JP2005209929A - Manufacturing method of laminated electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve problems of a conventional manufacturing method of laminated electronic components that unevenness easily occurs on the outer wall of a core getting higher magnetic flux density due to the variation of processing in the case of forming through-holes to a dielectric sheet and the lamination deviation or the like of a dielectric sheet wherein a magnetic body is placed to the winding shaft of a coil; and that a defect of a deformed laminated body has been occurred due to the driving pressure of a punching pin exerted to the laminated body, when the winding shaft of the coil of the laminated body is punched out. <P>SOLUTION: A dielectric layer and a coil forming conductor pattern are laminated, a coil is formed in the laminated body and the core is formed to the winding shaft of the coil. In this case, the dielectric layer wherein a recessed part is formed to the winding shaft of the coil and the coil forming conductor pattern are laminated to form the laminated body, and thereafter the winding shaft of the coil of the laminated body is punched out to form a through-hole into the laminated body. The core is formed to the winding shaft of the coil by forming the core of the magnetic body in the through-hole. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method of manufacturing a laminated electronic component in which a dielectric layer and a conductor pattern are laminated to form a coil in the laminated body, and a magnetic core is formed on the winding shaft portion of the coil.

As a multilayer electronic component, it is used to mount a single component such as a multilayer chip type inductor, transformer, common mode choke coil, composite component such as an LC filter, and other electronic components such as a DC-DC converter. Substrates and the like are known.
For example, a dielectric layer and a coil conductor pattern are laminated on a conventional multilayer electronic component, and a coil conductor pattern between dielectric layers is connected to form a coil in the laminate. There is one in which a magnetic core is formed on the shaft portion (see, for example, Patent Documents 1 and 2). Magnetic layers are stacked above and below the stacked body.
JP 7-201569 A Japanese Patent No. 3158757

In such a multilayer electronic component, for example, as shown in FIG. 5 (A), a through-hole S is formed in the winding axis portion of the coil of the dielectric sheet 51 formed on the base film F, and FIG. As shown in FIG. 5 (D), a magnetic body 52 is formed in the through hole as shown in FIG. 5B, and a coil conductor pattern 53 is printed on the surface of the dielectric sheet as shown in FIG. 5 (C). Further, the dielectric sheet 51 and the magnetic sheet 55 are manufactured by laminating a predetermined number of sheets in a predetermined order to form a coil in the stacked body (see Patent Document 1).
In such a multilayer electronic component, as shown in FIG. 6A, a dielectric sheet 61 on which a coil conductor pattern 63 is printed and a magnetic sheet 65 are laminated to form a laminated body. A coil is formed in the body, and a winding shaft portion of the coil of the laminate is punched to form a through hole S in the laminate as shown in FIG. 6 (B), and this laminate is shown in FIG. 6 (C). It is also manufactured by forming a magnetic body 62 in the through hole (see Patent Document 2).

  Since the conventional multilayer electronic component manufactured as shown in FIG. 5 has a dielectric sheet having a magnetic material formed on the winding axis portion of the coil, the variation in processing when the through hole is processed in the dielectric sheet. In addition, unevenness is likely to occur on the outer wall of the magnetic core located at the coil winding portion due to the laminating deviation of the dielectric sheet in which the magnetic material is disposed on the coil winding portion. When unevenness occurs on the outer wall of the core, there is a problem that the magnetic flux in the vicinity of the outer wall of the core, where the magnetic flux density is high, is difficult to pass, and a sufficient magnetic flux passage area cannot be secured, resulting in deterioration of characteristics. In addition, since this multilayer electronic component has a core formed by stacking multiple layers of magnetic bodies formed on a dielectric sheet, the magnetic bodies constituting the core easily peel off between the layers, and cracks occur in the cross-sectional direction of the core. There was a problem of entering.

  The conventional multilayer electronic component manufactured as shown in FIG. 6 can solve the above-described problems. In recent years, this type of multilayer electronic component has been miniaturized. For example, in the case of 1005 size, the horizontal interval between the through holes is 1.176 mm, and the vertical interval is 0.588 mm. There is also a tendency that the interval of becomes narrow. In such a situation, when the winding axis portion of the coil of the laminated body is punched as shown in FIG. 6, there is a problem that the laminated body is greatly deformed by the penetration pressure of the punching pins when the laminated body is punched.

  The present invention does not form irregularities on the outer wall of the core of the magnetic body, or the magnetic body constituting the core is peeled off between the layers and the cross section of the core does not crack, further suppressing deformation of the laminate. It is an object of the present invention to provide a method for manufacturing a multilayer electronic component that can be performed.

  The present invention relates to a method of manufacturing a laminated electronic component in which a dielectric layer and a coil conductor pattern are laminated to form a coil in the laminate, and a magnetic core is formed on the winding shaft portion of the coil. After laminating a dielectric layer having a dent in the shaft portion and a coil conductor pattern to form a laminate, the coil winding shaft portion of the laminate is punched to form a through hole in the laminate. A magnetic core is formed. As the dielectric layer, a ceramic green sheet in which a recess is formed in the winding axis portion of the coil is used. After the ceramic green sheet and the coil conductor pattern are laminated to form a laminated body, the coil winding axis of the laminated body is formed. A part is punched out to form a through hole in the laminate, and a magnetic core is formed in the through hole.

The present invention also relates to a method of manufacturing a laminated electronic component in which a dielectric layer and a coil conductor pattern are laminated to form a coil in the laminated body, and a magnetic core is formed on the winding shaft portion of the coil. The first step of irradiating laser to the coil winding part on the surface of the ceramic green sheet formed on the film to form a dent in the ceramic green sheet. Laminating the ceramic green sheet on the lower dielectric layer and pressing After the second step of peeling the base film, the third step of forming the coil conductor pattern on the surface of the ceramic green sheet, the first step to the third step are repeated to form the laminate, A fourth step of punching out the winding axis portion of the coil and forming a through hole in the laminate, and a fifth step of forming a magnetic core in the through hole.
Furthermore, the present invention provides a method for manufacturing a laminated electronic component in which a dielectric layer and a conductor pattern for a coil are laminated to form a coil in the laminated body, and a magnetic core is formed on a winding shaft portion of the coil. The first step of forming a dent in the ceramic green sheet by irradiating the winding portion of the coil of the ceramic green sheet formed on the film with a laser from the base film surface side, and forming a conductor pattern for the coil on the surface of the ceramic green sheet A second step of laminating ceramic green sheets to form a laminated body, a third step of punching out a winding axis portion of a coil of the laminated body to form a through hole in the laminated body, and a core in the through hole 4 is formed.

  In the method for manufacturing a multilayer electronic component according to the present invention, a dielectric layer in which a recess is formed in a winding axis portion of a coil and a conductor pattern for the coil are laminated to form a laminated body, and then the winding axis portion of the coil of the laminated body Are formed in the laminated body, and a magnetic core is formed in the through-hole. Therefore, irregularities are formed on the outer wall of the core, or the magnetic body constituting the core is peeled off between the layers. There is no crack in the cross section, and deformation of the laminate can be further suppressed.

In the multilayer electronic component of the present invention, first, a recess is formed in the ceramic green sheet formed on the base film. This dent is formed by irradiating a coil on the surface of the coil of the ceramic green sheet formed on the base film with a laser, or from the base film side of the ceramic green sheet formed on the base film. It is formed by irradiating a laser on a winding shaft portion of the coil.
When a recess is formed in the ceramic green sheet by irradiating the coil winding portion of the surface of the ceramic green sheet formed on the base film with a laser, this ceramic green sheet is laminated on the lower dielectric layer, and after crimping Then, the base film is peeled off to form a coil conductor pattern on the surface of the ceramic green sheet. Then, a laminate is formed by repeatedly forming a recess on the ceramic green sheet, laminating the ceramic green sheet on the lower dielectric layer, pressing, peeling the base film, and forming a coil conductor pattern on the surface of the ceramic green sheet. .
In addition, when a dent is formed in the ceramic green sheet by irradiating the winding part of the coil of the ceramic green sheet from the base film side of the ceramic green sheet formed on the base film, a coil is formed on the surface of the ceramic green sheet. A conductor pattern is formed, and a predetermined number of these ceramic green sheets are stacked in a predetermined order to form a laminate.
In the laminated body formed in this way, the winding portion of the coil of the ceramic green sheet is thinner than the other portions. Therefore, a plurality of gaps arranged in the stacking direction of the ceramic green sheet on the winding portion of the coil Will be formed. In this laminated body, the winding shaft portion of the coil is punched, and a through hole is formed in the winding shaft portion of the coil of the laminated body. A magnetic core is formed in the through hole.
Therefore, in the multilayer electronic component of the present invention, due to the plurality of gaps formed in the coil winding part, pressure is applied to this part during lamination and crimping, and the coil winding part is firmly integrated. Accordingly, the penetration resistance of the punching pin when the through hole is formed in the winding axis portion of the coil of the laminated body can be reduced. Further, when the laminated electronic component of the present invention is punched out in the state where the coil winding shaft portion of the laminate is punched in a state where a base fill having a through hole is attached to the coil winding shaft portion on the upper surface of the laminate, The deformation of the laminate can be suppressed without increasing the penetration resistance of the punching pin.

Hereinafter, a method for manufacturing a multilayer electronic component of the present invention will be described with reference to FIGS.
1 and 2 are cross-sectional views showing a first embodiment of a method for manufacturing a multilayer electronic component according to the present invention.
First, as shown in FIG. 1A, a ceramic green sheet 11 is formed by applying a paste of a dielectric material on a base film F by a doctor blade method or the like. H is formed. The ceramic green sheet 11 is formed to have a thickness of, for example, 40 μm. The dent H is formed by processing the ceramic green sheet by irradiating the coil winding axis portion with a laser from the surface side of the ceramic green sheet 11. At this time, the depth of the recess H is formed to be 30% to 70%, for example, about 50% of the thickness of the ceramic green sheet 11. Reference numeral 14A denotes a through-hole in which a conductor for connecting a coil conductor pattern described later between dielectric layers is formed, and is formed by a laser.
Next, as shown in FIG. 1B, the base film F and the ceramic green sheet 11 are laminated on the lower dielectric layer so that the ceramic green sheet 11 is positioned on the lower side. The layer and the ceramic green sheet are crimped. In the case of FIG. 1B, the base film B is held by fitting the reference hole and the reference pin of the table on the laminated table 10A, and the ceramic green sheets 11A and 11B having the depression H are recessed on the base film B. Are laminated so as to face the base film B side to form a lower dielectric layer. A coil conductor pattern 13 is printed on the surface of the ceramic green sheet 11B. On the ceramic green sheet 11B, the through hole 14A is fitted into the coil conductor pattern 13 on the surface of the ceramic green sheet 11B in a state where the ceramic green sheet 11 with the base film F is recessed and the H faces the ceramic green sheet 11B side. Are laminated. The ceramic green sheet 11 is pressed from above the base film F by a pressure press 10B and is pressed onto the ceramic green sheet 11B.
Further, after the base film F adhered to the ceramic green sheet 11 is peeled off, as shown in FIG. 1C, the conductors 14 are filled in the through holes of the ceramic green sheet 11, and the ceramic green sheet 11 A coil conductor pattern 13 is printed on the surface.
Subsequently, after the steps of FIGS. 1A to 1C are repeated as many times as necessary, as shown in FIG. 1D, the ceramic green sheet with the base film F on the lower dielectric layer 11G. 11H is laminated, and the lower dielectric layer 11G and the ceramic green sheet 11H are pressure-bonded. In the ceramic green sheet 11H with the base film F, a recess H is formed through the base film F to the ceramic green sheet 11H by irradiating a laser from the base film B side to the winding axis portion of the coil. At this time, the depth of the recess formed in the ceramic green sheet 11H is 30% to 70% of the thickness of the ceramic green sheet 11H, for example, about 50%.
Subsequently, as shown in FIG. 1 (E), these laminates are placed between the lower molds 10C and 10D of the puncher and the upper mold (ie punching pin) 10E with the base films B and F attached. As shown in FIG. 2 (A), the coil winding shaft portion is punched out, and a through hole S is formed in the coil winding shaft portion of the laminate. In FIG. 2A, the base film B is also punched out.
Next, as shown in FIG. 2 (B), the laminated body in which the through hole is formed in the winding shaft portion of this coil, with the base films B and F still attached, The pressure inlet 10F of the paste filling machine is brought into close contact with the magnetic paste P in the through hole. After the filled magnetic paste is sufficiently dried, the base films B and F are peeled off from the laminate. In the laminated body in which the through hole is filled with the magnetic paste, a magnetic core is formed at the coil winding shaft portion.
Furthermore, this laminated body has a base film F2 and magnetic ceramic green sheets 15A and 15B on the lower surface, and magnetic ceramic green sheets 15C and 15D and base film F2 on the upper surface. As shown in C), these laminates are integrated by being placed in a mold and pressed by the mold. This mold includes metal frames 10G, 10H, an upper plate 10I, and a lower plate 10J, and pressure is applied to the laminate by the upper plate 10I and the lower plate 10J.
The laminated body thus integrated is cut, degreased and fired. External electrodes are formed on the side surfaces of the fired laminate. The multilayer electronic component laminate formed in this way has magnetic layers formed on the upper and lower surfaces of the laminate by magnetic ceramic green sheets 15A, 15B, 15C, and 15D, and the coil winding axis. A magnetic core 12 connected to the upper and lower magnetic layers is formed in the portion.

  In the multilayer electronic component formed in this way, when the depth of the recess formed in the ceramic green sheet is set to 30 to 70% of the thickness of the ceramic green sheet, the through hole is formed in the winding portion of the coil. Since the penetration resistance of the punching pin can be further reduced, the deformation of the laminate can be reduced.

3 and 4 are cross-sectional views showing a second embodiment of the method for manufacturing a multilayer electronic component according to the present invention.
First, as shown in FIG. 3A, a dent H is formed in a ceramic green sheet 31 formed using a dielectric material on the base film F. The ceramic green sheet 31 is formed to have a thickness of, for example, 40 μm. The dent H is formed by processing the ceramic green sheet by irradiating the winding axis portion of the coil of the ceramic green sheet 31 with a laser from the base film F side. At this time, the depth of the recess formed in the ceramic green sheet 31 is 30% to 70%, for example, about 50% of the thickness of the ceramic green sheet 31.
Next, as shown in FIG. 3B, a coil conductor pattern 33 is printed on the surface of the ceramic green sheet 31. Reference numeral 34 denotes a conductor for connecting the coil conductor pattern between the dielectric layers, and is formed by filling the ceramic green sheet 31 with a conductor in a through hole formed by a laser. The through hole filled with the conductor may be formed as necessary, and may be formed so as to penetrate only the ceramic green sheet 31 or may be formed so as to penetrate the base film F.
Further, as shown in FIG. 3C, the base film B is held on the laminated table 30A by fitting the reference hole and the reference pin of the table, and the coil conductor pattern 33 is formed on the base film B. A predetermined number of ceramic green sheets 31A to 31F are stacked in a predetermined order, and a ceramic green sheet 31G with a base film F is stacked on the uppermost layer. At this time, the ceramic green sheets 31B to 31F may be laminated on each lower dielectric layer by repeating lamination, pressure bonding, and peeling of the base film, or may be previously laminated on the lower dielectric layer. The ceramic green sheets from which are peeled off may be laminated and pressure-bonded for each layer. Alternatively, the ceramic green sheets 31 </ b> A to 31 </ b> F from which the base film has been peeled in advance are laminated, and the ceramic green sheet 31 </ b> G with the base film F is laminated on the uppermost layer, and then these may be pressure bonded.
Subsequently, as shown in FIG. 3 (D), in these laminates, the coil winding shaft portion is punched with a puncher while the base films B and F are still attached, as shown in FIG. 4 (A). A through hole S is formed in the winding shaft portion of the coil of the laminate. In addition, 30C and 30D show the lower mold | type of a puncher, and 30E has shown the upper mold | type (namely, punching pin) of a puncher.
Next, as shown in FIG. 4 (B), the laminated body has the pressure inlet 30F of the paste filling machine in close contact with the base film F side of the through-hole while the base films B and F remain attached. After filling the through holes with the magnetic paste P and sufficiently drying the magnetic paste, the base films B and F are peeled off from the laminate. In the laminated body in which the through hole is filled with the magnetic paste, a magnetic core is formed at the coil winding shaft portion.
Further, this laminated body has a base film F3 and magnetic ceramic green sheets 35A and 35B on the lower surface, and a magnetic ceramic green sheets 35C and 35D and base film F3 on the upper surface. As shown to C), it arrange | positions in the metal mold | die provided with metal frame 30G, 30H, the upper board 30I, and the lower board 30J, and pressurizes with a metal mold | die, and these laminated bodies are integrated.
The laminated body thus integrated is cut, degreased and fired. External electrodes are formed on the side surfaces of the fired laminate. Further, in this laminate, magnetic layers are formed on the upper and lower surfaces of the laminate by magnetic ceramic green sheets 35A, 35B, 35C, and 35D, and the upper and lower magnetic layers are connected to the winding portion of the coil. A magnetic core 32 is formed.

As mentioned above, although the Example of the manufacturing method of the multilayer electronic component of this invention was described, this invention is not limited to these Examples. For example, although the case of a single component has been described in the embodiment, it is used for mounting a circuit in which a capacitor is built in a laminated body to form a circuit such as an LC filter, or other electronic components such as a DC-DC converter. The present invention can also be applied to what constitutes a substrate. In the embodiments, the magnetic material layers formed on the top and bottom of the laminated body have been described. However, the present invention can also be applied to the case where the magnetic material layers are not formed on the top and bottom of the laminated body. Furthermore, the recess of the ceramic green sheet may be formed by another means.
Further, in the first embodiment, before the through hole is formed in the winding portion of the coil of the laminate, the base film having the through hole in the winding portion of the coil is attached to the upper surface of the laminate. The laminated body may be pressed and integrated by putting the body in a mold having a metal frame, an upper plate, and a lower plate. Furthermore, in the first embodiment, after the steps of FIGS. 1A to 1C are repeated as many times as necessary to form a laminate, the magnetic material formed on the base film above and below the laminate. A ceramic green sheet of magnetic material with a base film with a dent formed by irradiating laser from the base film side of the ceramic green sheet is laminated, and these laminates are placed in a mold and pressed, integrated, and laminated A through-hole may be formed in the laminate by punching out the winding portion of the coil of the laminate with the base film attached to the body. Furthermore, in the second embodiment, the laminated body is formed by laminating dielectric ceramic green sheets 31A to 31F in a predetermined order, and bases on a magnetic ceramic green sheet formed on a base film vertically. Laminate ceramic green sheets with a base film with a base film that has been formed by irradiating a laser from the film side, put these laminates in a mold, press and integrate, and the base film adheres to the laminate In this state, the winding shaft portion of the coil of the laminate may be punched to form a through hole in the laminate.

It is sectional drawing which shows the 1st Example of the manufacturing method of the multilayer electronic component of this invention. It is sectional drawing which shows the 1st Example of the manufacturing method of the multilayer electronic component of this invention. It is sectional drawing which shows the 2nd Example of the manufacturing method of the multilayer electronic component of this invention. It is sectional drawing which shows the 2nd Example of the manufacturing method of the multilayer electronic component of this invention. It is sectional drawing which shows the manufacturing method of the conventional multilayer electronic component. It is sectional drawing which shows another manufacturing method of the conventional multilayer electronic component.

Explanation of symbols

11 Ceramic Green Sheet F Base film

Claims (11)

In a method for manufacturing a laminated electronic component in which a dielectric layer and a coil conductor pattern are laminated to form a coil in the laminated body, and a magnetic core is formed on a winding shaft portion of the coil.
After forming a laminated body by laminating a dielectric layer having a dent formed on the winding axis portion of the coil and the conductor pattern for the coil, punching out the winding axis portion of the coil of the laminated body and penetrating the laminated body A method of manufacturing a multilayer electronic component, wherein a hole is formed and a magnetic core is formed in the through hole. In a method for manufacturing a laminated electronic component in which a dielectric layer and a coil conductor pattern are laminated to form a coil in the laminated body, and a magnetic core is formed on a winding shaft portion of the coil.
As the dielectric layer, a ceramic green sheet in which a dent is formed in the winding axis portion of the coil is used. After the ceramic green sheet and the coil conductor pattern are laminated to form a laminated body, A method of manufacturing a multilayer electronic component, comprising: punching a winding shaft portion of the coil to form a through hole in the laminated body, and forming a magnetic core in the through hole.   3. The laminated type according to claim 2, wherein the ceramic green sheet is formed on a base film, and a recess is formed in the ceramic green sheet by irradiating a laser on a coil winding shaft portion of the surface of the ceramic green sheet. Manufacturing method of electronic components.   The ceramic green sheet is formed on a base film, and a recess is formed in the ceramic green sheet by irradiating a laser to a coil winding portion of the ceramic green sheet from the base film side. Manufacturing method for multilayer electronic components. In a method for manufacturing a laminated electronic component in which a dielectric layer and a coil conductor pattern are laminated to form a coil in the laminated body, and a magnetic core is formed on a winding shaft portion of the coil.
A first step of irradiating the winding portion of the coil on the surface of the ceramic green sheet formed on the base film with a laser to form a recess in the ceramic green sheet; and the ceramic green sheet on the lower dielectric layer After the lamination and pressure bonding, the second step of peeling the base film, the third step of forming the coil conductor pattern on the surface of the ceramic green sheet, the first step to the third step are repeated. After forming the laminated body, a fourth step of punching out the winding axis portion of the coil of the laminated body to form a through hole in the laminated body, and a fifth step in which a magnetic core is formed in the through hole. A method of manufacturing a multilayer electronic component comprising the steps of: In a method for manufacturing a laminated electronic component in which a dielectric layer and a coil conductor pattern are laminated to form a coil in the laminated body, and a magnetic core is formed on a winding shaft portion of the coil.
A first step of irradiating a laser on the winding axis portion of the coil of the ceramic green sheet formed on the base film from the base film surface side to form a recess in the ceramic green sheet, the coil on the surface of the ceramic green sheet A second step of forming a conductive pattern for forming a laminate, forming a laminated body by laminating the ceramic green sheets, and then forming a through-hole in the laminated body by punching out the winding portion of the coil of the laminated body And a fourth step in which a magnetic core is formed in the through hole. A method of manufacturing a multilayer electronic component, comprising:   After the first to third steps are repeated, the laminate of the fourth step is formed on the upper and lower sides of the coil winding portion of the magnetic ceramic green sheet formed on the base film. The method of manufacturing a multilayer electronic component according to claim 5, wherein the ceramic green sheets of magnetic material on which dents are formed by laser irradiation are laminated and pressed.   The laminated body of the third step includes a magnetic ceramic green sheet in which a concave portion is formed by irradiating a laser to a coil winding shaft portion of a magnetic ceramic green sheet formed on a base film. The method for producing a multilayer electronic component according to claim 6, wherein the multilayer electronic component is laminated and pressure-bonded.   A base film having a through hole is attached to a coil winding shaft portion on one side of the laminate, and the coil winding shaft portion of the laminate is punched with a mold to form a through hole in the laminate. The method for producing a multilayer electronic component according to claim 5.   In a state where a base film having a through hole is attached to one side of the laminate, the laminate is placed in a mold having a metal frame, an upper plate, and a lower plate, and the laminate is placed. The method for manufacturing a multilayer electronic component according to claim 5, wherein the press-integrating is performed.   9. The ferrite paste is filled in the through holes of the laminated body in a state where a base film having a through hole is attached to one or both surfaces of the laminated body on a winding shaft portion of the coil. A method for manufacturing a multilayer electronic component.

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