JPS5928304A - Manufacture of inductance element - Google Patents

Abstract

PURPOSE:To obtain the small-sized inductance element of high Q by forming a conductive layer in sufficient thickness and reducing resistance. CONSTITUTION:Ferrite 24 is printed on a ferrite layer 21 by using a mask 22 except the section where a conductive layer is formed. The conductive layer 23 is printed by using a mask 25. The mask 25 is formed in a pattern reverse to the mask 22. Conductive paste is printed to the section surrounded by the ferrite 24 and the upper section of said section. The conductive layer is formed, and ferrite 26 is printed on the conductive layer 25 and the ferrite 24. The process is repeated in succession, these layer and ferrite are laminated until the number of the conductive layers wound reaches a fixed number, and the whole is baked. Since the conductive layers are printed thickly at that time, sufficient thickness is kept even when they are shrunk through sintering. According to the manufacture, the thickness of the electrode of the element can be taken in a sufficiently large value. Consequently, the resistance of the electrode can be reduced, and high Q can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing an inductance element, and more particularly to a method for manufacturing an inductance element in which a magnetic material and a conductor are laminated by printing and then fired.

BACKGROUND ART Inductance elements have been used for a long time to increase inductance by winding a conductive wire into a coil and using a magnetic core such as a ferrite core. However, with the miniaturization of electronic circuits, there is a demand for miniaturization of electronic components, and compared to other circuit elements, inductance elements are adapted to miniaturization, but their development has been delayed.

The direction of miniaturization of inductance elements can be divided into two types: one is a wire-wound type, which has a smaller size without changing the basic structure of the conventional one, and the other type is a type formed by printing. Among the latter, inductance elements that have a structure in which a conductive layer and a magnetic layer are sequentially printed and laminated to form a conductive pattern circulating in a magnetic material are attracting attention. The present invention relates to a method of manufacturing such a printing/laminating type inductance element.

The above printed/laminated type inductance element and its manufacturing method are described in JP-A-55-56954 and other publications. To put it simply, a metal pattern for forming a coil is printed on an insulating layer using a conductive paste, one end of which is covered with an insulating layer, and a metal pattern for forming a coil is printed using a conductive paste and a conductive layer is printed around it using a conductive paste. Form a pattern. If the insulating layer is made of a magnetic material, the inductance can be increased, and it can be easily manufactured by a firing method. The present invention relates to a method for manufacturing an inductance element using a firing method.

Generally, N1-n hook-type ferrite calcined powder and ferrite powder pulverized to a particle size of about 1μ as the magnetic material, and silver powder and varadilum powder with a particle size of about 1μ as the conductive layer are used as binders (P, V, B, respectively). ) and a solvent are added, the 11th pattern is printed at a predetermined thickness, and then baked. In other words, as shown in FIG. Form layer 1'5 (A). Next, a ferrite 14 is formed to cover the ferrite 11 and the conductive layer 13 (B), and this process is sequentially repeated to stack the conductive layer pattern and the magnetic layer pattern.

However, a problem arises in that a sufficient Q cannot be obtained in the inductance element which is laminated as described above and is then fired. This is because the resistance of the coil pattern due to the conductive layer is large, and the reason for this increase in resistance is that the conductive layer is not sufficiently thick. That is, even if printed with a thickness of 30 μm before firing, the thickness decreased to about 15 μm after firing, resulting in an increase in resistance.

The present invention aims to solve the above problems and increase Q by forming a conductive layer with sufficient thickness 1 and reducing resistance.

Thereby, the object is to obtain a small inductance element with high Q.

In the aa method of an inductance element according to the present invention, the thickness of the conductive layer is formed thick in advance so that the required thickness can be obtained after firing. This is what I did.

Embodiments of the present invention will be described below with reference to FIG. This is a book in which a ferrite layer and a conductive layer are sequentially laminated, but their compositions are the same as in the previous example.

7. Ferrite 24 is printed on the light layer 21 using a mask 22 except for the portion where the conductive layer is to be formed (A).

The thickness of this ferrite 24 is about 50 μm, which can be formed by normal printing.

Next, the entire conductive layer 23 is printed using mask 2.5 (B). This master 25 is formed according to the pattern of the conductive layer, and has a pattern opposite to that of the mask 22 for forming the ferrite 24 described above. The conductive paste is printed on and in the area surrounded by the ferrite 24. Therefore, since it fits in the groove surrounded by the ferrite 24, the surface of the ferrite 240 and the surface of the conductive layer 230 are at the same height by normal printing, and then the conductive layer is printed to a thickness that is about twice the normal thickness. That is, it can be formed to a thickness of about 60 μm.

After forming the conductive layer 25, the entire ferrite 26 is further printed on the conductive layer 25 and the ferrite 24 (0).

These steps are sequentially repeated until the number of turns of the conductive layer reaches a predetermined number, and then the conductive layer is fired. in this case,
Since the conductive layer is printed to a thickness of about 60 μm, even if it shrinks due to sintering, the thickness of 50 μm or more is maintained.

According to the present invention, the thickness of the electrode of the laminated inductance element can be made sufficiently large.

Therefore, since the resistance of the electrode can be reduced, the problem of Q in the conventional small inductance inductor can be improved.

Furthermore, since the grooves formed by ferrite are used when printing the conductive layer, the shape does not collapse even when the conductive layer becomes thick, and an inductance element with high reliability and good yield can be obtained.

[Brief explanation of drawings]

FIG. 1 is a front sectional view showing a conventional method for manufacturing an inductance element, and FIG. 2 is a front sectional view showing a new embodiment of the present invention. 11, 14.21.24.26... Ferrite 12, 22.25... Mask 15.23... Patent applicant Toko Co., Ltd. Fig. 1 Fig. 2 Fig. 1

Claims (1)

[Claims] In a method for manufacturing a 4-inductance element in which magnetic layers and conductor layers are alternately laminated by a printing method to form a coil pattern that goes around once inside the magnetic body and then fired, a predetermined thickness is formed in the area other than the area where the conductor layer is formed. Then, a first magnetic layer is formed, a conductor layer is formed to be thicker than the second magnetic layer, and a second magnetic layer is formed to cover the conductor layer. A method of manufacturing an inductance element, characterized in that it is formed by sequentially laminating layers.