JP2018190933A - Wiring board and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board in which an element is mounted, which has good air permeability to gases generated inside and which can be easily manufactured.SOLUTION: A wiring board 1 comprises: a substrate 12 where a through hole 20 penetrating from a first surface 13 to a second surface 14 is formed; a first electrode 22 located in the through hole; a covering layer 30 which has an insulation layer 31 and a second electrode 32 formed to pierce the insulation layer, is formed on the substrate so as to cover the first electrode exposed from the substrate, and causes the second electrode to be electrically connected to the first electrode; a wiring layer 40 which is formed on the covering layer and electrically connected to the second electrode; and an element 100 which is located between the substrate and the wiring layer 40 so as to be embedded in the insulation layer and electrically connected to the wiring layer. The second electrode has a conductive member including conductive particles and a binder to electrically connect the first electrode and the wiring layer.SELECTED DRAWING: Figure 1

Description

  Embodiments of the present disclosure relate to a wiring board and a manufacturing method thereof.

  A substrate including the first surface and the second surface, a plurality of holes provided in the substrate and penetrating from the first surface to the second surface, and inside the holes so as to reach the second surface side from the first surface side of the substrate A through electrode substrate including an electrode portion provided is known (see Patent Document 1). Such a through electrode substrate can be used when manufacturing a wiring substrate. In the following description, the electrode portion is referred to as a through electrode.

JP 2011-3925 A

  The wiring substrate manufactured from the through electrode substrate as described above includes, for example, an insulating layer provided on the through electrode substrate, a wiring layer provided on the insulating layer, and a connection electrode provided so as to penetrate the insulating layer. In some cases, the wiring layer and the through electrode are electrically connected by a connection electrode.

  The connection electrode in such a wiring board may be formed by patterning a conductive layer formed by sputtering or vapor deposition. However, in this case, since the density of the connection electrode is increased, the gas generated on the through electrode side is difficult to escape to the outside. As a result, gas flows between the insulating layer and the substrate and the insulating layer easily swells, so that there is a concern about quality deterioration.

  In addition, when the connection electrode is formed by patterning the conductive layer formed by sputtering or vapor deposition as described above, the number of steps is relatively large, and thus there is a problem in improving productivity.

  An element may be mounted on the wiring board, but the element is generally mounted in a process independent of other processes. Naturally, it is also desired to improve the efficiency of the mounting process of such elements.

  An embodiment of the present disclosure has been made in view of the above-described circumstances, and is a wiring board on which an element is mounted, and can easily ensure good air permeability with respect to a gas generated inside and can be easily manufactured. An object of the present invention is to provide a wiring board that can be manufactured and a manufacturing method thereof.

  One embodiment of the present disclosure includes a first surface and a second surface located on the opposite side of the first surface, and a through-hole penetrating from the first surface to the second surface or the first surface and the first surface A substrate provided with a bottomed hole recessed from one of the second surfaces to the other, a first electrode located in the through hole or the bottomed hole, an insulating layer and the insulating layer are provided so as to penetrate The second electrode is provided on both or one of the first surface and the second surface so as to cover the first electrode exposed from the substrate, and the second electrode is disposed on the first surface. A coating layer electrically connected to one electrode; a wiring layer provided on the coating layer and electrically connected to the second electrode; and the insulating layer between the substrate and the wiring layer An element electrically connected to the wiring layer, and the second electrode is made of conductive particles. And electrically conductive member including a binder, and electrically connecting the wiring layer and the first electrode, the wiring substrate, it is.

  In the wiring board according to an embodiment of the present disclosure, the element may be electrically connected to the wiring layer via a conductive member made of the same material as the conductive member included in the second electrode.

  In the wiring substrate according to an embodiment of the present disclosure, the second electrode is electrically connected to the first electrode via a conductive connection layer provided on the first surface or the second surface. May be.

  The wiring board according to an embodiment of the present disclosure further includes a counter substrate positioned so as to face the substrate via the wiring layer and the coating layer, and the counter substrate includes the wiring layer and the coating layer. And may be integrated with the substrate.

  In the wiring substrate according to an embodiment of the present disclosure, the substrate and the counter substrate may be made of a glass substrate.

  In the wiring substrate according to an embodiment of the present disclosure, the counter substrate includes a counter side first surface and a counter side second surface positioned on the opposite side of the counter side first surface, and the counter side first A counter-side through hole penetrating from the surface to the counter-side second surface or a counter-side bottomed hole recessed from one of the counter-side first surface and the counter-side second surface to the other, and the counter-side through-hole A third electrode that is electrically connected to the wiring layer may be located in the hole or the opposed bottomed hole.

  In the wiring board according to an embodiment of the present disclosure, the conductive particles may include a metal.

  In the wiring board according to an embodiment of the present disclosure, the binder may include an epoxy resin.

  In the wiring board according to an embodiment of the present disclosure, the insulating layer may include a non-photosensitive resin.

  In the wiring board according to an embodiment of the present disclosure, the insulating layer may be made of a prepreg containing the non-photosensitive resin.

  In the wiring board according to an embodiment of the present disclosure, the insulating layer may include a polyimide resin.

  Moreover, the wiring board which concerns on one Embodiment of this indication WHEREIN: The said board | substrate may consist of a glass substrate.

  In addition, an embodiment of the present disclosure includes a first surface and a second surface located on the opposite side of the first surface, and a through-hole penetrating from the first surface to the second surface or the first surface And a step of preparing an electrode substrate having a substrate provided with a bottomed hole recessed from one of the second surfaces to the other, and a first electrode located in the through hole or the bottomed hole, and an insulating layer A second electrode provided so as to penetrate the insulating layer and a covering layer including an element located in the insulating layer; and the second electrode provided on the covering layer and electrically connected to the second electrode and the element. A wiring forming member projecting from the insulating layer, wherein the second electrode has a conductive member containing conductive particles and a binder, and the second electrode comprises the conductive layer The wiring forming member is electrically connected to the first electrode. The method of manufacturing a wiring board comprising a step of bonding the substrates, which is a.

  In the manufacturing method according to an embodiment of the present disclosure, the wiring forming member may be bonded to the electrode substrate by welding the insulating layer to the substrate.

  In the manufacturing method according to an embodiment of the present disclosure, the wiring forming member may be heated and pressurized toward the substrate and bonded to the electrode substrate.

  In the manufacturing method according to an embodiment of the present disclosure, the element may be electrically connected to the wiring layer via a conductive member made of the same material as the conductive member included in the second electrode. .

  In the manufacturing method according to an embodiment of the present disclosure, the second electrode is electrically connected to the first electrode via a conductive connection layer provided on the first surface or on the second surface. May be.

  In the manufacturing method according to an embodiment of the present disclosure, the conductive member may be formed using a conductive paste.

  In the manufacturing method according to an embodiment of the present disclosure, the wiring forming member may further include a base material layer bonded to the wiring layer on the side opposite to the coating layer side.

  Moreover, in the manufacturing method which concerns on one Embodiment of this indication, the said base material layer is a peeling layer which can be peeled from the said wiring layer, and may peel, after joining the said wiring formation member to the said electrode substrate.

  In the manufacturing method according to an embodiment of the present disclosure, the wiring forming member further includes a counter substrate bonded to the wiring layer on a side opposite to the coating layer side, and the counter substrate includes the wiring formation. After the member is bonded to the electrode substrate, the member may be positioned so as to face the substrate via the wiring layer and the coating layer, and be integrated with the substrate via the wiring layer and the coating layer.

  In the manufacturing method according to an embodiment of the present disclosure, the substrate and the counter substrate may be made of a glass substrate.

  In the manufacturing method according to an embodiment of the present disclosure, the counter substrate includes a counter-side first surface and a counter-side second surface positioned on the opposite side of the counter-side first surface, and the counter-side first A counter-side through hole penetrating from the surface to the counter-side second surface or a counter-side bottomed hole recessed from one of the counter-side first surface and the counter-side second surface to the other, and the counter-side through-hole A third electrode that is electrically connected to the wiring layer may be located in the hole or the opposed bottomed hole.

  In the manufacturing method according to an embodiment of the present disclosure, the binder may include an epoxy resin.

  In the manufacturing method according to an embodiment of the present disclosure, the insulating layer may include a non-photosensitive resin.

  In the manufacturing method according to an embodiment of the present disclosure, the insulating layer may be made of a prepreg containing the non-photosensitive resin.

  In the manufacturing method according to an embodiment of the present disclosure, the insulating layer may include a polyimide resin.

  In the manufacturing method according to an embodiment of the present disclosure, the substrate may be a glass substrate.

  According to the embodiment of the present disclosure, it is possible to provide a wiring board on which an element is mounted, which can easily ensure good air permeability with respect to a gas generated inside and can be easily manufactured.

It is sectional drawing which shows the wiring board which concerns on one Embodiment. It is a figure which shows the manufacturing process of the wiring board shown by FIG. It is a figure which shows the manufacturing process of the wiring board shown by FIG. It is a figure which shows the manufacturing process of the wiring board shown by FIG. It is a figure which shows the manufacturing process of the wiring board shown by FIG. It is a figure which shows the manufacturing process of the wiring board shown by FIG. It is a figure which shows the manufacturing process of the wiring board shown by FIG. It is sectional drawing which shows the wiring board which concerns on other embodiment. It is a figure which shows the manufacturing process of the wiring board shown by FIG. It is a figure which shows the manufacturing process of the wiring board shown by FIG. It is a figure which shows the manufacturing process of the wiring board shown by FIG. It is a figure which shows the manufacturing process of the wiring board shown by FIG. It is a figure which shows the manufacturing process of the wiring board shown by FIG. It is a figure which shows the manufacturing process of the wiring board shown by FIG. It is a figure which shows the manufacturing process of the wiring board shown by FIG. It is a figure which shows the manufacturing process of the wiring board shown by FIG. It is sectional drawing which shows the wiring board which concerns on other embodiment. It is a figure which shows the example of the product in which a wiring board is mounted.

  Hereinafter, a wiring board and a manufacturing method thereof according to an embodiment of the present disclosure will be described in detail with reference to the drawings. In addition, embodiment shown below is an example of embodiment of this indication, Comprising: This indication is limited to embodiment and is not interpreted. Further, in this specification, terms such as “substrate”, “base material”, “sheet”, and “film” are not distinguished from each other based only on the difference in names. For example, “substrate” and “base material” are concepts including members that can be called sheets and films. Furthermore, as used in this specification, the shape and geometric conditions and the degree thereof are specified. For example, terms such as “parallel” and “orthogonal”, length and angle values, and the like are bound to a strict meaning. Therefore, it should be interpreted including the extent to which similar functions can be expected. In the drawings referred to in this embodiment, the same portions or portions having similar functions are denoted by the same reference symbols or similar reference symbols, and repeated description thereof may be omitted. In addition, the dimensional ratio in the drawing may be different from the actual ratio for convenience of explanation, or a part of the configuration may be omitted from the drawing.

Wiring board will be described below embodiments of the present disclosure. First, the configuration of the wiring board 1 according to the present embodiment will be described. FIG. 1 is a cross-sectional view showing a wiring board 1.

  The wiring substrate 1 includes a substrate 12, a first electrode 22, a coating layer 30, a wiring layer 40, and the element 100. Of these, the substrate 12 and the first electrode 22 constitute the electrode substrate 10. That is, it can be said that the wiring board 1 includes the electrode substrate 10, the covering layer 30, the wiring layer 40, and the element 100. In FIG. 1, for convenience of explanation, the element 100 is schematically shown and is not hatched. Hereinafter, each component of the wiring board 1 will be described.

(Electrode substrate)
First, the electrode substrate 10 will be described. The electrode substrate 10 includes a substrate 12 and a first electrode 22. The electrode substrate 10 of this example is a through electrode substrate.

<Board>
The substrate 12 includes a first surface 13 and a second surface 14 located on the opposite side of the first surface 13. Further, the substrate 12 is provided with a plurality of through holes 20 penetrating from the first surface 13 to the second surface 14.

The substrate 12 includes an inorganic material having a certain insulating property. For example, the substrate 12 is a glass substrate, quartz substrate, sapphire substrate, resin substrate, silicon substrate, silicon carbide substrate, alumina (Al ₂ O ₃ ) substrate, aluminum nitride (AlN) substrate, zirconium oxide (ZrO ₂ ) substrate, etc. Alternatively, these substrates are stacked. The substrate 12 may partially include a substrate made of a conductive material such as an aluminum substrate or a stainless steel substrate.

  Examples of the glass used for the substrate 12 include non-alkali glass. The alkali-free glass is a glass that does not contain an alkali component such as sodium or potassium. The alkali-free glass includes, for example, boric acid instead of an alkali component. The alkali-free glass includes an alkaline earth metal oxide such as calcium oxide or barium oxide. Examples of the alkali-free glass include EN-A1 manufactured by Asahi Glass and Eagle XG manufactured by Corning. When the substrate 12 includes glass, the insulation of the substrate 12 can be improved.

  Moreover, when the board | substrate 12 contains glass, the thickness of the board | substrate 12 is 250 micrometers or more and 450 micrometers or less, for example.

  Although the through hole 20 is a cylindrical hole, the through hole 20 may have a shape in which the width decreases from the first surface 13 and the second surface 14 toward the central portion in the thickness direction of the substrate 12. Good. The through hole 20 may have a tapered shape that tapers from the first surface 13 to the second surface 14.

  The length of the through hole 20, that is, the dimension of the through hole 20 in the normal direction of the first surface 13 is equal to the thickness of the substrate 12. The width of the through hole 20, that is, the maximum width in the in-plane direction of the substrate 12 is, for example, 40 μm or more and 150 μm or less. In addition, the ratio of the length to the width of the through hole 20, that is, the aspect ratio of the through hole 20 is, for example, 4 or more and 10 or less.

<First electrode>
The first electrode 22 is a member that is located inside the through hole 20 and has conductivity. In the present embodiment, the thickness of the first electrode 22 is smaller than the width of the through hole 20, and therefore there is a space where the first electrode 22 does not exist inside the through hole 20. That is, the first electrode 22 is a so-called conformal via provided on the side wall 21 of the through hole 20. The thickness of the first electrode 22 is, for example, 100 nm or more and 20 μm or less.

  The first electrode 22 may be formed, for example, in a state including a seed layer and a plating layer arranged in order from the side wall 21 side of the through hole 20 to the center side of the through hole 20.

  The seed layer is a conductive layer that serves as a base for growing a plating layer by depositing metal ions in a plating solution during an electroplating process in which the plating layer is formed by electrolytic plating. As a material for the seed layer, a conductive material such as copper, titanium, or a combination thereof can be used. The material of the seed layer may be the same as or different from the material of the plating layer. This seed layer is formed by sputtering, vapor deposition, or a combination of sputtering and vapor deposition.

  The plating layer is a conductive layer formed by plating. As a material constituting the plating layer, a metal such as copper, gold, silver, platinum, rhodium, tin, aluminum, nickel, chromium, an alloy using these, or a laminate of these can be used.

  Further, in the illustrated example, the core 23 made of resin is filled in the internal space of the hollow first electrode 22. In the illustrated example, the first electrode 22 is a conformal via, but the first electrode 22 may be a filling type in which the inside of the through hole 20 is filled.

  In the illustrated example, a conductive connection layer 24 having conductivity is provided on the first surface 13 and the second surface 14. The conductive connection layer 24 on the first surface 13 side is electrically connected to the end of the first electrode 22 on the first surface 13 side, and the conductive connection layer 24 on the second surface 14 side is connected to the first electrode 22. Is electrically connected to the end of the second surface 14 side.

  Similarly to the first electrode 22, the conductive connection layer 24 may include a seed layer and a plating layer that are sequentially stacked on the first surface 13 and the second surface 14. In this case, the seed layer of the conductive connection layer 24 is formed at the same time as the seed layer of the first electrode 22 and may be formed by sputtering, vapor deposition, or a combination of sputtering and vapor deposition. Further, the plating layer of the conductive connection layer 24 may be formed simultaneously with the plating layer of the first electrode 22. The thickness of the conductive connection layer 24 is, for example, not less than 1 μm and not more than 20 μm.

(Coating layer)
The covering layer 30 includes an insulating layer 31 and a second electrode 32 provided so as to penetrate the insulating layer 31.

  In the illustrated example, the covering layer 30 is provided on the second surface 14 of the substrate 12 so as to cover the first electrode 22 exposed from the substrate 12, and the second electrode 32 is electrically connected to the first electrode 22. ing. Specifically, the second electrode 32 is electrically connected to the first electrode 22 via the conductive connection layer 24 on the second surface 14 side. In this example, the coating layer 30 is provided only on the second surface 14, but the coating layer 30 may be provided on the first surface 13 and the second surface 14, respectively.

  The insulating layer 31 in the covering layer 30 is a layer containing an organic material and having an insulating property. As the organic material of the insulating layer 31, polyimide resin, epoxy resin, or the like can be used. The organic material of the insulating layer 31 preferably has a dielectric loss tangent of 0.003 or less, more preferably 0.002 or less, and still more preferably 0.001 or less.

  When the insulating layer 31 has a non-photosensitive resin such as an epoxy resin, the insulating layer 31 may be made of, for example, a prepreg containing an epoxy resin. The thickness of the insulating layer 31 is, for example, 1 μm or more and 20 μm or less. However, the thickness of the insulating layer 31 is made larger than the thickness of the conductive connection layer 24.

  The second electrode 32 has a conductive member including conductive particles and a binder, and is electrically connected to the first electrode 22. The conductive member included in the second electrode 32 can be formed by using a conductive paste. The second electrode 32 is filled in a hole 31 </ b> A that penetrates a pair of main surfaces of the insulating layer 31 that extends along the first surface 13 and the second surface 14 of the substrate 12. Here, as described above, the second electrode 32 is electrically connected to the first electrode 22 via the conductive connection layer 24 on the second surface 14 side. 32 is connected to the first electrode 22 through a portion of the conductive connection layer 24 provided on the second surface 14 that extends onto the through hole 20.

  The conductive member included in the second electrode 32 includes at least conductive particles and a binder. The conductive member may further contain an additive, a solvent, a plasticizer, and the like. The electroconductive particle should just have electroconductivity, and specifically, a metal particle can be used. Examples of the metal used for the metal particles include copper, silver, and alloys using these. The conductive particles may be used in combination of a plurality of types of metal particles. A resin can be used for the binder. Specific examples include an epoxy resin. Such a conductive member preferably contains 70% or more of conductive particles. When the conductive member is formed of a conductive paste, the conductive paste includes at least conductive particles and a binder, and may include a solvent and an additive as necessary.

  The second electrode 32 has a trapezoidal shape that tapers toward the first electrode 22 side.

(Wiring layer)
The wiring layer 40 is provided on the coating layer 30 on the side opposite to the substrate 12 side, and is electrically connected to the second electrode 32. Therefore, the second electrode 32 electrically connects the first electrode 22 and the wiring layer 40. The wiring layer 40 shown in FIG. 1 is patterned into a desired pattern.

  The wiring layer 40 is a conductive layer. The material constituting the wiring layer 40 may be a metal such as copper, gold, silver, platinum, rhodium, tin, aluminum, nickel, chromium, or an alloy using these metals. The thickness of the wiring layer 40 is, for example, not less than 1 μm and not more than 20 μm.

(element)
The element 100 is located between the substrate 12 and the wiring layer 40 so as to be embedded in the insulating layer 31, and is electrically connected to the wiring layer 40.

  In the illustrated example, the element 100 has a plate shape, and the main surface on the substrate 12 side and the side surface located between the pair of main surfaces of the pair of main surfaces are entirely covered with the insulating layer 31. . On the other hand, the main surface opposite to the substrate 12 side of the pair of main surfaces of the element 100 is only partially covered by the insulating layer 31, but this main surface is also excluded except for the connection portion with the bump 101. The insulating layer 31 may be entirely covered.

  A bump 101 provided between the element 100 and the wiring layer 40 electrically connects the element 100 and the wiring layer 40. The bump 101 in the present embodiment has a conductive member made of the same material as the conductive member included in the second electrode 32 and is electrically connected to the wiring layer 40 through the conductive member. Thus, by using a conductive member made of the same material as the conductive member of the second electrode 32 in the bump 101, it is possible to reduce the manufacturing cost.

  The type and size of the element 100 are not particularly limited. For example, the element 100 may have a thickness of 50 μm in the normal direction of the substrate 12.

Method of manufacturing a wiring board Hereinafter, an example of a method of manufacturing the wiring substrate 1 described above will be described with reference to FIGS. 2-7.

(Through hole forming process)
First, the substrate 12 is prepared. Next, a resist layer is provided on at least one of the first surface 13 and the second surface 14. Thereafter, an opening is provided at a position corresponding to the through hole 20 in the resist layer. Next, by processing the substrate 12 in the opening of the resist layer, the through hole 20 can be formed in the substrate 12 as shown in FIG. As a method for processing the substrate 12, a dry etching method such as a reactive ion etching method or a deep reactive ion etching method, a wet etching method, or the like can be used.

  The through hole 20 may be formed in the substrate 12 by irradiating the substrate 12 with a laser. In this case, the resist layer may not be provided. As a laser for laser processing, an excimer laser, an Nd: YAG laser, a femtosecond laser, or the like can be used. When an Nd: YAG laser is employed, a fundamental wave having a wavelength of 1064 nm, a second harmonic having a wavelength of 532 nm, a third harmonic having a wavelength of 355 nm, or the like can be used.

Further, laser irradiation and wet etching can be appropriately combined. Specifically, first, a deteriorated layer is formed in a region of the substrate 12 where the through hole 20 is to be formed by laser irradiation. Subsequently, the altered layer is etched by immersing the substrate 12 in hydrogen fluoride or the like. Thereby, the through hole 20 can be formed in the substrate 12. In addition, the through holes 20 may be formed in the substrate 12 by a blasting process in which an abrasive is sprayed onto the substrate 12.
(First electrode forming step)
Next, as shown in FIG. 3, the first electrode 22 is formed on the side wall 21 of the through hole 20. In the present embodiment, the conductive connection layer 24 is formed on the first surface 13 and the second surface 14 simultaneously with the first electrode 22. Thereby, the electrode substrate 10 is prepared.

  Here, the first electrode 22 and the conductive connection layer 24 are formed by growing a plating layer after forming a seed layer by sputtering, vapor deposition, or a combination thereof.

(Core filling process)
Next, as shown in FIG. 4, the core 23 is filled in the first electrode 22. The core 23 may be filled by, for example, disposing a resin film on the first surface 13 and the second surface 14 and pushing the film into the first electrode 22 using a pressure difference. Further, such a film may be pushed into the first electrode 22 by a roller.

(Wiring formation process)
Next, a wiring portion for the first electrode 22 formed from the covering layer 30, particularly the second electrode 32 and the wiring layer 40 is formed. At this time, first, as shown in FIG. 5, a wiring forming member 50 is prepared. The wiring forming member 50 is a member in which the covering layer 30, the wiring layer 40, and the element 100 before being provided on the electrode substrate 10 are integrated. In the illustrated example, the wiring forming member 50 is formed on the wiring layer 40 on the side opposite to the covering layer 30 side. It further has the base material layer 60 joined.

  That is, the wiring forming member 50 according to this example is positioned so as to be embedded in the insulating layer 31, the second electrode 32 provided so as to penetrate the insulating layer 31, and the insulating layer 31, and is held by the insulating layer 31. The covering layer 30 including the element 100, the wiring layer 40 provided on the covering layer 30 and electrically connected to the second electrode 32 and the element 100, and bonded to the wiring layer 40 on the side opposite to the covering layer 30 side. The base material layer 60 is integrally provided. However, the point that the second electrode 32 protrudes from the insulating layer 31 on the wiring forming member 50 is different from the state after being provided on the electrode substrate 10. Further, the wiring layer 40 on the wiring forming member 50 is not patterned and is in a state of extending and spreading in a sheet shape.

  Moreover, the base material layer 60 in this example is formed from resin, and the handling property of the wiring forming member 50 is improved by supporting and protecting the wiring layer 40 and the insulating layer 31 thereon. The base material layer 60 is configured as a release layer that can be peeled off from the wiring layer 40.

  After the wiring forming member 50 as described above is arranged on the second surface 14 side, the wiring forming member 50 has its second electrode 32 electrically connected to the first electrode 22 as shown in FIG. Further, the first electrode 22 is bonded to the electrode substrate 10 from the side where the first electrode 22 is exposed from the substrate 12, in this example, from the second surface 14 side. At this time, the wiring forming member 50 is bonded to the electrode substrate 10 by welding the insulating layer 31 to the substrate 12. Specifically, the wiring forming member 50 is heated and pressurized toward the substrate 12. Thereby, the insulating layer 31 is melted and adhered to the substrate 12, and the wiring forming member 50 is bonded to the electrode substrate 10. At this time, as shown in FIG. 6, the second electrode 32 is crushed by heating and pressurization and becomes wider than the state before joining.

  Then, as shown in FIG. 7, after the base material layer 60 is peeled from the wiring layer 40, a resist 70 is provided on the wiring layer 40, and the wiring layer 40 is etched using the resist 70 as a mask. A pattern is formed on the wiring layer 40. Thereby, the wiring board 1 in the state shown in FIG. 1 is manufactured.

  In the wiring substrate 1 according to the present embodiment described above, the second electrode 32 has a conductive member including conductive particles and a binder, and electrically connects the first electrode 22 and the wiring layer 40. Thus, the 2nd electrode 32 has the electroconductive member containing electroconductive particle and a binder, and the air permeability with respect to gas is ensured. As a result, the gas generated on the inside, specifically on the first electrode 22 side, can pass through the second electrode 32 and be released to the outside from between the coating layer 30 and the wiring layer 40. Further, since the second electrode 32 is formed without performing patterning or the like, it takes less time to manufacture, and the element 100 is incorporated into the wiring substrate 1 simultaneously with the formation of the second electrode 32. Therefore, good air permeability with respect to the gas generated inside can be easily secured and can be easily manufactured.

  In particular, the wiring portion for the first electrode 22 formed from the covering layer 30, particularly the second electrode 32 and the wiring layer 40, is joined to the electrode substrate 10 by the wiring forming member 50 in which the covering layer 30 and the wiring layer 40 are integrated. Thus, according to the present embodiment, the wiring board 1 can be manufactured very easily.

(Other embodiment 1)
Next, another embodiment will be described with reference to FIGS. FIG. 8 is a cross-sectional view showing the wiring board 2 according to the present embodiment. 9 to 14 are diagrams showing a manufacturing process of the wiring board 2. Of the components in the present embodiment, the same components as those in the above-described embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 8, the wiring substrate 2 according to the present embodiment includes a substrate 12, a first electrode 22, a coating layer 30, a wiring layer 40, an element 100 and a counter substrate 112. The counter substrate 112 is positioned so as to face the substrate 12 via the wiring layer 40 and the covering layer 30, and is integrated with the substrate 12 via the wiring layer 40 and the covering layer 30.

  The counter substrate 112 includes a counter side first surface 113 and a counter side second surface 114 positioned on the opposite side of the counter side first surface 113, and penetrates from the counter side first surface 113 to the counter side second surface 114. The opposing side through hole 120 is provided, and the third electrode 122 that is electrically connected to the wiring layer 40 is located in the opposing side through hole 120. The third electrode 122 is electrically connected to the element 100 via the wiring layer 40, and is electrically connected to the first electrode 22 via the wiring layer 40, the second electrode 32, and the conductive connection layer 24. Yes. The third electrode 122 is a conformal via and is filled with a core 123 made of resin.

  The substrate 12 and the counter substrate 112 are preferably formed of the same material and size. In this embodiment, the substrate 12 and the counter substrate 112 are both glass substrates and have the same thickness. Thereby, good dimensional stability is ensured.

  Hereinafter, a method for manufacturing the wiring board 2 shown in FIG. 8 will be described.

(Electrode substrate manufacturing process)
First, the electrode substrate 10 having the substrate 12 and the first electrode 22 is prepared through a process similar to the process described with reference to FIGS.

(Wiring formation process)
Next, a wiring portion for the first electrode 22 formed from the covering layer 30, particularly the second electrode, the wiring layer 40, and the third electrode 122 is formed. At this time, first, a wiring forming member 150 shown in FIG. 15 manufactured through the steps shown in FIGS. 9 to 14 is prepared. The wiring forming member 150 in this embodiment is a member in which the covering layer 30, the wiring layer 40, and the element 100 before being provided on the electrode substrate 10 are integrated, and is bonded to the wiring layer 40 on the side opposite to the covering layer 30 side. The counter substrate 112 is further provided. Also in this example, the wiring layer 40 is patterned, but the insulating layer 31 of the covering layer 30 is located in a portion where the wiring layer 40 is not formed on the counter substrate 112.

  When manufacturing the wiring forming member 150, first, as shown in FIG. 9, the counter substrate 112 provided with the counter-side through hole 120 is prepared, and then the side wall of the counter-side through hole 120 and the counter substrate 112 are provided. A conductive layer 140 is formed on the opposing first surface 113 and the opposing second surface 114. The conductive layer 140 is formed by growing a plating layer after forming a seed layer by sputtering, vapor deposition, or a combination thereof.

  Next, as shown in FIG. 10, the conductive layer 140 on the opposing first surface 113 and the opposing second surface 114 is patterned into a desired pattern by etching, whereby wiring is formed on the opposing first surface 113. The layer 40 is provided, and the third electrode 122 is provided in the opposing through hole 120. Thereafter, as shown in FIG. 11, the core 123 is filled in the third electrode 122. The filling of the core 123 can be performed by a process similar to the process described in FIG.

  As shown in FIG. 12, the second electrode 32 is provided on the wiring layer 40 and the bump 101 is provided. In this case, the manufacturing cost can be suppressed by making the second electrode 32 and the conductive member forming the bump 101 the same. The second electrode 32 and the bump 101 may be provided on the wiring layer 40 by screen printing, for example. Then, as shown in FIG. 13, the bump 101 and the element 100 are electrically connected, and thereafter, the insulating layer 31 is provided on the wiring layer 40 as shown in FIG. Here, the insulating layer 31 covers the wiring layer 40, the element 100, and the opposing first surface 113. The second electrode 32 is in a state of penetrating the insulating layer 31.

  After the wiring forming member 150 according to this embodiment is manufactured through the above steps, the electrode substrate 10 and the wiring forming member 150 face each other as shown in FIG. Thereafter, as shown in FIG. 16, the wiring forming member 150 is formed on the side where the first electrode 22 is exposed from the substrate 12 such that the second electrode 32 is electrically connected to the first electrode 22. Bonded to the electrode substrate 10 from the second surface 14 side. At this time, the wiring forming member 150 is bonded to the electrode substrate 10 by welding the insulating layer 31 to the substrate 12. Specifically, the wiring forming member 150 is heated and pressurized toward the substrate 12. Thereby, the insulating layer 31 is melted and adhered to the substrate 12, and the wiring forming member 150 is bonded to the electrode substrate 10. At this time, as shown in FIG. 16, by heating and pressing, the second electrode 32 is crushed and becomes wider than the state before joining.

  Also in the wiring board 2 according to the embodiment described above, the second electrode 32 includes a conductive member including conductive particles and a binder, and electrically connects the first electrode 22 and the wiring layer 40. Thus, the 2nd electrode 32 has the electroconductive member containing electroconductive particle and a binder, and the air permeability with respect to gas is ensured. As a result, the gas generated inside, specifically on the first electrode 22 side, can easily pass through the second electrode 32 and be discharged to the outside. Further, since the second electrode 32 is formed without performing patterning or the like, it takes less time to manufacture, and the element 100 is incorporated into the wiring substrate 1 simultaneously with the formation of the second electrode 32. Therefore, good air permeability with respect to the gas generated inside can be easily secured and can be easily manufactured.

  In particular, the coating layer 30, particularly the wiring portion formed from the second electrode 32, the wiring layer 40, and the third electrode 122, for the first electrode 22, is integrated with the coating layer 30, the wiring layer 40, and the third electrode 122. Since the wiring forming member 150 is manufactured by bonding to the electrode substrate 10, the wiring substrate 2 can be manufactured very easily also in this embodiment.

(Other embodiment 2)
Next, still another embodiment will be described with reference to FIG. Of the components in the present embodiment, the same components as those in the above-described embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. As shown in FIG. 17, in this example, a bottomed hole 20 ′ recessed from the second surface 14 to the first surface 13 is provided in the substrate 12, and the first electrode 22 is located inside the bottomed hole 20 ′. In FIG. 17, the first electrode 22 is a filled via, but it may be a conformal via. The electrode substrate according to this embodiment can also be manufactured by the same procedure as that of the above-described embodiment. Note that a bottomed hole may be formed in the above-described counter substrate 112 instead of the counter-side through hole 120.

FIG. 18 is a diagram illustrating an example of a product on which the wiring board according to the embodiment of the present disclosure can be mounted. The wiring board according to the embodiment of the present disclosure can be used in various products. For example, it is mounted on a notebook personal computer 210, a tablet terminal 220, a mobile phone 230, a smartphone 240, a digital video camera 250, a digital camera 260, a digital clock 270, a server 280, and the like.

DESCRIPTION OF SYMBOLS 1, 2 ... Wiring board 10 ... Electrode board 12 ... Board | substrate 13 ... 1st surface 14 ... 2nd surface 20 ... Through-hole 20 '... Bottom hole 21 ... Side wall 22 ... 1st electrode 23 ... Core 24 ... Conductive connection layer 30 ... Covering layer 31 ... Insulating layer 31A ... Hole 32 ... Second electrode 40 ... Wiring layer 50 ... Wiring forming member 60 ... Base material layer 100 ... Element 101 ... Bump 112 ... Opposing substrate 113 ... Opposing side first surface 114 ... Opposing Side second surface 120 ... opposing side through-hole 122 ... third electrode 123 ... core 150 ... wiring forming member

Claims (17)

Including a first surface and a second surface located on the opposite side of the first surface, and a through-hole penetrating from the first surface to the second surface or one of the first surface and the second surface. A substrate with a bottomed hole recessed into the other;
A first electrode located in the through hole or the bottomed hole;
An insulating layer and a second electrode provided so as to penetrate the insulating layer, and both or one of the first surface and the second surface so as to cover the first electrode exposed from the substrate A coating layer provided on a surface and electrically connecting the second electrode to the first electrode;
A wiring layer provided on the covering layer and electrically connected to the second electrode;
An element located in the insulating layer between the substrate and the wiring layer and electrically connected to the wiring layer;
With
The wiring board, wherein the second electrode has a conductive member including conductive particles and a binder, and electrically connects the first electrode and the wiring layer.   2. The wiring board according to claim 1, wherein the element is electrically connected to the wiring layer via a conductive member made of the same material as the conductive member of the second electrode.   The wiring board according to claim 1, wherein the second electrode is electrically connected to the first electrode through a conductive connection layer provided on the first surface or the second surface. Further comprising a counter substrate positioned to face the substrate via the wiring layer and the coating layer;
The wiring substrate according to claim 1, wherein the counter substrate is integrated with the substrate via the wiring layer and the covering layer.   The wiring board according to claim 4, wherein the substrate and the counter substrate are made of a glass substrate. The counter substrate includes a counter side first surface and a counter side second surface positioned on the opposite side of the counter side first surface, and the counter side penetrating from the counter side first surface to the counter side second surface. A counter-side bottomed hole that is recessed from one of the through hole or the counter-side first surface and the counter-side second surface is provided,
The wiring board according to claim 4, wherein a third electrode that is electrically connected to the wiring layer is located in the opposing side through hole or the opposing side bottomed hole. Including a first surface and a second surface located on the opposite side of the first surface, and a through-hole penetrating from the first surface to the second surface or one of the first surface and the second surface. Preparing an electrode substrate having a substrate provided with a bottomed hole recessed in the other, and a first electrode located in the through hole or the bottomed hole;
An insulating layer, a second electrode provided so as to penetrate the insulating layer, and a covering layer including an element located in the insulating layer; and the second electrode provided on the covering layer and electrically connected to the element Preparing a wiring forming member having a connected wiring layer, wherein the second electrode has a conductive member including conductive particles and a binder and protrudes from the insulating layer;
Bonding the wiring forming member to the electrode substrate such that the second electrode is electrically connected to the first electrode.   The method for manufacturing a wiring board according to claim 7, wherein the wiring forming member is bonded to the electrode substrate by welding the insulating layer to the substrate.   The method of manufacturing a wiring board according to claim 8, wherein the wiring forming member is heated and pressed toward the substrate and bonded to the electrode substrate.   10. The wiring board according to claim 7, wherein the element is electrically connected to the wiring layer via a conductive member made of the same material as the conductive member of the second electrode. Production method.   11. The second electrode according to claim 7, wherein the second electrode is electrically connected to the first electrode via a conductive connection layer provided on the first surface or the second surface. Wiring board manufacturing method.   The method for manufacturing a wiring board according to claim 7, wherein the conductive member is formed using a conductive paste.   The method for manufacturing a wiring board according to claim 7, wherein the wiring forming member further includes a base material layer bonded to the wiring layer on the side opposite to the coating layer side.   The method for manufacturing a wiring board according to claim 13, wherein the base material layer is a peeling layer that is peelable from the wiring layer, and is peeled after the wiring forming member is bonded to the electrode substrate. The wiring forming member further includes a counter substrate bonded to the wiring layer on the side opposite to the covering layer side;
The counter substrate is positioned so as to face the substrate through the wiring layer and the coating layer after the wiring forming member is bonded to the electrode substrate, and is integrated with the substrate through the wiring layer and the coating layer. The method for manufacturing a wiring board according to claim 7, wherein:   The method for manufacturing a wiring board according to claim 15, wherein the substrate and the counter substrate are made of a glass substrate. The counter substrate includes a counter side first surface and a counter side second surface positioned on the opposite side of the counter side first surface, and the counter side penetrating from the counter side first surface to the counter side second surface. A counter-side bottomed hole that is recessed from one of the through hole or the counter-side first surface and the counter-side second surface is provided,
17. The method of manufacturing a wiring board according to claim 15, wherein a third electrode that is electrically connected to the wiring layer is located in the opposing side through hole or the opposing side bottomed hole.

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