GB878100A - Improvements in or relating to semi-conductor rectifiers of the p-n junction type - Google Patents

Improvements in or relating to semi-conductor rectifiers of the p-n junction type

Info

Publication number
GB878100A
GB878100A GB2473858A GB2473858A GB878100A GB 878100 A GB878100 A GB 878100A GB 2473858 A GB2473858 A GB 2473858A GB 2473858 A GB2473858 A GB 2473858A GB 878100 A GB878100 A GB 878100A
Authority
GB
United Kingdom
Prior art keywords
semi
pin
ring
electrode
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2473858A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Publication of GB878100A publication Critical patent/GB878100A/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B1/00—Film strip handling
    • G03B1/18—Moving film strip by means which act on the film between the ends thereof
    • G03B1/20—Acting means
    • G03B1/32—Friction grippers or rollers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K13/00—Conveying record carriers from one station to another, e.g. from stack to punching mechanism
    • G06K13/18—Conveying record carriers from one station to another, e.g. from stack to punching mechanism the record carrier being longitudinally extended, e.g. punched tape
    • G06K13/26—Winding-up or unwinding of record carriers; Driving of record carriers
    • G06K13/30—Winding-up or unwinding of record carriers; Driving of record carriers intermittently
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L13/00—Details of the apparatus or circuits covered by groups H04L15/00 or H04L17/00
    • H04L13/02—Details not particular to receiver or transmitter
    • H04L13/06—Tape or page guiding or feeding devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Resistance Heating (AREA)
  • Thermistors And Varistors (AREA)

Abstract

878,100. Semi-conductor rectifying devices. SIEMENS-SCHUCKERTWERKE A.G. July 31, 1958 [July 31, 1957; July 23, 1958], No. 24738/58. Class 37. The silicon or germanium element of a junction rectifier is disposed on the base of a cupshaped portion of a metal holder and the second terminal connecting member of the rectifier is a rigid pin which is mounted on the electrode of the semi-conductor element and is connected at its surrounding surface to the holder by welded connections through an insulated bushing. Fig. 1 shows frusto-conical holder member 1 of copper with a cup-shaped recess to the bottom of which a molybdenum plate 4 has been fixed, a ring 2 of weldable material such as iron or nickel is fitted to the lip 1a of the cup-shaped portion. An aluminium plate 5 is laid on the molybdenum; a silicon semi-conductor element 6 is laid on the aluminium and this in turn is covered with an electrode body 7 for example of gold-antimony. A tungsten plate 8 is then placed on the electrode and a rigid pin 9 having good thermal conductivity is then mounted at its lower face on the tungsten electrode. The PN junction is then formed by heating and etching. A separate ring 13 consisting of weldable material is mounted on a shoulder on the outer face of the pin and the pin is hollow in order that it may eventually be used for evacuating the space around the semi-conductor device. The insulating member 14, consists of a glass ring and an inner metal ring 15 and an outer metal ring 16 shaped so that they may engage rings 13 and 2 respectively to which they are welded by a process of resistance welding known as " hump welding. The conical member 1 engages a larger member 17 and is wedged in place by a threaded plug 18. A stud 19 on member 1 facilitates withdrawal. A cap 11 is applied after evacuation. Pin 9 may engage cooling fins and may form part of a plug coupling, Figs. 3-7 (not shown).
GB2473858A 1957-07-31 1958-07-31 Improvements in or relating to semi-conductor rectifiers of the p-n junction type Expired GB878100A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES0054550 1957-07-31
DES59117A DE1076824B (en) 1957-07-31 1958-07-23 Surface rectifier with a semiconductor element, which is fastened with one surface to a carrier plate and with the other surface on a rigid bolt

Publications (1)

Publication Number Publication Date
GB878100A true GB878100A (en) 1961-09-27

Family

ID=25995414

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2473858A Expired GB878100A (en) 1957-07-31 1958-07-31 Improvements in or relating to semi-conductor rectifiers of the p-n junction type

Country Status (4)

Country Link
DE (2) DE1076824B (en)
GB (1) GB878100A (en)
IT (2) IT609174A (en)
NL (2) NL6600089A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4688077A (en) * 1982-03-29 1987-08-18 Fujitsu Limited Semiconductor device having radiator
WO2013030001A1 (en) * 2011-08-26 2013-03-07 Robert Bosch Gmbh Semiconductor component with a heat sink

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE25184E (en) * 1959-08-03 1962-06-12 Mcadam
NL7604220A (en) * 1976-04-21 1977-10-25 Leer Koninklijke Emballage HOLDER WITH OUTFLOW DUCT AND ONE-TIME CLOSURE.
FR2376392A2 (en) * 1977-01-04 1978-07-28 Lemer & Cie Thick wall cooling system - comprises studs perpendicular to wall and with fins parallel to it

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2751528A (en) * 1954-12-01 1956-06-19 Gen Electric Rectifier cell mounting

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4688077A (en) * 1982-03-29 1987-08-18 Fujitsu Limited Semiconductor device having radiator
WO2013030001A1 (en) * 2011-08-26 2013-03-07 Robert Bosch Gmbh Semiconductor component with a heat sink

Also Published As

Publication number Publication date
DE1071234B (en)
NL6600089A (en) 1966-03-25
IT609174A (en)
DE1076824B (en) 1960-03-03
NL239393A (en)
IT602174A (en)

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