JPH077269A - Manufacture of ceramic multilayer board - Google Patents

Abstract

PURPOSE:To improve manufacturing properties and to reduce a cost of a ceramic multilayer board by simplifying manufacturing steps in a method for manufacturing the board having through holes. CONSTITUTION:The method for manufacturing a ceramic multilayer board comprises the steps of so forming through holes 2a-2d of a predetermined width intermittently continued along a shape of through holes to be formed at the board after baking at flat surfacelike green sheets that, when a plurality of the sheets 1a-1f are laminated, discontinued parts 3a-3d of the holes 2a 2d are not brought into contact with each other, laminating them, compression bonding them and removing, after baking, the parts to serve as the holes.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic multilayer substrate, and is particularly characterized by the step of forming a relatively large through hole in the ceramic multilayer substrate.

[0002]

2. Description of the Related Art In recent years, with the miniaturization of electronic devices and the digitization of circuits, high density ceramic multilayer substrates have been required. In addition, various shapes of ceramic multilayer substrates are required accordingly. For example, when a substrate is mounted in the vicinity of a mechanical part inside an electronic device, a fairly large through hole must be provided on the ceramic substrate for mounting the substrate. It may not be.

In the conventional manufacturing process for providing such a relatively large through hole in a ceramic multilayer substrate, as shown in FIG. 3, a through hole 2 having a predetermined shape is prepared in advance in each ceramic green sheet 1 by a punch pin or a die. A plurality of the stored materials are laminated to form a laminated body 6, and the laminated body is sintered for manufacturing. Further, when laminating, the laminating was carried out by a special jig 5 adapted to the through hole 2 as shown in FIG.

[0004]

However, in the manufacturing process of forming the through holes in the above-mentioned conventional ceramic multilayer substrate,
A special jig that matches the through holes is also required for stacking. That is, unless a jig that matches this through hole is used when stacking, stress is applied to the end of the through hole, the shape of the through hole collapses, and cracks form from this part when the substrate is sintered. Defective.

Therefore, according to this manufacturing method, it is necessary to make a jig that fits the through-holes used for stacking each time the shape of the through-holes changes, resulting in an increase in the cost of the substrate. An object of the present invention is to solve such problems, to simplify the manufacturing process of a ceramic multilayer substrate having a through hole, and to provide a lower cost ceramic multilayer substrate.

[0006]

In order to solve the above problems, a method for manufacturing a ceramic multilayer substrate according to the present invention has a predetermined width which is intermittent along the shape of a through hole to be formed in a ceramic multilayer substrate after firing. The through holes are formed on each planar green sheet so that the discontinuous portions of the through holes do not contact each other when a plurality of green sheets are stacked, and the stacked green sheets are stacked, pressure-bonded, and fired, and then the discontinuous holes are formed. It is characterized in that the portion is cut to remove the portion to be the through hole.

[0007]

According to the above-mentioned manufacturing method, the complete through holes are not formed in each green sheet when laminating and pressure bonding, that is, the positions where the through holes are to be formed are supported by the discontinuous portions. There is a green sheet in the state of being lit. Therefore, at the time of pressing by the press plate, the pressing force of the press plate is also applied to the green sheet portion existing at the position to be the through hole, and the strong stress is not applied to the peripheral edge of the through hole.

Further, since the discontinuous portions are laminated so that they do not overlap each other at the time of lamination, they can be easily cut after firing. As described above, according to the present invention, it is not necessary to prepare a jig corresponding to the shape of the through hole as in the prior art, which is very useful for reducing the cost of the ceramic multilayer substrate.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the method for producing a ceramic multilayer substrate of the present invention will be described below with reference to the drawings. In FIG. 1, 1a to 1f are six 200 μm layers to be laminated.
Each of the green sheets is a thick green sheet, and each of the green sheets has a discontinuous through hole 2 having a width of 0.2 mm along the periphery of the through hole to be formed by a punch pin of 0.2 mm square.
a to 2d are formed.

That is, the green sheet portions 4a to 4f supported by the discontinuous portions 3a to 3d are present at the through holes of the green sheets 1a to 1f. Then, the discontinuous portion 3 formed on each green sheet
a to 3d are, when these green sheets are laminated,
They are formed at positions where they do not abut each other.

FIG. 2 shows a state in which these green sheets 1a to 1f are laminated. In this state, they are pressed by a press plate from above and below to be integrated, and then fired. Then, the discontinuous portions 3a to 3d are all cut to remove the green sheet portions 4a to 4f to form predetermined through holes.

The width of the through holes 2a to 2d is such that the periphery of the green sheet portions 4a to 4f does not come into contact with the peripheral edge of the portion to be the through hole of each green sheet 1a to 1f during pressing or firing. It is preferable that the width is narrow and the width and position of the discontinuous portion are narrow and the number thereof is small as long as the width and position are such that the green sheet portions 4a to 4f can be supported.

[0013]

As described above, according to the manufacturing method of the present invention,
At the time of stacking and pressure bonding, complete through holes are not formed in each green sheet, and at the positions that should be through holes,
Since a part of the green sheet exists in the state of being supported by the discontinuous portion, the pressing force of the press plate is also applied to the green sheet part that exists at the position that should become this through hole when pressed by the press plate. Therefore, a strong stress is not applied to the periphery of the through hole.

Since the discontinuous portions are laminated so that they do not overlap each other during lamination, they can be easily cut after firing.

As described above, according to the present invention, it is not necessary to prepare a jig corresponding to the shape of the through hole as in the conventional case,
This is very useful for reducing the cost of the ceramic multilayer substrate.

[Brief description of drawings]

FIG. 1 is a plan view of a green sheet in one step of an embodiment of a method for manufacturing a ceramic multilayer substrate of the present invention.

FIG. 2 is a plan view of stacked green sheets in another process of the same embodiment.

FIG. 3 is a perspective view showing one step of a conventional method for manufacturing a ceramic multilayer substrate.

FIG. 4 is a side sectional view showing a laminated green sheet in another step of the manufacturing method.

[Explanation of symbols]

 1a-1f Green sheet 2a-2d Through hole 3a-3d Discontinuous part 4a-4f Removal part 5 Jig 6 Green sheet laminated body

Claims (1)

[Claims] 1. When a plurality of green sheets are laminated, a through hole having a predetermined width, which is interrupted along the shape of a through hole to be formed in a fired ceramic multilayer substrate, is formed in a discontinuous portion of the through hole. A ceramic multi-layer, characterized in that it is formed on each planar green sheet so as not to contact each other, laminated, pressure-bonded, and after firing, the discontinuous portion is cut to remove the portion to be the through hole. Substrate manufacturing method.