WO2000052975A1 - Circuit board printer - Google Patents
Circuit board printer Download PDFInfo
- Publication number
- WO2000052975A1 WO2000052975A1 PCT/GB2000/000776 GB0000776W WO0052975A1 WO 2000052975 A1 WO2000052975 A1 WO 2000052975A1 GB 0000776 W GB0000776 W GB 0000776W WO 0052975 A1 WO0052975 A1 WO 0052975A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- substrate
- conductive material
- printer
- board printer
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/102—Using microwaves, e.g. for curing ink patterns or adhesive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
Definitions
- This invention relates to a circuit board printer, and in particular although not exclusively to an in-house printer controlled by a computer to produce prototype circuit boards according to a computer aided design (CAD) .
- This invention also extends to a deposition means for printing circuit boards, and a method of printing circuit boards (PCBs) .
- PCBs are increasingly used in a wide range of electrical equipment .
- PCBs provide a basis for and connection between a variety of discrete components such as resistors, capacitors and microprocessors.
- a PCB comprises a substrate of electrically insulating material, such as epoxy glass (FR-4) , upon which is formed a circuit pattern of electrically conducting material such as copper.
- Circuits can be printed on both sides of a PCB, with two sides being electrically connected by "through-holes".
- PCB production method includes precoating a substance with a conductive material, printing a circuit pattern on to this using a chemically resistant material, etching away unwanted conductive material, and then removing the chemically resistant material.
- a second example of a PCB production method uses an "additive" technique in which a circuit pattern is formed by an initial use of electroless plating of copper followed by electroplating to achieve the required copper thickness. The method is controlled so that plating coats only where required. Again, this method is both inefficient in terms of chemicals and materials required, and is particularly time consuming. These factors make it unsuitable for prototype production, particularly when a large number of prototypes need to be rapidly produced and tested. It can take several days to order a prototype made by such a conventional PCB production method, which may constitute significant lost lead time.
- a circuit board printer comprising a housing and, within the housing:
- the circuit board printer according to the present invention offers several advantages over prior art apparatus for the production of PCBs. Firstly, the number of components required to produce the PCB is reduced compared to examples in the prior art which require numerous equipment associated with extra mechanical and chemical processing of the board. The components themselves are all adaptable to be of a size which can fit within an enclosure comparable in size to a photocopying machine. This enables prototypes to be produced "in-house” rather than ordering the production of prototypes from a large-scale PCB manufacturer. Reduction in the complexity of the apparatus results in a concomitant reduction in the speed and cost of production, vital to the production of prototypes.
- a curable conductive material preferably polymeric
- the curable polymeric conductive material is particularly versatile, and can be applied in the polymeric state or substantially so.
- the flow characteristics of the material are adaptable by addition of certain additives or by partial polymerisation.
- the material can normally be applied in a cold state thereby avoiding problems associated with the handling of heated metal- based materials as typically found in the prior art .
- the material has especially strong adhesive properties .
- the material is not prone to clogging of holes or "bridging" between holes as is a problem with many prior art materials. Deposition of the material can be extremely accurate. Previously, it has been difficult or impossible to fill holes with a diameter less than approximately 50 micrometers, with holes averaging in size between 250 to 100 microns.
- Use of the polymeric conductive material according to the present invention alleviates these problems.
- the circuit board printer is controlled by a computer program operating in relation to computer aided design.
- This option offers considerable flexibility, accuracy and speed; particularly important for prototype production.
- computer control results in a high degree of reproductivity in relation to the prototypes themselves and also the relocation of previously drilled holes.
- a substrate loader for the storing of uncut substrates, cut substrates and insulating layers; respectively.
- a substrate unloader for the storing of uncut substrates, cut substrates and insulating layers; respectively.
- a substrate unloader for the storing of uncut substrates, cut substrates and insulating layers; respectively.
- a insulating layer loader for the storing of uncut substrates, cut substrates and insulating layers; respectively.
- the cutting means includes a laser, a drill, and/or a milling device.
- a cleaning means is preferably included for cleaning debris from the groove or hole.
- This cleaning means has the advantage that it does not necessarily have to be a chemical-based cleaning means that introduces waste as in the prior art; it could simply be of a suction type such as a conventional vacuum cleaner.
- the circuit board printer preferably further includes a vacuum table in proximity to the cutting means and the deposition means, the vacuum table being arranged to hold the substrate stationary.
- a vacuum table has the advantage that it is not necessary to introduce any further mechanical means for holding the substrate in position.
- the deposition means includes a pneumatic control, the pneumatic control including a solenoid or an air-controlled valve.
- a pneumatic control rather than, say, a hydraulic -based control as is common in the prior art, diminishes the need for lubricants associated with use of hydraulic machinery. It is also possible to easily manufacture a compact pneumatic control that can be cheaper than conventional hydraulic controls.
- the deposition means preferably includes a syringe.
- the syringe enables precise deposition of very small quantities of deposition material which may be necessary when filling small diameter holes on a reduced size prototype board. Precise deposition ensures there is a minimum amount of waste.
- additional machinery such as a squeegy, to spread out the deposited material.
- the syringe can also be made compact in size to fit into the confines of an in- house circuit board printer.
- a plurality of dispensers may be held by the deposition system.
- a motorised mechanism controlled by the CAD/CAE software positions the required pre-packaged dispenser so as to dispense the required amount of ink into the grooves.
- the oven is a vacuum batch oven including infrared, convection or microwave heating sources.
- a batch oven enables several substrates to be cured at once.
- a batch oven can be made particularly compact in contrast to conveyorised ovens typically employed in the prior art .
- the advantage of using a vacuum oven is that the environment for curing is optimum for producing high quality PCBs.
- the combination of infrared and also convection heating elements is ideally matched to a predrying phase and second stage phase of the conductive material curing process.
- the oven includes a microfilter. Inclusion of the latter ensures that the oven is safe to use within an in-house circuit board printer, in addition to being an oven that can be made compactly and cost effectively.
- the transport mechanism is rotating. This enables the components of the printer to be arranged around the transport mechanism, thereby minimising the total size of the printer.
- the cutting means is preferably arranged to redrill a hole filled with cured conductive material. Since the cutting means is arranged to drill the hole originally, it is not necessary to use extra equipment such as optical aligning equipment, to relocate the hole's position: the position may simply be recalled from the computer memory.
- the substrate material is preferably of insulating type and is made of epoxy glass popularly known as FR-4. Any other substrate material used in the industry could also be utilised.
- the holes and grooves are drilled/milled directly into the FR-4 substrate.
- the substrate is not provided with any coating or dielectric layer, prior to grooving, as is conventional ' in the prior art. In conventional PCB manufacture, a groove is made in the dielectric coating, and not into the underlying substrate itself.
- a circuit board printer comprising: (a) cutting means arranged to cut grooves in the surface of a substrate; and
- a deposition means for depositing a conductive material into the grooves to form conductive tracks, the deposition means including a syringe arranged to follow the line of the grooves and to deposit conductive material therein.
- the curable polymeric conductive material can be applied in monomer or substantially monomer state, and has flow characteristics suitable for use with such a syringe-based deposition means.
- the syringe enables clean, efficient and accurate deposition of the material.
- the accuracy of the deposition minimises waste and the need for chemicals to clean away unwanted spillage,- and also further reduces any risk of bridging between deposited areas of material.
- the syringe can be made efficiently and compactly compared to prior art examples which have adopted more complex techniques requiring extra machinery. For example, it is not necessary to use a squeegy roller to redeposit the material once it has been initially "spot pasted" onto the board.
- the deposition means includes a pneumatic control, the pneumatic control including a solenoid or an air-controlled valve.
- a pneumatic control is more cost effective and compact than many typical prior art controls, such as a hydraulic control.
- the deposition means preferably includes means to suck the conductive material through the hole. This offers the advantage of being able to fill holes that are much smaller in size than would be possible to fill using conventional hole filling methods .
- a computer program is preferably used to control the deposition means, the computer program operating in relation to a computer aided design.
- a circuit board printing method comprising: (a) drilling a first hole in a first substrate;
- the invention additionally extends to:
- the invention also extends to: (a) drilling a first hole and cutting a first groove in the first face of first substrate;
- the method includes, in order, drilling a first hole in a first substrate; depositing a curable conductive material in the first hole; curing the conductive material, redrilling the first hole, forming a multilayer board comprising a layer of insulating material between the first substrate and a second substrate, redrilling the first hole; depositing further conductive material into the redrilled first hole; and curing the further conductive material .
- the redrilling includes removing any insulating material from the hole. The method of redrilling avoids the expensive and timely procedure of removing the insulating material by chemical means.
- redrilling the hole includes drilling through the hole in the first substrate, the insulating layer and a corresponding hole in the second substrate.
- the advantage of predrilling holes in the first and second substrate prior to laminating means that re-registration of the drilling means at the holes' position does not require additional equipment.
- the method constitutes a simple, rapid way involving a minimum number of steps to produce a hole from a substrate layer to another.
- Drilling the hole preferably includes drilling using a laser or a milling device.
- the conductive material is deposited by a syringe. This offers the possibility of an accurate deposition with minimum waste from an apparatus that can be made compactly and cost effectively. Accurate deposition by a syringe eliminates the necessity for further deposition apparatus, such as a squeegy roller.
- the conductive material is cured in a vacuum batch oven including infrared, microwave or convection heat sources .
- This batch oven can be made compactly and cheaply compared with a conveyorised oven, whilst the use of a vacuum offers an optimum environment for curing.
- the conductive material could be cured by using a combination of infra red heat from the heated platens of a mini-press for pre-dry, a hot air gun or a hot air curtain air process heater for reflow.
- the airflow and temperature to the air gun or hot air curtain may be controlled by a controller connected to a computer via a variable voltage source (variac) .
- the method preferably further includes sucking the conductive material through the hole.
- Previous methods such as electroplating, have limited the minimum size of the hole to be above 50 microns. Sucking the material through the hole means holes of less than 50 microns diameter can be filled. This offers the advantage that it enables boards to be produced with a high density of hole as may be required for a prototype board, particularly one that is reduced in size.
- the method includes cleaning debris away from the hole.
- the method further includes cutting a groove in the first substrate and depositing the curable polymeric conductive material into the groove.
- the method is preferably controlled by a computer program operating in relation to a computer aided design.
- the redrilled hole is preferably about y . or 2 / 5 the diameter of the original hole.
- the invention further extends to a circuit board printer comprising a housing and, within the housing:
- an air gun, or hot air curtain preferably incorporating a negative pressure skirt (to assist with the removal of solvents and re-circulation used gases) with its associated heating elements coupled to a variable voltage source (VARIAC) controlled by a computer for curing the conductive material;
- VARIAC variable voltage source
- pressing means arranged to laminate the substrates with an insulating layer, the mini-press also doubling as an infra red source for pre-drying and post-curing of the conductive material; and (e) a transport mechanism for positioning the substrate prior to lamination.
- the oven may optionally be dispensed with.
- the air gun or the hot curtain is moved across the substrate to follow the circuit pattern, with the substrate remaining stationary on a vacuum table.
- a moving laser especially an infra-red laser.
- Such a laser could either remain stationary, with the beam being optically directed to follow the circuit pattern, or alternatively, the laser could be moved bodily across the substrate.
- Fig. 1 illustrates the components of the machine enclosure of the circuit board printer according to an embodiment of the present invention,-
- Fig. 2 is a plane view of the milling and drilling mechanism and the deposition means;
- Fig. 3 shows the deposition means and associated pneumatic control;
- Fig. 4 is a sectional view of the oven;
- Fig. 5 is a side view of the oven;
- Fig. 6 is a part-sectional view of the pressing means and associated pneumatic control;
- Figs. 7 and 8 illustrate the various stages involved in the manufacture of a multilayer printed circuit board
- Fig. 9 is a top view of a printed circuit board with cut grooves and holes
- Fig. 10 is a top view of a printed circuit board with grooves and holes filled with conductive material
- Fig. 11 illustrates an alternative embodiment in which the oven is dispensed with showing a side view of the minipress, milling and drilling mechanism and substrate loader mounted on a common platform;
- Fig. 12 illustrates a front view of the minipress with the milling and drilling mechanism moved into the minipress
- Fig. 13 illustrates a side view of the minipress in which is positioned the milling and drilling mechanism and associated hot air curtain
- Fig. 14 shows a rear view of the minipress, illustrating in more detail the hot air curtain
- Fig. 15 is a more detailed illustration of the hot air curtain of the Figure 11 embodiment
- Fig. 16 shows further details of the hot air curtain
- Fig. 17 shows an air gun for yet another embodiment
- Fig. 18 illustrates a side view of the components of the circuit board printer according to a further embodiment of the present invention
- Fig. 19 is an enlarged and more detailed reverse side view of the ink roller deposition station shown in Fig. 18;
- Fig. 20 is a cross-section of the oven of Fig. 18 in the open position
- Fig. 21 is a cross-sectional view of the oven in the closed position
- Fig. 22 is a cross-sectional view of the oven taken on the lines A-A of Fig. 20.
- Fig. 1 illustrates the main components comprising a machine enclosure 2 of a circuit board printer according to a first embodiment of the present invention.
- the components can be adapted to fit within a machine enclosure 2 that is typically generally rectangular in shape and occupies a volume of approximately lm 3 or less.
- the components of the circuit board printer are preferably controlled by a computer program in order to produce a printed circuit board (PCB) according to a computer aided design (CAD) .
- PCB printed circuit board
- CAD computer aided design
- the printer is used to produce prototype PCBs rapidly and cost effectively whilst employing a minimum number of components and procedural steps .
- the production of a PCB is typically indicated by the computer program instigating release of a substrate 8 from a substrate loader 24.
- a transport mechanism 6 moves the substrate to a milling and drilling means 12 which cuts grooves and drills holes in the substrate according to a circuit pattern to be produced.
- a deposition means 10 inserts a conductive material onto the grooves and holes, with the conductive material subsequently cured in an oven 14.
- multilayer boards can be formed by laminating two or more substrates prepared in this way with separating insulating layers by pressing the layers together in a pressing means 16. Following lamination, the multilayer board is returned to the milling and drilling mechanism 12 and deposition means 10 for redrilling and filling of holes, before being cured for a second time. Finished boards can be stored in a substrate unloader 20, before removal via an access door 4.
- the substrate loader which can be accessed through its own access door 4, will automatically release a bare substrate upon demand.
- this release is computer controlled, with the computer program operating in accordance with instructions to produce a PCB according to a CAD.
- the CAD software employed is preferably capable of directly converting conventional Gerber output files into DXF or any similar CNC data required to operate, in particular, the milling and drilling mechanism 12.
- the substrate 8 that is released may be formed from any suitable insulating material such as polyamide , polyimide, reinforced polypropylene or epoxy glass (FR- 4) .
- the substrate is released to the transport mechanism 6.
- This mechanism may be rotating or may alternatively by a linear x-y transport; it is used to move the substrate and insulating layers between the components in the machine enclosure 2.
- the transport mechanism 6 first moves the substrate 8 to the milling and drilling mechanism 12.
- the substrate 8 is held in fixed relation to the milling and drilling mechanism 12 on a vacuum table 26, as illustrated in Fig. 2.
- the vacuum table 26 is arranged to operate effectively, even when the substrate 8 is subsequently drilled with holes and grooves.
- the milling and drilling mechanism 12 is positioned on a servo-motor controlled CNC router system with associated x,y,z controllers; and includes a high speed router head.
- the milling and drilling mechanism could be replaced by a laser.
- the choice of laser depends in general upon the substrate material used.
- the laser is a Nd:YAG laser, with a wavelength of emission in the region of 532 nm.
- the milling and drilling mechanism 12 is arranged to cut grooves in the surface of the substrate enhancing the adhesion of the conductive unit to the substrate.
- the depth of the grooves is perfectly below 50 micrometres because cutting into the glass fibre region of a typical substrate material such as epoxy glass may reduce the lifetime of the drilling means.
- the grooves when filled with cured conductive material form the basis of the conductive tracks that are used for carrying electric currents on the completed PCB.
- the width of a groove as opposed to its depth will in general determine the amount of current to be carried by the groove.
- the milling and drilling mechanism 12 is arranged to drill holes in the substrate material.
- holes later serve as either “vias” (electrical connectors between one face of the substrate and the other) or as through holes (a hole designed to hold the pins of an electrical component onto the substrate prior to being secured in place) .
- Possible electrical components include resistors, capacitors or memory chips.
- the diameter of the holes drilled depends upon their intended function, and the design of the PCB to be produced. In general, holes to function as through holes are drilled to be two and a half times the diameter of the pin of any through component to be inserted into the hole. Holes to be used as blind or buried vias are generally drilled to be twice the normal size. However, PCBs are sometimes required in which the size of the vias must be restricted to less than approximately 50 micrometres. This may be owing to a need for a high density of components, or because some prototype boards are manufactured to be a reduced size. In the case of these through holes, the holes are drilled to be the exact size required for the intended component.
- the grooves of the substrate are optionally vacuum- cleaned by an attached vacuum cleaner (not shown) .
- the transport mechanism 6 will turn the board over to enable grooves and holes to be cut on the second side of the board if a double-sided board is to be produced.
- Pads required for holding surface-mounted components can also be cut during the milling process, and can subsequently be filled with conductive material, if required, by the deposition means 10.
- the deposition means 10 is typically positioned in close proximity to the milling and drilling mechanism 12, as shown in Fig. 2, possibly mounted on the same serv- motor controlled system.
- the deposition means comprises a syringe with a needle 30.
- Fig. 3 illustrates the deposition means 10 and associated pneumatic control means.
- the deposition means 10 includes a dispenser head 29; piston 33; shut-off valve 32 with associated shut- off valve detector 31; and needle 30.
- a computer 35 running a CAD-related program automatically actuates an air pressure regulator 36 and a solenoid valve 34 to supply pressure from an air supply 37 to the piston 33 part of the dispenser head 29.
- air-controlled valves may be used instead of solenoid valves 34.
- the deposition means 10 deposits conductive material onto the grooves and holes.
- the actual size of the dispenser chosen is dependent on the width of the groove to be filled. This choice of dispenser is controlled by a computer via a motorized mechanism within the deposition head.
- the shut-off valve actuator 31 is arranged to ensure that only the required amount of conductive material is allowed to pass through the needle 30 within a given time span.
- the amount of conductive material deposited per given cross-sectional area is determined by the speed of the dispenser head 29 relative to the substrate 8 and the time interval during which the shut-off valve actuator 31 is open.
- the size of the needle 30 may be altered depending upon the amount of conductive material to be dispensed.
- a 100 micrometre needle bore is used for deposition of conductive material onto a groove of 100 micrometre width.
- the transport mechanism 6 may turn the substrate 8 over so as to allow deposition of conductive material onto its other side.
- the conductive material itself is a curable polymeric conductive material, and when cured constitutes the electrical pathways on the circuit board and the connection between components either mounted on the board or otherwise. Any form of conductive material can in general be used provided that it is compatible with the choice of substrate material and does not exhibit an unacceptable high level of hydrophobic behaviour.
- An example of suitable polymeric conductive material includes a curable polymeric matrix combined with a metallic additive.
- Polymeric based inks or compounds which undergo a change in electrical nature when exposed to an influence such as laser or ultra-violet light can also be used in conjunction with the present invention.
- an enhancing conducting material can be added to the polymeric material.
- the transport mechanism 6 Upon completion of the deposition of the conductive material, the transport mechanism 6 removes the substrate 8 and transports it to the oven 14, as shown in Fig. 4.
- the oven can be any means that will cure the polymeric conductive material such as a lamp, heat source or vapour-phase device.
- the oven is a batch oven of a size suitable to fit into the machine enclosure 2.
- the oven may be a vacuum oven in which the vacuum provides an optimum environment for curing and also facilitates the extraction of the solvent.
- the heating elements are enclosed within an oven casing 40 to ensure the oven is safe to use within an in-house printer. There may be a combination of infrared heating elements
- the oven 14 includes a microwave source. As illustrated in Fig. 4, the oven 14 includes an oven door 38 through which the substrate is inserted; and also a substrate support tray 46.
- the infrared heating elements dry off any solvent used in the conductive material during a pre-drying process. The pre-drying period, if required, varies depending upon the conductive material used.
- Fig. 5 shows a side view of the oven, with oven inner vacuum casing 470 included in particular to promote efficient curing.
- the oven includes a vacuum outlet 480 through which the dried off solvents are extracted from the oven.
- the solvents also preferably pass through a micro filter 471 to ensure that all the exhaust gasses are free from harmful chemicals .
- the conductive material is allowed to reflow in the presence of nitrogen gas in a second stage in order to avoid oxidation.
- Nitrogen gas is introduced into a convection part of the oven comprising convection heating elements 45, a convention fan 44 and a fan motor 41, a nitrogen inlet 490, and the heating elements 45 are then actuated to cause the re-flow to occur.
- the rate of flow of nitrogen gas into the oven and the rise and fall of temperature within the oven is controlled by a microprocessor profile control system 43.
- a connection 42 typically RS 232 provides external communication with a controlling PC (not shown) .
- the conductive material cured in the grooves forms conductive tracks on the substrate; with the substrate including through holes for components and vias connecting the two faces of the substrate.
- the embodiment shown in Fig. 1 is suitable for the production of multilayer as well as single-layer boards .
- Such multilayer boards comprise two or more printed circuit boards or substrates that have been laminated together with separating insulating layers.
- the multilayer boards typically require vias that connect the various layers together.
- the main enclosure 2 illustrated in Fig. 1 includes a multilayer staging area 18 where prepared substrates are stored, before the laminating process. Also illustrated is an insulating layer or "pre-preg" loader 22 which stores layers of insulating material to be used as a separation between the prepared substrates comprising the multilayer.
- the termination of a multilayer board is carried out by the "minipress" pressing means 16 illustrated in Fig. 1, and in detail in Fig. 6.
- This pressing means is operated using an air cylinder 54, a pneumatic pump 53 and a pneumatic ram 55.
- the pneumatic control is capable of generating up to 2.1 MPa .
- a main frame 50 of the pressing means 16 encloses insulating layers 49, heated platens 47 and heating elements 46.
- a temperature control system 51 is usually included external to the main frame 50.
- the pressing means 16 is compact compared with most conventionally laminating devices, in addition to being simpler and cheaper owing in particular to the inclusion of a pneumatic control .
- An example of a multilayer board comprises three substrate layers.
- the substrate layers are prepared as described above and are illustrated in Fig. 7 and Fig. 8.
- Fig. 7a three such substrates are represented by the hashed rectangles punctuated by gaps which represent predrilled holes.
- Fig. 7b the holes have been filled with conductive material; whilst in Fig. 7c the conductive material has been cured.
- the unhashed rectangles common to Figs. 7a, 7b and 7c represent two insulating layers.
- These insulating layers are optionally transported to the drilling means 12 for drilling of holes prior to laminating.
- the transport mechanism 6 may transport the substrates to the drilling means 12 for portions of the cured inks to be drilled out to reveal through-holes as shown in Fig.
- Fig. 8g illustrates holes that have been filled with fresh conductive material so as to form a continuous electrical connection between the faces when subsequently cured.
- Figs. 7 and 8 also illustrate the manufacturing of a via that connects the bottom layer of one board, through an intermediate substrate, to the bottom layer of a further board.
- the production of this continuous productive path could alternatively be achieved by terminating two substrates; redrilling, filling and curing the holes and then adding a third layer.
- Blind vias which connect inner substrate layers with outer substrate layers, can also be created by the printer drilling through the vias that connect two sides of two different substrates (four layers) and thereafter filling the hole created on the vias with conductive material, ensuring that the conductive material connecting the two vias together is in its liquid state.
- the multilayer boards that can be produced by this method can have any number of comprising substrate layers.
- several such boards may be in production in the printer simultaneously.
- Fig. 9 illustrates a single substrate layer upon which has been drilled grooves 56 and holes 57.
- Fig. 10 illustrates the same board with the grooves 56 and the holes 47 filled with cured conductive material.
- An alternative embodiment is illustrated schematically in Figs. 11 to 16.
- the oven 14 (Fig. 1) is dispensed with and curing is carried out using an infra-red source, such as the platens of the minipress 16, along with one or more hot air cushions.
- this embodiment is identical with the embodiment previously described, and the same reference numerals will be used to label similar or identical parts.
- the milling and drilling mechanism 12 is mounted onto a common platform 100 with the pressing means or mini-press 16.
- the milling and drilling mechanism 12 may be moved on the stand toward or away from the mini-press 16 in the direction of the arrows 102. Also illustrated in Fig. 11 is a hot air curtain 120 which may be attached to the milling and drilling mechanism 12, or the deposition means 10.
- Fig. 12 is a further side view on which the milling and drilling mechanism 12 and associated hot air curtain 102 have been moved into the mini-press 16.
- the milling and drilling mechanism 12 includes a router-spindle 104 and a dispenser carriage 106.
- Fig. 13 shows a front view of the mini-press 16 into which the milling and drilling mechanism and associated hot air curtain have been translated.
- a CNC gantry system 108 is shown.
- the milling and drilling mechanism 12 is moved away from the mini-press 16.
- the substrate 8 is then positioned between the platens 47 and pre-dried. This is achieved by heating the platens by means of the heating elements 46 so that they act as infra-red sources.
- Fig. 14 also illustrates an inlet 110 for nitrogen and an outlet 112 to the vacuum.
- Activation of the hot air curtain 120 along with their associated air and nitrogen supplies causes reflow of the conductive material on the substrate 8.
- the hot air curtain 120 is moved across the substrate as curing proceeds. During this operation, the board remains stationary held in place by the lower platen 47 which acts as a vacuum table. The speed of the hot air curtain 120 relative to the board 8 is the factor which determines the flow profile of the board.
- Fig. 15 is a further more detailed illustration of the hot air curtain.
- Fig. 15(a) shows the nitrogen inlets 112 of the hot air curtain 120 in relation to the hot air curtain heaters or coils 116.
- Fig. 15(b) illustrates a negative pressure skirt of the hot air curtain arranged to move across the substrate, in addition to the return of the nitrogen supply 122.
- Fig. 16 further illustrates the hot air curtain 120.
- Fig. 16(a) is a top view showing the nitrogen inlet 110 and the electrical connection 118.
- Fig. 16(b) shows a plan view of one of the heating elements 116, with an outer tube 114 optionally made from stainless steel.
- the hot air curtain could be replaced by a hot air gun as shown generally at 125 in Fig. 17.
- the hot air gun comprises a nitrogen inlet 128, a heating element or coil (not shown) and a downwardly-directed nozzle 130. Heated nitrogen 132 issuing from the nozzle 130 is directed onto the material to be cured.
- the air gun 125 is attached to the milling heat, and can thus be moved in the xy plane across the substrate .
- the deposition of the ink is carried out first, in the channels, and the gun is then moved back along those same channels, curing the ink as it goes.
- the same software may be used to position the deposition head and the gun.
- Fig. 18 of the drawings depicts the components of a circuit board printer in accordance with a further embodiment of the present invention. It will be seen that the components are arranged linearly on a bench 100 and they may be surrounded by a hood or enclosure 102, shown in broken outline. As with the first embodiment shown in Fig.
- the circuit board printer includes a milling and drilling mechanism 104 for creating grooves and holes in a circuit board substrate 106 (shown in broken outline) , a conductive ink deposition station, generally indicated by reference numeral 108, for depositing conductive ink onto both sides of the printed circuit board 106, an oven 110 for receiving the printed circuit board with the conductive ink deposited in the grooves and holes and for curing the conductive ink.
- a milling and drilling mechanism 104 for creating grooves and holes in a circuit board substrate 106 (shown in broken outline)
- a conductive ink deposition station generally indicated by reference numeral 108
- oven 110 for receiving the printed circuit board with the conductive ink deposited in the grooves and holes and for curing the conductive ink.
- 106 may be provided as a finished single layer board with cured ink or it can be used in the formation of a multilayer board which comprises two or more printed circuit boards which have been laminated together with separate insulating layers.
- a mini-press 112 may be used to laminate such printed circuit boards and insulating layers together to create a multilayer board.
- the printed circuit board 106 may be moved along the work bench 100 using a transport mechanism which includes rollers 114 which may be actuated under the control of a computer to move the circuit board from the cutting and drilling mechanism 104 to the oven 110 at a controlled speed.
- the milling and cutting head 104 operates in substantially the same as the milling and drilling mechanism 12 described with reference to the first embodiment.
- the milled and drilled board 106 is then conveyed by the mechanism to the ink deposition station 108 which will be better described with reference to Fig. 19 of the drawings.
- the ink deposition station consists of two opposed ink roller applicators, generally indicated by reference number 118a and 118b. Each respective roller applicator 118a, 118b has an associated pre-filled ink cartridge 120a, 120b.
- the pre-filled ink cartridge has an associated plunge 122a, 122b which are coupled via an interface adaptor 124 to a computer 126.
- the computer 126 sends control signals to the plungers to apply pressure to the ink so that the conductive ink is deposited on the circuit board 106 at a controlled rate.
- the viscosity of the ink enables the ink to stick to the rollers which drag the ink from the cartridge and apply the ink to the surfaces of the board 106 to deposit a uniform ink film of about lOO ⁇ m on the board surfaces. It will be seen that the rollers 118a, 118b rotate in opposite directions so as to apply a conductive ink 128 on either side of the printed circuit board 108 in a layer 128 of uniform thickness.
- the deposited ink is then forced into the grooves 130 and holes 132 by polyurethane blades 134a, 134b.
- the grooves are about 150 ⁇ m deep.
- the ink also lies on top of the circuit board surface 106a. This ink must be removed and this is also achieved by using the moveable polyurethane wiper blade 134a and a fixed polyurethane wiper blade 134b.
- the moveable wiper blade 134a is coupled to a pneumatic actuator 136 which again is coupled to the computer 126 and which can adjust the distance of the moveable wiper blade 134a from the circuit board surface 106a so as to define a gap between the moveable wiper blade 130a and the fixed blade 130b to accommodate circuit boards of different thickness and apply pressure between blades 130a, 130b.
- the circuit boards are typically 500 ⁇ m to 1.26 mm thick.
- the wiper blade portions substantially in contact with the circuit board surfaces are not opposed across the circuit board; they are slightly offset to facilitate removing the ink from the board surface .
- the wiper blades remove ink from the surface 106 and leave the circuit board with filled grooves 130 and filled holes 132.
- the ink which is removed from the circuit board surfaces wells up to create reservoir portions 138a, 138b and these reservoir portions are connected by respective conduits 139a, 139b to the ink cartridges 120a, 120b respectively and the excess wiped ink pumped by virtue of pumps 140a, 140b back into the cartridges to provide an ink recovery system.
- This particular deposition apparatus has an advantage over the syringe in that it provides a uniform ink thickness in all grooves and also facilitates the recovery of excess ink.
- the circuit board 106 is passed through between the roller applicators 118a, 118b at a controlled speed in the direction of arrow A so that the ink is uniformly deposited on either side of the circuit board 106 and any excess ink is removed by the wiper blades 134a, 134b to leave ink in the grooves and holes 130,132 as shown.
- suction is provided to the reservoirs 138a, 138b far enough away from the circuit board so as to have no effect on the ink in the grooves.
- the pneumatic piston 136 is controlled to apply pressure to the upper wiper blade 134a to maintain sufficient pressure on the board to provide an effective wiping action to facilitate ink recovery.
- Figs. 20 to 22 of the drawings depicts a more detailed view of the over 110 shown in Fig. 18.
- the oven consists of upper and lower heating plates, generally indicated by reference numeral 144a, 144b.
- Fig. 20 shows the oven in the open position with a printed circuit board 106 with grooves and holes filled with conductive ink to be cured.
- the upper and lower heating stations 144a, 144b are substantially identical but only one will be described in detail.
- In upper station 144a four spaced infra-red heating elements 146a are shown.
- the heating elements are disposed in a chamber 148 and radiation from the elements 146 passes through a ceramic glass plate 150 to heat the printed circuit board 108.
- FIG. 21 This occurs when the oven is in the closed position as shown in Fig. 21.
- a heat seal 152 is disposed on the periphery of the ceramic glass 150 to effectively provide a seal around the printed circuit board.
- apertures 154,156 are disposed at either end of the oven between the seals 154,156.
- an extractor fan 158 is coupled to the oven and is actuated to force air through the oven and through the apertures 154,156 to remove fumes as the conductive ink cures.
- the removed fumes are fed to conduits 158 which are coupled to a filter 160, as best seen in Fig. 21 for filtering fumes removed from the curing of the conductive ink.
- Fig. 22 depicts a sectional view on the line A-A of Fig. 20 and shows that the infra-red heating elements 146 are provided by elongate infra-red bulbs.
- an infra-red laser may be used to cure ink in the grooves and the holes .
- the laser may be coupled to a computer to be driven in the same path as the syringe so as to allow the laser beam to track the filled ink grooves and holes and thereby facilitate curing.
- the ink roller applicator deposition apparatus may be provided with a single roller and a single wiper for a single-sided board instead of the double roller applicator arrangement shown in Fig. 19. The location of the extractor conduits in Fig.
- the pneumatic piston for moving the moveable wiper head 132a may be replaced by any other suitable movement actuator, such as a solenoid or other electrical or hydraulic actuator.
- the oven shown in Figs. 20 to 22 may have any suitable number of heating elements. Indeed, different types of heating elements may be used in order to cure or dry the ink. This could be a suitable heating element or coil or hot air applied to the ceramic glass.
- any of the previously-described embodiments may also be used to produce discrete components such as resistors, capacitors, diodes and inductors; these components being directly printed onto the substrate.
- a modified curable material is used (preferably polymeric) , this material being applied to the substrate in the areas where conventional components would normally be employed.
- the drilling means is used to provide appropriate grooves, channels or areas for receipt of the modified material, applied as discussed above by means of the deposition means.
- the modified material is then cured as usual, thereby forming discrete electronic components which are electrically coupled by the conductive polymeric materials making up the PCB circuits .
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU31736/00A AU3173600A (en) | 1999-03-04 | 2000-03-06 | Circuit board printer |
CA002366927A CA2366927A1 (en) | 1999-03-04 | 2000-03-06 | Circuit board printer |
EP00909454A EP1163826A1 (en) | 1999-03-04 | 2000-03-06 | Circuit board printer |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9905031.2 | 1999-03-04 | ||
GBGB9905031.2A GB9905031D0 (en) | 1999-03-04 | 1999-03-04 | Circuit board printer |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000052975A1 true WO2000052975A1 (en) | 2000-09-08 |
Family
ID=10848987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB2000/000776 WO2000052975A1 (en) | 1999-03-04 | 2000-03-06 | Circuit board printer |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1163826A1 (en) |
AU (1) | AU3173600A (en) |
CA (1) | CA2366927A1 (en) |
GB (1) | GB9905031D0 (en) |
WO (1) | WO2000052975A1 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012102998A1 (en) * | 2011-01-26 | 2012-08-02 | S.D. Warren Company | Creating conductivized traces for use in electronic devices |
US8286342B2 (en) | 2007-11-26 | 2012-10-16 | S.D. Warren Company | Methods for manufacturing electronic devices |
US8411711B2 (en) | 2005-12-07 | 2013-04-02 | Innolume Gmbh | Semiconductor laser with low relative intensity noise of individual longitudinal modes and optical transmission system incorporating the laser |
US8551386B2 (en) | 2009-08-03 | 2013-10-08 | S.D. Warren Company | Imparting texture to cured powder coatings |
US9323880B2 (en) | 2014-05-28 | 2016-04-26 | GE Intelligent Platforms, Inc | Apparatus and method for file translation |
CN115397129A (en) * | 2022-10-27 | 2022-11-25 | 江油星联电子科技有限公司 | Printing device for processing circuit board |
CN115623706B (en) * | 2022-12-14 | 2023-03-03 | 四川超声印制板有限公司 | Printed circuit board compression fittings |
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- 2000-03-06 CA CA002366927A patent/CA2366927A1/en not_active Abandoned
- 2000-03-06 WO PCT/GB2000/000776 patent/WO2000052975A1/en not_active Application Discontinuation
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- 2000-03-06 EP EP00909454A patent/EP1163826A1/en not_active Withdrawn
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8411711B2 (en) | 2005-12-07 | 2013-04-02 | Innolume Gmbh | Semiconductor laser with low relative intensity noise of individual longitudinal modes and optical transmission system incorporating the laser |
US8286342B2 (en) | 2007-11-26 | 2012-10-16 | S.D. Warren Company | Methods for manufacturing electronic devices |
US8551386B2 (en) | 2009-08-03 | 2013-10-08 | S.D. Warren Company | Imparting texture to cured powder coatings |
WO2012102998A1 (en) * | 2011-01-26 | 2012-08-02 | S.D. Warren Company | Creating conductivized traces for use in electronic devices |
US9323880B2 (en) | 2014-05-28 | 2016-04-26 | GE Intelligent Platforms, Inc | Apparatus and method for file translation |
CN115397129A (en) * | 2022-10-27 | 2022-11-25 | 江油星联电子科技有限公司 | Printing device for processing circuit board |
CN115623706B (en) * | 2022-12-14 | 2023-03-03 | 四川超声印制板有限公司 | Printed circuit board compression fittings |
Also Published As
Publication number | Publication date |
---|---|
AU3173600A (en) | 2000-09-21 |
GB9905031D0 (en) | 1999-04-28 |
EP1163826A1 (en) | 2001-12-19 |
CA2366927A1 (en) | 2000-09-08 |
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