GB1251837A - - Google Patents

Info

Publication number
GB1251837A
GB1251837A GB1251837DA GB1251837A GB 1251837 A GB1251837 A GB 1251837A GB 1251837D A GB1251837D A GB 1251837DA GB 1251837 A GB1251837 A GB 1251837A
Authority
GB
United Kingdom
Prior art keywords
semi
terminal
base terminal
mass
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19671589553 external-priority patent/DE1589553A1/en
Priority claimed from DE19671589555 external-priority patent/DE1589555C3/en
Application filed filed Critical
Publication of GB1251837A publication Critical patent/GB1251837A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Rectifiers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

1,251,837. Semi - conductor devices. ROBERT BOSCH G.m.b.H. 30 Oct., 1968 [31 Oct., 1967; 25 Nov., 1967], No. 51360/68. Heading H1K. The solid base terminal of a semi-conductor power device is of generally plate-like form with an upstanding central portion upon which the semi-conductor element is mounted. As shown a junction diode has a base terminal 1a of nickel-plated copper, the semi-conductor element being attached to the upstanding portion after the upper surface has been coated by the solder-flood method. The nail-head 2a of the other terminal is of the same diameter as the upstanding portion of the lower terminal. The periphery of the semi-conductor element is lacquered. The cover of the housing, iron cylinder 15a, glass ring 15b, and nickel-iron tube 15c is welded to the base terminal at a welding ridge 12 and is crimped or welded to the second terminal at 2b. A hollow conical lip 11 acts as a contamination shield for the element. In an otherise identical variant the housing cover is omitted and a resin-mass is formed about the assembly. In this case, ridge 9 defines the limit of the resin-mass and the hollow conical lip keys the resin-mass to the assembly. In the embodiments the edge 15 of the base terminal is milled so that the rectifier may be securely anchored in the bore of a cooling plate into which it is pressed.
GB1251837D 1967-10-31 1968-10-30 Expired GB1251837A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19671589553 DE1589553A1 (en) 1965-06-26 1967-10-31 Semiconductor component
DE19671589555 DE1589555C3 (en) 1967-11-25 1967-11-25 Semiconductor component

Publications (1)

Publication Number Publication Date
GB1251837A true GB1251837A (en) 1971-11-03

Family

ID=25753330

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1251837D Expired GB1251837A (en) 1967-10-31 1968-10-30

Country Status (5)

Country Link
DE (1) DE1589555B2 (en)
ES (1) ES359776A1 (en)
FR (1) FR1587284A (en)
GB (1) GB1251837A (en)
NL (1) NL159535B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4303935A (en) * 1977-12-13 1981-12-01 Robert Bosch Gmbh Semiconductor apparatus with electrically insulated heat sink
US4328512A (en) * 1977-06-16 1982-05-04 Robert Bosch Gmbh Two-element semiconductor diode rectifier assembly structure
EP1087439A2 (en) * 1999-09-27 2001-03-28 Philips Corporate Intellectual Property GmbH Rectifier assembly for an alternator of a motor vehicle
WO2022229279A1 (en) * 2021-04-30 2022-11-03 Danfoss Silicon Power Gmbh Semiconductor power module and method and tool for manufacturing such a module
CN117241926A (en) * 2021-04-30 2023-12-15 丹佛斯硅动力有限责任公司 Semiconductor power module and method and tool for manufacturing such a module

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5315763A (en) * 1976-07-28 1978-02-14 Hitachi Ltd Resin sealed type semiconductor device
FR2454699A2 (en) * 1979-01-12 1980-11-14 Sev Alternateurs Power diode for alternator bridge rectifier - uses encapsulated semiconductor element fitted onto metal base
FR2813442A1 (en) * 2000-08-31 2002-03-01 Valeo Equip Electr Moteur Power diode for use in rectifier bridge of rotary electric machine such as alternator for automobile vehicles

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4328512A (en) * 1977-06-16 1982-05-04 Robert Bosch Gmbh Two-element semiconductor diode rectifier assembly structure
US4303935A (en) * 1977-12-13 1981-12-01 Robert Bosch Gmbh Semiconductor apparatus with electrically insulated heat sink
EP1087439A2 (en) * 1999-09-27 2001-03-28 Philips Corporate Intellectual Property GmbH Rectifier assembly for an alternator of a motor vehicle
EP1087439A3 (en) * 1999-09-27 2004-09-08 International Rectifier Corporation Rectifier assembly for an alternator of a motor vehicle
WO2022229279A1 (en) * 2021-04-30 2022-11-03 Danfoss Silicon Power Gmbh Semiconductor power module and method and tool for manufacturing such a module
CN117241926A (en) * 2021-04-30 2023-12-15 丹佛斯硅动力有限责任公司 Semiconductor power module and method and tool for manufacturing such a module

Also Published As

Publication number Publication date
NL159535B (en) 1979-02-15
ES359776A1 (en) 1970-06-16
NL6815470A (en) 1969-05-02
FR1587284A (en) 1970-03-13
DE1589555A1 (en) 1970-07-23
DE1589555B2 (en) 1977-01-27

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee