CN207219157U - The rigid-flexible harden structure of ladder - Google Patents
The rigid-flexible harden structure of ladder Download PDFInfo
- Publication number
- CN207219157U CN207219157U CN201721059525.8U CN201721059525U CN207219157U CN 207219157 U CN207219157 U CN 207219157U CN 201721059525 U CN201721059525 U CN 201721059525U CN 207219157 U CN207219157 U CN 207219157U
- Authority
- CN
- China
- Prior art keywords
- rigid
- solder mask
- region
- protection materials
- rigid region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a kind of rigid-flexible harden structure of ladder, including：First rigid region, the second rigid region, the flexure region for connecting the first rigid region and the second rigid region, the thickness of first rigid region is more than the thickness of the second rigid region, and first rigid region is set with second rigid region in stepped；The cascaded surface of second rigid region is provided with solder mask, and one layer of strippable protection materials are covered on the solder mask.The utility model will together be taken off after the rigid-flex board of hierarchic structure is pressed coated in the protection materials on solder mask and impression, expose the ladder welding resistance interface without any impression, and convenient, reliably to solve the problems, such as this region solder mask is weighed wounded.
Description
Technical field
Electronic applications are the utility model is related to, more particularly, to a kind of rigid-flexible harden structure of ladder.
Background technology
As electronic product develops rapidly to the direction of miniaturization, densification, high integration and multifunction, to printing
Wiring board requirement also more and more higher, except densification, high layering and complicated outside the pale of civilization, also require that part is rigid-flexible
Plate needs the rigid regions of two or more different-thickness preferably to match the installation of client.
High density ladder rigid-flex board is a kind of two or more thickness for including thick rigid region and thin rigid region
Hierarchic structure.And the hierarchic structure of thin rigid region is in when internal layer makes and just needs to make solder mask in advance, otherwise rank
Terraced structure can not carry out welding resistance making after producing, and the solder mask in this region easily wipes flower by trough rim or thin ladder slot area dust
Or weigh wounded and cause to scrap.
Utility model content
Based on this, the utility model is the solder mask easily quilt of the thin rigid region for the ladder rigid-flex board for overcoming prior art
Trough rim or thin ladder slot area dust, which are wiped flower or weighed wounded, produces the defects of impression causes to scrap, there is provided a kind of ladder is rigid-flexible hardened
Structure.
Its technical scheme is as follows：
A kind of rigid-flexible harden structure of ladder, including：First rigid region, the second rigid region, connection the first rigid region and
The flexure region of second rigid region, the thickness of first rigid region are more than the thickness of the second rigid region, and described the
One rigid region is set with second rigid region in stepped；The cascaded surface of second rigid region is provided with welding resistance
Layer, and one layer of strippable protection materials are covered on the solder mask.
The technical program after the rigid-flex board of hierarchic structure is pressed, by coated in the protection materials on solder mask and
Impression is together taken off, exposes the ladder welding resistance interface without any impression, and convenient, reliably to solve this region solder mask is weighed wounded
The problem of.
In one of the embodiments, the protection materials are high temperature resistant peelable glue.
In one of the embodiments, the solder mask is completely covered in the protection materials.
In one of the embodiments, projected area of the protection materials on solder mask is more than the face of the solder mask
Product.
In one of the embodiments, between projected outline and solder mask profile of the protection materials on solder mask
Interval is at least 0.2mm.
In one of the embodiments, the profile of the projected outline on solder mask of the protection materials and solder mask it
Between the scope of spacing distance be 0.2mm-1.0mm.
In one of the embodiments, the thickness range of the protection materials is 0.03mm-0.5mm.
In one of the embodiments, the thickness of the protection materials is 0.05mm.
In one of the embodiments, pad or hole, the pad are additionally provided with the cascaded surface of second rigid region
Or one layer of strippable protection materials are covered on hole.
The beneficial effects of the utility model are：
The utility model after the rigid-flex board of hierarchic structure is pressed, by coated in the protection materials on solder mask and
Impression is together taken off, exposes the ladder welding resistance interface without any impression, and convenient, reliably to solve this region solder mask is weighed wounded
The problem of.
And because strippable protection materials are high temperature resistant peelable glue, it has the characteristic being easily peeled off, and will not occur
Degumming enters the problem of hole or viscose glue, ensures that the solder mask surface treatment after degumming is smooth.
Brief description of the drawings
Fig. 1 is the schematic diagram of the rigid-flexible harden structure of ladder of the present utility model.
Description of reference numerals：
10th, the first rigid region；20th, the second rigid region；30th, flexure region；40th, solder mask；50th, protection materials；60、
Pad.
Embodiment
It is below in conjunction with accompanying drawing and specifically real for the purpose of this utility model, technical scheme and advantage is more clearly understood
Mode is applied, the utility model is described in further detail.It should be appreciated that embodiment described herein
Only to explain the utility model, the scope of protection of the utility model is not limited.
The rigid-flexible harden structure of a kind of ladder as shown in Figure 1, including：First rigid region 10, the second rigid region 20, connection
The flexure region 30 of first rigid region 10 and the second rigid region 20, the thickness of first rigid region 10 are firm more than second
Property region 20 thickness, and first rigid region 10 and second rigid region 20 are set in stepped；Described second
The cascaded surface of rigid region 20 is provided with solder mask 40, and one layer of strippable protection materials 50 are covered on the solder mask 40.
Present embodiment is after the rigid-flex board of above-mentioned hierarchic structure is pressed, by coated in the protection on solder mask 40
Impression on material 50 and protection materials 50 is together taken off, exposes the ladder welding resistance interface i.e. solder mask 40 without any impression, side
Just the solder mask 40 for, reliably solving the problems, such as this region is weighed wounded.
Further, since it is covered with the protected material on the solder mask 40 of thin rigid region in second rigid region 20
Material 50, the solder mask 40 on thin rigid region are also resolved the problem of excessive glue, need to only be taken the protection materials 50 off, i.e.,
Excessive glue on solder mask 40 can together be removed, improve the yield of hierarchic structure rigid-flex board.
Further, the protection materials 50 are high temperature resistant peelable glue.Because strippable protection materials 50 are high temperature resistant
The problem of peelable glue, it has the characteristic being easily peeled off, will not be not easily stripped, and degumming enters hole or viscose glue, after ensureing degumming
The surface treatment of solder mask 40 it is smooth, and its resistant to elevated temperatures characteristic meet rigid-flex board make process requirements.
Further, in order to ensure that whole solder masks is not weighed wounded, the resistance need to be completely covered in the protection materials
Layer.Preferably, projected area of the protection materials 50 on solder mask 40 is more than the area of the solder mask 40.It is i.e. described
The profile that the solder mask 40 and protection materials are completely covered in protection materials 50 exceeds the profile of solder mask 40；And the protection
Interval between projected outline and the profile of solder mask 40 of the material 50 on solder mask 40 is at least 0.2mm.Preferably, the guarantor
The scope of spacing distance is 0.2mm- between the projected outline on solder mask 40 of protective material 50 and the profile of solder mask 40
1.0mm, it both ensure that solder mask was not weighed wounded, the waste of protection materials will not be caused again.
In addition, the thickness range of the protection materials 50 is 0.03mm-0.5mm.Protection materials 50 within this range are easy
In stripping, and its thickness ensure that the solder mask 40 positioned at lower floor is not weighed wounded.Preferably, the thickness of the protection materials 50 is
0.05mm.At the position easily weighed wounded or pressing dynamics are larger, it can also suitably increase the thickness of the protection materials 50, avoid
Solder mask 40 below is weighed wounded.
Further, pad 60 or hole, the pad 60 or hole are additionally provided with the cascaded surface of second rigid region 20
One layer of strippable protection materials 50 of upper covering.It ensure that the pad 60 on the cascaded surface of the second rigid region 20 or hole are not wiped
Flower weighs wounded, ensures welding quality.And present embodiment uses high temperature resistant peelable glue rather than PI glue (polyimides glue), PI glue
Although high temperature resistant, its peelable performance is bad；And peelable glue and the associativity of solder mask 40 are good, and when throwing off protection materials 50 again not
Degumming be present and enter hole and the problem of welding resistance is stained with degumming, strippable property is preferable, ensure that whole solder mask 40, pad 60 or the product in hole
Matter and outward appearance, avoid solder mask 40 of the welding resistance of thin ladder slot area i.e. on the second rigid region 20 from being weighed wounded by trough rim, also keep away
The glue stain for having exempted to be laminated, which is sticked on solder mask 40 or pad 60, causes open defect.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this area
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (9)
- A kind of 1. rigid-flexible harden structure of ladder, it is characterised in that including：First rigid region, the second rigid region, connection first are firm Property region and the second rigid region flexure region, the thickness of first rigid region is more than the thickness of the second rigid region, And first rigid region is set with second rigid region in stepped；Set on the cascaded surface of second rigid region There is solder mask, and one layer of strippable protection materials are covered on the solder mask.
- 2. the rigid-flexible harden structure of ladder according to claim 1, it is characterised in that the protection materials are that high temperature resistant is peelable Glue.
- 3. the rigid-flexible harden structure of ladder according to claim 1, it is characterised in that the resistance is completely covered in the protection materials Layer.
- 4. the rigid-flexible harden structure of ladder according to claim 1, it is characterised in that throwing of the protection materials on solder mask Shadow area is more than the area of the solder mask.
- 5. the rigid-flexible harden structure of ladder according to claim 1, it is characterised in that throwing of the protection materials on solder mask Interval between shadow profile and solder mask profile is at least 0.2mm.
- 6. the rigid-flexible harden structure of ladder according to claim 1, it is characterised in that the protection materials on solder mask The scope of spacing distance is 0.2mm-1.0mm between projected outline and the profile of solder mask.
- 7. the rigid-flexible harden structure of ladder according to claim 1, it is characterised in that the thickness range of the protection materials is 0.03mm-0.5mm。
- 8. the rigid-flexible harden structure of ladder according to claim 7, it is characterised in that the thickness of the protection materials is 0.05mm。
- 9. the rigid-flexible harden structure of ladder according to claim any one of 1-8, it is characterised in that second rigid region Pad or hole are additionally provided with cascaded surface, one layer of strippable protection materials are covered on the pad or hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721059525.8U CN207219157U (en) | 2017-08-23 | 2017-08-23 | The rigid-flexible harden structure of ladder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721059525.8U CN207219157U (en) | 2017-08-23 | 2017-08-23 | The rigid-flexible harden structure of ladder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207219157U true CN207219157U (en) | 2018-04-10 |
Family
ID=61816259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721059525.8U Active CN207219157U (en) | 2017-08-23 | 2017-08-23 | The rigid-flexible harden structure of ladder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207219157U (en) |
-
2017
- 2017-08-23 CN CN201721059525.8U patent/CN207219157U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101610645B (en) | Method for manufacturing flexible-rigid plate | |
| CN103547081B (en) | Resistance welding processing method, system and the circuit board of a kind of super thick copper foil circuit board | |
| CN104202922B (en) | Method for manufacturing rigid-flex printed circuit board with rigid areas different in thickness | |
| CN101296562A (en) | Copper foil substrates and method for making flexible printed circuit board of the same | |
| CN107809855A (en) | The preparation method of one species support plate | |
| CN106961810A (en) | A kind of production method using the Rigid Flex finished product of pressing production twice | |
| CN105050325A (en) | Rigid-flex printed circuit board milling method | |
| CN207219157U (en) | The rigid-flexible harden structure of ladder | |
| CN110430674A (en) | A kind of preparation method of electroplating deposition circuit board | |
| CN203708621U (en) | Ultrathin single-sided flexible printed circuit board | |
| TWI413467B (en) | Fabrication method of rigid-flex circuit board | |
| CN105916291B (en) | A kind of production method of high-density interconnected printed circuit board | |
| CN203618215U (en) | Plate structure for preventing warpage of ladder type printed circuit board | |
| CN103929885B (en) | The processing method for protecting PCB stepped plate step surface line patterns | |
| TWI286917B (en) | Thermal bonding structure and manufacture process of flexible printed circuit (FPC) | |
| CN103338599B (en) | A kind of Rigid Flex processing technology | |
| CN206164973U (en) | Use thermosetting green oil's resistant flexible circuit board who buckles | |
| TWI661757B (en) | Printed circuit board and method for manufacturing the same | |
| CN106028685A (en) | Manufacturing method of flexible circuit board employing ink instead of adhesive tape and flexible circuit board | |
| JPH0258885A (en) | Copper clad insulating film for printed wiring board | |
| CN201274603Y (en) | Soft and hard composite board | |
| CN206237670U (en) | Metallization flexible base plate | |
| CN206452594U (en) | A kind of use liquid photosensitive PI flexible electric circuit board | |
| CN205491428U (en) | Hot pressing laminating flexible circuit board | |
| WO2022006792A1 (en) | Preparation method for electroplated circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |