JP7182856B2 - Wiring board and its manufacturing method - Google Patents

Description

An embodiment of the present disclosure relates to a wiring board and a manufacturing method thereof.

a substrate including a first surface and a second surface; a plurality of holes provided in the substrate and penetrating from the first surface to the second surface; There is known a through electrode substrate provided with an electrode portion (see Patent Literature 1). Such a through electrode substrate can be used when manufacturing a wiring substrate. In the following description, the electrode portion is called a through electrode.

JP 2011-3925 A

A wiring board manufactured from a through electrode substrate as described above includes, for example, an insulating layer provided on the through electrode substrate, a wiring layer provided on the insulating layer, and a connection electrode provided to penetrate the insulating layer. , and a multilayer wiring board in which the wiring layers and the through electrodes are electrically connected by the connection electrodes.

A connection electrode in such a wiring substrate may be formed by patterning a conductive layer formed by sputtering or vapor deposition. However, in this case, the density of the connection electrodes increases, making it difficult for the gas generated on the side of the through electrodes to escape to the outside. As a result, gas flows between the insulating layer and the substrate, and the insulating layer tends to swell, which may lead to deterioration in quality.

In addition, when the conductive layer formed by sputtering or vapor deposition is patterned to form the connection electrode as described above, the number of man-hours is relatively large, so there is also a problem in improving productivity.

In addition, there are cases where elements are mounted on the wiring board, and the mounting of the elements is generally performed in a process independent of other processes. It is naturally desired to improve the efficiency of the mounting process of such elements.

The embodiments of the present disclosure have been made in view of the above circumstances, and provide a wiring board on which an element is mounted, which can easily ensure good ventilation for gas generated inside and can be easily manufactured. It is an object of the present invention to provide a wiring board and a manufacturing method thereof.

One embodiment of the present disclosure includes a first surface and a second surface located opposite to the first surface, and a through hole penetrating from the first surface to the second surface or the first surface and the a substrate provided with a bottomed hole recessed from one side of the second surface to the other; a first electrode positioned in the through hole or the bottomed hole; an insulating layer; a second electrode provided on one or both of the first surface and the second surface so as to cover the first electrode exposed from the substrate; a coating layer electrically connected to one electrode; a wiring layer provided on the coating layer and electrically connected to the second electrode; and a wiring layer in the insulating layer between the substrate and the wiring layer and an element electrically connected to the wiring layer, wherein the second electrode has a conductive member containing conductive particles and a binder, and the first electrode and the wiring layer are separated from each other. A wiring board that is electrically connected.

In the wiring board according to one embodiment of the present disclosure, the element may be electrically connected to the wiring layer via a conductive member made of the same material as the conductive member of the second electrode.

Further, in the wiring board according to one embodiment of the present disclosure, the second electrode is electrically connected to the first electrode via a conductive connection layer provided on the first surface or the second surface. You may

Further, the wiring board according to one embodiment of the present disclosure further includes a counter substrate positioned to face the substrate with the wiring layer and the covering layer interposed therebetween, wherein the counter substrate includes the wiring layer and the covering layer. It may be integrated with the substrate via.

Further, in the wiring board according to one embodiment of the present disclosure, the substrate and the counter substrate may be made of a glass substrate.

Further, in the wiring board according to the embodiment of the present disclosure, the counter substrate includes a first counter surface and a second counter surface located opposite to the first surface, and An opposing-side through hole penetrating from the surface to the opposing-side second surface or an opposing-side bottomed hole recessed from one of the opposing-side first surface and the opposing-side second surface to the other is provided, and the opposing-side through hole is provided. A third electrode electrically connected to the wiring layer may be located in the hole or the bottomed hole on the opposite side.

Further, in the wiring board according to one embodiment of the present disclosure, the conductive particles may contain metal.

Further, in the wiring board according to one embodiment of the present disclosure, the binder may contain an epoxy resin.

Moreover, in the wiring board according to an embodiment of the present disclosure, the insulating layer may contain a non-photosensitive resin.

Further, in the wiring board according to an embodiment of the present disclosure, the insulating layer may be made of prepreg containing the non-photosensitive resin.

Further, in the wiring board according to one embodiment of the present disclosure, the insulating layer may contain polyimide resin.

Moreover, in the wiring board according to the embodiment of the present disclosure, the substrate may be made of a glass substrate.

Further, one embodiment of the present disclosure includes a first surface and a second surface located on the opposite side of the first surface, and a through hole penetrating from the first surface to the second surface or the first surface and a step of preparing an electrode substrate having a substrate provided with a bottomed hole recessed from one of the second surfaces to the other, and a first electrode positioned in the through hole or the bottomed hole; and an insulating layer. a covering layer including a second electrode provided to penetrate the insulating layer and an element located in the insulating layer; and a covering layer provided on the covering layer and electrically connected to the second electrode and the element. a step of preparing a wiring forming member having a wiring layer, wherein the second electrode has a conductive member containing conductive particles and a binder and protrudes from the insulating layer; and bonding the wiring forming member to the electrode substrate so as to be electrically connected to the first electrode.

In the manufacturing method according to an embodiment of the present disclosure, the wiring forming member may be joined to the electrode substrate by welding the insulating layer to the substrate.

Further, in the manufacturing method according to an embodiment of the present disclosure, the wiring forming member may be heated and pressurized toward the substrate to be bonded to the electrode substrate.

Further, in the manufacturing method according to an embodiment of the present disclosure, the element may be electrically connected to the wiring layer via a conductive member made of the same material as the conductive member of the second electrode. .

Further, in the manufacturing method according to an embodiment of the present disclosure, the second electrode is electrically connected to the first electrode via a conductive connection layer provided on the first surface or the second surface. may be

Moreover, in the manufacturing method according to an embodiment of the present disclosure, the conductive member may be formed using a conductive paste.

Further, in the manufacturing method according to an embodiment of the present disclosure, the wiring forming member may further have a base material layer joined to the wiring layer on the side opposite to the coating layer side.

Further, in the manufacturing method according to an embodiment of the present disclosure, the base layer may be a release layer that can be separated from the wiring layer, and may be separated after the wiring forming member is joined to the electrode substrate.

Further, in the manufacturing method according to an embodiment of the present disclosure, the wiring forming member further includes a counter substrate bonded to the wiring layer on a side opposite to the covering layer, and the counter substrate includes the wiring forming member. After joining the member to the electrode substrate, the member may be positioned so as to face the substrate through the wiring layer and the covering layer, and be integrated with the substrate through the wiring layer and the covering layer.

Further, in the manufacturing method according to an embodiment of the present disclosure, the substrate and the counter substrate may be glass substrates.

Further, in the manufacturing method according to an embodiment of the present disclosure, the opposing substrate includes a first opposing surface and a second opposing surface located on the opposite side of the first opposing surface. An opposing-side through hole penetrating from the surface to the opposing-side second surface or an opposing-side bottomed hole recessed from one of the opposing-side first surface and the opposing-side second surface to the other is provided, and the opposing-side through hole is provided. A third electrode electrically connected to the wiring layer may be located in the hole or the bottomed hole on the opposite side.

Moreover, in the manufacturing method according to an embodiment of the present disclosure, the binder may contain an epoxy resin.

Moreover, in the manufacturing method according to an embodiment of the present disclosure, the insulating layer may contain a non-photosensitive resin.

Moreover, in the manufacturing method according to an embodiment of the present disclosure, the insulating layer may be made of a prepreg containing the non-photosensitive resin.

Moreover, in the manufacturing method according to an embodiment of the present disclosure, the insulating layer may contain polyimide resin.

Moreover, in the manufacturing method according to an embodiment of the present disclosure, the substrate may be a glass substrate.

According to the embodiments of the present disclosure, it is possible to provide a wiring board on which an element is mounted, which can easily ensure good air permeability for gases generated inside, and which can be easily manufactured.

1 is a cross-sectional view showing a wiring board according to one embodiment; FIG. 2A to 2C are diagrams showing a manufacturing process of the wiring board shown in FIG. 1; FIG. 2A to 2C are diagrams showing a manufacturing process of the wiring board shown in FIG. 1; FIG. 2A to 2C are diagrams showing a manufacturing process of the wiring board shown in FIG. 1; FIG. 2A to 2C are diagrams showing a manufacturing process of the wiring board shown in FIG. 1; FIG. 2A to 2C are diagrams showing a manufacturing process of the wiring board shown in FIG. 1; FIG. 2A to 2C are diagrams showing a manufacturing process of the wiring board shown in FIG. 1; FIG. FIG. 10 is a cross-sectional view showing a wiring board according to another embodiment; FIG. 9 is a diagram showing a manufacturing process of the wiring board shown in FIG. 8; FIG. 9 is a diagram showing a manufacturing process of the wiring board shown in FIG. 8; FIG. 9 is a diagram showing a manufacturing process of the wiring board shown in FIG. 8; FIG. 9 is a diagram showing a manufacturing process of the wiring board shown in FIG. 8; FIG. 9 is a diagram showing a manufacturing process of the wiring board shown in FIG. 8; FIG. 9 is a diagram showing a manufacturing process of the wiring board shown in FIG. 8; FIG. 9 is a diagram showing a manufacturing process of the wiring board shown in FIG. 8; FIG. 9 is a diagram showing a manufacturing process of the wiring board shown in FIG. 8; It is a cross-sectional view showing a wiring board according to still another embodiment. It is a figure which shows the example of the product by which a wiring board is mounted.

Hereinafter, a wiring board and a method for manufacturing the same according to embodiments of the present disclosure will be described in detail with reference to the drawings. The embodiments shown below are examples of the embodiments of the present disclosure, and the present disclosure should not be construed as being limited to the embodiments. Also, in this specification, terms such as "substrate", "base material", "sheet" and "film" are not to be distinguished from each other based only on the difference in designation. For example, "substrate" and "base material" are concepts that include members that can be called sheets and films. Furthermore, terms used herein to specify shapes and geometric conditions and their degrees, such as terms such as "parallel" and "perpendicular", length and angle values, etc., are bound by strict meanings. However, it is interpreted to include the extent to which similar functions can be expected. In addition, in the drawings referred to in this embodiment, the same reference numerals or similar reference numerals may be assigned to the same portions or portions having similar functions, and repeated description thereof may be omitted. Also, the dimensional ratios in the drawings may differ from the actual ratios for convenience of explanation, and some of the configurations may be omitted from the drawings.

Wiring Board Hereinafter, embodiments of the present disclosure will be described. First, the configuration of the wiring board 1 according to this embodiment will be described. FIG. 1 is a cross-sectional view showing a wiring board 1. FIG.

The wiring board 1 includes a substrate 12 , a first electrode 22 , a covering layer 30 , a wiring layer 40 and elements 100 . Of these, the substrate 12 and the first electrode 22 constitute the electrode substrate 10 . That is, it can be said that the wiring substrate 1 includes the electrode substrate 10 , the covering layer 30 , the wiring layer 40 and the elements 100 . In addition, in FIG. 1, for convenience of explanation, the element 100 is shown schematically and is not hatched. Each component of the wiring board 1 will be described below.

(Electrode substrate)
First, the electrode substrate 10 will be described. The electrode substrate 10 has a substrate 12 and a first electrode 22 . The electrode substrate 10 of this example is a through electrode substrate.

<Substrate>
Substrate 12 includes a first side 13 and a second side 14 opposite first side 13 . Further, the substrate 12 is provided with a plurality of through holes 20 penetrating from the first surface 13 to the second surface 14 .

Substrate 12 includes an inorganic material having a certain insulating property. For example, the substrate 12 may be a glass substrate, a quartz substrate, a sapphire substrate, a resin substrate, a silicon substrate, a silicon carbide substrate, an alumina (Al ₂ O ₃ ) substrate, an aluminum nitride (AlN) substrate, a zirconia oxide (ZrO ₂ ) substrate, etc. Alternatively, these substrates are laminated. The substrate 12 may partially include a substrate made of a conductive material such as an aluminum substrate or a stainless steel substrate.

Examples of the glass used for the substrate 12 include alkali-free glass. Alkali-free glass is glass that does not contain alkaline components such as sodium and potassium. Alkali-free glass includes, for example, boric acid instead of an alkaline component. Alkali-free glass also contains, for example, alkaline earth metal oxides such as calcium oxide and barium oxide. Examples of alkali-free glass include EN-A1 manufactured by Asahi Glass and Eagle XG manufactured by Corning. By including glass in the substrate 12, the insulating properties of the substrate 12 can be enhanced.

Further, when the substrate 12 contains glass, the thickness of the substrate 12 is, for example, 250 μm or more and 450 μm or less.

Although the through hole 20 is a cylindrical hole, the through hole 20 may have a shape in which the width decreases from the first surface 13 and the second surface 14 toward the central portion in the thickness direction of the substrate 12. good. Also, the through hole 20 may be tapered from the first surface 13 to the second surface 14 .

The length of the through hole 20 , that is, the dimension of the through hole 20 in the normal direction of the first surface 13 is equal to the thickness of the substrate 12 . The width of the through hole 20, that is, the maximum width in the in-plane direction of the substrate 12 is, for example, 40 μm or more and 150 μm or less. Also, the ratio of the length to the width of the through hole 20, that is, the aspect ratio of the through hole 20 is, for example, 4 or more and 10 or less.

<First electrode>
The first electrode 22 is a member positioned inside the through-hole 20 and having conductivity. In this embodiment, the thickness of the first electrode 22 is smaller than the width of the through-hole 20, so there is a space inside the through-hole 20 where the first electrode 22 does not exist. That is, the first electrode 22 is a so-called conformal via provided on the side wall 21 of the through hole 20 . The thickness of the first electrode 22 is, for example, 100 nm or more and 20 μm or less.

The first electrode 22 may be formed to include a seed layer and a plating layer that are arranged in order from the sidewall 21 side of the through hole 20 to the center side of the through hole 20, for example.

The seed layer is a conductive layer that serves as a base for depositing metal ions in the plating solution and growing the plating layer during the electroplating process for forming the plating layer by electroplating. The material of the seed layer can be a conductive material such as copper, titanium, or a combination thereof. The material of the seed layer may be the same as or different from the material of the plating layer. This seed layer is formed by sputtering, vapor deposition, or a combination of sputtering and vapor deposition.

A plated layer is a conductive layer formed by plating. As the material constituting the plated layer, metals such as copper, gold, silver, platinum, rhodium, tin, aluminum, nickel, chromium, alloys using these, or laminates thereof can be used.

In the illustrated example, the internal space of the hollow first electrode 22 is filled with a core 23 made of resin. In addition, although the first electrode 22 is a conformal via in the illustrated example, the first electrode 22 may be a filling type in which the inside of the through hole 20 is filled.

In the illustrated example, a conductive connection layer 24 having conductivity is provided on the first surface 13 and the second surface 14 . The conductive connection layer 24 on the first surface 13 side is electrically connected to the end portion of the first electrode 22 on the first surface 13 side, and the conductive connection layer 24 on the second surface 14 side is connected to the first electrode 22 . is electrically connected to the end on the second surface 14 side of the .

The conductive connection layer 24 may include a seed layer and a plating layer that are sequentially laminated on the first surface 13 and the second surface 14, like the first electrode 22. As shown in FIG. In this case, the seed layer of the conductive connection layer 24 is formed at the same time as the seed layer of the first electrode 22, and may be formed by sputtering, vapor deposition, or a combination of sputtering and vapor deposition. Also, the plated layer of the conductive connection layer 24 may be formed at the same time as the plated layer of the first electrode 22 . The thickness of the conductive connection layer 24 is, for example, 1 μm or more and 20 μm or less.

(coating layer)
The covering layer 30 has an insulating layer 31 and a second electrode 32 provided to penetrate the insulating layer 31 .

In the illustrated example, a covering layer 30 is provided on the second surface 14 of the substrate 12 to cover the first electrodes 22 exposed from the substrate 12 and electrically connect the second electrodes 32 to the first electrodes 22 . ing. Specifically, the second electrode 32 is electrically connected to the first electrode 22 via the conductive connection layer 24 on the second surface 14 side. Although the coating layer 30 is provided only on the second surface 14 in this example, the coating layer 30 may be provided on the first surface 13 and the second surface 14 respectively.

The insulating layer 31 of the covering layer 30 is a layer containing an organic material and having insulating properties. As an organic material for the insulating layer 31, polyimide resin, epoxy resin, or the like can be used. The organic material of the insulating layer 31 preferably has a dielectric loss tangent of 0.003 or less, more preferably 0.002 or less, and even more preferably 0.001 or less.

If the insulating layer 31 contains a non-photosensitive resin such as epoxy resin, the insulating layer 31 may be made of, for example, a prepreg containing epoxy resin. The thickness of such an insulating layer 31 is, for example, 1 μm or more and 20 μm or less. However, the thickness of the insulating layer 31 is made larger than the thickness of the conductive connection layer 24 .

The second electrode 32 has a conductive member containing conductive particles and a binder and is electrically connected to the first electrode 22 . The conductive member that the second electrode 32 has can be formed by using a conductive paste. The second electrode 32 is filled in a hole 31</b>A passing through a pair of main surfaces of the insulating layer 31 extending along the first surface 13 and the second surface 14 of the substrate 12 . Here, as described above, the second electrode 32 is electrically connected to the first electrode 22 via the conductive connection layer 24 on the second surface 14 side. 32 is connected to the first electrode 22 via a portion of the conductive connection layer 24 provided on the second surface 14 that extends above the through hole 20 .

The conductive member of the second electrode 32 includes at least conductive particles and a binder. The conductive member may further contain additives, solvents, plasticizers, and the like. The conductive particles need only be conductive, and specifically, metal particles can be used. Examples of the metal used for the metal particles include copper, silver, and alloys using these. The conductive particles may be used in combination of multiple types of metal particles. Moreover, resin can be used for the binder. Specifically, an epoxy resin etc. can be mentioned. Such a conductive member preferably contains 70% or more of the conductive particles. When the conductive member is formed from a conductive paste, the conductive paste contains at least conductive particles and a binder, and may contain a solvent, an additive, and the like, if necessary.

The second electrode 32 has a trapezoidal shape that tapers toward the first electrode 22 side.

(wiring layer)
The wiring layer 40 is provided on the cover layer 30 on the side opposite to the substrate 12 side and electrically connected to the second electrode 32 . Therefore, the second electrode 32 electrically connects the first electrode 22 and the wiring layer 40 . The wiring layer 40 shown in FIG. 1 is patterned into a desired pattern.

The wiring layer 40 is a conductive layer. The material forming the wiring layer 40 may be a metal such as copper, gold, silver, platinum, rhodium, tin, aluminum, nickel, chromium, or an alloy using these. The thickness of the wiring layer 40 is, for example, 1 μm or more and 20 μm or less.

(element)
The element 100 is positioned so as to be embedded in the insulating layer 31 between the substrate 12 and the wiring layer 40 and is electrically connected to the wiring layer 40 .

In the illustrated example, the element 100 is plate-shaped, and of the pair of main surfaces, the main surface on the substrate 12 side and the side surface located between the pair of main surfaces are entirely covered with an insulating layer 31 . . On the other hand, of the pair of main surfaces of the element 100 , the main surface on the side opposite to the substrate 12 side is only partially covered with the insulating layer 31 . It may be entirely covered with an insulating layer 31 .

A bump 101 provided between the element 100 and the wiring layer 40 electrically connects the element 100 and the wiring layer 40 . Bump 101 in the present embodiment has a conductive member made of the same material as the conductive member of second electrode 32, and is electrically connected to wiring layer 40 via the conductive member. By using the conductive member made of the same material as the conductive member of the second electrode 32 in the bump 101 in this way, it is possible to reduce the manufacturing cost.

The type and size of the element 100 are not particularly limited, but the element 100 may have a thickness of 50 μm in the normal direction of the substrate 12, for example.

Method for Manufacturing Wiring Board An example of a method for manufacturing the above-described wiring board 1 will be described below with reference to FIGS.

(Through hole forming step)
First, the substrate 12 is prepared. Next, a resist layer is provided on at least one of the first surface 13 and the second surface 14 . After that, openings are provided in the resist layer at positions corresponding to the through holes 20 . Next, through-holes 20 can be formed in the substrate 12 as shown in FIG. 2 by processing the substrate 12 in the openings of the resist layer. As a method for processing the substrate 12, a dry etching method such as a reactive ion etching method or a deep reactive ion etching method, a wet etching method, or the like can be used.

The through holes 20 may be formed in the substrate 12 by irradiating the substrate 12 with a laser. In this case, the resist layer may not be provided. As a laser for laser processing, an excimer laser, Nd:YAG laser, femtosecond laser, or the like can be used. When an Nd:YAG laser is employed, a fundamental wave with a wavelength of 1064 nm, a second harmonic with a wavelength of 532 nm, a third harmonic with a wavelength of 355 nm, or the like can be used.

Alternatively, laser irradiation and wet etching can be combined as appropriate. Specifically, first, an altered layer is formed in a region of the substrate 12 where the through hole 20 is to be formed by laser irradiation. Subsequently, the substrate 12 is immersed in hydrogen fluoride or the like to etch the altered layer. Through holes 20 can thus be formed in the substrate 12 . Alternatively, the through holes 20 may be formed in the substrate 12 by blasting the substrate 12 with an abrasive.
(First electrode forming step)
Next, as shown in FIG. 3, the first electrode 22 is formed on the side wall 21 of the through hole 20. Next, as shown in FIG. In this embodiment, the conductive connection layer 24 is formed on the first surface 13 and the second surface 14 at the same time as the first electrode 22 . Thus, the electrode substrate 10 is prepared.

Here, the first electrode 22 and the conductive connecting layer 24 are formed by growing a plating layer after forming a seed layer by sputtering, vapor deposition, or a combination thereof.

(Core filling process)
Next, as shown in FIG. 4, the inside of the first electrode 22 is filled with the core 23 . The core 23 may be filled, for example, by placing resin films on the first surface 13 and the second surface 14 and pressing the films into the first electrodes 22 using a pressure difference. Such a film may also be pushed inside the first electrode 22 by a roller.

(Wiring formation process)
Next, a wiring portion for the first electrode 22, which is formed from the coating layer 30, particularly the second electrode 32 and the wiring layer 40, is formed. At this time, first, as shown in FIG. 5, a wiring forming member 50 is prepared. The wiring forming member 50 is a member that integrates the covering layer 30, the wiring layer 40, and the element 100 before being provided on the electrode substrate 10. It also has a bonded substrate layer 60 .

That is, the wiring forming member 50 according to this example is positioned to be embedded in the insulating layer 31, the second electrode 32 provided to penetrate the insulating layer 31, and the insulating layer 31, and is held by the insulating layer 31. A covering layer 30 including an element 100, a wiring layer 40 provided on the covering layer 30 and electrically connected to the second electrode 32 and the element 100, and a wiring layer 40 joined to the wiring layer 40 on the side opposite to the covering layer 30 side. It integrally has a base material layer 60 . However, the point that the second electrode 32 protrudes from the insulating layer 31 on the wiring forming member 50 is different from the state after being provided on the electrode substrate 10 . Moreover, the wiring layer 40 on the wiring forming member 50 is not patterned and is in a state of being spread out like a sheet.

The base material layer 60 in this example is made of resin, and supports and protects the wiring layer 40 and the insulating layer 31 thereon, thereby improving the handleability of the wiring forming member 50 . Further, the base material layer 60 is configured as a release layer that can be separated from the wiring layer 40 .

After arranging the wiring forming member 50 as described above on the second surface 14 side, as shown in FIG. Secondly, it is joined to the electrode substrate 10 from the side where the first electrode 22 is exposed from the substrate 12, which is the second surface 14 side in this example. At this time, the wiring forming member 50 is joined to the electrode substrate 10 by welding the insulating layer 31 to the substrate 12 . Specifically, the wiring forming member 50 is heated and pressurized toward the substrate 12 . As a result, the insulating layer 31 is melted and attached to the substrate 12 , and the wiring forming member 50 is joined to the electrode substrate 10 . At this time, as shown in FIG. 6, the second electrode 32 is crushed by the heat and pressure and becomes wider than before bonding.

Thereafter, as shown in FIG. 7, after the substrate layer 60 is separated from the wiring layer 40, a resist 70 is provided on the wiring layer 40, and the wiring layer 40 is etched using the resist 70 as a mask. A pattern is formed in the wiring layer 40 . Thus, the wiring board 1 in the state shown in FIG. 1 is manufactured.

In the wiring board 1 according to this embodiment described above, the second electrode 32 has a conductive member containing conductive particles and a binder, and electrically connects the first electrode 22 and the wiring layer 40 . Since the second electrode 32 has a conductive member containing conductive particles and a binder in this way, gas permeability is ensured. As a result, gas generated inside, specifically on the side of the first electrode 22 , can pass through the second electrode 32 and be released to the outside from between the covering layer 30 and the wiring layer 40 . In addition, since the second electrode 32 is formed without patterning or the like, it does not take much time and effort to manufacture, and the element 100 is incorporated into the wiring board 1 at the same time as the second electrode 32 is formed. Therefore, it is possible to easily ensure good air permeability for the gas generated inside, and to manufacture it easily.

In particular, the wiring portion for the first electrode 22 formed by the coating layer 30, particularly the second electrode 32 and the wiring layer 40 is formed by joining the wiring forming member 50 integrating the coating layer 30 and the wiring layer 40 to the electrode substrate 10. Therefore, according to this embodiment, the wiring board 1 can be very easily manufactured.

(Other embodiment 1)
Next, another embodiment will be described with reference to FIGS. 8 to 14. FIG. FIG. 8 is a cross-sectional view showing the wiring board 2 according to this embodiment. 9 to 14 are diagrams showing the manufacturing process of the wiring board 2. First, as shown in FIG. Components of this embodiment that are the same as those of the above-described embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIG. 8, the wiring board 2 according to this embodiment includes a substrate 12, a first electrode 22, a coating layer 30, a wiring layer 40, an element 100, and a counter substrate 112. As shown in FIG. The opposing substrate 112 is positioned to face the substrate 12 with the wiring layer 40 and the covering layer 30 interposed therebetween, and is integrated with the substrate 12 with the wiring layer 40 and the covering layer 30 interposed therebetween.

The opposing substrate 112 includes a first opposing surface 113 and a second opposing surface 114 located on the opposite side of the first opposing surface 113, and penetrates from the first opposing surface 113 to the second opposing surface 114. A facing-side through hole 120 is provided, and a third electrode 122 electrically connected to the wiring layer 40 is positioned in the facing-side through hole 120 . The third electrode 122 is electrically connected to the element 100 through the wiring layer 40 and electrically connected to the first electrode 22 through the wiring layer 40, the second electrode 32 and the conductive connection layer 24. there is The third electrode 122 is a conformal via, the inside of which is filled with a core 123 made of resin.

The substrate 12 and the opposing substrate 112 are preferably made of the same material and of the same size. In this embodiment, the substrate 12 and the opposing substrate 112 are both made of glass and have the same thickness. This ensures good dimensional stability.

A method of manufacturing the wiring board 2 shown in FIG. 8 will be described below.

(Manufacturing process of electrode substrate)
First, the electrode substrate 10 having the substrate 12 and the first electrodes 22 is prepared through processes similar to those described with reference to FIGS.

(Wiring formation process)
Next, a wiring portion for the first electrode 22, which is formed from the coating layer 30, particularly the second electrode thereof, the wiring layer 40, and the third electrode 122, is formed. At this time, first, a wiring forming member 150 shown in FIG. 15 manufactured through the steps shown in FIGS. 9 to 14 is prepared. The wiring forming member 150 in the present embodiment is a member in which the coating layer 30, the wiring layer 40, and the element 100 are integrated before being provided on the electrode substrate 10, and is joined to the wiring layer 40 on the side opposite to the coating layer 30 side. It further has a counter substrate 112 that is mounted on the substrate. In this example as well, the wiring layer 40 is patterned, but the insulating layer 31 of the covering layer 30 is positioned on the portion of the opposing substrate 112 where the wiring layer 40 is not formed.

When fabricating the wiring forming member 150, first, as shown in FIG. A conductive layer 140 is formed on the opposing first surface 113 and the opposing second surface 114 . The conductive layer 140 is formed by growing a plating layer after forming a seed layer by sputtering, vapor deposition, or a combination thereof.

Next, as shown in FIG. 10, the conductive layer 140 on the first surface 113 on the opposite side and the second surface 114 on the opposite side is patterned into a desired pattern by etching. A layer 40 is provided and a third electrode 122 is provided in the opposing side through hole 120 . After that, as shown in FIG. 11, the inside of the third electrode 122 is filled with the core 123 . The filling of the core 123 can be performed in the same process as the process described with reference to FIG.

Then, as shown in FIG. 12, the second electrode 32 is provided on the wiring layer 40 and the bump 101 is provided. At this time, by using the same conductive member for forming the second electrode 32 and the bump 101, the manufacturing cost can be suppressed. The second electrodes 32 and the bumps 101 may be provided on the wiring layer 40 by screen printing, for example. Then, as shown in FIG. 13, the bumps 101 and the element 100 are electrically connected, and then the insulating layer 31 is provided on the wiring layer 40 as shown in FIG. Here, the insulating layer 31 covers the wiring layer 40 , the element 100 and the opposing first surface 113 . Also, the second electrode 32 penetrates the insulating layer 31 .

After the wiring forming member 150 according to the present embodiment is produced through the above steps, the electrode substrate 10 and the wiring forming member 150 are opposed to each other as shown in FIG. After that, as shown in FIG. 16, the wiring forming member 150 is formed on the side where the first electrode 22 is exposed from the substrate 12, in this example, such that the second electrode 32 is electrically connected to the first electrode 22. It is joined to the electrode substrate 10 from the second surface 14 side. At this time, the wiring forming member 150 is joined to the electrode substrate 10 by welding the insulating layer 31 to the substrate 12 . Specifically, the wiring forming member 150 is heated and pressurized toward the substrate 12 . As a result, the insulating layer 31 is melted and attached to the substrate 12 , and the wiring forming member 150 is joined to the electrode substrate 10 . At this time, as shown in FIG. 16, the second electrode 32 is crushed by the heat and pressure and becomes wider than before bonding.

Also in the wiring board 2 according to the embodiment described above, the second electrode 32 has a conductive member containing conductive particles and a binder to electrically connect the first electrode 22 and the wiring layer 40 . Since the second electrode 32 has a conductive member containing conductive particles and a binder in this way, gas permeability is ensured. As a result, the gas generated inside, specifically on the side of the first electrode 22 , can be easily discharged to the outside through the second electrode 32 . In addition, since the second electrode 32 is formed without patterning or the like, it does not take much time and effort to manufacture, and the element 100 is incorporated into the wiring board 1 at the same time as the second electrode 32 is formed. Therefore, it is possible to easily ensure good air permeability for the gas generated inside, and to manufacture it easily.

In particular, the wiring portion for the first electrode 22, which is formed of the covering layer 30, particularly the second electrode 32, the wiring layer 40, and the third electrode 122, integrates the covering layer 30, the wiring layer 40, and the third electrode 122. Since it is produced by bonding the wiring forming member 150 to the electrode substrate 10, the wiring substrate 2 can be produced very easily in this embodiment as well.

(Other embodiment 2)
Next, still another embodiment will be described with reference to FIG. Components of this embodiment that are the same as those of the above-described embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. As shown in FIG. 17, in this example, a bottomed hole 20' recessed from the second surface 14 to the first surface 13 is provided in the substrate 12, and the first electrode 22 is positioned inside the bottomed hole 20'. Although the first electrode 22 is a filled via in FIG. 17, it may be a conformal via. The electrode substrate according to this embodiment can also be manufactured in the same procedure as in the above-described embodiments. A bottomed hole may be formed in the counter substrate 112 described above instead of the counter-side through hole 120 .

Example of Products Mounted with Wiring Board FIG. 18 is a diagram showing an example of a product on which the wiring board according to the embodiment of the present disclosure can be mounted. A wiring board according to an embodiment of the present disclosure can be used in various products. For example, it is installed in a notebook personal computer 210, a tablet terminal 220, a mobile phone 230, a smart phone 240, a digital video camera 250, a digital camera 260, a digital clock 270, a server 280, and the like.

DESCRIPTION OF SYMBOLS 1, 2... Wiring board 10... Electrode board 12... Substrate 13... First surface 14... Second surface 20... Through hole 20'... Bottomed hole 21... Side wall 22... First electrode 23... Core 24... Conductive connection layer REFERENCE SIGNS LIST 30 Coating layer 31 Insulating layer 31A Hole 32 Second electrode 40 Wiring layer 50 Wiring forming member 60 Base material layer 100 Element 101 Bump 112 Opposing substrate 113 Opposing side first surface 114 Opposing Second side surface 120 Opposite side through hole 122 Third electrode 123 Core 150 Wiring forming member

Claims (18)

A through hole including a first surface and a second surface located opposite to the first surface and penetrating from the first surface to the second surface or from one of the first surface and the second surface a substrate made of a glass substrate provided with a bottomed hole recessed to the other;
a first electrode positioned in the through hole or the bottomed hole;
An insulating layer containing a polyimide resin and a second electrode provided to penetrate the insulating layer, and the insulating layer covers the first surface and the first electrode exposed from the substrate and the substrate. a cover layer welded to one or both of the second surfaces and electrically connecting the second electrode to the first electrode;
a wiring layer provided on the covering layer and electrically connected to the second electrode;
a device located in the insulating layer between the substrate and the wiring layer and electrically connected to the wiring layer;
with
the second electrode has a conductive member containing conductive particles and a resin-containing binder, electrically connecting the first electrode and the wiring layer;
The wiring board, wherein the second electrode has air permeability, and allows gas generated on the first electrode side to pass through the second electrode and be released between the covering layer and the wiring layer. 2. The wiring board according to claim 1, wherein said element is electrically connected to said wiring layer via a conductive member made of the same material as a conductive member of said second electrode. 3. The wiring board according to claim 1, wherein said second electrode is electrically connected to said first electrode via a conductive connection layer provided on said first surface or said second surface. further comprising a counter substrate positioned to face the substrate via the wiring layer and the covering layer;
4. The wiring substrate according to claim 1, wherein said counter substrate is integrated with said substrate via said wiring layer and said covering layer. 5. The wiring substrate according to claim 4, wherein said counter substrate is made of a glass substrate. The opposing substrate includes a first opposing surface and a second opposing surface located on the opposite side of the first opposing surface, and the opposing substrate penetrating from the first opposing surface to the second opposing surface. a through-hole or an opposed-side bottomed hole recessed from one of the opposed-side first surface and the opposed-side second surface to the other;
6. The wiring board according to claim 4, wherein a third electrode electrically connected to said wiring layer is positioned in said opposing side through hole or said opposing side bottomed hole. 7. The wiring board according to claim 1, wherein said wiring layer is connected to said second electrode and said element. A through hole including a first surface and a second surface located opposite to the first surface and penetrating from the first surface to the second surface or from one of the first surface and the second surface a step of preparing an electrode substrate having a substrate made of a glass substrate provided with a bottomed hole recessed in the other direction and a first electrode positioned in the through hole or the bottomed hole;
An insulating layer containing a polyimide resin, a coating layer including a second electrode provided to penetrate the insulating layer and an element located in the insulating layer, and the second electrode and the element provided on the coating layer and a wiring layer electrically connected to the second electrode, the second electrode having a conductive member containing conductive particles and a resin-containing binder, and protruding from the insulating layer. and
bonding the wiring forming member to the electrode substrate by heating and pressurizing the wiring forming member toward the substrate so that the second electrode is electrically connected to the first electrode; prepared,
The method of manufacturing a wiring board, wherein the second electrode has air permeability, and the gas generated on the side of the first electrode is allowed to pass through the second electrode and be discharged between the covering layer and the wiring layer. 9. The method of manufacturing a wiring substrate according to claim 8, wherein said wiring forming member is joined to said electrode substrate by welding said insulating layer to said substrate. 10. The method of manufacturing a wiring board according to claim 8, wherein said element is electrically connected to said wiring layer via a conductive member made of the same material as a conductive member of said second electrode. 11. The second electrode according to any one of claims 8 to 10 , wherein said second electrode is electrically connected to said first electrode via a conductive connection layer provided on said first surface or said second surface. A method for manufacturing a wiring board. 12. The method of manufacturing a wiring board according to claim 8, wherein said conductive member is formed using a conductive paste. 13. The method of manufacturing a wiring board according to claim 8, wherein said wiring forming member further has a base material layer joined to said wiring layer on a side opposite to said coating layer. 14. The method of manufacturing a wiring substrate according to claim 13 , wherein the base material layer is a peelable layer that can be peeled off from the wiring layer, and is peeled off after bonding the wiring forming member to the electrode substrate. The wiring forming member further has a counter substrate bonded to the wiring layer on a side opposite to the covering layer,
The counter substrate is positioned so as to face the substrate through the wiring layer and the covering layer after the wiring forming member is joined to the electrode substrate, and is integrated with the substrate through the wiring layer and the covering layer. 13. The method for manufacturing a wiring board according to claim 8, wherein: 16. The method of manufacturing a wiring board according to claim 15 , wherein said counter substrate is made of a glass substrate. The opposing substrate includes a first opposing surface and a second opposing surface located on the opposite side of the first opposing surface, and the opposing substrate penetrating from the first opposing surface to the second opposing surface. a through-hole or an opposed-side bottomed hole recessed from one of the opposed-side first surface and the opposed-side second surface to the other;
17. The method of manufacturing a wiring board according to claim 15 , wherein a third electrode electrically connected to said wiring layer is positioned in said opposing side through hole or said opposing side bottomed hole. 18. The method of manufacturing a wiring substrate according to claim 8, wherein said wiring layer uses said wiring forming member in which said wiring layer is connected to said second electrode and said element.

Images