JP2005051053A - Method for manufacturing high-frequency laminated component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To increase flatness in a high-frequency laminated component for high-density packaging and high integration in a high-frequency part for the manufacturing method of the high-frequency laminated component for forming a high-frequency circuit especially by using an inner-layer electrode. <P>SOLUTION: A recess 11 is formed at a position in contact with an inner-layer electrode 1 on the lower surface of a laminated sheet 2 laminated onto the laminated sheet 2 having the inner-layer electrode 1, thus accommodating the inner-layer electrode into the recess and hence improving the flatness in the high-frequency laminated component. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention particularly relates to a method for manufacturing a high-frequency laminated component in which a high-frequency circuit is formed using an inner layer electrode.

  Conventionally, this type of high-frequency laminated component has been formed by appropriately stacking laminated sheets 2 having inner layer electrodes 1 printed on the upper surface and firing the laminated body 3 as shown in FIG.

As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
Japanese Patent Laid-Open No. 6-77659

  In recent years, high-density mounting of high-frequency components on a mother board and high integration of high-frequency components have been promoted, and flatness has been desired for such high-frequency laminated components.

  However, when the laminated sheet 2 on which the inner layer electrode 1 is formed is appropriately stacked as described above for the high-frequency laminated component, the laminated sheet 2 stacked according to the thickness of the inner layer electrode 1 positioned between the laminated sheets 2 as shown in FIG. As a result, there is a problem that unevenness is formed on the surface of the laminated body 3 and the flatness of the high-frequency laminated component is deteriorated.

  Therefore, the present invention aims to solve such problems and increase the flatness of the high-frequency laminated component.

  And in order to achieve this object, the invention according to claim 1 of the present invention is particularly the position where the inner layer electrode on the lower surface of the second laminated sheet stacked on the first laminated sheet having the inner layer electrode contacts. By forming the recess in the inner layer, the inner layer electrode is accommodated in the recess, and the flatness of the high-frequency laminated component can be improved.

  In particular, the invention according to claim 2 is formed by forming a recess forming pattern in advance on the support film, then forming a laminated sheet on the support film, and peeling the support film and the recess forming pattern from the laminated sheet. By forming the recess, the recess can be easily formed.

  In the invention according to claim 3, it is possible to form the recesses more easily by forming the recess forming pattern with a material having a high releasability from the laminated sheet.

  The invention according to claim 4 can obtain the effect according to claim 3 more specifically, particularly by forming the recess forming pattern with a material similar to that of the support film.

  In the fifth aspect of the invention, in particular, by reducing the depth of the concave portion by the thickness of the inner layer electrode, it is possible to suppress the generation of bubbles in the concave portion during lamination.

  The invention according to claim 6, particularly, the laminate is sintered in a state where the laminate is sandwiched between the shrinkage suppression sheets that are not sintered at the temperature at which the laminate is sintered, so that the unevenness due to the inner layer electrode with respect to the laminate is obtained. Can be suppressed, and the warpage associated with the sintering of the laminated sheet can also be suppressed, and the flatness of the high-frequency laminated component can be further improved.

  The invention according to claim 7 is the mounting of the high-frequency device, in particular, by mounting the high-frequency device that forms a part of the high-frequency circuit on the surface of the sintered laminate, thereby improving the flatness of the laminate. As a result, the high-frequency characteristics of the high-frequency laminated component during mass production can be stabilized.

  The invention according to claim 8 can further enhance the effect of improving the flatness of the multilayer substrate, in particular, by mounting the high-frequency device mounted on the multilayer body by a bare chip.

  According to the ninth aspect of the present invention, in particular, since the high frequency device is formed of a piezoelectric element or a semiconductor element, the effect according to the seventh aspect can be obtained more specifically.

  The method for manufacturing a high-frequency laminated component according to the present invention is particularly advantageous in that a recess is formed at a position where the inner layer electrode on the lower surface of the second laminated sheet that is stacked on the first laminated sheet having the inner layer electrode is in contact with the inner layer electrode. Thus, the flatness of the high-frequency laminated component can be improved.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected and demonstrated about the structure similar to the background art mentioned above.

  FIG. 1 is an exploded perspective view schematically showing a multilayer high-frequency multilayer component, and an inner layer electrode 1 that forms a high-frequency circuit such as a capacitor, an inductor, and a strip line is appropriately disposed between dielectric ceramic layers, and a via hole ( In particular, a high-frequency device having a structure in which layers are connected to each other by a structure such as a piezoelectric element and a semiconductor element that are difficult to form in the multilayer body 3 on the upper surface of the multilayer body 3 4 is implemented.

  And the formation process of such a high frequency lamination | stacking component is the sheet | seat formation process 6 which forms the lamination sheet 2 on the support film 5, as shown in FIG. 2, and the electrode formation process which forms the inner layer electrode 1 on the lamination sheet 2 7, a laminating step 8 in which the support film 5 is peeled off from the laminated sheet 2 on which the inner layer electrode 1 is formed, and the laminated sheet 2 is appropriately stacked, a firing step 9 in which the laminate 3 is sintered, and this sintered laminate The mounting step 10 includes mounting the high-frequency device 4 on the upper surface of the body 3.

  And in this one Embodiment, in order to suppress that the inner layer electrode 1 forms an unevenness | corrugation in the surface of the laminated body 3 by the thickness in the lamination process 8, the laminated sheet 2 stacked on the laminated sheet 2 which has the inner layer electrode 1 The recess 11 is formed at the position where the inner layer electrode 1 abuts on the lower surface.

  That is, with the laminated sheet 2 having such a configuration, when the laminated sheet 2 is stacked on the laminated sheet 2, the inner layer electrode 1 is accommodated in the concave portion 11, and irregularities are formed on the surface of the laminated body 3. The thickness of the inner layer electrode 1 that causes this is offset by the recess 11 and the flatness of the high-frequency laminated component can be improved. In addition, since the inner layer electrode 1 is accommodated in the recess 11, changes in the electrode shape due to the pressing pressure in the laminating step 8 are also suppressed, and circuit elements such as capacitors and inductors set in the high frequency circuit design Since the realization of the characteristics becomes easy, the design tact for the high-frequency laminated component can be improved.

  In addition, in forming the concave portion 11 on the lower surface of the laminated sheet 2 in this way, it can be formed by performing a die press or the like on the laminated sheet 2 on which the sheet is formed. In the forming step 6, it is formed by applying a dielectric slurry to be the laminated sheet 2 on the support film 5. Therefore, by forming the recess forming pattern 12 on the support film 5 in advance, The formation pattern 12 is transferred to the lower surface of the support film 5, and when the support film 5 is peeled off from the laminated sheet 2, the recess formation pattern 12 is also peeled off and the recess 11 can be easily formed.

  In addition, it is preferable to select a material having a high releasability from the laminated sheet 2 in order to improve transferability to the laminated sheet 2, and the concave portion forming pattern 12 is selected by selecting a material similar to the support film 5. The bondability between the pattern 12 for use and the support film 5 is enhanced, and the peelability from the laminated sheet 2 is the same as that of the support film, so that the remaining part of the recess forming pattern 12 can be prevented.

  And in providing such a recessed part 11, by making the depth of the recessed part 11 smaller than the thickness of the inner layer electrode 1, the inner layer electrode 1 will contact | abut reliably on the bottom face of the recessed part 11 at the time of lamination | stacking, As a result, a recessed part is obtained. 11 is less likely to remain in the air, and bubbles can be prevented from being generated at the interface between the laminated sheet 2 and the inner layer electrode 1, and the influence of the bubbles on the inner layer electrode 1 forming the high frequency circuit element, that is, the influence on the high frequency characteristics. Can be suppressed.

  Note that the method for increasing the flatness of the high-frequency laminated component is not particularly illustrated, but the laminate 3 is sandwiched by a shrinkage suppression sheet that does not sinter the laminate 3 at the temperature at which the laminate 3 is sintered. Although it is known to sinter in this state, by combining this method with the method described above, it is possible to further suppress the occurrence of irregularities due to the inner layer electrode 1 with respect to the laminate 3 and to accompany the sintering of the laminate sheet 2. Warpage can be suppressed together, and the flatness of the high-frequency laminated component can be further improved.

  Further, by mounting the high-frequency device 4 that forms a part of the high-frequency circuit on the upper surface of the multilayer body 3 formed in this manner, the high-frequency device 4 can be mounted while the flatness of the multilayer body 3 is improved. Therefore, the mountability of the high-frequency device 4 is remarkably improved, and as a result, the increase / decrease in the inductance component at the connection location due to mounting misalignment is suppressed during mass production, so that the high-frequency characteristics of the high-frequency laminated component can be stabilized. It is.

  In particular, in the bare chip mounting of the high-frequency device 4 that is required to have a high flatness of the laminated body 3, it is possible to produce a greater effect by adopting such a construction method. Note that examples of the high-frequency device 4 element used for such bare chip mounting include those formed of a piezoelectric element or a semiconductor element.

  The method for producing a high-frequency laminated component according to the present invention has an effect that the flatness of the high-frequency laminated component can be improved, and in particular, it is formed by appropriately stacking laminated sheets on which inner layer electrodes are formed and firing the laminated body. It is useful for a method of manufacturing a high-frequency laminated component.

The disassembled perspective view which shows the high frequency laminated component in one Embodiment of this invention Schematic showing the manufacturing method of the same high-frequency laminated component Schematic showing a conventional method of manufacturing high-frequency laminated parts Cross-sectional view of a high-frequency laminated component created using this manufacturing method

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Inner-layer electrode 2 Laminated sheet 3 Laminated body 4 High frequency device 5 Support film 6 Sheet formation process 7 Electrode formation process 8 Lamination process 9 Firing process 11 Recess 12 Recess formation pattern

Claims (9)

A method for producing a high-frequency laminated component comprising an inner layer electrode for forming a high-frequency circuit in an inner layer portion of a laminate in which a plurality of laminated sheets are stacked, wherein the laminated sheet is formed on a support film and a forming step, An electrode forming step for forming the inner layer electrode on the laminated sheet; a laminating step for appropriately stacking the laminated sheet on which the inner layer electrode is formed; and a sintering step for sintering the laminated body. A high-frequency laminated component comprising: a concave portion formed at a position where an inner layer electrode provided on the first laminated sheet abuts on a lower surface of a second laminated sheet stacked on a first laminated sheet having an inner layer electrode. Production method. In the sheet forming step, a recess forming pattern is formed in advance on the support film, and then a laminated sheet is formed on the support film, and the support film and the recess forming pattern are peeled off from the laminated sheet to form a recess. The manufacturing method of the high frequency laminated component of Claim 1 characterized by the above-mentioned. The method for manufacturing a high-frequency laminated component according to claim 2, wherein the recess forming pattern is formed of a material having a high releasability from the laminated sheet. 4. The method for manufacturing a high-frequency laminated component according to claim 3, wherein the recess forming pattern is formed of a material similar to that of the support film. The method for manufacturing a high-frequency laminated component according to claim 2, wherein the depth of the concave portion is made smaller than the thickness of the inner layer electrode. The firing process is characterized in that sintering is performed in a state where the laminate is sandwiched between shrinkage-suppressing sheets that are not sintered at a temperature at which the laminate is sintered, and then the shrinkage-suppressing sheet is removed from the laminate. The manufacturing method of the high frequency lamination | stacking component of description. 2. The method of manufacturing a high-frequency laminated component according to claim 1, wherein a high-frequency device for forming a part of the high-frequency circuit is mounted on the surface of the sintered laminated body. The method for manufacturing a high-frequency laminated component according to claim 7, wherein the high-frequency device is mounted on a bare chip. The method of manufacturing a high-frequency laminated component according to claim 8, wherein the high-frequency device is formed of a piezoelectric element or a semiconductor element.

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