JP2003198129A - Method of manufacturing laminated ceramic electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve flatness of mounting regions of components to be mounted in a multilayer ceramic substrate in which the components to be mounted are loaded on the external surface of the laminated body. <P>SOLUTION: More intensive pressing can be performed only at the particular portion which collides with a projected portion 26 by pressing a raw laminated body 23 using a metal die 24 for press having the projected portion 26. Therefore, difference of pressing pressures resulting from conductive films 4, 6 and via hole conductor 5 can be made small and amount of contraction during the baking process can also be made small. Accordingly, flatness of the bottom surface of a recessed portion 27 corresponding to the more intensively pressed portion in the laminated body 28 after the sintering process can further be improved. The components 8, 9 to be mounted can be loaded with the bottom surface of the recessed portion 27 defined as the mounting region. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a laminated ceramic electronic component such as a multilayer ceramic substrate, and more particularly to a method for manufacturing a laminated ceramic electronic component having a structure in which another mounting component is mounted. It is about.

[0002]

2. Description of the Related Art In order to miniaturize electronic equipment, it is effective to miniaturize electronic parts used in electronic equipment and to use a circuit board having a laminated structure as a circuit board for mounting the electronic parts. is there. This is because elements such as capacitors and inductors can be built in the circuit board having such a laminated structure.

As a circuit board having a laminated structure as described above, there is, for example, a multilayer ceramic board 1 as shown in FIG.

The multi-layer ceramic substrate 1 comprises a laminated body 3 composed of a plurality of laminated ceramic layers 2.

Inside the laminated body 3, some internal conductor films 4 extending along a specific interface between the ceramic layers 2 and some via-hole conductors extending so as to penetrate the specific ceramic layer 2 in the thickness direction. 5 are provided.

On the upper surface of the laminated body 3, several outer conductor films 6 are provided. Also, some outer conductor films 7 are provided on the lower surface of the laminated body 3.

The internal conductor film 4, the via-hole conductor 5 and the external conductor films 6 and 7 are provided for interconnecting the circuit elements formed in the multilayer ceramic substrate 1, and particularly in the internal conductor film 4 and the via-hole conductor 5. Is
A passive element such as a capacitor or an inductor is formed inside the laminated body 3, and in the outer conductor film 6, terminal electrodes for mounting components 8 and 9 mounted on the upper surface of the laminated body 3 are formed. In addition, the external conductor film 7 serves as a terminal electrode for connection to the mother board on which the multilayer ceramic substrate 1 is mounted.

Such a multilayer ceramic substrate 1 is manufactured as follows.

First, a plurality of ceramic green sheets to be the ceramic layers 2 are prepared.

Next, at least one of the inner conductor film 4, the via-hole conductor 5 and the outer conductor film 6 is formed on a specific portion of a specific one of the plurality of ceramic green sheets. Printing of a conductive paste is applied in forming the inner conductor film 4 and the outer conductor film 6, and in forming the via-hole conductor, a through hole may be provided in the ceramic green sheet and the conductive paste may be filled therein. Done.

Next, by laminating a plurality of ceramic green sheets, a raw laminate to be the laminate 3 is produced.

Next, the green laminate is pressed in the laminating direction.

Next, the green laminated body is fired, whereby the laminated body 3 after sintering is obtained.

Next, the outer conductor film 7 is formed on the lower surface of the laminate 3 by applying a conductive paste by printing and baking it. The outer conductor film 7 may be formed at the stage of the raw laminated body before firing, or may be formed at the stage of the ceramic green sheet before laminated. In this case, firing of the raw laminated body is performed. It is baked at the same time.

Next, on the upper surface of the laminate 3, for example, an IC
A mounting component 8 such as a bare chip forming a SAW filter or a mounting component 9 such as a surface mounting component forming a multilayer ceramic capacitor is mounted. Figure 4
Then, the mounting component 8 is connected to the external conductor film 6 via the solder bumps 10, and the mounting component 9 is surface-mounted by connecting its electrodes to the external conductor film 6 via solder (not shown). However, other connection methods such as die bonding and wire bonding may be applied depending on the form of the mounted component. In addition to the solder bumps, gold bumps may be used as the bumps.

In this way, the multilayer ceramic substrate 1 is completed.

[0017]

In order to enable mounting of the mounting components 8 and 9 described above and to mount them in an appropriate state, the upper surface of the laminated body 3 serving as a mounting surface must be flat. I won't.

However, on the upper surface of the laminate 3,
As shown by the broken line in FIG. 4, a convex surface portion 11 is formed,
The concave portion 12 may be formed. The cause is as follows.

As described above, when pressing the raw laminated body in the laminating direction, the raw laminated body is pressed by the upper and lower press dies made of rigid bodies having smooth surfaces. . Therefore, the upper and lower surfaces of the green laminate are flat after pressing.

However, as described above, when pressing is performed with a pressing die made of a rigid body having a smooth surface, the portion where any one of the conductor films 4 and 6 is present is smaller than the portion where this is not present and the conductor film is not present. A portion having a relatively large number of either 4 or 6 will be subjected to a higher pressure than a portion having a relatively small number thereof. Similarly, in the via-hole conductor 5, a higher pressure is applied to a portion filled with a relatively large amount of the conductive paste, compared to a portion where the conductive paste is not present or a portion where the conductive paste is filled in a small amount.

The pressure difference in the plane of such a green laminate appears as a difference in shrinkage in the firing step,
As a result, in the portion where one of the conductor films 4 and 6 is present or the portion where a relatively large number is present and the via hole conductor 5 which is filled with a relatively large amount of conductive paste, the convex surface portion 11 as shown by the broken line in FIG. Will be brought.

On the other hand, when the filling amount of the conductive paste in the via-hole conductor 5 is relatively small, a lower pressure is exerted in the pressing process. Therefore, in the portion of the via-hole conductor 5, the concave surface portion 12 is provided after firing as shown by the broken line in FIG.

The above problem can be solved to some extent by increasing the press pressure. That is, by further increasing the pressing pressure, the difference in pressure caused by the conductor films 4 and 6 and the via-hole conductor 5 described above is reduced, and the shrinkage amount in the firing step is further reduced. 3 can be improved in flatness.

However, if the pressing pressure is further increased as described above, another problem will occur as follows.

FIG. 5 is a schematic plan view of a raw aggregate laminate 13 produced when the raw laminates 3a to be the individual laminates 3 are manufactured in the aggregate state.

The raw aggregate laminate 13 is divided along a dividing line 14 indicated by a chain line to obtain a plurality of raw laminates 3a. Therefore, the inner conductor film 4, the via-hole conductor 5, and the outer conductor film 6 provided in the laminate 3 shown in FIG. 4 are already formed in each part of the raw aggregate laminate 13 which is divided by the dividing line 14. ing.

As described above, when a higher pressing pressure is applied to such a raw aggregate 13, the raw aggregate laminate 13 expands in the plane direction, and as a result,
As shown by the broken line in FIG. 5, the raw collective laminate 13 is deformed so that each side 15 thereof bulges outward.

The raw aggregate laminate 1 thus deformed
The portion of the sheet 3 that is to be the individual green laminate 3 a is deviated from the portion defined by the predetermined dividing line 14. Therefore, when the deformed raw aggregate layered body 13 is divided along the division line 14, a disconnection defect that divides the conductor film 4 or 6 or the via-hole conductor 5 often occurs.

The above-mentioned problem can be solved to some extent by disposing the conductor films 4 and 6 and the via-hole conductor 5 at a position sufficiently distant from the dividing line 14, but if such measures are taken, individual problems can be solved. It is necessary to increase the area to be the raw laminate 3a, and as a result, miniaturization of the multilayer ceramic substrate 1 is impeded.

Some multi-layer ceramic substrates are provided with a cavity inside which a mounting component can be accommodated. When pressing a green laminate for a multilayer ceramic substrate having such a cavity, a pressing process is performed with an elastic body arranged on the cavity side so that pressure can be exerted in the cavity. It

Therefore, in the case of a laminated body having a cavity, even if the pressing pressure is further increased, it is not possible to reduce the pressure difference due to the above-mentioned conductor film or via-hole conductor. In the laminated body, it is difficult to flatten the bottom surface of the cavity, and a convex surface portion and / or a concave surface portion may be formed on the bottom surface of the cavity.

In order to prevent the mounting area for the mounted components from being affected by the conductor film or the via-hole conductor without increasing the pressing pressure, the conductor film or the via-hole conductor should be located immediately below the mounting area as much as possible. It is also possible not to provide. However, if this measure is adopted,
The design of the wiring conductors in the multilayer ceramic substrate is greatly restricted, and the area of the laminated body becomes unnecessarily large, which hinders the miniaturization of the multilayer ceramic substrate.

The various problems as described above are not limited to the case of the multilayer ceramic substrate, and other laminated types such as a hybrid type electronic component having a structure in which mounting components are mounted, for example, an electronic component body having a laminated structure are provided. It can also be encountered in electronic components.

Therefore, an object of the present invention is to provide a method for manufacturing a multilayer ceramic electronic component which can solve the above-mentioned problems.

[0035]

In the method of manufacturing a multilayer ceramic electronic component according to the present invention, a step of preparing a plurality of ceramic green sheets and a step of specifying a plurality of ceramic green sheets are performed as in the conventional case. A step of forming at least one of a conductor film and a via-hole conductor in a specific part of the object, a step of producing a raw laminate by laminating a plurality of ceramic green sheets, and a step of firing the raw laminate. A step of obtaining a laminated body after sintering and a step of mounting a mounting component on the surface of the laminated body after sintering are carried out.

In order to solve the above-mentioned technical problems, the present invention is characterized by the following structure in the method for manufacturing a multilayer ceramic electronic component as described above.

That is, in a structure in which at least two ceramic green sheets are laminated, it is a part including at least a part of a part where at least one of a conductor film and a via-hole conductor is formed, and mounting parts are mounted. And / or pressing the structure in the stacking direction of the ceramic green sheets so that the surface opposite to the surface on which the mounted component is mounted and / or the surface on which the mounted component is mounted is pressed more strongly than other parts. Is carried out.

The above-mentioned structure in which at least two ceramic green sheets are laminated may be a raw laminate obtained after the lamination or a structure obtained during the lamination. .

Then, in the step of mounting the mounted component described above, the mounted component is mounted on the surface region of the laminated body after sintering, which corresponds to the portion pressed more strongly in the pressing step.

The present invention is also applied to a method of manufacturing a laminated ceramic electronic component having a cavity. In this case, the above-mentioned green laminate has a cavity.

As described above, when the present invention is applied to the method for manufacturing a multilayer ceramic electronic component having a cavity, the portion that is pressed harder in the pressing step is located in the region corresponding to the bottom portion of the cavity. Preferably.

The portion to be pressed more strongly in the pressing step may straddle a plurality of portions in which at least one of the conductor film and the via-hole conductor is formed.

Preferably, in the pressing step, the pressing pressure in the portion to be pressed more strongly is selected in the range of 10 to 80 MPa.

According to a preferred embodiment of the present invention, in the pressing step, a pressing die having a convex portion in a portion to be pressed more strongly is used. In this case, a concave portion corresponding to this convex portion is formed in the raw laminate.

Further, in the case of the above-described embodiment, the surface area for mounting the mounting component is provided on the bottom surface of the above-mentioned recess.

In the pressing process, the mold having the above-mentioned convex portion is used only on one side of the structure to be pressed, and the surface area for mounting the mounting component is formed corresponding to the convex portion. The recess may be provided on the surface opposite to the recess.

When a press die having a convex portion is used in the pressing step, the convex portion preferably has a height in the range of 30 to 200 μm.

[0048]

1 is a view for explaining a method of manufacturing a multilayer ceramic electronic component according to a first embodiment of the present invention. In this embodiment, a multilayer ceramic substrate 21 as shown in FIG. 1 (3) is manufactured. As can be seen by comparing the multilayer ceramic substrate 21 with the multilayer ceramic substrate 1 shown in FIG. 4, the multilayer ceramic substrates 21 and 1 have many common elements. Therefore, in the case where it is not particularly necessary to distinguish them from each other, in FIG. 1, elements corresponding to those shown in FIG. 4 are denoted by the same reference numerals, and redundant description may be omitted.

First, as shown in FIG. 1A, a plurality of ceramic green sheets 22 are prepared. These ceramic green sheets 22 are to be the ceramic layers 2 shown in FIG.

Next, at least one of the inner conductor film 4, the via-hole conductor 5 and the outer conductor film 6 is formed on a specific portion of a specific one of the plurality of ceramic green sheets 22.

More specifically, the specific ceramic green sheet 22 is provided with a through hole for the via-hole conductor 5 by using a method such as punching or laser processing.
The through hole is filled with a conductive paste, whereby the via hole conductor 5 is formed. Further, the inner conductor film 4 or the outer conductor film 6 is formed on the specific ceramic green sheet 22 by screen-printing a conductive paste. The order of the formation process of the via-hole conductor 5 and the formation process of the conductor films 4 and 6 may be any, and the conductivity for the via-hole conductor 5 may be the same as the formation process of the conductor films 4 and 6. You may implement the filling process of a conductive paste.

Next, as shown in FIG. 1B, a plurality of ceramic green sheets 22 are laminated to form a raw laminate 23.

Next, the green laminate 23 is pressed in the laminating direction. In this pressing step, a characteristic method is adopted as described below.

As shown in FIG. 1 (2), an upper press die 24 and a lower press die 25 each made of a rigid body are used to carry out the pressing step, and the raw laminate 23 is arranged between them. To be done.

The upper press die 24 has a convex portion 26. Therefore, when the pressing step is performed, a specific portion including at least a portion of the raw laminate 23 in which at least one of the conductor films 4 and 6 and the via-hole conductor 5 is formed is different from other portions. It will be pressed harder. As a result, a concave portion 27 corresponding to the convex portion 26 is formed on the upper surface of the raw laminated body 23.

Next, the green laminate 23 is fired, whereby the sintered laminate 28 is sintered as shown in FIG. 1 (3).
Is obtained.

Next, the outer conductor film 7 is formed on the lower surface of the laminated body 28 by applying and baking a conductive paste. As described above with reference to FIG. 4, the external conductor film 7 is coated with the conductive paste at the stage of the raw laminate 23 or at the stage of the ceramic green sheet 22 before being laminated to form the raw laminate 23. In the step of baking, the conductive paste may be formed by baking at the same time.

Next, while using the surface area corresponding to the portion of the laminated body 28 pressed more strongly in the above-mentioned pressing step, that is, the bottom surface of the recess 27 as the mounting area,
The mounting components 8 and 9 are mounted on this mounting area by the same method as described with reference to FIG.

In this way, the multilayer ceramic substrate 21
Is completed.

In this multilayer ceramic substrate 21, the convex portion 11 and the concave portion 12 as shown in FIG. 4 are unlikely to be formed on the bottom surface of the concave portion 27 which is the mounting surface, and good flatness is provided. The reason is as follows.

That is, at the stage of the green laminate 23, a stronger pressing pressure is exerted on the bottom surface of the recess 27 as compared with the other portions. As a result, in this portion, the difference in pressure due to the presence of the conductor films 4 and 6 and the via-hole conductor 5 is further reduced, and the shrinkage amount in the firing step is further reduced. As a result, in the firing step,
This is because the difference in shrinkage is small.

Further, in this pressing step, a stronger pressing pressure is not exerted on the entire raw laminate 23, but only on a portion required as a mounting area, so that the entire raw laminate 23 extends in the surface direction. Therefore, when the raw laminated body 23 is in the form of a raw aggregated laminated body in which a plurality of these are aggregated, it is possible to prevent the bulge on each side as shown in FIG. 5 from occurring easily. it can.

As described above, in the pressing step, the pressing pressure at the portion to be pressed more strongly is 10 to 80 MP.
It is preferable to be selected in the range of a. If the pressing pressure is less than 10 MPa, the effect of improving the flatness of the bottom surface of the recess 27, which is the mounting region, is small. On the other hand, if the pressing pressure is more than 80 MPa, the elongation of the entire green laminate 23 becomes too large. This is because disconnection defects easily occur in the wiring conductor such as the conductor film 4.

Further, the height of the convex portion 26 provided on the upper press die 24 is preferably selected in the range of 30 to 200 μm. When the height of the convex portion 26 is less than 30 μm,
The effect of pressing using the upper press die 24 having the convex portion 26 is almost eliminated, while the height of the convex portion 26 is 20
This is because if it exceeds 0 μm, the wiring conductor is likely to be broken at the peripheral portion of the recess 27 formed thereby.

In addition, in the step of laminating a plurality of ceramic green sheets 22 to obtain the green laminate 23 and the subsequent pressing step, the ceramic green sheets 2 are
In order to prevent the displacement between the two, it is possible to use a mold having an outer frame that surrounds the ceramic green sheet 22, or to provide a through hole in the outer peripheral portion of the ceramic green sheet 22 and insert a pin there through to insert the ceramic green sheet. It is preferable to position the sheet 22.

Although the upper press die 24 is formed integrally with the convex portion 26, a die in which the portion providing the convex portion 26 and the other portion are divided may be used. .
In this case, in the pressing step, even if the portion providing the convex portion 26 and the other portion are simultaneously operated, or
It may be operated in two stages. In the latter case, the convex portion 2
6 and the other parts are activated at the same time,
After pressing the entire green laminate 23 with a relatively weak pressing pressure, it is possible to control so that only the portion providing the convex portion 26 is operated with a stronger pressing pressure.

As described above, the pressing step is not performed on the green laminate 23 obtained after the lamination, but at least two ceramic green sheets 22 obtained during the lamination. May be applied to the structure in the state of being laminated. Typically, a so-called sequential pressing step may be employed, in which a pressing step is performed every time one ceramic green sheet 22 is laminated.

When the raw laminated body 23 or the laminated body 28 is prepared in the state of a collective laminated body, the raw collective laminated body is divided and the individual raw laminated body 23 is taken out, followed by a firing step. After that, the step of mounting the mounting components 8 and 9 may be carried out. However, when the raw collective laminate is fired to obtain a sintered laminated laminate, the mounting components 8 and 9 are mounted. Mounting is carried out, and then the collective laminated body is divided into a plurality of laminated bodies 28, that is, a plurality of multilayer ceramic substrates 21.
May be taken out. In addition, when the raw laminated body is fired to obtain the sintered laminated body, the laminated body is divided and a plurality of multilayer ceramic substrates 21 are taken out. You may make it implement.

FIG. 2 is a view corresponding to FIG. 1 (3) for explaining the second embodiment of the present invention. In FIG. 2, elements corresponding to those shown in FIG. 1 (3) are designated by the same reference numerals, and redundant description will be omitted.

In the second embodiment, the concave portion 27 is formed on the lower surface of the laminated body 28a provided on the multilayer ceramic substrate 21a, and the upper surface is made flat.

In order to obtain such a laminated body 28a, as shown in FIG.
In the pressing process described with reference to (2), the lower press die 25 having a convex portion is used, and the upper press die 24 is flat.

According to this embodiment, the mounting area for mounting the mounting components 8 and 9 is provided on the surface opposite to the recess 27. Even in this case, since stronger pressing pressure is exerted on the portion where the recess 27 is formed as compared with other portions at the stage of the green laminate,
Similar to the case of the first embodiment, the flatness in the mounting region can be improved.

As can be inferred from the first and second embodiments described above, the convex portions 26 are formed on both the upper press die 24 and the lower press die 25 shown in FIG. 1 (2). May be.

FIG. 3 is a diagram for explaining the third embodiment of the present invention. The third embodiment is intended to manufacture a multilayer ceramic substrate including a laminated body having a cavity. In FIG. 3, elements corresponding to those shown in FIG. 1 are designated by the same reference numerals, and redundant description will be omitted.

FIG. 3 (1) shows a raw laminate 31 produced in this embodiment. Also, FIG.
Part (1) of FIG. 1 shows the raw laminate 23 obtained by the manufacturing method according to the first embodiment and shown in FIG. 1 (2).

In the third embodiment, the recess 27 is
In a region corresponding to the bottom portion of the cavity 32,
Although it is formed on the bottom surface of the cavity 32, the present invention is not limited to this, and even if it is formed on the lower surface side of the stacked body 32 as in the second embodiment, it is formed over a wider area than the bottom surface of the cavity 32. May be.

In order to obtain the raw laminated body 31 shown in FIG. 3 (1), first, the raw laminated body 23 forming a part thereof is manufactured by the method described with reference to FIG.

Next, a plurality of ceramic green sheets 34 each provided with a through hole 33 for providing the cavity 32 are prepared, and these ceramic green sheets 34 are laminated on the green laminate 23.

In stacking these ceramic green sheets 34, it is also possible to take measures to use a die having an outer frame for preventing the above-mentioned stacking deviation or to use a combination of through holes and pins.

Next, as shown in FIG. 3B, the elastic body 35 is arranged on the opening side of the cavity 32 of the raw laminated body 31, and the raw laminated body 31 and the elastic body 35 can be connected to each other. It is housed in a bag 36 made of a flexible sheet.

Next, the raw laminate 31 and the elastic body 35 are used.
Is placed in a hydrostatic press with bag 36,
Through the bag 36, the raw laminate 31 is shown, as indicated by arrow 37.
And the hydrostatic pressure is applied to the elastic body 35. At this time, since the elastic body 35 is deformed along the inner surface of the cavity 32 of the raw laminate 31, it is possible to exert a uniform pressure on the entire surface of the raw laminate 31.

After the pressing step is completed in this way, the green laminate 31 is taken out of the bag 36.

As can be seen from the formation region of the concave portion 27, the portion of the raw laminate 31 that is more strongly pressed in the pressing step performed to obtain the portion of the raw laminate 23 that is a part of the depression 27 is , Located in the area of the bottom surface of the cavity 32.

Next, the green laminate 31 is fired. When the raw laminated body 31 is prepared as a collective laminated body, this firing step may be performed on the raw collective laminated body or after dividing the raw collective laminated body.

Next, the step of mounting the mounting parts on the laminated body after sintering is carried out. The mounting area for this mounting component is the recess 2 in the area of the bottom surface of the cavity 32.
Within the area where 7 is provided.

Next, if necessary, an outer conductor film is formed on the lower surface of the laminate to complete the multilayer ceramic substrate having the cavities 32.

Although the present invention has been described with reference to some of the embodiments shown in the drawings, various other modifications are possible within the scope of the present invention.

For example, the illustrated multilayer ceramic substrate 2
The form of the wiring conductor such as the inner conductor film 4, the via-hole conductor 5 and the outer conductor films 6 and 7 and the arrangement of the mounting components 8 and 9 in 1 are merely examples, and may be arbitrarily changed according to the required design. be able to.

Further, the concave portion 2 provided in the raw laminate 23
The planar shape of 7 or the portion pressed more strongly is generally, for example, a simple prismatic shape, but it can be changed to any other shape depending on the design of the multilayer ceramic substrate.

Further, in the illustrated embodiment, the above-mentioned recess 27, that is, the portion that is pressed harder, is the conductive film 4.
And 6 and the via-hole conductor 5 are straddled over a plurality of portions where each is formed, only one is given to one raw laminated body 23. It may be provided so as to be distributed to a plurality of locations for one raw laminate.

Further, in the illustrated embodiment, the conductor films 4 and 6 are formed so as not to extend over the boundary between the recess 27 and the other portions, but this boundary is within the region where the conductor film extends. It may be located.

Although the illustrated embodiment is directed to a method for manufacturing a multilayer ceramic substrate having a structure in which mounting components are mounted, the main body portion of a multilayer ceramic electronic component other than the multilayer ceramic substrate is used as the laminated body. The present invention can also be applied to a method of manufacturing, for example, a hybrid type multilayer ceramic electronic component having a structure in which appropriate mounting components are mounted thereon.

[0093]

As described above, according to the present invention, at least two ceramic green sheets, which are a green laminate obtained after the lamination of the ceramic green sheets is finished or obtained during the lamination, are provided. A portion including at least a part of a portion in which at least one of a conductor film and a via-hole conductor is formed with respect to a structure in a stacked state, and a surface side on which a mounting component is mounted and / or a mounting component is mounted. The step of pressing this laminated body in the stacking direction of the ceramic green sheets is performed so that the surface opposite to the surface to be pressed is pressed more strongly than other parts. In the open portion, the difference in pressing pressure due to the conductor film and the via-hole conductor can be reduced.

Therefore, when firing the green laminate,
Since it is possible to reduce the difference in shrinkage ratio caused by the above-mentioned difference in pressing pressure and also reduce the shrinkage amount itself, the surface area of the sintered laminate corresponding to the more strongly pressed portion can be reduced. The flatness can be improved.

Therefore, if the mounting components are mounted on the surface area with improved flatness, it is possible to advantageously prevent an improper mounting state or the mounting itself becoming impossible. You can

Further, as described above, the flatness of the surface region on which the mounting component is to be mounted is improved regardless of the presence of the conductor film or the via-hole conductor. The degree of freedom in designing the wiring conductor is increased, and it is possible to contribute to miniaturization of the multilayer ceramic electronic component and high density of wiring.

Further, as described above, the portion to be pressed more strongly is not the entire surface direction of the green laminate, so that in the pressing step, undesired elongation in the green direction is suppressed in the green laminate. it can. Therefore, it is possible to prevent the generation of defective products due to the deformation of the wiring conductor due to the deformation of the raw laminate, and when the raw laminate is pressed in the state of an aggregate laminate in which a plurality of the raw laminates are assembled. This makes it possible to prevent disconnection defects such as undesired disconnection of the wiring conductor when the raw aggregated laminate is divided due to the deformation of the raw aggregated laminate.

In the above-mentioned pressing step, if the pressing pressure in the portion to be pressed more strongly is selected in the range of 10 to 80 MPa, the effect of improving the flatness by pressing can be surely obtained and the raw laminate can be obtained. It is possible to more surely prevent the undesired elongation at.

Further, when a press die having a convex portion is used in the pressing step, it is possible to easily realize a pressed state in which a specific portion is pressed more strongly, as described above.

When the height of the above-mentioned convex portion is selected in the range of 30 to 200 μm, it is possible to surely press more strongly in the region where the convex portion hits, and undesired deformation of the raw laminate by this pressing. Can be prevented more reliably.

[Brief description of drawings]

FIG. 1 is a view sequentially showing typical steps included in a method for manufacturing a multilayer ceramic electronic component according to a first embodiment of the present invention, in which elements shown in the drawings are shown in a front view showing a specific cross section thereof. Has been done.

FIG. 2 is a diagram corresponding to FIG. 1 (3) for explaining the method for manufacturing the multilayer ceramic electronic component according to the second embodiment of the present invention.

FIG. 3 is a view for explaining a method of manufacturing a multilayer ceramic electronic component according to a third embodiment of the present invention, showing only characteristic steps, and the elements shown in the drawings are front views showing specific cross sections thereof. Shown in the figure.

FIG. 4 is a front view showing a specific cross section of a multilayer ceramic substrate 1 as an example of a multilayer ceramic electronic component which is of interest to the present invention.

FIG. 5 is a plan view schematically showing a raw collective laminate 13 for explaining the problem to be solved by the present invention.

[Explanation of symbols]

2 ceramic layers 4 Internal conductor film 5 Via hole conductor 6,7 External conductor film 8, 9 mounted parts 21,21a Multilayer ceramic substrate 22,34 Ceramic green sheet 23,31 Raw laminate 24 Upper press die 25 Lower press die 26 convex 27 recess 28,28a laminated body 32 cavities

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Norio Sakai             2-10-10 Tenjin, Nagaokakyo, Kyoto Stock             Murata Manufacturing Co., Ltd. F term (reference) 5E346 AA02 AA12 AA15 AA22 AA32                       AA51 CC16 DD02 DD34 EE24                       EE25 EE27 FF45 GG04 GG06                       GG07 GG08 GG09 HH11

Claims (11)

[Claims] 1. A step of preparing a plurality of ceramic green sheets, a step of forming at least one of a conductor film and a via-hole conductor on a specific portion of a specific one of the plurality of ceramic green sheets, A step of producing a green laminate by laminating ceramic green sheets, and forming at least one of the conductor film and the via-hole conductor in a structure in a state where at least two ceramic green sheets are laminated. The part including at least a part of the mounted part and the surface on which the mounted component is mounted and / or the surface opposite to the surface on which the mounted component is mounted are pressed more strongly than other parts. Pressing the structure in the stacking direction of the ceramic green sheets, and baking the green stack. By doing so, a step of obtaining a laminated body after sintering, and a step of mounting a mounting component on a surface region of the laminated body after sintering that corresponds to a portion pressed more strongly in the pressing step are provided. , Method for manufacturing multilayer ceramic electronic component. 2. The laminated ceramic electronic component according to claim 1, wherein the structure in a state where the at least two ceramic green sheets are laminated is the green laminate obtained after the lamination is completed. Production method. 3. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the structure in which at least two ceramic green sheets are stacked is obtained during the stacking. 4. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the green laminate has a cavity. 5. The method for manufacturing a multilayer ceramic electronic component according to claim 4, wherein the portion pressed more strongly in the pressing step is located in a region corresponding to the bottom surface portion of the cavity. 6. The pressurizing portion in the pressing step straddles a plurality of portions in which at least one of the conductor film and the via-hole conductor is formed, according to any one of claims 1 to 5. A method for manufacturing the multilayer ceramic electronic component described. 7. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein in the pressing step, the pressing pressure at the portion to be pressed more strongly is selected in the range of 10 to 80 MPa. 8. In the pressing step, a press die having a convex portion in a portion to be pressed more strongly is used, and a concave portion corresponding to the convex portion is formed in the green laminate. 8. A method for manufacturing a multilayer ceramic electronic component according to any one of items 1 to 7. 9. The method for manufacturing a multilayer ceramic electronic component according to claim 8, wherein the surface region on which the mounted component is mounted is provided on the bottom surface of the recess. 10. In the pressing step, a press die having the convex portion is used only on one side of the structure to be pressed, and the surface area for mounting the mounting component is different from the concave portion. Given on the opposite side,
The method for manufacturing the multilayer ceramic electronic component according to claim 8. 11. The method for manufacturing a multilayer ceramic electronic component according to claim 8, wherein the protrusion has a height in the range of 30 to 200 μm.