical change with first colloid, and in the groove of conducting wire, form the lead colloid.

Can be further understood by the following detailed description and accompanying drawings about the advantages and spirit of the present invention.

Description of drawings

Figure 1A～1C is the schematic diagram of the manufacture method of conducting wire of the present invention.

Among the figure

10 insulated baseboards, the groove of 12 conducting wires, 14 first colloids, 16 lead colloids

Embodiment

See also Figure 1A～1C, Figure 1A～1C figure is the schematic diagram of the manufacture method of conducting wire of the present invention.The structure of the conducting wire of of the present invention conductivity colloid 16 of formation shown in 1C figure mainly can be divided into three steps, promptly form groove 12, first colloid 14 of formation shown in 1B figure of the conducting wire shown in 1A figure, form the conducting wire of the conductivity colloid 16 shown in 1C figure.

Conductivity colloid 16 is by first colloid 14 and can to produce the second colloid (not shown) of chemical change each other formed with first colloid 14, and this chemical change makes second colloid and first colloid 14 that belongs to gluey attitude originally, forms solid-state lead colloid 16 in the groove 12 of conducting wire.First colloid 14 of the present invention and second colloid can be section's super Buddhist nun's gram (Cotronics) electron conduction epoxy compounds that company provided (Electrically Conductive Epoxies).Use for convenient, super Buddhist nun's gram (Cotronics) company of section can provide two unmixing first colloids 14 and second colloid in advance, then, successively inserts the groove 12 of conducting wire in the suitable fabrication steps of the present invention.What need special declaration is, first colloid 14 used in the present invention and second colloid and unrestricted can only use section super Buddhist nun's gram (Cotronics) company provided, all can use as long as can satisfy the colloid of the required requirement of manufacture method of the present invention (not having electronic conduction ability after promptly two colloids can not solidify, mix before unmixed).

Shown in 1A figure, the manufacture method of conducting wire of the present invention at first, according to the design of conducting wire, by the engraving means as laser or machining, is carved out the groove 12 of conducting wire in insulated baseboard 10 on the insulated baseboard 10 of printed circuit board (PCB).

Then, utilize inkjet technology (Inkjet technology) for example or small fine rule spraying technology that half tone provided, and insert and to produce in first colloid 14 of bridging actions with insulated baseboard 10, shown in 1B figure in the groove 12 of conducting wire.After the groove 12 of conducting wire forms first colloid 14, need check still whether first colloid 14 has discontinuous situation in the groove 12 of conducting wire, and, clean not first colloid 14 in the groove 12 of conducting wire.

Why first colloid 14 needs and can produce bridging action with insulated baseboard 10, be to bite insulated baseboard 10 tightly for the conducting wire of the lead colloid 16 that makes follow-up formation, avoid in the known technology, the conducting wire of Copper Foil can come off, and then causes situation about opening circuit.

Shown in 1C figure, inserting and to produce second colloid of chemical change with first colloid 14, and in the groove 12 of conducting wire, forming the conducting wire of lead colloid 16.Similarly, after this, clean not second colloid in the groove 12 of conducting wire, promptly avoid producing between the circuit unnecessary path situation.

So far, finished the structure of the conducting wire of conductivity colloid 16 of the present invention.Therefore, the present invention is just by the groove 12 of the conducting wire of being carved out in insulated baseboard 10, in the conducting wire that wherein forms lead colloid 16, be replaced in the wire line that forms Copper Foil on the insulated baseboard 10, and, improve the insulation values between circuit because all have insulation values between circuit originally with regard to the sidewall of very high insulated baseboard 10.Simultaneously, also can therefore improve the density of configuration.In addition, also because manufacture method of the present invention need not use etching solution fully, avoid using etching solution to make public hazards.And compared with known technology, manufacture method of the present invention clearly reduces steps such as development, etching, and reduces cost of manufacture.

At last, based on the ability of reinforcement conducting channel of the present invention, and on the lead colloid 16 shown in 1C figure, conductive materials is coated with thereon, or forms the metallic conduction circuit thereon in the mode of plating or evaporation with spraying method in conductivity.

By the above detailed description of preferred embodiments, hope can be known description feature of the present invention and spirit more, and is not to come category of the present invention is limited with above-mentioned disclosed preferred embodiment.On the contrary, its objective is that hope can contain various changes and have in the category of claim of being arranged in of equality institute of the present invention desire application.

Claims

1. the manufacture method of a conducting wire, in order to produce the conducting wire at printed circuit board (PCB), this manufacture method comprises at least:

Insulated baseboard is provided;

According to the design of this conducting wire, in this insulated baseboard, carve out the groove of this conducting wire by the engraving means;

Insert and to produce first colloid of bridging action in the groove of this conducting wire with this insulated baseboard; And

Insert and can produce second colloid of chemical change with this first colloid, and form the lead colloid in the groove of this conducting wire, this conductivity colloid promptly is this conducting wire.

2. the manufacture method of conducting wire as claimed in claim 1 wherein on this lead colloid in the groove of this conducting wire, forms the metallic conduction circuit in the mode of electroplating.

3. the manufacture method of conducting wire as claimed in claim 1, wherein insert this first colloid in the groove of this conducting wire after, this manufacture method further comprises:

Clean not first colloid of this in the groove of this conducting wire.

4. the manufacture method of conducting wire as claimed in claim 1, wherein in the groove of this conducting wire, form this lead colloid inserting this second colloid after, this manufacture method further comprises:

Clean not second colloid of this in the groove of this conducting wire.

5. the manufacture method of conducting wire as claimed in claim 1, wherein this chemical change of being produced of this second colloid and this first colloid mainly is, make this second colloid and this first colloid that belong to gluey attitude originally, in the groove of this conducting wire, form this solid-state lead colloid.

6. the structure of a conducting wire forms the conducting wire on the insulated baseboard of printed circuit board (PCB), it is characterized in that,

In the groove of this conducting wire of in this insulated baseboard, being carved out, has the lead colloid, this conductivity colloid promptly is this conducting wire, this lead colloid is formed by first colloid that can produce chemical change each other and second colloid, and this first colloid can produce bridging action with this insulated baseboard.

7. the structure of conducting wire as claimed in claim 6, wherein this chemical change of being produced of this second colloid and this first colloid mainly is, make this second colloid and this first colloid that belong to gluey attitude originally, in the groove of this conducting wire, form this solid-state lead colloid.

8. the structure of conducting wire as claimed in claim 6 wherein on this lead colloid in the groove of this conducting wire, has the metallic conduction circuit that forms by plating.