FR1587284A - - Google Patents
Info
- Publication number
- FR1587284A FR1587284A FR1587284DA FR1587284A FR 1587284 A FR1587284 A FR 1587284A FR 1587284D A FR1587284D A FR 1587284DA FR 1587284 A FR1587284 A FR 1587284A
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Rectifiers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19671589553 DE1589553A1 (en) | 1965-06-26 | 1967-10-31 | Semiconductor component |
DE19671589555 DE1589555C3 (en) | 1967-11-25 | 1967-11-25 | Semiconductor component |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1587284A true FR1587284A (en) | 1970-03-13 |
Family
ID=25753330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1587284D Expired FR1587284A (en) | 1967-10-31 | 1968-10-29 |
Country Status (5)
Country | Link |
---|---|
DE (1) | DE1589555B2 (en) |
ES (1) | ES359776A1 (en) |
FR (1) | FR1587284A (en) |
GB (1) | GB1251837A (en) |
NL (1) | NL159535B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2394893A1 (en) * | 1977-06-16 | 1979-01-12 | Bosch Gmbh Robert | CURRENT RECTIFIER DEVICE |
FR2454699A2 (en) * | 1979-01-12 | 1980-11-14 | Sev Alternateurs | Power diode for alternator bridge rectifier - uses encapsulated semiconductor element fitted onto metal base |
FR2813442A1 (en) * | 2000-08-31 | 2002-03-01 | Valeo Equip Electr Moteur | Power diode for use in rectifier bridge of rotary electric machine such as alternator for automobile vehicles |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5315763A (en) * | 1976-07-28 | 1978-02-14 | Hitachi Ltd | Resin sealed type semiconductor device |
US4303935A (en) * | 1977-12-13 | 1981-12-01 | Robert Bosch Gmbh | Semiconductor apparatus with electrically insulated heat sink |
DE19946255A1 (en) * | 1999-09-27 | 2001-03-29 | Philips Corp Intellectual Pty | Rectifier arrangement |
DE102021120935B4 (en) * | 2021-04-30 | 2023-08-10 | Danfoss Silicon Power Gmbh | Process for forming a semiconductor power module |
WO2022229279A1 (en) * | 2021-04-30 | 2022-11-03 | Danfoss Silicon Power Gmbh | Semiconductor power module and method and tool for manufacturing such a module |
-
1967
- 1967-11-25 DE DE1967B0095566 patent/DE1589555B2/en active Granted
-
1968
- 1968-10-29 FR FR1587284D patent/FR1587284A/fr not_active Expired
- 1968-10-30 GB GB1251837D patent/GB1251837A/en not_active Expired
- 1968-10-30 NL NL6815470.A patent/NL159535B/en not_active IP Right Cessation
- 1968-10-31 ES ES359776A patent/ES359776A1/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2394893A1 (en) * | 1977-06-16 | 1979-01-12 | Bosch Gmbh Robert | CURRENT RECTIFIER DEVICE |
FR2454699A2 (en) * | 1979-01-12 | 1980-11-14 | Sev Alternateurs | Power diode for alternator bridge rectifier - uses encapsulated semiconductor element fitted onto metal base |
FR2813442A1 (en) * | 2000-08-31 | 2002-03-01 | Valeo Equip Electr Moteur | Power diode for use in rectifier bridge of rotary electric machine such as alternator for automobile vehicles |
ES2187365A1 (en) * | 2000-08-31 | 2003-06-01 | Valeo Equip Electr Moteur | Power diode for use in rectifier bridge of rotary electric machine such as alternator for automobile vehicles |
Also Published As
Publication number | Publication date |
---|---|
NL6815470A (en) | 1969-05-02 |
NL159535B (en) | 1979-02-15 |
ES359776A1 (en) | 1970-06-16 |
DE1589555A1 (en) | 1970-07-23 |
DE1589555B2 (en) | 1977-01-27 |
GB1251837A (en) | 1971-11-03 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |