JP2009226924A - Printing mask, method for manufacturing the same, printing method using the printing mask, and method for manufacturing wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a printing mask capable of forming microwiring lines without any disconnection even in a state immediately after printing. <P>SOLUTION: The printing mask constituted of a platelike member is provided with first and second mask areas having a connection part and separation part in a boundary. The connection part is formed into a bridge structure interconnecting the first and second mask areas. The plate-like member has a first layer constituted of a metal layer having a through-hole constituting the separation part, and a second layer stacked on the first layer and an area other than an area corresponding to the connection part on the first layer. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a printing mask used for forming a conductor pattern in a process of manufacturing a ceramic substrate such as a multilayer ceramic wiring substrate, a method for manufacturing the printing mask, and printing using such a printing mask. The present invention relates to a method and a method for manufacturing a wiring board.

  Conventionally, in a multilayer ceramic substrate, a conductive film to be an internal electrode is formed on a ceramic green sheet, and a plurality of ceramic green sheets on which the conductive film is formed are laminated to obtain a ceramic laminated body. Manufactured by firing. As a method for forming a conductive film serving as an internal electrode on a ceramic green sheet, a screen printing method has been usually used because of problems such as cost, tact, and thick film formation.

  In this screen printing method, a screen plate having a mesh or a plate combining a mesh and a metal mask is mainly used.

However, when a fine wiring having a width of about 30 μm or less, which is required in recent years, is used for the purpose of suppressing problems such as irregularities caused by the mesh on the wiring due to the presence of this mesh and the lack of ink. There is a problem that even if high thixotropy ink is used because the ink is blocked, the thickness is difficult to be placed.

  In response to these problems, the use of a metal mask without a mesh can suppress the occurrence of such irregularities due to the mesh, and also has a greater thickness due to the absence of a mesh for the purpose of suppressing ink loss. Can be placed.

However, in the case of a metal mask, there are design restrictions such as a closed pattern (for example, a pattern of a circle, a quadrangle, a polygon, etc.) in which the opening is closed. It is difficult to design the pattern. Therefore, as a method of satisfying this, a method of using a metal mask obtained by connecting two mask regions arranged with a closed circuit pattern by a plurality of bridges, and etching a part of the bridge in contact with the printed material. Has been proposed (see Patent Document 1). Thereby, it is possible to form a closed pattern wiring without disconnecting a desired pattern.
JP 2007-331195 A

However, in the method described in Patent Document 1, since there is a constraint that the aspect ratio between the width of the fine wiring and the thickness of the metal mask must be 1 or less, a fine wiring having a width of about 30 μm or less recently required is used. In order to form, half etching with respect to a metal mask having a thickness of 30 μm or less is forced. However, from the viewpoint of strength, since the thickness of the metal mask that can be half-etched is 100 μm or more, it is substantially difficult to cope with this.

  The present invention has been made to solve the above-described problems. A printing mask capable of forming fine wiring without being disconnected even in a state immediately after printing, a method for manufacturing the printing mask, and a printing mask are provided. An object of the present invention is to provide a printing method used and a method for manufacturing a wiring board.

  The printing mask of the present invention is a printing mask made of a plate-like member, and includes a first mask region and a second mask region having a connection portion and a separation portion at a boundary portion, and the connection portion includes The first mask region and the second mask region are connected to each other, and the plate-like member includes a first layer made of a metal layer provided with a through-hole forming the separated portion and the first layer. And a second layer stacked in a region other than the region corresponding to the connection portion on the layer.

In the printing mask, preferably, the plate-like member has a third layer that is laminated in a region corresponding to the connection portion on the first layer and is thinner than the second layer. In the printing mask, the second layer is preferably thicker than the first layer.

  In the printing mask, the second layer and the third layer are preferably made of a resin layer.

  In the printing mask, preferably, when viewed in plan, an angle formed by the connection portion and the first mask region, and an angle formed by the connection portion and the second mask region are: Each is rounded.

  In the printing mask, preferably, the bridge structure has a tapered side wall.

  A first printing mask manufacturing method according to the present invention is a printing mask manufacturing method including a plurality of layers, and includes a first mask region, a second mask region, the first mask region, and the second mask. Preparing a metal plate having a bridge-shaped third mask region connecting the mask region; forming a resin layer on the first to third mask regions of the metal plate; and The resin layer on the third mask region is completely removed, or the resin layer on the third mask region is thinner than the resin layer on the first mask region and the second mask region. And removing a part of the resin layer on the third mask region.

  A second printing mask manufacturing method according to the present invention is a printing mask manufacturing method including a plurality of layers, and includes a first mask region, a second mask region, the first mask region, and the second mask. A step of preparing a metal plate having a bridge-shaped third mask region connecting the mask region; and a step of forming a resin layer on the first and second mask regions of the metal plate.

  The printing method of the present invention is a printing method using any one of the above-described printing masks, the step of arranging the printing material on the second layer side of the printing mask, and the printing material And a step of applying a printing material from the first layer side of the printing mask.

  A first method for manufacturing a wiring board according to the present invention is a method for manufacturing a wiring board using the printing mask described above, and a step of disposing a ceramic green sheet on the second layer side of the printing mask. And a step of applying a conductive paste from the first layer side of the printing mask to the ceramic green sheet, a step of drying the conductive paste, and the dried conductive paste. The method includes a step of laminating a plurality of the ceramic green sheets to produce a green sheet laminate, and a step of firing the green sheet laminate.

  A second method for manufacturing a wiring board according to the present invention is a method for manufacturing a wiring board using the above-described printing mask, the step of disposing a support on the second layer side of the printing mask; Applying the conductive paste from the first layer side of the printing mask to the support, drying the conductive paste, and drying the dry on the support A step of applying a ceramic slurry so as to cover the conductive paste, a step of drying the ceramic slurry to form a first laminate of a support and a ceramic green sheet, and a support from the first laminate Removing a ceramic green sheet with a conductor layer, laminating a plurality of the ceramic green sheets with a conductor layer to produce a green sheet laminate, and the green sheet. And a step of firing the door laminate.

  According to the printing mask of the present invention, fine wiring can be formed without disconnection even immediately after printing.

  According to the method for producing a printing mask of the present invention, a printing mask capable of forming a fine wiring pattern can be easily produced.

  According to the printing method using the printing mask of the present invention, fine wiring can be formed without disconnection even immediately after printing.

  According to the method for manufacturing a wiring board of the present invention, a wiring board having fine wiring can be manufactured.

Embodiments of the present invention will be described below with reference to the accompanying drawings.
FIG. 1 is a diagram showing a configuration example of a printing mask according to an embodiment of the present invention, in which (a) is a perspective view and (b) and (c) are plan views. FIG. 2 is a diagram showing a detailed configuration of the printing mask 1 shown in FIG. 1 and a pattern shape of a fine wiring formed using the printing mask 1, and FIG. The plan view of the mask 1 and the plan view of the pattern shape of the fine wiring, (b) is a cross-sectional view along the dotted line XX in (a) and the fine wiring pattern along the dotted line X′-X ′ corresponding to the dotted line XX (C) is a cross-sectional view taken along the dotted line YY in (a) and a cross-sectional view taken along the dotted line Y′-Y ′ corresponding to the dotted line YY. FIG. 5 is a cross-sectional view taken along a dotted line ZZ and a cross-sectional view taken along a dotted line Z′-Z ′ corresponding to the dotted line ZZ. As shown in FIG. 1A, the printing mask 1 according to the present embodiment is a mask composed of a two-layer plate-shaped member including a metal layer 2 and a resin layer 3. Further, as shown in FIGS. 1B and 1C, the printing mask 1 has a through hole 4, and the first mask region P1 and the second mask region P2 are sandwiched by the through hole 4 therebetween. Have. The first mask region P1 and the second mask region P2 are connected by a plurality of bridge-shaped connection portions (hereinafter referred to as “bridge portions”) 5. The bridge portion 5 forms a third mask region P3.

  In addition, as shown in FIG. 2, only the resin layer 3 on the back side of the bridge portion 5 is selectively removed to form a recess on the back side of the bridge portion 5.

  For example, when a wiring pattern is formed using such a printing mask 1 in the manufacturing process of the wiring substrate, a substrate 6 such as a ceramic substrate is disposed on one main surface side of the printing mask 1 and the other is printed. A printed material 7 such as a conductive paste is applied from the main surface side. This application is performed, for example, by moving the squeegee in the surface direction on the other main surface of the printing mask 1. At this time, the printed matter 7 that has reached the other main surface side of the printing mask 1 through the through hole 4 wraps around the back side of the bridge portion 5 as shown in FIG. It is possible to form a wiring pattern as shown in FIG.

  As described above, the plate-like member having the printing mask 1 having the metal layer 2 provided with the through holes 4 and the resin layer 3 laminated in a region other than the region corresponding to the bridge portion 5 on the metal layer 2. Therefore, a closed pattern of fine wiring having a width of 30 μm or less can be easily and stably formed. That is, even for a thin metal mask that cannot be handled by the conventional half-etching process, a bridge structure can be easily manufactured by laminating the resin layer 3 on the metal mask and controlling the thickness of the resin layer 3. Therefore, the fine closed circuit pattern as described above can be easily produced. In addition, when a mask having a mesh is used, the mesh may suppress the amount of application of the printed material. However, if the printing mask 1 according to the present embodiment is used, the amount of application of the printing material can be suppressed. In addition, fine wiring can be printed.

  In addition, by making the resin layer 3 thicker than the metal layer 2, it is possible to reduce the influence of the printed product concave portion caused by the bridge portion 5 on the entire film thickness of the printed product 7 transferred to the printed material 6.

  The layer laminated on the metal layer 2 may be made of any kind of resin. However, when the resin has particularly good bondability with metal and good exposure resolution, and more easily, Precise pattern formation is possible. In the printing mask 1, the resin layer 3 is used as a layer laminated on the metal layer 2 for ease of processing, but a layer made of another material may be used.

  Further, as a method of manufacturing the printing mask 1, a metal plate having an opening pattern made of through holes is prepared, and then a resin layer is formed on the metal plate, and further laminated in a region corresponding to the bridge portion 5. A method of removing the entire resin layer by etching or laser processing can be employed. In this case, a desired printing mask having a high-precision pattern is produced without damaging the metal plate by performing selective etching only on the resin layer or laser processing using an effective laser wavelength only on the resin layer. It becomes possible to do. Further, instead of removing the entire resin layer laminated on the bridge portion 5, a part of the resin layer laminated on the bridge portion 5 becomes thinner than the resin layer laminated on the region other than the bridge portion 5. It may be removed as follows.

  Moreover, when creating a fine pattern, in order to selectively remove only the resin layer 3 laminated | stacked on the bridge | bridging part 5, it is preferable to etch using a laser beam below visible light wavelength. At this time, if a top hat beam having a flat spire value of the laser beam is used, a desired printing mask 1 having a pattern with higher accuracy can be manufactured while suppressing damage to the metal plate 2. . 3A shows the shape of the top hat beam, FIG. 3B shows the waveform of the top hat beam, and FIG. 3C shows the resin layer 3 by the top hat beam having the waveform shown in FIG. Shows the shape of the hole formed. As shown in FIG. 3B, in the top hat beam, the high output intensity portion of the laser light has a uniform output intensity distribution. The output intensity in the uniformly distributed region is an output intensity that can sufficiently remove the resin layer 3 and that does not damage the metal plate 2.

As shown in FIG. 3B, when the resin layer 3 can be removed when the output intensity of the laser light is 1 / e ² or more of the peak value, the output intensity is 1 / e ² or more of the peak value. The ratio d / D of the diameter d of the flat portion of the beam steeple to the beam diameter D of a certain portion is preferably 70% or more. With such a beam waveform, it is possible to manufacture a desired printing mask 1 having a pattern with higher accuracy while suppressing damage to the metal plate 2.

  Further, in laser processing, it is preferable to use an aperture in order to prevent the excess resin layer 3 from being removed by a region having a predetermined output intensity or more at the skirt portion of the beam waveform.

  In addition, by using a material having a high reflectance with respect to light as the metal layer 2, the metal layer 2 is processed from both the incident laser beam and the reflected laser beam. The laminated resin layer 3 can be efficiently removed, and a highly accurate pattern can be formed on the printing mask 1.

  In addition, the manufacturing method of the mask 1 for printing is not this limitation, The resin layer from which the part corresponding to the opening pattern and the bridge | bridging part 5 of the metal layer which has the opening pattern which consists of a through-hole becomes an opening pattern Can be prepared in advance, and the metal plate and the resin layer can be bonded together later.

  Moreover, the metal plate which has an opening pattern which consists of a through-hole, and the resin layer which has an opening pattern in the part corresponding to the opening pattern of a metal layer, and the thickness of the part corresponding to the bridge part 5 is thinner than the thickness of another area | region May be prepared in advance, and the metal plate and the resin layer may be bonded together later.

  Next, a method for manufacturing a ceramic substrate using the printing mask 1 according to the present embodiment will be described. First, a ceramic green sheet is arranged on the resin layer 3 side of the printing mask 1. For example, the ceramic green sheet is arranged on the table so that the printing mask 1 and the ceramic green sheet are kept at a certain distance. Then, a conductive paste is placed on the printing mask 1 and squeezed at a desired squeegee speed. At this time, the conductor paste passes through the through hole 4 and is transferred to the ceramic green sheet. Thereafter, the conductor paste is dried. A plurality of ceramic green sheets having the conductive paste thus dried are prepared and laminated to prepare a green sheet laminate. Thereafter, the green sheet laminate is fired to obtain a ceramic wiring board. Before applying the conductive paste to the ceramic green sheets using the printing mask 1, through holes are formed in some ceramic green sheets in advance, and after applying the conductive paste to the through holes, the ceramic green sheets are Conductor vias may be formed by stacking and firing.

  As shown in FIG. 4, the angle formed between the bridge portion 5 and the first mask region P1 and the angle formed between the bridge portion 5 and the second mask region P2 may be rounded. Here, FIG. 4A is a plan view of the printing mask 1, and FIG. 4B is a partially enlarged view of the region S1 in FIG. According to such a configuration, during squeezing, the stress applied to the bridge portion 5 is relaxed, and breakage of the bridge portion 5 can be suppressed.

  Moreover, as shown in FIG. 5, the bridge part 5 may have a tapered side wall. Here, FIG. 5A is a plan view of the printing mask 1, FIG. 5B is a cross-sectional view taken along line XX of the region S2 in FIG. 5A, and FIG. It is a perspective view which shows the part of area | region S2 in a). As described above, when the side wall of the bridge portion 5 has a tapered shape, the ink easily flows into the lower portion of the bridge portion 5.

  The printing mask 1 is used for manufacturing various wiring boards. For example, a support such as a pet film may be disposed on the resin layer 3 side of the printing mask 1 and a conductive paste may be applied to the support from the metal layer 2 side of the printing mask 1. Thereafter, the conductor paste is dried, a ceramic slurry is applied thereon, and the ceramic slurry is dried to produce a laminate of the support and the ceramic green sheet. The support is removed from the laminate to obtain a ceramic green sheet with a conductor layer, and a green sheet laminate is produced by laminating a plurality of ceramic green sheets with a conductor layer. Obtainable.

  Furthermore, a resin substrate can be obtained by forming a wiring conductor on the resin layer using the printing mask 1.

It is a figure which shows the structural example of the printing mask by embodiment of this invention, (a) is a perspective view, (b) is a top view, (c) shows area | region P1, P2 in a printing mask. It is a top view. FIG. 2 is a diagram showing a detailed configuration of the printing mask 1 shown in FIG. 1 and a pattern shape of a fine wiring formed using the printing mask 1, and (a) is a plan view of the printing mask 1. And (b) is a sectional view taken along a dotted line XX in (a) and a sectional view taken along a dotted line X′-X ′ corresponding to the dotted line XX, (c) ) Is a cross-sectional view taken along dotted line YY in (a) and a cross-sectional view taken along a dotted line Y′-Y ′ corresponding to dotted line YY, and (d) is taken along dotted line ZZ in (a). It is sectional drawing and sectional drawing of the fine wiring pattern in dotted line Z'-Z 'corresponding to dotted line ZZ. (A) shows the shape of the top hat beam, (b) shows the waveform of the top hat beam, and (c) shows the shape of the hole processed by the top hat beam having the waveform shown in (b). . (A) is a top view of a printing mask, (b) is the elements on larger scale of area | region S1 in (a). (A) is a plan view of a printing mask, (b) is a cross-sectional view taken along line XX of region S2 in (a), and (c) is a perspective view showing a portion of region S2 in (a). is there.

Explanation of symbols

1. 1. Mask for printing 2. Metal layer Resin layer 4. Through hole (opening pattern)
5. Bridge part 6. Substrate

Claims (11)

  A printing mask made of a plate-like member, comprising a first mask region and a second mask region having a connection portion and a separation portion at a boundary portion, wherein the connection portion includes the first mask region and the second mask. The plate-like member is a region other than a region corresponding to the connection portion on the first layer and the first layer made of a metal layer provided with a through hole forming the separation portion. A printing mask having a second layer laminated thereon.   2. The printing mask according to claim 1, wherein the plate-like member has a third layer that is laminated in a region corresponding to the connection portion on the first layer and is thinner than the second layer.   The printing mask according to claim 1, wherein the second layer is thicker than the first layer.   The printing mask according to any one of claims 1 to 3, wherein the second layer and the third layer are made of a resin layer.   The angle formed between the connection portion and the first mask region and the angle formed between the connection portion and the second mask region when viewed in a plan view are rounded, respectively. The mask for printing in any one.   6. The printing mask according to claim 1, wherein the bridge structure has a tapered side wall. A method for producing a printing mask comprising a plurality of layers,
Preparing a metal plate having a first mask region, a second mask region, and a bridge-shaped third mask region connecting the first mask region and the second mask region;
Forming a resin layer on the first to third mask regions of the metal plate;
The resin layer on the third mask region is entirely removed, or the resin layer on the third mask region is thinner than the resin layer on the first mask region and the second mask region. A step of removing a part of the resin layer on the three mask regions. A method for producing a printing mask comprising a plurality of layers,
Preparing a metal plate having a first mask region, a second mask region, and a bridge-shaped third mask region connecting the first mask region and the second mask region;
Forming a resin layer on the first and second mask regions of the metal plate. A printing method using the printing mask according to any one of claims 1 to 6,
A printing method comprising: arranging a printing material on the second layer side of the printing mask; and applying a printing material to the printing material from the first layer side of the printing mask. A method of manufacturing a wiring board using the printing mask according to any one of claims 1 to 6,
Disposing a ceramic green sheet on the second layer side of the printing mask;
Applying a conductive paste from the first layer side of the printing mask to the ceramic green sheet;
Drying the conductive paste;
Laminating a plurality of ceramic green sheets having the dried conductor paste to produce a green sheet laminate;
A method of manufacturing a wiring board, comprising a step of firing the green sheet laminate. A method of manufacturing a wiring board using the printing mask according to any one of claims 1 to 6,
Disposing a support on the second layer side of the printing mask;
Applying a conductive paste from the first layer side of the printing mask to the support;
Drying the conductive paste;
Applying a ceramic slurry so as to cover the dried conductor paste on the support;
Drying the ceramic slurry to form a first laminate of a support and a ceramic green sheet; removing the support from the first laminate to obtain a ceramic green sheet with a conductor layer;
A step of laminating a plurality of ceramic green sheets with a conductor layer to produce a green sheet laminate,
A method of manufacturing a wiring board, comprising a step of firing the green sheet laminate.

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