GB583285A - Improvements in or relating to electrical apparatus, particularly for radio communication - Google Patents

Improvements in or relating to electrical apparatus, particularly for radio communication

Info

Publication number
GB583285A
GB583285A GB19845/44A GB1984544A GB583285A GB 583285 A GB583285 A GB 583285A GB 19845/44 A GB19845/44 A GB 19845/44A GB 1984544 A GB1984544 A GB 1984544A GB 583285 A GB583285 A GB 583285A
Authority
GB
United Kingdom
Prior art keywords
conducting paths
conducting
pad
pressed
end cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB19845/44A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MURRAYFIELD NOMINEES Ltd
PETER PLOWMAN
Original Assignee
MURRAYFIELD NOMINEES Ltd
PETER PLOWMAN
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MURRAYFIELD NOMINEES Ltd, PETER PLOWMAN filed Critical MURRAYFIELD NOMINEES Ltd
Priority to GB19845/44A priority Critical patent/GB583285A/en
Publication of GB583285A publication Critical patent/GB583285A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10393—Clamping a component by an element or a set of elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Moulding By Coating Moulds (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

583,285. Wireless receiving sets. MURRAYFIELD NOMINEES, Ltd., and PLOWMAN, P. Oct. 13, 1944, No. 19845. [Class 40 (v)] [Also in Group XXXVI] A method of making electrical connections consists in forming conducting paths on an insulating carrier 10, of synthetic resin or other material, by the application of a paste composed of metal particles, such as fine copper powder, in a non-metallic liquid vehicle, such as amyl acetate in which a small quantity of celluloid may be dissolved. The stripes of metal paste in the carrier 10 may form the connections of a wireless receiving set, the electrical components being held in, or on insulating blocks 26, 27. A conducting path 33 is engaged by the metallic end cap 34 of a resistance 31 urged upwards resiliently by a pad 35 of soft rubber, while the other end cap 34a connects through a pin 36 and conducting path 37 with condensers 38, 39 pressed by rubber pads 42, 43. A choke 44 may be pressed by a pad 46 so that its terminal clips connect with two conducting paths 49, 50 while the leads 56, 57 of a transformer 51 may be attached to the upper ends of wires 52, 53 whose lower ends engage with conducting paths 54, 55.
GB19845/44A 1944-10-13 1944-10-13 Improvements in or relating to electrical apparatus, particularly for radio communication Expired GB583285A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB19845/44A GB583285A (en) 1944-10-13 1944-10-13 Improvements in or relating to electrical apparatus, particularly for radio communication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB19845/44A GB583285A (en) 1944-10-13 1944-10-13 Improvements in or relating to electrical apparatus, particularly for radio communication

Publications (1)

Publication Number Publication Date
GB583285A true GB583285A (en) 1946-12-13

Family

ID=10136171

Family Applications (1)

Application Number Title Priority Date Filing Date
GB19845/44A Expired GB583285A (en) 1944-10-13 1944-10-13 Improvements in or relating to electrical apparatus, particularly for radio communication

Country Status (1)

Country Link
GB (1) GB583285A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2945163A (en) * 1955-01-10 1960-07-12 Globe Union Inc Component mounting for printed circuits
US2961746A (en) * 1956-06-18 1960-11-29 Aladdin Ind Inc Printed circuits
DE975642C (en) * 1953-03-06 1962-03-22 Blaupunkt Werke Gmbh Method for contacting two-dimensional circuits or switching elements that are printed or copied on carrier plates or carrier foils, preferably made of thermoplastics, and covered with an electrically insulating layer
US3077511A (en) * 1960-03-11 1963-02-12 Int Resistance Co Printed circuit unit
US3123424A (en) * 1964-03-03 Electrical plug with anti-shock prongs
DE3826999A1 (en) * 1987-11-25 1989-06-08 Mitsubishi Electric Corp Cable link and a method for its production
US4907991A (en) * 1987-11-25 1990-03-13 Mitsubishi Denki Kabushiki Kaisha Connective jumper
WO2000052975A1 (en) * 1999-03-04 2000-09-08 Sigtronics Limited Circuit board printer
DE19955538A1 (en) * 1999-11-18 2003-08-28 Orga Kartensysteme Gmbh Printed conductor carrier layer for lamination into a chip card, method for producing a conductor carrier layer Injection molding tool for carrying out the method for producing a conductor carrier layer

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3123424A (en) * 1964-03-03 Electrical plug with anti-shock prongs
DE975642C (en) * 1953-03-06 1962-03-22 Blaupunkt Werke Gmbh Method for contacting two-dimensional circuits or switching elements that are printed or copied on carrier plates or carrier foils, preferably made of thermoplastics, and covered with an electrically insulating layer
US2945163A (en) * 1955-01-10 1960-07-12 Globe Union Inc Component mounting for printed circuits
US2961746A (en) * 1956-06-18 1960-11-29 Aladdin Ind Inc Printed circuits
US3077511A (en) * 1960-03-11 1963-02-12 Int Resistance Co Printed circuit unit
DE3826999A1 (en) * 1987-11-25 1989-06-08 Mitsubishi Electric Corp Cable link and a method for its production
US4907991A (en) * 1987-11-25 1990-03-13 Mitsubishi Denki Kabushiki Kaisha Connective jumper
US4962585A (en) * 1987-11-25 1990-10-16 Mitsubishi Denki Kabushiki Kaisha Connective jumper and method of manufacturing the same
WO2000052975A1 (en) * 1999-03-04 2000-09-08 Sigtronics Limited Circuit board printer
DE19955538A1 (en) * 1999-11-18 2003-08-28 Orga Kartensysteme Gmbh Printed conductor carrier layer for lamination into a chip card, method for producing a conductor carrier layer Injection molding tool for carrying out the method for producing a conductor carrier layer
DE19955538B4 (en) * 1999-11-18 2014-06-05 Morpho Cards Gmbh Printed conductor carrier layer for lamination into a chip card, method for producing a conductor carrier layer Injection molding tool for carrying out the method for producing a conductor carrier layer

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