JPS5359398A - Liquid crystal display panel - Google Patents

Liquid crystal display panel

Info

Publication number
JPS5359398A
JPS5359398A JP13449076A JP13449076A JPS5359398A JP S5359398 A JPS5359398 A JP S5359398A JP 13449076 A JP13449076 A JP 13449076A JP 13449076 A JP13449076 A JP 13449076A JP S5359398 A JPS5359398 A JP S5359398A
Authority
JP
Japan
Prior art keywords
liquid crystal
crystal display
display panel
chip
panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13449076A
Other languages
Japanese (ja)
Inventor
Okito Naito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP13449076A priority Critical patent/JPS5359398A/en
Publication of JPS5359398A publication Critical patent/JPS5359398A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319Arrangement of the layer connectors prior to mounting
    • H01L2224/83191Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838Bonding techniques
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06Polymers
    • H01L2924/078Adhesive characteristics other than chemical
    • H01L2924/0781Adhesive characteristics other than chemical being an ohmic electrical conductor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits

Abstract

PURPOSE:To connect many terminals of a panel and a terminal of an IC chip by connecting conductive resin bump on the chip and a panel substrate, in the connection between terminal of the digital liquid crystal display panel and the IC chip.
JP13449076A 1976-11-09 1976-11-09 Liquid crystal display panel Pending JPS5359398A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13449076A JPS5359398A (en) 1976-11-09 1976-11-09 Liquid crystal display panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13449076A JPS5359398A (en) 1976-11-09 1976-11-09 Liquid crystal display panel

Publications (1)

Publication Number Publication Date
JPS5359398A true JPS5359398A (en) 1978-05-29

Family

ID=15129533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13449076A Pending JPS5359398A (en) 1976-11-09 1976-11-09 Liquid crystal display panel

Country Status (1)

Country Link
JP (1) JPS5359398A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6010735A (en) * 1983-06-30 1985-01-19 Toshiba Corp Semiconductor device
JPS6169035A (en) * 1985-09-18 1986-04-09 Hitachi Ltd Liquid crystal display element

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6010735A (en) * 1983-06-30 1985-01-19 Toshiba Corp Semiconductor device
JPH0469428B2 (en) * 1983-06-30 1992-11-06 Tokyo Shibaura Electric Co
JPS6169035A (en) * 1985-09-18 1986-04-09 Hitachi Ltd Liquid crystal display element

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