GB716250A - Improvements in or relating to electric semi-conducting devices - Google Patents

Improvements in or relating to electric semi-conducting devices

Info

Publication number
GB716250A
GB716250A GB13657/51A GB1365751A GB716250A GB 716250 A GB716250 A GB 716250A GB 13657/51 A GB13657/51 A GB 13657/51A GB 1365751 A GB1365751 A GB 1365751A GB 716250 A GB716250 A GB 716250A
Authority
GB
United Kingdom
Prior art keywords
plug
tube
metal
whisker
disc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB13657/51A
Inventor
Henry Wolfson
Stanley Carden Shepard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to BE530249D priority Critical patent/BE530249A/xx
Priority to LU37433D priority patent/LU37433A1/xx
Priority to NL238107D priority patent/NL238107A/xx
Priority to NL86185D priority patent/NL86185C/xx
Priority to BE554903D priority patent/BE554903A/xx
Priority to NLAANVRAGE7703161,A priority patent/NL170157B/en
Priority to DENDAT1069726D priority patent/DE1069726B/en
Priority to BE512559D priority patent/BE512559A/xx
Priority to BE538791D priority patent/BE538791A/xx
Priority to GB13657/51A priority patent/GB716250A/en
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to FR1066148D priority patent/FR1066148A/en
Priority to US292304A priority patent/US2785349A/en
Priority to DEI5966A priority patent/DE968077C/en
Priority to FR66909D priority patent/FR66909E/en
Priority to DEI8884A priority patent/DE1060992B/en
Publication of GB716250A publication Critical patent/GB716250A/en
Priority to DEI10229A priority patent/DE1015934B/en
Priority to GB15973/55A priority patent/GB795113A/en
Priority to FR69762D priority patent/FR69762E/en
Priority to CH342657D priority patent/CH342657A/en
Priority to GB4261/56A priority patent/GB797822A/en
Priority to FR71643D priority patent/FR71643E/en
Priority to DEST13682A priority patent/DE1098102B/en
Priority to GB13142/59A priority patent/GB914592A/en
Priority to FR792952A priority patent/FR75616E/en
Priority to DEST15123A priority patent/DE1255823B/en
Priority to FR800665A priority patent/FR76055E/en
Priority to GB25349/59A priority patent/GB884824A/en
Priority to GB16156/60A priority patent/GB877644A/en
Priority to CH543660A priority patent/CH384722A/en
Priority to FR827169A priority patent/FR77758E/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/26—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with means for mechanically breaking-up or deflecting the jet after discharge, e.g. with fixed deflectors; Breaking-up the discharged liquid or other fluent material by impinging jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/24—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
    • B65D81/26—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
    • B65D81/266—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing gases, e.g. oxygen absorbers or desiccants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/20—Seals between parts of vessels
    • H01J5/22—Vacuum-tight joints between parts of vessel
    • H01J5/28—Vacuum-tight joints between parts of vessel between conductive parts of vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/36—Selection of substances as active materials, active masses, active liquids
    • H01M4/48—Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides
    • H01M4/50—Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/66—Selection of materials
    • H01M4/661—Metal or alloys, e.g. alloy coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M6/00—Primary cells; Manufacture thereof
    • H01M6/04—Cells with aqueous electrolyte
    • H01M6/045—Cells with aqueous electrolyte characterised by aqueous electrolyte
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M6/00—Primary cells; Manufacture thereof
    • H01M6/04—Cells with aqueous electrolyte
    • H01M6/06—Dry cells, i.e. cells wherein the electrolyte is rendered non-fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M6/00—Primary cells; Manufacture thereof
    • H01M6/04—Cells with aqueous electrolyte
    • H01M6/06—Dry cells, i.e. cells wherein the electrolyte is rendered non-fluid
    • H01M6/10—Dry cells, i.e. cells wherein the electrolyte is rendered non-fluid with wound or folded electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00—Discharge tubes and lamps
    • H01J2893/0033—Vacuum connection techniques applicable to discharge tubes and lamps
    • H01J2893/0037—Solid sealing members other than lamp bases
    • H01J2893/0044—Direct connection between two metal elements, in particular via material a connecting material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
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    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
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    • H01L2924/01019—Potassium [K]
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    • H01L2924/01023—Vanadium [V]
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    • H01L2924/01027—Cobalt [Co]
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    • H01L2924/01029—Copper [Cu]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01032—Germanium [Ge]
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    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Food Science & Technology (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

716,250. Crystal rectifiers. STANDARD TELEPHONES' & CABLES, Ltd. June 8, 1951, No. 13657/51. Class 37. A rectifier comprises a semiconductor body and an electrode, each of which is secured to a metal plug Which is a force fit in the ends of a tube of insulating material. Fig. shows rectifier comprising a whisker electrode 3 welded to a metal cup 5 and engaging the surface of a crystal 2 which is conductively fixed to a metal cup 4. The metal cups and 5 are formed from flat discs of metal which are forced into the ends of a tube i of insulating material by means of a ram. A projection on each disc is used for connecting the cups to terminal wires 6 and 7 of copper, nickel or copper-clad steel. The ends are sealed with a thermosetting or thermoplastic material 9 such as a lithageglycerine cement or "Araldite" (Registered Trade Mark), the material filling the plugs 4 and 5. The material may be applied as a powder, or in the form of a disc, and alumina may be added together witha pigment to provide colour identification for the ends. The crystal 2 is attached to cup 4 by soldering or by means of a conducting cement such as that described in Specification 716,243, [Group V]. An alternative assembly (Fig. 12) is described in which the whisker 3 is welded to the terminal wire 7 and to a springy wire 15, so that the whisker is held centrally in the tube when the wire 7 is pulled through a central hole in the disc or plug 5. In this case no welding or soldering to plug 5 is necessary. Further modifications provide for the plugs 4 and 5 to be formed solid from a soft metal such as lead, the plug being slightly tapered and then forced into the tube with a ram. Alternatively, two rams might be used to provide a plug shaped as shown in Fig. 17, or the inside ends of the tube i may be slightly enlarged providing a plug formation as shown in Fig. 22. The invention has the advantage that no screws or solder are used in the final assembly, and the units can be soldered into circuit without special precautions for cooling.
GB13657/51A 1951-06-08 1951-06-08 Improvements in or relating to electric semi-conducting devices Expired GB716250A (en)

Priority Applications (30)

Application Number Priority Date Filing Date Title
BE512559D BE512559A (en) 1951-06-08
BE538791D BE538791A (en) 1951-06-08
NL86185D NL86185C (en) 1951-06-08
LU37433D LU37433A1 (en) 1951-06-08
NLAANVRAGE7703161,A NL170157B (en) 1951-06-08 METHOD AND DEVICE FOR GASIFICATION OF SOLID FUELS BY PARTIAL OXIDATION.
DENDAT1069726D DE1069726B (en) 1951-06-08 Galvanic element for high current loads and process for its manufacture
NL238107D NL238107A (en) 1951-06-08
BE530249D BE530249A (en) 1951-06-08
BE554903D BE554903A (en) 1951-06-08
GB13657/51A GB716250A (en) 1951-06-08 1951-06-08 Improvements in or relating to electric semi-conducting devices
FR1066148D FR1066148A (en) 1951-06-08 1952-06-06 Improvements to electric crystal rectifiers
US292304A US2785349A (en) 1951-06-08 1952-06-07 Electric semi-conducting devices
DEI5966A DE968077C (en) 1951-06-08 1952-06-08 Process for the manufacture of crystal rectifiers
FR66909D FR66909E (en) 1951-06-08 1954-07-06 Improvements to electric crystal rectifiers
DEI8884A DE1060992B (en) 1951-06-08 1954-07-07 Process for making an electrical connection in semiconductors such as germanium
DEI10229A DE1015934B (en) 1951-06-08 1955-05-20 Crystallode with a semiconductor crystal built into a tight housing and desiccant arranged in the housing
GB15973/55A GB795113A (en) 1951-06-08 1955-06-03 Improvements in or relating to containers including desiccants
FR69762D FR69762E (en) 1951-06-08 1955-06-06 Improvements to electric crystal rectifiers
CH342657D CH342657A (en) 1951-06-08 1955-06-07 Method of manufacturing semiconductor elements
GB4261/56A GB797822A (en) 1951-06-08 1956-02-10 Improvements in or relating to semi-conductor junction diodes
FR71643D FR71643E (en) 1951-06-08 1957-02-08 Improvements to electric crystal rectifiers
DEST13682A DE1098102B (en) 1951-06-08 1958-04-23 A method of manufacturing an electric semiconductor device
GB13142/59A GB914592A (en) 1951-06-08 1959-04-17 Electrical semi-conductor device
FR792952A FR75616E (en) 1951-06-08 1959-04-23 Improvements to electric crystal rectifiers
DEST15123A DE1255823B (en) 1951-06-08 1959-05-13 Process for the production of cooling elements for electrical components from cooling plates arranged on a bolt perpendicular to the longitudinal axis, in particular for semiconductor power rectifiers and transistors
FR800665A FR76055E (en) 1951-06-08 1959-07-21 Improvements to electric crystal rectifiers
GB25349/59A GB884824A (en) 1951-06-08 1959-07-23 Improvements in or relating to galvanic cells
GB16156/60A GB877644A (en) 1951-06-08 1960-05-06 Method of manufacturing cooling bodies for cooling electrical components
CH543660A CH384722A (en) 1951-06-08 1960-05-12 Process for the production of heat sinks for cooling electrical components
FR827169A FR77758E (en) 1951-06-08 1960-05-13 Improvements to electric crystal rectifiers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB13657/51A GB716250A (en) 1951-06-08 1951-06-08 Improvements in or relating to electric semi-conducting devices

Publications (1)

Publication Number Publication Date
GB716250A true GB716250A (en) 1954-09-29

Family

ID=10027022

Family Applications (1)

Application Number Title Priority Date Filing Date
GB13657/51A Expired GB716250A (en) 1951-06-08 1951-06-08 Improvements in or relating to electric semi-conducting devices

Country Status (1)

Country Link
GB (1) GB716250A (en)

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