JP2009246167A - Manufacturing method of laminated ceramic electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated ceramic electronic component capable of preventing a part of an internal electrode projecting from a ceramic sintered body from retracting into the ceramic sintered body in a baking process. <P>SOLUTION: In this manufacturing method, a sheet laminated body 140 manufactured by laminating sheet bodies 120 including ceramic green sheets 103 provided with external electrode parts 18 in through grooves, and sheet bodies 110 provided with internal electrodes 12-15 straddling over the upper surfaces and sidewalls of the through grooves of the ceramic green sheets 103 with the internal electrodes 12-15 electrically connected to the external electrode parts 18 in the through grooves is cut in a cutting process to be formed into laminated body individual pieces 145, which are baked in a baking process. In the baking process, the external electrode parts 18 and the internal electrode parts 12-15 electrically connected to the ceramic green sheets 103 can be baked at the same time. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a multilayer ceramic electronic component.

  2. Description of the Related Art Multilayer ceramic electronic parts such as chip capacitors configured by laminating ceramic green sheets are conventionally known. For example, Japanese Unexamined Patent Application Publication No. 2003-243246 (Patent Publication 1) describes a multilayer ceramic electronic component having this configuration. The outer surface of the multilayer ceramic electronic component is composed of a ceramic body made of a ceramic sintered body, and a plurality of internal electrodes are provided in the interior thereof in a parallel positional relationship via the ceramic body. A part of each of the plurality of internal electrodes protrudes from the end face of the ceramic body, and the external electrode is electrically connected to the protruding portion of the internal electrode.

In the method for manufacturing a multilayer ceramic electronic component described in the publication, a ceramic green sheet mainly composed of BaTiO ₃ is produced, and an edge is exposed on the end face side of the ceramic green sheet on the surface of a predetermined number of ceramic green sheets. The conductive paste is applied as follows. As a result, a part of the plurality of internal electrodes is caused to protrude from the end face of the ceramic body as described above.
JP 2003-243246 A

  However, in the method for manufacturing a multilayer ceramic electronic component described in the above publication, the edge of the internal electrode is simply exposed on the end face side of the ceramic green sheet. In the firing step after the forming step, the internal electrode shrinks and enters the ceramic body (ceramic sintered body) and is electrically connected to the external electrode provided outside the ceramic body. Connection failure that cannot be performed occurs.

  Then, this invention aims at providing the manufacturing method of the laminated ceramic electronic component which can prevent the part of the internal electrode which protrudes from the ceramic sintered compact in a baking process entering a ceramic sintered compact. .

  In order to achieve the above object, the present invention comprises a step of applying a photosensitive ceramic slurry in a sheet form on the upper surface of a substrate, and a photosensitive ceramic in which the sheet-like photosensitive ceramic slurry is dried to be in a semi-cured state. A ceramic green sheet forming step for forming a green sheet, and a penetrating through the photosensitive ceramic green sheet in a direction intersecting the upper surface of the substrate by exposing and developing a part of the photosensitive ceramic green sheet A through groove forming step of forming a groove in the part of the photosensitive ceramic green sheet, and an exposed portion exposed to the through groove on the upper surface of the photosensitive ceramic green sheet facing the upper surface of the substrate Forming an internal electrode having a plurality of internal electrodes, and filling the entire space in the through groove with a conductive paste to form the through groove A sheet body manufacturing process for manufacturing the photosensitive ceramic green sheet, the internal electrode, and a sheet body having the external electrode section, and the sheet body manufacturing process is performed a plurality of times. The photosensitive ceramic green sheet and the internal electrode so that the through-grooves are positioned in a direction substantially perpendicular to the lower surface of the photosensitive ceramic green sheet. In the direction along the lower surface of the photosensitive ceramic green sheet, and laminating the sheet body so as to be laminated alternately, and removing the base material from the sheet body to produce a sheet laminated body A portion between the adjacent internal electrodes of the sheet laminate is cut in a direction intersecting the through groove, and the external electrode portion is cut along the side wall of the through groove. A cutting step of the of the laminate piece, provides a method of manufacturing a multilayer ceramic electronic component and a firing step of the laminate sintered body by firing the laminate piece.

  A through groove that forms a through groove in a part of the photosensitive ceramic green sheet in a direction intersecting the upper surface of the substrate by exposing and developing a part of the photosensitive ceramic green sheet. Forming a plurality of internal electrodes having exposed portions exposed to the through grooves on the upper surface of the photosensitive ceramic green sheet facing the upper surface of the base material; Since the process of filling the space with the conductive paste and providing the external electrode portion in the through groove is performed, the internal electrode and the external electrode can be electrically connected before firing. For this reason, it is possible to reliably prevent the contact failure between the external electrode and the internal electrode caused by the internal electrode contracting and entering the laminated body during firing in the firing step. Moreover, it is not necessary to perform a separate step of forming an external electrode outside the laminate sintered body, and the manufacturing process can be simplified.

  In addition, since the ceramic green sheet, the internal electrode, and the external electrode constituting the laminated body piece can be fired at the same time, it is a laminated layer that increases the adhesion strength of the external electrode to the ceramic sintered body constituting the laminated body. It can be a ceramic electronic component.

  In addition, since the external electrode is formed by cutting the external electrode portion formed in the through groove, as compared with the case where the external electrode is separately provided after the sintering process as in the prior art, the laminated body Control of the outer dimensions of the sintered body can be facilitated, and the mounting density can be increased.

  Here, in the internal electrode forming step, it is preferable to form the internal electrode by projecting into the through groove in a direction along the upper surface of the photosensitive ceramic green sheet.

  In the internal electrode forming step, the internal electrode is formed by projecting into the through groove in the direction along the upper surface of the photosensitive ceramic green sheet, so that the surface area of the internal electrode portion electrically connected to the external electrode portion can be increased. It is possible to electrically connect the internal electrode and the external electrode more firmly.

  In the internal electrode forming step, the internal electrode is preferably formed so as to straddle the upper surface of the photosensitive ceramic green sheet and the side wall of the through groove.

  In the internal electrode formation step, the internal electrode is formed so as to straddle the upper surface of the photosensitive ceramic green sheet and the side wall of the through groove. A ceramic sintered body formed by sintering a ceramic green sheet of a laminated body piece is a portion of the internal electrode protruding from the side wall of the laminated body piece due to contraction of the internal electrode in the firing process. Can be prevented.

  The present invention also includes a step of applying a photosensitive ceramic slurry in the form of a sheet on the upper surface of a substrate, and a ceramic for forming a photosensitive ceramic green sheet that is dried to be semi-cured by drying the sheet-like photosensitive ceramic slurry. A green sheet forming step, and exposing and developing a part of the photosensitive ceramic green sheet to form a through groove penetrating the photosensitive ceramic green sheet in a direction intersecting the upper surface of the substrate. A through groove forming step formed in the part of the green sheet; a step of filling the entire space in the through groove with a conductive paste to provide an external electrode portion in the through groove; An internal electrode forming step of arranging and forming a plurality of internal electrodes so as to straddle the upper surface with respect to the lower surface of the photosensitive ceramic green sheet and the external electrode portion; A sheet body manufacturing process for manufacturing the sheet body having the photosensitive ceramic green sheet, the internal electrode, and the external electrode portion, and a plurality of the sheet bodies manufactured by performing the sheet body manufacturing process a plurality of times. The photosensitive ceramic green sheets and the internal electrodes are alternately laminated so that the through grooves are in a positional relationship in which the through grooves coincide with each other in a direction substantially perpendicular to the lower surface of the photosensitive ceramic green sheets. A laminating step of laminating the sheet body and removing the base material from the sheet body to produce a sheet laminated body, and a direction intersecting the through groove in a direction along the lower surface of the photosensitive ceramic green sheet A cutting step of cutting a portion between the adjacent internal electrodes of the sheet laminate and cutting the external electrode portion along the side wall of the through groove to form a plurality of laminate pieces Provides a method of manufacturing a multilayer ceramic electronic component and a firing step of the laminate sintered body by firing the laminate piece.

  A through groove that forms a through groove in a part of the photosensitive ceramic green sheet in a direction intersecting the upper surface of the substrate by exposing and developing a part of the photosensitive ceramic green sheet. A forming step, a step of filling the entire space in the through groove with a conductive paste to provide an external electrode portion in the through groove, an upper surface of the photosensitive ceramic green sheet facing the upper surface of the substrate, and an upper surface of the external electrode portion. Since the internal electrode forming step of forming a plurality of internal electrodes so as to straddle the substrate is performed, the internal electrodes and the external electrodes can be electrically connected before firing. For this reason, it is possible to reliably prevent the contact failure between the external electrode and the internal electrode caused by the internal electrode contracting and entering the laminated body during firing in the firing step. Moreover, it is not necessary to perform a separate step of forming an external electrode outside the laminate sintered body, and the manufacturing process can be simplified.

  In addition, since the ceramic green sheet, the internal electrode, and the external electrode constituting the laminated body piece can be fired at the same time, it is a laminated layer that increases the adhesion strength of the external electrode to the ceramic sintered body constituting the laminated body. It can be a ceramic electronic component.

  In addition, since the external electrode is formed by cutting the external electrode portion formed in the through groove, as compared with the case where the external electrode is separately provided after the sintering process as in the prior art, the laminated body Control of the external dimensions of the sintered body can be facilitated.

  Here, in the through-groove forming step, the through-groove is formed separately and adjacent to each part of the photosensitive ceramic green sheet that becomes one end of each of the laminate pieces, thereby forming the internal electrodes. In the process, it is preferable to form one internal electrode for each through groove.

  In the through groove forming step, the through groove is formed separately and independently adjacent to each part of the photosensitive ceramic green sheet that becomes one end of each laminate piece. In the internal electrode forming step, the through groove is formed with respect to each through groove. Since the internal electrodes are formed one by one, the through groove can be made as small as possible, and the deformation of the ceramic green sheet can be suppressed as much as possible in the laminating process.

  Moreover, it is preferable to perform a binder removal process step of removing the binder in the ceramic green sheet by heating the laminate pieces after the cutting step and before the firing step.

  After the cutting step and before the firing step, the binder (resin content) in the ceramic green sheet is gradually removed in order to perform a debinding process in which the laminate pieces are heated to remove the binder in the ceramic green sheet. The ceramic green sheet can be uniformly reduced. For this reason, it is possible to prevent the resin component in the ceramic green sheet from being rapidly removed during firing and cracking the fired product.

  As described above, the present invention can provide a method for manufacturing a multilayer ceramic electronic component capable of preventing the portion of the internal electrode protruding from the ceramic sintered body from entering the ceramic sintered body in the firing step. .

  A method for manufacturing a multilayer ceramic electronic component according to the first embodiment of the present invention will be described. First, the multilayer ceramic electronic component manufactured by the manufacturing method of the multilayer ceramic electronic component according to the first embodiment or the second embodiment will be described with reference to FIGS. More specifically, the multilayer ceramic electronic component 1 is a multilayer ceramic capacitor. The multilayer ceramic electronic component 1 has a small chip shape in which ceramic green sheets are stacked, and the outer shape is a substantially rectangular parallelepiped shape. The multilayer ceramic electronic component 1 is configured by a ceramic green sheet (hereinafter referred to as “ceramic sintered body 11”) whose outer shell is laminated and fired, and a bottom surface thereof is interposed through the ceramic sintered body 11 inside. A total of four internal electrodes 12 to 15 are provided in parallel with 1A and the upper surface 1B.

  Of the four internal electrodes 12-15, the first 12 and the third 14 from the bottom of FIG. 2 protrude from the left side wall 1C of the ceramic sintered body 11 in FIG. It has a substantially L-shaped bent cross section, and has side wall upper arrangement portions 12A and 14A arranged on the left side wall 1C from the bent portion. The side wall upper placement portions 12A and 14A are electrically connected to the external electrode 16 provided on the left side wall 1C. Of the four internal electrodes 12 to 15, the second 13 and the fourth 15 from the bottom of FIG. 2 protrude from the right side wall 1D of the ceramic sintered body 11 in FIG. It has a substantially L-shaped bent cross section, and has side wall upper placement portions 13A and 15A arranged on the right side wall 1D from the bent portion. The side wall upper placement portions 13A and 15A are electrically connected to the external electrode 17 provided on the right side wall 1D. When the dimensions of the multilayer ceramic electronic component 1 are small, for example, the vertical dimension is 0.4 mm, the horizontal dimension is 0.2 mm, and the height is approximately 0.2 mm. The height is about 2.5 mm.

  Next, the multilayer ceramic electronic component 2 manufactured by the manufacturing method of the multilayer ceramic electronic component according to the third to fourth embodiments will be described with reference to FIGS. In the multilayer ceramic electronic component 2, the internal electrodes 22 to 25 are different only in that the internal electrodes 12 to 15 of the multilayer ceramic electronic component 1 are formed by removing the side wall arrangement portions 12 </ b> A to 15 </ b> A. The configuration of this part is the same as that of the multilayer ceramic electronic component 1.

  Next, a method for manufacturing the multilayer ceramic electronic component according to the first embodiment will be described with reference to FIGS. In the method for manufacturing a multilayer ceramic electronic component, a sheet body manufacturing process is first performed. In the sheet body manufacturing process, first, a light-transmitting PET sheet 101 is prepared, and a photosensitive ceramic slurry is applied to the upper surface 101A of the PET sheet 101 in a sheet form. The PET sheet 101 corresponds to a base material. A photosensitive material is added to the ceramic slurry to be applied, and the ceramic slurry has photocurability.

  Next, by drying the ceramic slurry, as shown in FIG. 5, a ceramic green sheet forming step for forming a photosensitive ceramic green sheet 103 is performed.

  Next, a through groove forming step is performed. In the through groove forming step, first, the ceramic green sheet 103 is exposed. More specifically, a mask having non-translucency (not shown) is applied to the upper surface 101A of the PET sheet 101 shown in FIG. 5B and corresponding to a position where a through groove 103a described later is formed. Then, exposure is performed from the upper surface 101A side of the PET sheet 101. The portion of the ceramic green sheet 103 corresponding to an unillustrated portion of the ceramic green sheet 103 is exposed to light and cured, but the ceramic green sheet corresponding to an unillustrated portion of the mask is applied. The portion 103 is not exposed because a mask (not shown) has non-translucency. For this reason, the portion of the ceramic green sheet 103 corresponding to the portion on which the mask (not shown) is applied is not photocured.

  Next, the PET sheet 101 on which the ceramic green sheet 103 is formed is dipped in a developer, and the ceramic green sheet corresponding to a portion of the ceramic green sheet 103 that is not photocured, that is, a portion on which a mask (not shown) is applied. The part 103 is removed. As a result, as shown in FIG. 6B, a through groove 103a penetrating the ceramic green sheet 103 in a direction perpendicular to the upper surface 101A of the PET sheet 101 is formed. As shown in FIG. 6A, four through-grooves 103a are formed in parallel in the vertical direction of the figure. In the present embodiment, the number of through-grooves 103a is four for convenience of explanation. However, in a product that is actually manufactured, the number of grooves is adjusted according to the number of laminates 145 to be manufactured, which will be described later. The number is also large.

  Next, an internal electrode forming step is performed. In the internal electrode forming step, the internal electrode 12 is formed on the ceramic green sheet 103 by screen printing. Since the internal electrodes 12 to 15 of the multilayer ceramic electronic component 1 are the same, only the formation of the internal electrode 12 will be described here. As shown in FIG. 7A, a total of nine internal electrodes 12 are formed on the ceramic green sheet 103 in a substantially rectangular shape whose longitudinal direction is directed in the horizontal direction of the drawing. The nine internal electrodes 12 are arranged at a predetermined interval in the width direction (vertical direction in the drawing), and have a positional relationship in which the end portions in the longitudinal direction are aligned, and the left end portions protrude into the through grooves 103a. . Since the internal electrode 12 is pressed against the ceramic green sheet 103 at the time of screen printing, as shown in FIG. 7B, the portion of the internal electrode 12 located in the through groove 103a is the side wall of the through groove 103a. It is arrange | positioned on the said side wall along 103b, and becomes the side wall arrangement | positioning part 12A. Accordingly, the internal electrode 12 is formed across the upper surface 103A with respect to the lower surface 103B of the ceramic green sheet 103 facing the PET sheet 101 and the side wall 103b of the through groove 103a.

  Next, an external electrode forming step is performed. In the external electrode forming step, the conductive paste is supplied into the through groove 103a to fill the entire space in the through groove 103a with the conductive paste. As a result, as shown in FIG. 8, an external electrode portion 18 made of the conductive paste and serving as external electrodes 16 and 17 described later is provided in the through groove 103 a. At this time, since the upper sidewall portion 12A of the internal electrode 12 is disposed in the through groove 103a, the sidewall upper portion 12A is electrically connected to the external electrode portion 18.

  The above is the sheet body manufacturing process. A plurality of sheet bodies 110 (110-1 to 110-4) are manufactured by performing the above sheet body manufacturing process a plurality of times. Moreover, the sheet | seat bodies 120-1 to 120-3 which do not have the internal electrode 12 are performed by performing the process which does not have only the internal electrode formation process among the above-mentioned sheet body manufacturing processes several times (FIG. 9 ( b) etc.) are manufactured in plural. The thickness of the portion of the thickness of the sheet body 110 in the vertical direction in FIG. 8B excluding the internal electrode 12, that is, the thickness of the portion of the ceramic green sheet 103 that becomes the ceramic sintered body 11 by the firing process described later is , About 0.5 μm to 20 μm.

  Next, a lamination process is performed. In the laminating step, first, the sheet body 120-1 (FIG. 9B) that does not have the internal electrodes 12 to 15 is turned upside down corresponding to FIG. It sticks by pressing the upper surface of the ceramic green sheet 103 to the adhesive sheet 131 by which adhesiveness falls by the above. Then, the PET sheet 101 is peeled off. Next, the sheet body 120-2 (FIG. 9B) that does not have the internal electrodes 12 to 15 is turned upside down corresponding to FIG. 8B, and in a direction substantially perpendicular to the lower surface of the ceramic green sheet 103. The PET sheet 101 is peeled off by being attached to the sheet body 120-1 so that the positions of the through grooves 103a coincide with each other.

  Next, the sheet body 110-1 (FIG. 9B) having the internal electrodes 12 is turned upside down in FIG. 8B, and the positions of the through grooves 103a are mutually perpendicular to the bottom surface of the ceramic green sheet 103. The PET sheet 101 is peeled off by being attached to the sheet body 120-2 so as to have a matching positional relationship. Next, the sheet body 110-2 (FIG. 9B) having the internal electrode 13 is turned upside down in FIG. 8B and the left-right direction in FIG. The PET sheet 101 is peeled off by being attached to the sheet body 110-1 so that the positions of the through-grooves 103a coincide with each other in a substantially vertical direction. Next, the sheet body 110-3 (FIG. 9B) having the internal electrode 14 is turned upside down in FIG. 8B, and the positions of the through grooves 103a are mutually perpendicular to the bottom surface of the ceramic green sheet 103. The PET sheet 101 is peeled off by being attached to the sheet body 110-2 so as to have a matching positional relationship. Next, the sheet body 110-4 having the internal electrode 15 (FIG. 9B) is turned upside down in FIG. 8B and the left and right direction in FIG. The PET sheet 101 is peeled off by adhering to the sheet body 110-3 so that the positions of the through grooves 103a coincide with each other in a substantially vertical direction.

  Next, the sheet body 120-3 (FIG. 9B) that does not have the internal electrodes 12 to 15 is turned upside down in FIG. 8B, and the through groove extends in a direction substantially perpendicular to the lower surface of the ceramic green sheet 103. The PET sheet 101 is peeled off as shown in FIG. 9B, pasted on the sheet 110-4 so that the positions 103a coincide with each other. Through the above-described lamination process, as shown in FIG. 9B, the sheet laminate 140 having a positional relationship in which the internal electrodes 12 to 15 are alternately shifted in the horizontal direction in the drawing is manufactured.

  Next, a cutting process is performed. In the cutting step, in the direction along the lower surface of the sheet-like ceramic green sheet 103, the direction intersecting the through groove 103a, more specifically, in the left-right direction of FIG. 9A, FIG. The positions corresponding to the internal electrodes 12 to 15 shown are cut with a predetermined width. Further, the external electrode portion 18 in the through groove 103a is cut at the center position of each through groove 103a in the left-right direction in FIG. Further, unnecessary portions around the sheet laminate 140 are cut and removed. As a result, as shown in FIG. 10B, the external electrode 16 electrically connected to the side wall arrangement portions 12A, 14A of the internal electrodes 12, 14 and the side wall arrangement portion of the internal electrodes 13, 15 are provided. Nine stacked body pieces 145 provided with external electrodes 17 electrically connected to 13A and 15A are obtained. Then, the adhesive sheet 131 is peeled off and removed.

  Next, the laminated body piece 145 is pressed by applying a predetermined pressure in the laminating direction. Next, a binder removal process is performed. In the binder removal process, the laminated body piece 145 is heated to about 300 ° C., and the binder in the ceramic green sheet 103 is gradually removed.

  Since the binder removal process is performed, the binder (resin component) in the ceramic green sheet 103 can be gradually removed as described above, and the ceramic green sheet 103 can be uniformly reduced. For this reason, it is possible to prevent the resin content in the ceramic green sheet 103 from being suddenly removed during firing and causing cracks in the fired product 150.

  Next, a baking process is performed. In the firing step, the nine ceramic pieces 145 are fired at approximately 1000 ° C. to cure and fire the ceramic green sheet 103 to obtain nine fired products 150 as shown in FIG. The fired product 150 corresponds to a laminated body sintered body.

  A through-groove 103a that penetrates the ceramic green sheet 103 in a direction intersecting the upper surface 101A of the PET sheet 101 is formed in a part of the ceramic green sheet 103 by exposing and developing a part of the ceramic green sheet 103. A groove forming step, an internal electrode forming step of forming a plurality of internal electrodes 12 across the upper surface 103A of the ceramic green sheet 103 and the side wall 103b of the through groove 103a, and the entire space in the through groove 103a with conductive paste The internal electrode 12 to 15 and the external electrode part 18 can be electrically connected before the firing process because the process of filling and providing the external electrode part 18 in the through groove 103a is performed. For this reason, the contact failure of the external electrode part 18 and the internal electrodes 12-15 which arises when the internal electrodes 12-15 shrink | contract and enter into the inside of a laminated body sintered body in the baking process is ensured. Can be prevented.

  In particular, the internal electrodes 12 to 15 are formed so as to protrude into the through groove 103a in the direction along the upper surface 103A of the ceramic green sheet 103, and further on the upper surface 103A of the ceramic green sheet 103 and the side wall 103b of the through groove 103a. Since the internal electrodes 12 to 15 are formed so as to straddle, the surface area of the portions of the internal electrodes 12 to 15 that are electrically connected to the external electrode portion 18 can be increased and disposed on the side wall 103b of the through groove 103a. The inner electrode placement portions 12A to 15A of the internal electrode thus caught are caught on the side wall 103b of the multilayer piece 145, and the internal electrodes 12 to 15 are contracted in the firing step so as to protrude from the side wall 103b of the multilayer piece 145. It is possible to reliably prevent the internal electrodes 12 to 15 from entering the fired product 150. Moreover, it is not necessary to perform a separate step of forming an external electrode outside the laminate sintered body, and the manufacturing process can be simplified.

  Moreover, since the ceramic green sheet 103, the internal electrodes 12-15, and the external electrode part 18 which comprise the laminated body piece 145 can be simultaneously fired, the external electrode with respect to the ceramic sintered body which comprises a laminated body sintered body Thus, the multilayer ceramic electronic component 1 with the increased adhesive strength of the portion 18 can be obtained.

  In addition, since the external electrodes 16 and 17 are formed by cutting the external electrode portion 18 formed in the through groove 103a, as compared with the case where an external electrode is separately provided after the sintering process as conventionally performed. Thus, it is possible to easily control the outer dimensions of the laminated body sintered body, and to increase the mounting density.

  Next, a method for manufacturing a multilayer ceramic electronic component according to the second embodiment will be described with reference to FIGS. In the method of manufacturing a multilayer ceramic electronic component according to the second embodiment, the shape of the through groove 203a formed in the through groove forming process is different, and one internal electrode is formed for one through groove 203a in the internal electrode forming process. 12 is different from that of the first embodiment, and the points other than these points are the same as those of the first embodiment. Therefore, the same members and the like as those in the first embodiment are described with the same reference numerals, and only the portions different from those in the first embodiment will be described.

  In the through groove forming step, first, a position on the upper surface 101A of the PET sheet 101 where a through groove 203a described later is formed, that is, a diagram of one end portion which is the left end portion of each laminate piece 145 shown in FIG. A mask having non-translucency (not shown) is put on each of the positions corresponding to the positions adjacent to the left side. Further, non-translucency (not shown) is provided at a position corresponding to a position adjacent to the right side of the right side of the figure of the other right end of the three right ends of the laminate pieces 145 of FIG. Put on each mask you have. Then, exposure is performed from the upper surface 101A side of the PET sheet 101. As in the first embodiment, the ceramic green sheet 103 corresponding to a portion where a mask (not shown) is not applied is exposed and photocured, but a mask (not shown) is applied. The ceramic green sheet 103 corresponding to the above portion is not exposed because a mask (not shown) has non-translucency. For this reason, the ceramic green sheet 103 corresponding to the masked portion (not shown) is not photocured.

  Next, a ceramic green sheet corresponding to a portion of the ceramic green sheet 103 that is not photocured, that is, a portion on which a mask (not shown) is applied, is obtained by immersing the PET sheet 101 coated with the ceramic green sheet 103 in a developer. The part 103 is removed. Thereby, as shown in FIG. 12, a through groove 203a penetrating the ceramic green sheet 103 is formed in a direction perpendicular to the upper surface 101A of the PET sheet 101. As shown in FIG. 12A, a total of twelve through-grooves 203a are formed in four rows and three columns with the longitudinal direction thereof all directed in the vertical direction of the drawing.

  In the internal electrode forming step, the internal electrode 12 is formed on the ceramic green sheet 103 by screen printing as in the first embodiment. At this time, as shown in FIG. 13, one internal electrode 12 is formed for each through groove 203a, and the left end portion of each internal electrode 12 is penetrated one by one as in the first embodiment. Project into the groove 203a.

  In the external electrode forming step, as shown in FIG. 14, the external electrode portions 28 are respectively provided in the through grooves 203a formed in a total of 12 in 4 rows and 3 columns in plan view. In the laminating step, a plurality of sheet bodies 210 and 220 (210-1 to 210-4, 220-1 to 220-3) are stacked and 12 in total in 4 rows and 3 columns in plan view as shown in FIG. A sheet laminate 240 in which the external electrode portions 28 are respectively provided in the formed through grooves 203a is manufactured. The other processes are the same as those in the first embodiment.

  In the through groove forming step, the through groove 203a is formed separately and independently adjacent to each part of the ceramic green sheet 103 which is one end of each laminated body piece 145. In the internal electrode forming step, each through groove 203a is formed. In contrast, since the internal electrodes 12 are formed one by one, the through groove 203a can be made as small as possible, and deformation of the ceramic green sheet 103 can be suppressed as much as possible in the stacking process.

  Next, a method for manufacturing a multilayer ceramic electronic component according to the third embodiment will be described with reference to FIGS. The method for manufacturing a multilayer ceramic electronic component according to the third embodiment is different from the first embodiment in that the internal electrode forming step is performed after the external electrode forming step is performed. This is the same as in the first embodiment. Therefore, the same members and the like as those in the first embodiment are described with the same reference numerals, and only the portions different from those in the first embodiment will be described.

  In the external electrode forming step performed after the through groove forming step, the entire space in the through groove 103a is filled with the conductive paste by supplying the conductive paste into the through groove 103a as in the first embodiment. As a result, as shown in FIG. 16, an external electrode portion 18 made of the conductive paste and serving as external electrodes 16 and 17 to be described later is provided in the through groove 103a.

  In the internal electrode formation step performed after the external electrode formation step, the internal electrode 22 is formed by screen printing so as to straddle the upper surface 103A of the ceramic green sheet 103 and the external electrode portion 18 in the through groove 103a. More specifically, as shown in FIG. 17, the internal electrode 22 is formed on the ceramic green sheet 103 extending from the right end portion of the drawing in the through groove 103 a to the right of the drawing. Since the internal electrodes 22 to 25 of the multilayer ceramic electronic component 2 (FIG. 3 and the like) are the same, only the formation of the internal electrode 22 will be described here.

  In the laminating step, a plurality of sheet bodies 310 and 320 (310-1 to 310-4, 320-1 to 320-3) manufactured as described above are laminated to form a sheet stack as shown in FIG. A body 340 is manufactured. Processes other than these are the same as those in the first embodiment, and in the cutting process, as shown in FIG. 19, they are electrically connected to the portions of the internal electrodes 22 and 24 protruding from the left side wall 1C of the fired product 250. 9 laminate pieces 245 provided with the external electrode 16 and the external electrode 17 electrically connected to the internal electrodes 23 and 25 protruding from the right side wall 1D of the fired product 250 are obtained. In the firing step, nine laminate pieces 245 are fired to form nine fired products 250 as shown in FIG.

  Next, a method for manufacturing a multilayer ceramic electronic component according to the fourth embodiment will be described with reference to FIGS. The method for manufacturing a multilayer ceramic electronic component according to the fourth embodiment is different from the second embodiment in that the internal electrode forming step is performed after the external electrode forming step is performed. This is the same as in the second embodiment. Therefore, the same members and the like as those of the second embodiment are described with the same reference numerals, and only the portions different from those of the second embodiment will be described.

  In the external electrode forming process performed next to the through groove forming process, as in the second embodiment, the conductive paste is supplied into the through groove 203a shown in FIG. Fill with sex paste. As a result, as shown in FIG. 22, the external electrode portions 28 which are the external electrodes 16 and 17 and are made of the conductive paste are provided in the through-groove 203a formed in a total of 12 rows and 4 columns in a plan view. It is done.

  In the internal electrode formation process performed after the external electrode formation process, the internal electrode 22 is formed by screen printing so as to straddle the upper surface 103A of the ceramic green sheet 103 and the external electrode portion 28 in the through groove 203a. More specifically, as shown in FIG. 23, the internal electrode 22 extends from the right end position of the drawing in the through groove 203a formed in a total of 12 rows and 4 columns in 4 rows and 3 columns to the right in the drawing. And formed over the ceramic green sheet 103. In the laminating step, a plurality of sheet bodies 410 and 420 (410-1 to 410-4, 420-1 to 420-3) manufactured as described above are laminated to form a sheet stack as shown in FIG. The body 440 is manufactured. Processes other than these are the same as in the second embodiment.

  The manufacturing method of the multilayer ceramic electronic component of the present invention is not limited to the above-described embodiment, and various modifications and improvements can be made within the scope described in the claims. For example, although the internal electrode 22 has a substantially L-shaped cross section in the first and second embodiments, it is not limited to this shape. Even if it has a portion that further extends on the PET sheet 101 from the upper side wall arrangement portion 12A, it is formed over the upper surface of the ceramic green sheet 103, the side wall 103b of the through groove 103a, and the PET sheet 101. Good. In addition to this, as a configuration that does not have a portion formed on the side wall 103b of the through groove 103a or the PET sheet 101, for example, an exposed portion exposed to the through grooves 103a and 203a is provided. The internal electrode may be configured, or a part of the internal electrode may protrude into the through grooves 103a and 203a.

  In the internal electrode formation step, the internal electrodes 12 and 22 are formed on the ceramic green sheet 103 by screen printing. However, the internal electrodes 12 and 22 are not limited to screen printing, and may be formed by pasting by transfer or gravure printing. You may form, and you may form by the thin film formation method by sputtering, CVD, vapor deposition, etc.

  Moreover, you may comprise with the photosensitive material which has the solubility to a developing solution by exposing a ceramic green sheet. The multilayer ceramic electronic components 1 and 2 are multilayer ceramic capacitors, but are not limited to capacitors. Further, the number of sheet bodies 110, 120, 210, 220, 310, 320, 410, 420 is not limited to the number in the present embodiment.

  In addition, although the pressure-sensitive adhesive sheet 131 is used in the lamination process, other sheets may be used instead of the pressure-sensitive adhesive sheet 131, and the ceramic is obtained by sucking air through other means, for example, a sheet having good air permeability. A means for adsorbing the green sheet 103 and terminating the adsorption when the lamination process is completed may be used. Moreover, although the sheet laminated bodies 140, 240, 340, and 440 were heated to 150 ° C. or more and the adhesive sheet 131 was peeled off, the quality and characteristics of the multilayer ceramic electronic components 1 and 2 that became products in the steps after the binder removal processing As long as it does not adversely affect the surface, it may be burned in the firing step without peeling.

  Further, in the through groove forming step, a non-light-transmitting mask (not shown) is applied to a position corresponding to the position where the through groove 103a is formed on the lower surface 101B of the PET sheet 101 shown in FIG. 5B. Then, exposure may be performed through the mask from the lower surface 101B side of the PET sheet 101.

  The method for producing a multilayer ceramic electronic component of the present invention is useful in the field of multilayer ceramic electronic components that require that the external electrode and the internal electrode be reliably electrically connected.

The top view which shows the multilayer ceramic electronic component manufactured by the manufacturing method of the multilayer ceramic electronic component by the 1st, 2nd embodiment of this invention. The side sectional view showing the multilayer ceramic electronic component manufactured by the manufacturing method of the multilayer ceramic electronic component by the 1st and 2nd embodiment of the present invention. The top view which shows the multilayer ceramic electronic component manufactured by the manufacturing method of the multilayer ceramic electronic component by the 3rd, 4th embodiment of this invention. Side sectional drawing which shows the multilayer ceramic electronic component manufactured by the manufacturing method of the multilayer ceramic electronic component by the 3rd, 4th embodiment of this invention. It is a figure which shows a mode that the photosensitive ceramic green sheet was provided on the PET sheet in the manufacturing method of the multilayer ceramic electronic component by the 1st Embodiment of this invention, (a) is a top view, (b) is a side view Cross-sectional view. It is a figure which shows the through-groove formation process of the manufacturing method of the multilayer ceramic electronic component by the 1st Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows the internal electrode formation process of the manufacturing method of the multilayer ceramic electronic component by the 1st Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows the external electrode formation process of the manufacturing method of the multilayer ceramic electronic component by the 1st Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows the lamination process of the manufacturing method of the multilayer ceramic electronic component by the 1st Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows the process of heating a sheet | seat laminated body, peeling an adhesive sheet, and pressing in the manufacturing method of the multilayer ceramic electronic component by the 1st Embodiment of this invention, (a) is a top view, (b) Is a side sectional view. It is a figure which shows the binder removal process and baking process of the manufacturing method of the multilayer ceramic electronic component by the 1st Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows the through-groove formation process of the manufacturing method of the multilayer ceramic electronic component by the 2nd Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows the internal electrode formation process of the manufacturing method of the multilayer ceramic electronic component by the 2nd Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows the external electrode formation process of the manufacturing method of the multilayer ceramic electronic component by the 2nd Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows the lamination process of the manufacturing method of the multilayer ceramic electronic component by the 2nd Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows the external electrode formation process of the manufacturing method of the multilayer ceramic electronic component by the 3rd Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows the internal electrode formation process of the manufacturing method of the multilayer ceramic electronic component by the 3rd Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows the lamination process of the manufacturing method of the multilayer ceramic electronic component by the 3rd Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows the process of heating a sheet | seat laminated body, peeling an adhesive sheet, and pressing in the manufacturing method of the multilayer ceramic electronic component by the 3rd Embodiment of this invention, (a) is a top view, (b) Is a side sectional view. It is a figure which shows the binder removal process and baking process of the manufacturing method of the multilayer ceramic electronic component by the 3rd Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows the through-groove formation process of the manufacturing method of the multilayer ceramic electronic component by the 4th Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows the external electrode formation process of the manufacturing method of the multilayer ceramic electronic component by the 4th Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows the internal electrode formation process of the manufacturing method of the multilayer ceramic electronic component by the 4th Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows the lamination process of the manufacturing method of the multilayer ceramic electronic component by the 4th Embodiment of this invention, (a) is a top view, (b) is side sectional drawing.

Explanation of symbols

1, 2 Multilayer ceramic electronic components 12-15 Internal electrode 16, 17 External electrode 18, 28 External electrode portion 12A, 13A, 14A, 15A Side wall upper portion 101 PET sheet 103 Ceramic green sheets 103a, 203a Through grooves 110, 210, 310, 410 Sheet body 140, 240, 340, 440 Sheet laminated body 145, 245 Laminated body piece 150, 250 Ceramic sintered body

Claims (6)

A step of applying the photosensitive ceramic slurry in a sheet form on the upper surface of the substrate, and a ceramic green sheet forming step of forming a photosensitive ceramic green sheet in which the sheet-like photosensitive ceramic slurry is dried to be in a semi-cured state; By exposing and developing a part of the photosensitive ceramic green sheet, a through groove penetrating the photosensitive ceramic green sheet in a direction intersecting the upper surface of the substrate is formed in the part of the photosensitive ceramic green sheet. Forming a plurality of internal electrodes having exposed portions exposed to the through grooves on the upper surface of the lower surface of the photosensitive ceramic green sheet facing the upper surface of the substrate. And a step of filling an entire space in the through groove with a conductive paste and providing an external electrode portion in the through groove, A sheet process of manufacturing a sheet member having a photosensitive ceramic green sheet and the internal electrode and the external electrode portion,
A plurality of the sheet bodies manufactured by performing the sheet body manufacturing process a plurality of times are arranged so that the through grooves are in a positional relationship in which the through grooves are aligned with each other in a direction substantially perpendicular to the lower surface of the photosensitive ceramic green sheet. Laminating the sheet body so that the photosensitive ceramic green sheets and the internal electrodes are alternately laminated, and laminating the sheet body by removing the substrate from the sheet body; and
Cutting a portion between the adjacent internal electrodes of the sheet laminate in a direction crossing the through groove in a direction along the lower surface of the photosensitive ceramic green sheet and along the side wall of the through groove A cutting step of cutting the electrode part into a plurality of laminate pieces,
A method for producing a multilayer ceramic electronic component, comprising: a firing step of firing the individual laminate body to obtain a multilayer body sintered body.   2. The method of manufacturing a multilayer ceramic electronic component according to claim 1, wherein in the internal electrode forming step, the internal electrode is formed to project into the through groove in a direction along the upper surface of the photosensitive ceramic green sheet.   3. The multilayer ceramic electronic component according to claim 2, wherein in the internal electrode forming step, the internal electrode is formed so as to straddle the upper surface of the photosensitive ceramic green sheet and the side wall of the through groove. Method. A step of applying the photosensitive ceramic slurry in a sheet form on the upper surface of the substrate, and a ceramic green sheet forming step of forming a photosensitive ceramic green sheet in which the sheet-like photosensitive ceramic slurry is dried to be in a semi-cured state; By exposing and developing a part of the photosensitive ceramic green sheet, a through groove penetrating the photosensitive ceramic green sheet in a direction intersecting the upper surface of the substrate is formed in the part of the photosensitive ceramic green sheet. A through-groove forming step formed on the substrate, a step of filling an entire space in the through-groove with a conductive paste and providing an external electrode portion in the through-groove, and a step of forming the photosensitive ceramic green sheet facing the upper surface of the substrate. An internal electrode forming step of arranging and forming a plurality of internal electrodes so as to straddle the upper surface with respect to the lower surface and the external electrode portion, and the photosensitivity A sheet process of manufacturing a sheet having a La Mick green sheet and internal electrode and the external electrode portion,
A plurality of the sheet bodies manufactured by performing the sheet body manufacturing process a plurality of times are arranged so that the through grooves are in a positional relationship in which the through grooves are aligned with each other in a direction substantially perpendicular to the lower surface of the photosensitive ceramic green sheet. Laminating the sheet body so that the photosensitive ceramic green sheets and the internal electrodes are alternately laminated, and laminating the sheet body by removing the substrate from the sheet body; and
Cutting a portion between the adjacent internal electrodes of the sheet laminate in a direction crossing the through groove in a direction along the lower surface of the photosensitive ceramic green sheet and along the side wall of the through groove A cutting step of cutting the electrode part into a plurality of laminate pieces,
A method for producing a multilayer ceramic electronic component, comprising: a firing step of firing the individual laminate body to obtain a multilayer body sintered body. In the through groove forming step, the through groove is formed separately and adjacent to each part of the photosensitive ceramic green sheet that becomes one end of each laminate piece,
5. The method of manufacturing a multilayer ceramic electronic component according to claim 1, wherein in the internal electrode forming step, the internal electrode is formed one by one for each through groove.   The binder removal process of removing the binder in the ceramic green sheet by heating the laminate pieces after the cutting process and before the firing process is performed. 6. The method for producing a multilayer ceramic electronic component according to any one of 5 above.

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