GB934185A - Method of mounting electrical semiconductor elements on a base plate - Google Patents

Method of mounting electrical semiconductor elements on a base plate

Info

Publication number
GB934185A
GB934185A GB766/60A GB76660A GB934185A GB 934185 A GB934185 A GB 934185A GB 766/60 A GB766/60 A GB 766/60A GB 76660 A GB76660 A GB 76660A GB 934185 A GB934185 A GB 934185A
Authority
GB
United Kingdom
Prior art keywords
plate
base
copper
groove
small
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB766/60A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Publication of GB934185A publication Critical patent/GB934185A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

934,185. Semi-conductor devices. STANDARD TELEPHONES & CABLES Ltd. Jan. 8, 1960 [Jan. 14, 1959], No. 766/60. Class 37. In a method of mounting a semi-conductor element on a metallic base-plate possessing good heat-conducting properties, the element is connected during processing to a small metallic plate of good heat-conducting properties which acts as one electrode connection and which, after the completion of the said processing and the provision of a second connection, is connected to the base-plate by partial deformation of the material of the base-plate in the cold state. In the rectifier shown, a wafer 1 of germanium or silicon comprising a PN junction is soldered to a lead 5 made of copper or silver wire, preferably gilded silver wire, the ends of which are welded to form a solid part 6, and is also soldered to a small conical or, as shown, stepped plate 4 preferably of silver with a coating of gold; the device is then etched. The solder may contain significant impurities to produce the PN junction. The small plate 4 is inserted in a central recess in a base-plate 7 of, e.g. soft copper, the recess having a convex bottom and fitting closely to the wider part of plate 4, which may be grooved or roughened. Concentric with the central recess is an annular groove in the base-plate 7. The upstanding copper between the recess and the groove is deformed over the step in plate 4 by two concentric cylindrical stamps (not shown), the outer one being located in the groove, while the inner one is forced down on to the copper. A cap comprising a steel tube 12, to one end of which is fused a glass bead 13 through which is sealed a small tube 14, is fitted into the groove and the copper around the groove is deformed over a flange at the bottom of tube 12. Finally, the small tube 14 is deformed around the lead 5 at 15. The base-plate 7 has a threaded shank 16 which serves to mount it on a chassis. Semiconductor devices other than diodes may be mounted in this way, and several devices may be mounted on a single base-plate. Specifications 838,167 and 914,592 are referred to.
GB766/60A 1959-01-14 1960-01-08 Method of mounting electrical semiconductor elements on a base plate Expired GB934185A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEST14659A DE1098103B (en) 1959-01-14 1959-01-14 Method for installing an electrical semiconductor element in a housing
GB234/61A GB942331A (en) 1959-01-14 1961-01-03 Improvements in or relating to semiconductor devices

Publications (1)

Publication Number Publication Date
GB934185A true GB934185A (en) 1963-08-14

Family

ID=25993904

Family Applications (2)

Application Number Title Priority Date Filing Date
GB766/60A Expired GB934185A (en) 1959-01-14 1960-01-08 Method of mounting electrical semiconductor elements on a base plate
GB234/61A Expired GB942331A (en) 1959-01-14 1961-01-03 Improvements in or relating to semiconductor devices

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB234/61A Expired GB942331A (en) 1959-01-14 1961-01-03 Improvements in or relating to semiconductor devices

Country Status (4)

Country Link
BE (1) BE586536R (en)
DE (1) DE1098103B (en)
FR (2) FR1299502A (en)
GB (2) GB934185A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2322474A (en) * 1997-02-25 1998-08-26 Mitsubishi Electric Corp Mounting rectifiers in heat sinks
FR2825514A1 (en) * 2001-06-02 2002-12-06 Bosch Gmbh Robert Connection between semiconducting component and cooling body has inner and outer bottom surfaces in thermal contact when cooling body and component are joined together

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1242758B (en) * 1961-04-07 1967-06-22 Siemens Ag Semiconductor arrangement, especially for high performance, in which a thin, disk-shaped semiconductor body is attached to a carrier plate
NL135878C (en) * 1961-08-12
DE1271834B (en) * 1961-09-02 1968-07-04 Siemens Ag Semiconductor device
DE1229647B (en) * 1961-12-22 1966-12-01 Walter Brandt G M B H Method for producing a surface rectifier arrangement
BE626623A (en) * 1961-12-30 1900-01-01
JPS5952030B2 (en) * 1981-03-26 1984-12-17 株式会社東芝 Cold welding method
US4579102A (en) * 1983-04-14 1986-04-01 Sukup Eugene G Biomass heat exchanger furnace
DE10141603A1 (en) * 2001-08-24 2003-03-06 Bosch Gmbh Robert Method for attaching an electrical element and assembly with an attached electrical element

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO66796A (en) * 1941-09-04
NL93941C (en) * 1955-03-24 1959-11-16

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2322474A (en) * 1997-02-25 1998-08-26 Mitsubishi Electric Corp Mounting rectifiers in heat sinks
US5828564A (en) * 1997-02-25 1998-10-27 Mitsubishi Denki Kabushiki Kaisha Rectifier heat dissipation
GB2322474B (en) * 1997-02-25 1999-04-28 Mitsubishi Electric Corp Rectifier mounted in a heat dissipator
FR2825514A1 (en) * 2001-06-02 2002-12-06 Bosch Gmbh Robert Connection between semiconducting component and cooling body has inner and outer bottom surfaces in thermal contact when cooling body and component are joined together

Also Published As

Publication number Publication date
DE1098103B (en) 1961-01-26
GB942331A (en) 1963-11-20
BE586536R (en) 1960-07-14
FR81208E (en) 1963-08-16
FR1299502A (en) 1962-07-27

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