JP3266986B2 - Manufacturing method of ceramic multilayer substrate - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic multilayer substrate, and more particularly to a method for forming a relatively large through hole in a ceramic multilayer substrate.

[0002]

2. Description of the Related Art In recent years, high-density ceramic multilayer substrates have been demanded with the miniaturization of electronic devices and the digitization of circuits. Along with this, various shapes of ceramic multilayer substrates are also required.For example, when a substrate is mounted close to a mechanical part in an electronic device, a considerably large through hole must be provided in the ceramic substrate on the substrate mounting. Sometimes not.

In a conventional manufacturing process for providing such a relatively large through-hole in a ceramic multilayer substrate, as shown in FIG. 3, a through-hole 2 of a predetermined shape is previously formed in each ceramic green sheet 1 by a punch pin or a mold. The laminated body 6 is made by laminating a plurality of the above-mentioned materials, and the laminate is sintered to manufacture. In addition, when laminating, lamination was performed using a special jig 5 adapted to the through hole 2 as shown in FIG.

[0004]

However, in the manufacturing process of providing a through-hole in the above-mentioned conventional ceramic multilayer substrate,
When stacking, a special jig corresponding to the through hole is required. That is, if a jig that matches this through hole is not used when laminating, stress will be applied to the end of the through hole, the shape of the through hole will collapse, and cracks will occur from this part when sintering the substrate. Failure occurs.

Therefore, according to this manufacturing method, every time the shape of the through-hole changes, a jig must be made to match the through-hole used for lamination, resulting in an increase in the cost of the substrate. An object of the present invention is to solve such a problem and to simplify the manufacturing process of a ceramic multilayer substrate provided with a through-hole, and to provide a lower-cost ceramic multilayer substrate.

[0006]

In order to solve the above-mentioned problems, a method of manufacturing a ceramic multilayer substrate according to the present invention is directed to a method for manufacturing a ceramic multilayer substrate having a predetermined width which is interrupted along a shape of a through hole to be formed in a fired ceramic multilayer substrate. The through-holes are formed in each planar green sheet so that the discontinuous portions of the through-holes do not come into contact with each other when a plurality of green sheets are laminated. The method is characterized in that a part is cut to remove a part to be the through hole.

[0007]

According to the above-mentioned manufacturing method, when laminating and crimping, no complete through-hole is formed in each green sheet, that is, a position where a through-hole is to be formed is supported by a discontinuous portion. There is a green sheet in the state where it was done. Therefore, at the time of pressing by the press plate, the pressing force of the press plate is also applied to the green sheet portion existing at the position where the through hole is to be formed, and strong stress is not applied to the peripheral edge of the through hole.

In addition, since the discontinuous portions are laminated so as not to overlap with each other during lamination, they can be easily cut after firing. As described above, according to the present invention, it is not necessary to prepare a jig corresponding to the shape of the through-hole as in the related art, which greatly contributes to the cost reduction of the ceramic multilayer substrate.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the method for manufacturing a ceramic multilayer substrate according to the present invention will be described below with reference to the drawings. In FIG. 1, reference numerals 1a to 1f denote six 200 μm stacked layers, respectively.
Each green sheet is provided with a discontinuous through hole 2 having a width of 0.2 mm along a peripheral edge of a through hole to be formed by a punch pin of 0.2 mm square.
a to 2d are formed.

That is, the green sheet portions 4a to 4f supported by the discontinuous portions 3a to 3d are present in the portions that become the through holes of the green sheets 1a to 1f. Then, the discontinuous portion 3 formed on each green sheet is formed.
a to 3d, when these green sheets are laminated,
They are formed at positions that do not abut each other.

FIG. 2 shows a state in which these green sheets 1a to 1f are stacked. In this state, it is pressed from above and below by a press plate, integrated, and fired. Thereafter, all the discontinuous portions 3a to 3d are cut to remove the green sheet portions 4a to 4f to form predetermined through holes.

The width of the through holes 2a to 2d is set so long as the periphery of the green sheet portions 4a to 4f does not abut on the periphery of the portion to be a through hole of each green sheet 1a to 1f during pressing or firing. The narrower the width, the better the width and the position of the discontinuous portion as long as the strength and the position can support the green sheet portions 4a to 4f.

[0013]

As described above, according to the production method of the present invention,
When laminating and crimping, complete through holes are not formed in each green sheet, and in the positions that should be through holes,
Since a part of the green sheet exists while being supported by the discontinuous portion, the pressing force of the press plate is also applied to the green sheet portion existing at a position where the through hole should be formed when pressed by the press plate. As a result, no strong stress is applied to the periphery of the through hole.

Since the discontinuous portions are laminated so as not to overlap with each other at the time of lamination, they can be easily cut after firing.

As described above, according to the present invention, it is not necessary to prepare a jig corresponding to the shape of the through-hole unlike the related art.
This is very useful for reducing the cost of the ceramic multilayer substrate.

[Brief description of the drawings]

FIG. 1 is a plan view of a green sheet in one step of an embodiment of a method for manufacturing a ceramic multilayer substrate of the present invention.

FIG. 2 is a plan view of laminated green sheets in another process of the embodiment.

FIG. 3 is a perspective view showing one step of a conventional method for manufacturing a ceramic multilayer substrate.

FIG. 4 is a side sectional view showing the laminated green sheets in another step of the manufacturing method.

[Explanation of symbols]

 1a to 1f Green sheet 2a to 2d Through hole 3a to 3d Discontinuous part 4a to 4f Removal part 5 Jig 6 Green sheet laminate

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-4-33397 (JP, A) JP-A-4-288854 (JP, A) JP-A-2-238642 (JP, A) JP-A-3-338 274108 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 3/46 H05K 3/00

Claims (1)

(57) [Claims] 1. A through hole having a predetermined width intermittently formed along the shape of a through hole to be formed in a fired ceramic multilayer substrate, and a discontinuous portion of the through hole is formed when a plurality of green sheets are laminated. A ceramic multi-layer formed by forming each of the planar green sheets so as not to contact each other, laminating, pressing, and firing, and then cutting the discontinuous portion to remove a portion to become the through hole. Substrate manufacturing method.