JP3422134B2 - Laminated electronic component and method of manufacturing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component, for example, a laminated electronic component such as a laminated inductor and a method for manufacturing the same.

[0002]

2. Description of the Related Art A conventional laminated electronic component will be described by taking an inductor as an example. As shown in FIG. 4, an insulating sheet 51 having internal electrodes 52 to 56 on its surface is stacked to form a laminated body. The internal electrodes 52 to 5 through the through holes 57a to 57d provided in the insulating sheet 51.
The coil was formed by electrically connecting 6 in series.

Alternatively, as shown in FIG. 5, after the internal electrode 71 is formed on the surface of the insulating film 61 (see FIG. 5A), the tip 71a of the internal electrode 71 is exposed. The insulating film 62 is formed on the left half of the insulating film 61.
Are formed (see FIG. 5B). Next, after forming the internal electrode 72 on the right half of the insulating film 61 (see FIG. 5C), insulating the substantially right half of the insulating film 61 by exposing the tip portion 72a of the internal electrode 72. The film 63 is formed (see FIG. 5D). Further, the internal electrode 73 is formed on the surfaces of the insulating films 62 and 63 (see FIG. 5E). As described above, the coil is formed by alternately forming the insulating film and the internal electrode.

[0004]

In the former of those described in the prior art, when it is desired to increase the cross-sectional area of the internal electrodes 52 to 56 to reduce the resistance in order to secure the Q characteristic, the internal electrode 52 is required. Since increasing the width of ~ 56 increases the product size, the internal electrodes 52 to 56 are usually made thicker to increase the cross-sectional area. However, when the internal electrodes become thicker than the thickness of the insulating sheet 51, the thickness of the laminated body in the portion where the internal electrodes 52 to 56 are provided and the internal electrodes 52 to 56 are not provided. The thickness of the laminated body of the portion is greatly different. As a result, the product shape becomes a drum shape and cannot be mounted on the printed circuit board, and the stacking of the insulating sheets 51 is likely to occur, making it difficult to narrow the inductance value of the coil. Had the problem.

Further, in the latter case, although the thickness of the internal electrodes 71 to 73 is increased to secure the Q characteristic, there is no concern that the product shape becomes a drum shape, but the insulating films 61 to 63 and the internal electrodes 71 to 71. Since 73 is alternately laminated on the right side or substantially the left side of the inductor, the number of steps is large and the period required for production is long. Further, the insulating films 61 to 63 and the internal electrode 7
Although 1 to 73 are formed by printing, there is a problem that it is difficult to thin the internal electrodes 71 to 73 and it is not possible to reduce the product size because the accuracy of thick film printing is limited.

Therefore, an object of the present invention is to provide a small-sized laminated electronic component which is less likely to cause shape defects and stacking misalignment, and has a small number of steps and a short production period, and a manufacturing method thereof.

[0007]

In order to achieve the above object, a laminated electronic component according to the present invention is provided with a through electrode for an internal electrode.
A first insulating sheet having a hole and a through hole
When joining the second insulating sheet provided with the through holes,
Through hole for internal electrode and through hole for through hole
Filled with conductive material to form internal electrodes and through holes
Multiple laminated insulating sheets are laminated to form a laminate
However, the internal electrodes are electrically connected to each other through the through holes in the laminated body .

The method of manufacturing a laminated electronic component according to the present invention includes (a) a step of providing through holes for internal electrodes in the first insulating sheet, and (b) through holes in the second insulating sheet. a step of providing a through-hole, (c) after bonding the first insulating sheet and the second insulating sheet, through holes for internal electrodes a conductive material and transmural for through-hole
Fills the through holes at the same time and has internal electrodes and through holes
Forming a composite insulating sheets, and forming the laminated body by stacking (d) is a composite insulating sheet,
Electrically connecting the internal electrodes to each other through the through holes in the stack . Through holes for internal electrodes and through holes
Are formed by laser processing, for example. Also, the first
The edge sheet and the second insulating sheet are resin films, respectively.
Lined with a first insulation sheet and a second insulation
The sex sheets are joined to face each other.

[0009]

The conductive material filled in the through holes for the internal electrodes provided in the first insulating sheet is used as the internal electrode, and the conductive material filled in the through holes for the through holes provided in the second insulating sheet is It is considered as a through hole. Since these internal electrodes and through holes are provided in each insulating sheet,
The surface of the insulating sheet is flat. Therefore, the insulating sheets can be stacked with a uniform thickness even if the number of laminated sheets is large.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a laminated electronic component and a manufacturing method thereof according to the present invention will be described below with reference to the accompanying drawings. As shown in FIG. 1A, a first insulating sheet 2 lined with a resin film 1 such as polyethylene terephthalate is prepared. As the material of the first insulating sheet 2,
For example, ceramics such as ferrite, dielectrics and insulators are used. The thickness of the first insulating sheet 2 is set to be equal to the thickness of the internal electrodes described later.

Next, as shown in FIG. 1 (b), the first insulating sheet 2 and the resin film 1 are subjected to laser processing to form internal electrode holes 3 having a predetermined shape. Similarly, as shown in FIG. 1C, a second insulating sheet 5 backed by a resin film 4 such as polyethylene terephthalate is prepared. The material of the second insulating sheet 5 is usually
The same type as the first insulating sheet 2 is used. Second
The thickness of the insulating sheet 5 is set to be equal to the thickness required for insulation between adjacent internal electrodes.

As shown in FIG. 1D, the second insulating sheet 5 and the resin film 4 are laser-processed to form through-hole holes 6 at predetermined positions. Next, FIG. 1 (e)
As shown in (1), the first insulating sheet 2 and the second insulating sheet 5 are joined and temporarily pressure-bonded. Next, as shown in FIG. 1 (f), a conductive paste 7 such as Ag, Pd, Ag-Pd, or Cu is applied to the internal electrode holes 3 and the through hole holes 6 by a printing method, and then filled and dried. To do. Since the resin films 1 and 4 are attached to the surfaces of the first and second insulating sheets 2 and 5, the resin films 1 and 4 can function as a print pattern mask. Therefore, it is not necessary to prepare a print pattern mask in the printing process, and the manufacturing cost can be suppressed. It is not always necessary to use the resin films 1 and 4 as a print pattern mask, and the resin films 1 and 4 may be peeled off at the time of printing and printed by using a separately prepared print pattern mask. Good.

Thus, the conductive paste 7 filled in the internal electrode holes 3 becomes internal electrodes, and the through hole holes 6 are formed.
The conductive paste 7 filled in is a through hole. Then, as shown in FIG. 1 (g), the resin films 1 and 4 are peeled off. The obtained first and second insulating sheets 2,
The insulating sheet of No. 5 contains internal electrodes and through holes, and its surface is flat.

FIG. 2 shows a coil formed by laminating a plurality of insulating sheets thus obtained. The insulating sheets 12 ₁ , 12 ₂ , 12 ₃ , ... 12 _n have internal electrodes 13 ₁ , 13 ₂ , 13 ₃ , ... 13 _n and through holes 20 respectively.
Built-in ₁ , 20 ₂ , 20 ₃ , ... One end 13a of the internal electrode 13 ₁ is exposed on the left end surface of the insulating sheet 12 ₁ , and one end 13b of the internal electrode 13 _n is exposed on the right end surface of the insulating sheet 12 _n . Then, when the insulating sheets 12 _{1 to} 12 _n are stacked, the internal electrodes 13 ₁
˜13 _n are electrically connected in series through through holes 20 ₁ , 20 ₂ , ... Forming a coil.

Next, as shown in FIG. 3, the insulating protective sheets 2 are provided above and below the stacked insulating sheets 12 _{1 to} 12 _n.
2 are provided. And the laminated insulating sheet 12
_{After 1 to} 12 _n and the insulating protective sheet 22 are integrally fired, external electrodes 25 and 26 are formed on both left and right ends by means such as sputtering, vapor deposition, or printing. External electrode 25 is electrically connected to the end portion 13a of the internal electrode 13 _1, the external electrode 26 is electrically connected to an end 13b of the inner electrode 13 _n.

The laminated inductor 11 thus obtained
Since the surfaces of the insulating sheets 12 _{1 to} 12 _n are flat, even if the number of laminated insulating sheets 12 _{1 to} 12 _n increases or the thickness of the internal electrodes 13 _{1 to} 13 _n increases. Can be stacked to a uniform thickness. As a result,
The outer shape of the product does not have a drum shape unlike the conventional multilayer inductor, and mounting defects on the printed circuit board can be reduced. Further, it is possible to suppress the stacking deviation of the insulating sheets 12 _{1 to} 12 _n , and it is possible to narrow the inductance value of the coil. Furthermore, the internal electrodes 13 _{1 to} 13 _n and the through holes 2
If 0 ₁ , 20 ₂ ... Are formed in the insulating sheets 12 _{1 to} 12 _n in the same step, the number of steps is reduced and the period required for production can be shortened.

The laminated electronic component and the method for manufacturing the same according to the present invention are not limited to the above-mentioned embodiment, but can be variously modified within the scope of the gist thereof. As a means for forming the holes for internal electrodes and the holes for through holes in the insulating sheet, punching, sandblasting, dicer processing, or the like may be adopted in addition to laser processing. Alternatively,
After forming a resist film on a predetermined portion of the surface of the insulating sheet by photolithography, the portion of the insulating sheet exposed from the resist film may be dissolved with a solvent to form holes for internal electrodes or through holes. .

Further, the multilayer electronic component may be a capacitor, a resistor or the like other than the inductor.

[0019]

As is apparent from the above description, according to the present invention, since the internal electrodes and the through holes are built in the first and second insulating sheets, respectively, the surfaces of the first and second insulating sheets are formed. Becomes flat. Therefore, the insulating sheets can be stacked to have a uniform thickness even if the number of laminated sheets is large or the thickness of the internal electrodes is large, and the outer shape of the product does not have a drum shape like a conventional laminated electronic component. Therefore, mounting defects on the printed circuit board can be reduced. Further, it is possible to suppress stacking deviation of the insulating sheets, and it is possible to narrow the deviation of the inductance value of the coil.

If the internal electrodes and the through holes are formed in the first and second insulating sheets in the same process, respectively,
The number of steps is reduced, the period required for production can be shortened, and the multilayer electronic component can be manufactured at low cost. Furthermore, since the internal electrodes are formed in the first insulating sheet, the thickness of the internal electrodes can be easily increased. In particular, in the case of a laminated inductor, a small one having excellent Q characteristics can be obtained. .

[Brief description of drawings]

FIG. 1 is a cross-sectional view for explaining one embodiment of a method for manufacturing a multilayer electronic component according to the present invention.

FIG. 2 is an exploded perspective view showing an embodiment of a laminated electronic component according to the present invention.

FIG. 3 is a sectional view of the multilayer electronic component shown in FIG.

FIG. 4 is an exploded perspective view showing a conventional laminated electronic component.

FIG. 5 is a perspective view showing a procedure for manufacturing another conventional laminated electronic component.

[Explanation of symbols]

2 ... first insulating sheet 3 ... internal electrode hole 5 ... second insulating sheet 6 ... through hole hole 7 ... conductive paste 11 ... laminated inductor 12 ₁ to 12 _n ... insulating sheet 13 ₁ to 13 _n ... Internal electrodes 20 _{1 to} 20 ₃ ... Through holes

Continuation of front page (56) Reference JP-A-7-130543 (JP, A) JP-A-7-106175 (JP, A) JP-A-7-66555 (JP, A) JP-A-5-299841 (JP , A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01F 41/04

Claims (4)

(57) [Claims] 1. A first insulator provided with a through hole for an internal electrode.
Second with rim sheet and through holes for through holes
While bonding the insulating sheet, for the internal electrode
Fill the through holes and the through holes for through holes with a conductive material.
Insulation electrodes with internal electrodes and through holes
A plurality of sheets are laminated to form a laminated body, and
In addition , the multilayer electronic component is characterized in that the internal electrodes are electrically connected to each other through the through holes . 2. A process in the first insulating sheet provided through holes for internal electrodes, and the step of forming a through hole for a through hole in the second insulating sheet, said second insulated from the first insulating sheet after was joining the sex sheet <br/>, internal electrodes and through the conductive material is filled at the same time the through hole of the through-hole and the through hole for the inner electrode
Configure forming a composite insulating sheet having a hole, a laminate by stacking the composite insulating sheet, said
And a step of electrically connecting the internal electrodes to each other through the through hole in the laminate, the method for producing a laminated electronic component. 3. A through hole for the internal electrode and the through hole.
It is special that the through holes for the
The method for manufacturing a laminated electronic component according to claim 2, wherein the characteristic is a characteristic. 4. The first insulating sheet and the second insulating sheet
Each sheet is lined with a resin film
The first insulating sheet and the second insulating sheet are
3. The joint according to claim 2, wherein the joints are fitted to each other.
Alternatively, the method for manufacturing a multilayer electronic component according to claim 3.