JP2007201371A - Method for manufacturing multilayer circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer circuit board for hardly generating the deformation or mutual position deviation of a conductor pattern, and for suppressing manufacture failure or manufacture costs due to buffer materials to be used in the case of hot press. <P>SOLUTION: A laminate 10 where an axial section 71x of a positioning pin 71 is put through a positioning hole 1h formed in each resin film 10a to 10f is arranged between hot press boards 60a and 60b, by using the positioning pin 71 having a fringe 71t at one end of the axial section 71x; and a buffer member 31 is interposed between an end face 10sb of the laminate 10 at the fringe 71t side of the positioning pin 71 and the hot press board 60b. A smoothing board 50 has a positioning hole 50h between an end face 10sa of the laminate 10 at the opposite side of the fringe 71t of the positioning pin 71 and the hot press board 60a, and heated and pressurized by the hot press boards 60a and 60 so that the resin films 10a to 10f can be bonded to each other. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for producing a multilayer circuit board, in which a plurality of resin films made of a thermoplastic resin having a conductor pattern formed thereon are laminated, and the laminate films are bonded to each other by heating and pressing. .

  As a method for producing a multilayer circuit board, a method of laminating resin films on which conductor patterns are formed and pressurizing them while heating them is known. Thereby, a some resin film can be adhere | attached collectively and a multilayer circuit board can be manufactured. Also, a press method for heating and pressurizing a laminate of resin films using a hot press plate, which is used in the method for manufacturing a multilayer circuit board, is disclosed in Japanese Patent Application Laid-Open No. 2003-273511 (Patent Document 1). .

According to the press method disclosed in Patent Document 1, a pressing member (buffer material) having a buffering effect is provided between a laminated body of a resin film on which a hot press plate and a conductor pattern are formed during heating and pressurization. Intervene. Thereby, the thickness distribution of the laminated body due to the presence of the conductor pattern can be canceled and a uniform pressure can be applied to the whole. For this reason, the mutual position shift of the conductor pattern currently formed in each resin film can be suppressed, and a product yield can be raised.
JP 2003-273511 A

  FIG. 8 is a schematic cross-sectional view showing an example of the arrangement of resin film laminates and pressure members at the time of heating and pressing according to a conventional multilayer circuit board manufacturing method.

  As shown in FIG. 8, each of the resin films 10a to 10f made of the thermoplastic resin 1 is formed with a bottomed hole with the conductor pattern 2a as a bottom, and is filled with a conductive paste 3 serving as a connection conductor. . The laminate 9 of the resin films 10a to 10f is arranged between the two hot press plates 60a and 60b in the following arrangement. That is, in the arrangement shown in FIG. 8, the pressure difference applied to each part of the end faces 9sa and 9sb from the hot press plates 60a and 60b between the both end faces 9sa and 9sb of the laminate 9 and the hot press plates 60a and 60b, respectively. Cushioning materials 30a and 30b for reducing the above are interposed. As the buffer materials 30a and 30b, for example, a metal such as stainless steel cut into a fiber shape, and the fiber metal formed into a plate shape or generally called asbestos can be used.

  In the manufacturing method of the multilayer circuit board in which a plurality of resin films formed with a conductor pattern are collectively laminated, in order to prevent the laminated resin films from being misaligned during heating and pressurization, Generally, a positioning pin is used. In particular, in the production of a multi-layer multilayer circuit board produced by cutting out a predetermined region from a large-area resin film adhesive, the presence of positioning pins during heating and pressurization is indispensable. As shown in FIG. 8, the resin films 10a to 10f and the cushioning materials 30a and 30b are respectively provided with positioning holes 1h and 30h in the same arrangement, and the positioning pins 70 penetrate through the positioning holes 1h and 30h. In this state, a hot press is performed.

  According to the multilayering method using the positioning pins 70 shown in FIG. 8, it is possible to reliably prevent the positional deviation between the laminated resin films 10 a to 10 f during the heating and pressing by the hot press plates 60 a and 60 b. it can. On the other hand, in order to carry out multilayering using the positioning pins 70 shown in FIG. 8, not only the resin films 10a to 10f but also the cushioning materials 30a and 30b are positioned to release the positioning pins 70 during pressing. It is necessary to open the hole 30h with high accuracy.

  The cushioning materials 30a and 30b are mainly composed of a fibrous material, and are usually used by being wrapped in a heat-resistant film in order to prevent scattering of dust (a cushioning material) from the cushioning material itself. The positioning holes 30h of the cushioning materials 30a and 30b are formed by using a drill to fix the cushioning materials 30a and 30b wrapped in a heat-resistant film by setting them in a dedicated jig. At the time of drilling, since the chips of the buffer material by the drill adhere to the heat-resistant film, it is necessary to clean the attached chips. In addition, the cushioning materials 30a and 30b are usually disposable for each hot press, and a large amount of the cushioning materials 30a and 30b are necessary for manufacturing the multilayer circuit board. Cleaning man-hours also increase. For this reason, the formation of the positioning holes 30h in the cushioning materials 30a and 30b in the manufacturing process is a significant cost factor.

  Further, if the positioning holes 30h are formed in the cushioning materials 30a and 30b, dust may come out from the positioning holes 30h during hot pressing even after the chips of the cushioning material are sufficiently cleaned by the drill. If this dust is bitten during the multi-layering process, it will cause a defect in the manufactured multilayer circuit board due to the dents or dust being embedded.

  Accordingly, the present invention is a method of manufacturing a multilayer circuit board in which a plurality of resin films having conductor patterns formed thereon are collectively multilayered by hot pressing, wherein the conductor patterns are not easily deformed or misaligned, and It aims at providing the manufacturing method of the multilayer circuit board which can suppress the manufacturing defect and manufacturing cost resulting from the buffer material used at the time of hot press.

  The method for manufacturing a multilayer circuit board according to claim 1 is a laminate of a plurality of resin films made of a thermoplastic resin having a conductor pattern formed using a positioning pin having a flange at one end of a shaft portion. A laminated body in which a shaft portion of the positioning pin penetrates a positioning hole provided in each resin film is disposed between two hot press plates, and the laminated body on the flange side of the positioning pin Between the one end face and the heat press plate, a buffer material for reducing a pressure difference applied to each part of the one end face from the hot press plate is interposed, and the laminated layer on the opposite side to the flange portion of the positioning pin A smooth plate having a flat surface between the other end surface of the body and the hot press plate, and having a positioning hole provided in the same arrangement as the resin film, the shaft portion of the positioning pin is the smooth plate Board position The resin film is bonded to each other to form a multilayer circuit board by pressurizing while heating the laminate from both sides with the two hot press plates through the female hole. It is characterized by.

  In the manufacturing method described above, the positioning pin passes through the positioning hole of each resin film constituting the laminated body, and the cushioning material is interposed between the end face of the laminated body on the flange side of the positioning pin and the heat press plate. . On the other hand, a smooth plate having a positioning hole is interposed between the end face of the laminate on the side opposite to the collar portion of the positioning pin and the hot press plate.

  The positioning holes formed in the smooth plate fix the positioning pins in a predetermined arrangement and serve as guide holes for the positioning pins during hot pressing. With this smooth plate, a multilayer circuit board having a flat end on one side can be manufactured.

  On the other hand, the cushioning material disposed on the opposite side of the smooth plate across the laminate reduces the pressure difference applied to each part of the end face of the laminate from the hot press plate. In the above manufacturing method, a cushioning material is interposed between the flange portion of the positioning pin that penetrates the positioning hole of the laminate and the heat press plate. It is not necessary to form a positioning hole that becomes a scattering port for the constituent material. In addition, by providing a flange at the end of the shaft portion of the positioning pin, excessive penetration of the positioning pin into the laminate can be prevented during hot pressing.

  As described above, the method for manufacturing a multilayer circuit board is a method for manufacturing a multilayer circuit board in which a plurality of resin films on which a conductor pattern is formed are collectively multilayered by hot pressing, wherein the conductor pattern is deformed. It is a method for manufacturing a multilayer circuit board that is less prone to misalignment and mutual misregistration, and that can suppress manufacturing defects and manufacturing costs due to the buffer material used during hot pressing.

  In the method for manufacturing a multilayer circuit board, as described in claim 2, a surface resin film that adheres to at least one end surface of the laminate, and is provided in the same arrangement as the resin film. The surface resin film having a positioning hole formed is laminated so that the shaft portion of the positioning pin penetrates the positioning hole of the surface resin film, and the laminate and the laminate are heated and pressed by the hot press plate. The surface resin film can be bonded simultaneously to form a multilayer circuit board. For example, in the case of claim 3, the surface resin film serves as a surface protective layer in the multilayer circuit board, and in the case of claim 4, the surface resin film is exposed on the surface of the multilayer circuit board. It becomes the solder resist layer of the conductor pattern.

  Thus, even if the outermost surface is a multilayer circuit board made only of a resin such as a surface protective layer or a solder resist layer, the above manufacturing method can be used to suppress deformation of the conductor pattern and mutual positional deviation, and It can be multilayered.

  As described in claim 5, in the method of manufacturing a multilayer circuit board, when heating and pressurizing with the hot press plate, between at least one end face of the laminate and the cushioning material and / or the smooth plate, An adhesion preventing film having a positioning hole provided in the same arrangement as that of the resin film can be interposed so that the shaft portion of the positioning pin penetrates the positioning hole of the adhesion preventing film.

  By interposing the anti-adhesion film, the end face of the laminate is not directly in contact with the cushioning material or the smooth plate, and the end face of the laminate is protected during hot pressing, and the end face of the laminate is cushioned or smooth. It can prevent adhering to a board. Thereby, the laminated body in which the resin films obtained after hot pressing are bonded to each other can be easily taken out.

  7. The method of manufacturing a multilayer circuit board according to claim 6, wherein the multilayer circuit board is manufactured by cutting out a predetermined area from the adhesive body of the plurality of resin films bonded to each other. And when the space for cutting out is provided in each resin film that surrounds the predetermined region and constitutes the laminate, when heating and pressurizing with the hot press plate, A frame-shaped press plate that is in contact with the cut-out space between the other end surface and the smooth plate, and has a positioning hole provided in the same arrangement as the resin film, and the positioning pin The shaft portion can be interposed so as to penetrate the positioning hole of the frame-shaped pressing plate.

  In the production of a multi-layer circuit board produced by cutting out a predetermined region from an adhesive body of a large area resin film, precise positioning of the resin films is particularly necessary.

  According to the said manufacturing method, a frame-shaped press board is interposed between the end surface of a laminated body, and a smooth board, and it presses, heating. This frame-shaped pressing plate has positioning holes provided in the same arrangement as the resin film. At the time of hot pressing, the positioning pin penetrates the positioning hole of the frame-shaped pressing plate, and the frame-shaped pressing plate is used for cutting out. Press precisely in place in the space. By pressing the space for cutting by the frame-shaped pressing plate, the flow of the resin plasticized by heat can be suppressed, and the deformation of the conductor patterns in the predetermined region and mutual displacement can be suppressed. Moreover, since sufficient pressure can be applied to the space for cutting, the occurrence of delamination can be suppressed in the space for cutting that is the outer peripheral portion of the multilayer circuit board. In manufacturing the multi-layered circuit board, it is needless to say that manufacturing defects and manufacturing costs due to the buffer material can be suppressed because it is not necessary to make positioning holes in the buffer material.

  According to a seventh aspect of the present invention, in the method for manufacturing a multilayer circuit board, a surface on the shaft portion side of the flange portion of the positioning pin can be a plane perpendicular to the shaft portion. In this case, the structure is simple and the positioning pin is inexpensive. Further, according to an eighth aspect of the present invention, the shaft side surface of the collar portion of the positioning pin may be tapered toward the shaft portion. In this case, when pulling out the positioning pins from the laminate in which the resin films obtained after hot pressing are bonded to each other, workability is improved, and the positioning pins can be easily taken out from the laminate.

  According to a ninth aspect of the present invention, in the method for manufacturing a multilayer circuit board, a surface of the flange portion of the positioning pin opposite to the shaft portion can be a plane perpendicular to the shaft portion. Also in this case, the structure is simple and the positioning pin is inexpensive. According to a tenth aspect of the present invention, the surface of the flange portion of the positioning pin that is opposite to the shaft portion may be formed in a conical shape that faces outward. Moreover, you may form the surface in the side opposite to the axial part in the collar part of the said positioning pin in the curved surface shape which faced outward. In these cases, the ratio of the positioning pin sinking into the cushioning material increases as compared with the case where the surface of the flange portion of the positioning pin opposite to the shaft portion is a plane perpendicular to the shaft portion. Therefore, conversely, it is possible to reduce the adverse effect that occurs when the flange portion of the positioning pin sinks into the end surface of the laminate.

  The present invention relates to a method for manufacturing a multilayer circuit board, in which a plurality of resin films on which a conductor pattern is formed are heated and pressed by hot pressing to collectively form a multilayer. The best mode for carrying out the present invention will be described below with reference to the drawings.

  FIG. 1 is a diagram for explaining a method of manufacturing a multilayer circuit board according to the present invention, and is a schematic cross-sectional view showing a basic arrangement example of a laminate of resin films and respective pressure members during heating and pressing. is there. In addition, the same code | symbol was attached | subjected about the same thing as the laminated body shown in FIG. 8, and each pressurization member about the laminated body shown in FIG. Moreover, in the following description, although it demonstrates taking the case of the lamination | stacking of the six resin films 10a-10f shown in FIG. 1, the lamination | stacking number of resin films is not restricted to this, It is arbitrary lamination | stacking of several sheets, Good. In the production of multilayer circuit boards in recent years, the number of laminated resin films tends to increase, and multilayer circuit boards having 20 or more laminated resin films have been produced.

  In the manufacturing method of the multilayer circuit board shown in FIG. 1, the laminated body 10 is arrange | positioned between the two hot press boards 60a and 60b. Each resin film 10a-10f which comprises the laminated body 10 is the same as each resin film 10a-10f which comprises the laminated body 9 of FIG. That is, each resin film 10a to 10f made of the thermoplastic resin 1 has a bottomed hole with the conductor pattern 2a as a bottom, and is filled with a conductive paste 3 serving as a connection conductor.

  In the method for manufacturing a multilayer circuit board shown in FIG. 1, positioning pins 71 are used to prevent the laminated resin films 10a to 10f from being displaced during heating and pressurization. Unlike the positioning pin 70 shown in FIG. 8, the positioning pin 71 has a flange portion 71t at one end of the shaft portion 71x. The laminated body 10 shown in FIG. 1 is a laminated body in which a shaft portion 71x of a positioning pin 71 having a flange portion 71t is passed through a positioning hole 1h provided in each resin film 10a to 10f.

  In the manufacturing method of the multilayer circuit board shown in FIG. 1, as in the conventional manufacturing method shown in FIG. 8, between the end face of the laminate 9 on the flange 71t side of the positioning pin 71 and the hot press plate 60b, The buffer material 31 for reducing the pressure difference applied to each part of the end face 10sb of the laminated body 10 from the hot press plate 60b is interposed. However, unlike the cushioning material 30b used in the manufacturing method of FIG. 8, the positioning hole 30h is not formed in the cushioning material 31 used in the manufacturing method of FIG.

  Moreover, in the manufacturing method of the multilayer circuit board shown in FIG. 1, instead of the buffer material 30a in the manufacturing method of FIG. 8, the end surface 10sa of the laminated body 10 on the opposite side to the flange portion 71t of the positioning pin 71 and the hot press plate A smooth plate 50 is interposed between 60a. The smooth plate 50 has a flat surface 50s and positioning holes 50h provided in the same arrangement as the resin films 10a to 10f. The smooth plate 50 is interposed between the end face 10sa of the laminate 10 and the hot press plate 60a so that the shaft portion 71x of the positioning pin 71 passes through the positioning hole 50h of the smooth plate 50.

  The manufacturing method of the multilayer circuit board of the present invention is such that the laminate 10 of the resin films 10a to 10f, the buffer material 31, the smooth plate 50, and the positioning pins 71 are arranged as shown in FIG. 1, and the two hot press plates 60a and 60b are used. The resin films 10a to 10f are bonded to each other by applying pressure while heating the laminate 10 from both sides. At the same time, the conductive paste 3 is sintered and becomes a connection conductor that connects the conductor patterns 2a of the resin films 10a to 10f. By this heating and pressurization, the six resin films 10a to 10f on which the conductor pattern 2a is formed are collectively multilayered, and a multilayer circuit board made of the laminate 10 is completed.

  In the manufacturing method, the positioning pin 71 passes through the positioning holes 1h of the resin films 10a to 10f constituting the laminated body 10, and the end surface 10sb of the laminated body 10 on the flange 71t side of the positioning pin 71 and the heat The buffer material 31 is interposed between the press plates 60b. On the other hand, a smooth plate 50 having a positioning hole 50h is interposed between the end face 10sa of the laminated body 10 on the opposite side of the flange portion 71t of the positioning pin 71 and the hot press plate 60a.

  The positioning hole 50h formed in the smooth plate 50 serves as a guide hole for the positioning pin 71 during hot pressing while fixing the positioning pin 71 in a predetermined arrangement. With this smooth plate 50, a multilayer circuit board with a flat one-side end face 10sa can be manufactured.

  On the other hand, the buffer material 31 disposed on the opposite side of the smooth plate 50 across the laminate 10 reduces the pressure difference applied to each part of the end surface 10sb of the laminate 10 from the hot press plate 60b. In the manufacturing method, the cushioning material 31 is interposed between the flange 71t of the positioning pin 71 penetrating the positioning hole 1s of the laminate 10 and the hot press plate 60b, and the cushioning material 31 has an increased manufacturing cost. It is not necessary to form the positioning hole 30b in FIG. 8 which is a factor and serves as a scattering port for dust (a constituent material of the buffer material 31). In addition, by providing the flange portion 71t at the end of the shaft portion 71x of the positioning pin 71, excessive entry of the positioning pin 71 into the laminated body 10 can be prevented during hot pressing.

  As described above, the method for manufacturing a multilayer circuit board is a method for manufacturing a multilayer circuit board in which a plurality of resin films 10a to 10f on which a conductor pattern 2a is formed are multilayered by hot pressing. This is a method for manufacturing a multilayer circuit board in which deformation of the conductor pattern 2a and mutual positional deviation are unlikely to occur, and manufacturing defects and manufacturing costs due to the buffer material 31 used during hot pressing can be suppressed.

  FIG. 2 is a schematic cross-sectional view showing another arrangement example of the laminate of the resin film and each pressing member at the time of heating and pressing. In addition, the same code | symbol was attached | subjected about the same thing as the laminated body shown in FIG. 1, and each pressurization member about the laminated body shown in FIG.

  In the method for manufacturing the multilayer circuit board shown in FIG. 2, the laminate 11 is disposed between the two hot press plates 60a and 60b. The laminated body 11 in FIG. 2 is obtained by laminating surface resin films 11a and 11b that adhere to the end faces 10sa and 10sb on both end faces 10sa and 10sb of the laminated body 10 in FIG. The surface resin films 11a and 11b have positioning holes 11h provided in the same arrangement as the resin films 10a to 10f, and the laminated body 10 so that the shaft portion 71x of the positioning pins 71 penetrates the positioning holes 11h. Are stacked on the end faces 10sa and 10sb. The surface resin films 11a and 11b serve as the outermost resin layer of the manufactured multilayer circuit board. For example, the surface protective layer of the manufactured multilayer circuit board or the solder resist layer of the conductor pattern 2a exposed on the surface It can be.

  Further, in the manufacturing method of FIG. 2, adhesion preventing films 40 a and 40 b are interposed between both end surfaces 11 sa and 11 sb of the laminate 11 and the buffer material 31 and the smooth plate 50. The adhesion preventing films 40a and 40b have positioning holes 40h provided in the same arrangement as the resin films 10a to 10f so that the shaft portion of the positioning pin 71 penetrates the positioning holes 40h of the adhesion preventing films 40a and 40b. Thus, the both ends 11sa and 11sb of the laminate 11 are interposed between the cushioning material 31 and the smooth plate 50.

  In the manufacturing method of FIG. 2, the laminated body 10 and the surface resin films 11a and 11b, that is, the resin films 10a to 10f and the surface resin films 11a and 11b are bonded simultaneously by heating and pressing with the hot press plates 60a and 60b. As a result, a multilayer circuit board made of the laminate 11 is completed. As described above, even if the outermost surface is a multilayer circuit board made of only a resin such as a surface protective layer or a solder resist layer, the positioning pins 71 having the flanges 71t are used to laminate the same as in the manufacturing method of FIG. A smooth plate 50 having a cushioning material 31 without a positioning hole and a positioning hole 50h can be arranged on both sides of the body 11 and hot-pressed. As a result, deformation of the conductor pattern 2a in the multilayer body 11 and mutual positional deviation can be suppressed, and a multilayered structure can be obtained.

  Further, in the manufacturing method of FIG. 2, the end surfaces 11 sa and 11 sb of the laminated body 11 do not directly contact the buffer material 31 and the smooth plate 50 by interposing the anti-adhesion films 40 a and 40 b as described above. Yes. Thereby, it is possible to protect the end surfaces 11sa and 11sb of the multilayer body 11 during hot pressing and to prevent the end surfaces 11sa and 11sb of the multilayer body 11 from adhering to the cushioning material 31 and the smooth plate 50. For this reason, the laminated body 11 with which each resin film 11a, 10a-10f, 11b obtained after hot press was mutually adhere | attached can be easily taken out from each pressurization member.

  2 shows a multilayer circuit board in which surface resin films 11a and 11b are arranged on both end faces 10sa and 10sb of the laminate 10 and the outermost surfaces on both sides are made only of a resin such as a surface protective layer or a solder resist layer. This is an example of manufacturing. However, the present invention is not limited to this, and the surface resin films 11a and 11b are laminated on either one of the end faces 10sa and 10sb of the laminate 10, and only one outermost surface is made of only a resin such as a surface protective layer or a solder resist layer. A multilayer circuit board may be manufactured.

  In FIG. 2, adhesion preventing films 40 a and 40 b are interposed between both end surfaces 11 sa and 11 sb of the laminate 11, the buffer material 31, and the smooth plate 50. However, the present invention is not limited thereto, and the adhesion preventing films 40 a and 40 b may be interposed between any one of the end surfaces 11 sa and 11 sb of the laminate 11 and the buffer material 31 or the smooth plate 50. Furthermore, in the case of a combination of materials in which the end face of the laminate and the cushioning material and the smooth plate are not attached by hot pressing, the adhesion preventing films 40a and 40b may be omitted.

  FIG. 3 and FIG. 4 show another example of manufacturing a multilayer circuit board according to the present invention, in which a plurality of resin films on which a conductor pattern is formed are laminated, and the laminated body is bonded to each other by heating and pressing. It is a manufacturing example of a multilayer circuit board manufactured by cutting out a predetermined region from this adhesive body.

  FIG. 3 is a schematic cross-sectional view showing another arrangement example of the laminate of the resin film and each pressing member at the time of heating and pressing. 4A is a schematic perspective view showing the six laminated resin films 12a to 12f in FIG. 3 side by side, and FIG. 4B is an upper surface of the frame-shaped pressing plate 20 in FIG. FIG.

  In addition, about the same thing as the laminated body and each pressurization member which were shown in FIG. 1 about the laminated body and each pressurization member which were shown in FIG. 3, the same code | symbol was attached | subjected. In the arrangement of FIG. 3, similarly to the case of FIG. 2, surface resin films may be laminated on both sides of the laminate 12 made of the resin films 12 a to 12 f. In FIG. 4A, for the sake of simplicity, all the resin films 12a to 12f are laminated with the surface on which the conductor patterns 2a and 2b are formed facing forward, but an actual multilayer circuit board is manufactured. In FIG. 3, as shown in FIG. 3, some resin films 12d-12f are reversed and laminated | stacked. Each resin film 12a-12f has a bottomed hole with the conductor pattern 2a at the bottom, and is filled with a conductive paste 3 serving as a connection conductor.

  Each of the six resin films 12a to 12f shown in FIG. 4A is made of a thermoplastic resin film 1 such as a liquid crystal polymer, and a conductor pattern made of a copper foil shown by hatching on the thermoplastic resin film 1. 2a and 2b are formed. A positioning hole 1h is formed in the conductor pattern 2b on the outer periphery of the resin films 12a to 12f.

  In the method for manufacturing a multilayer circuit board shown in FIGS. 3 and 4, the multilayer circuit board to be manufactured is manufactured by cutting a predetermined region from an adhesive body of a plurality of large resin films 12a to 12f bonded to each other. Circuit boards t1 to t9. Each of the resin films 12a to 12f constituting the laminated body 12 is provided with a cutting space ks surrounding a predetermined area. In this case, as shown in FIG. 3, the frame-shaped pressing plate 20 is interposed between the end surface 12 sa of the laminated body 12 and the smooth plate 50 when being heated and pressed by the hot pressing plates 60 a and 60 b. .

  The frame-shaped pressing plate 20 contacts the space ks for cutting out the resin film 12a constituting the laminated body 12 via the adhesion preventing film 40a. The frame-shaped pressing plate 20 has positioning holes 20 h provided in the same arrangement as the resin films 12 a to 12 f so that the shaft portion 71 x of the positioning pin 71 passes through the positioning holes 20 h of the frame-shaped pressing plate 20. The laminate 12 is interposed between the end face 12sa of the laminate 12 and the smooth plate 50.

  As in the manufacturing method shown in FIG. 3 and FIG. 4, in the manufacture of a multi-layer multilayer circuit board manufactured by cutting out a predetermined area from an adhesive body of large-area resin films 12 a to 12 f, the resin films 12 a to 12 f Precise positioning between each other is particularly necessary.

  According to the manufacturing method shown in FIGS. 3 and 4, the frame-shaped pressing plate 20 is interposed between the end surface 12sa of the laminated body 12 and the smooth plate 50, and pressing is performed while heating. The frame-shaped pressing plate 20 has positioning holes 20h provided in the same arrangement as the resin films 12a to 12f, and the positioning pin 71 penetrates the positioning holes 20h of the frame-shaped pressing plate 20 during hot pressing, The frame-shaped pressing plate 20 accurately presses a predetermined position in the cutting space ks. By pressing the cutting space ks by the frame-shaped pressing plate 20, the flow of the resin 1 plasticized by heat can be suppressed, and the deformation of the conductor pattern 2a in the predetermined region and mutual displacement can be suppressed. . In addition, since a sufficient pressure can be applied to the cutting space ks, it is possible to suppress the occurrence of delamination in the cutting space ks that is the outer peripheral portion of the multilayer circuit boards t1 to t9. In manufacturing the multi-layer multilayer circuit board, it is needless to say that manufacturing defects and manufacturing costs due to the buffer material 31 can be suppressed because there is no need to make positioning holes in the buffer material 31.

  Next, the positioning pin 71 shown in FIGS. 1 to 3 used in the method for manufacturing the multilayer circuit board will be described.

  FIG. 5 is a diagram showing a schematic dimension of the positioning pin 71. When about 20 resin films are laminated, the thickness of the laminated body becomes several mm. When this laminated body is hot-pressed, a multilayer circuit board having a thickness of about 1 mm is manufactured. Since the positioning pin 71 is inserted into the positioning hole 50h of the smooth plate 50 and fixed in place, the positioning pin 71 has a length of 10 to 30 mm.

  In the positioning pin 71 shown in FIG. 5, both the surface 71ta on the shaft portion side of the flange portion 71t and the surface 71tb on the opposite side to the shaft portion are both planes perpendicular to the shaft portion 71x. In this case, the structure is simple and the positioning pin 71 is inexpensive.

  FIGS. 6A and 6B and FIGS. 7A to 7C are diagrams showing other positioning pins 72 to 76, all of which are flange portions 72 t to 76 t at one end of the shaft portions 72 x to 76 x. However, the shapes of the flange portions 72t to 76t are different from each other.

  In the positioning pin 72 shown in FIG. 6A, a surface 72tb on the opposite side of the shaft portion 72x in the flange portion 72t is formed in a conical shape facing outward. In the positioning pin 73 shown in FIG. 6B, a surface 73tb on the opposite side of the shaft portion 73x in the flange portion 73t is formed in a curved shape facing outward. When the positioning pins 72 and 73 shown in FIGS. 6A and 6B are used instead of the positioning pin 71 in the arrangement of FIGS. 1 to 3, the positioning pins 72 and 73 are compared with the case where the positioning pin 71 is used. The rate at which 73 sinks into the buffer material 31 increases. Therefore, conversely, it is possible to reduce adverse effects caused by the flanges 72t and 73t of the positioning pins 72 and 73 being recessed into the end faces 10sb to 12sb of the stacked bodies 10 to 12.

  In the positioning pins 74 to 76 shown in FIGS. 7A to 7C, surfaces 74ta to 76ta on the shaft portions 74x to 76x side of the flange portions 74t to 76t are tapered toward the shaft portions 74x to 76x, respectively. Is formed. When the positioning pins 74 to 76 shown in FIGS. 7A to 7C are used instead of the positioning pins 71 in the arrangement of FIGS. 1 to 3, the resin films obtained after hot pressing are bonded to each other. Workability is improved when the positioning pins 74 to 76 are pulled out from the laminates 10 to 12, and the positioning pins can be easily taken out from the laminates 10 to 12.

  As described above, any of the above-described methods for manufacturing a multilayer circuit board is a method for manufacturing a multilayer circuit board in which a plurality of resin films on which a conductor pattern is formed are multi-layered by hot pressing. This is a method for manufacturing a multilayer circuit board in which deformation of a conductor pattern and mutual positional deviation hardly occur, and manufacturing defects and manufacturing costs caused by a buffer material used during hot pressing can be suppressed.

It is a figure explaining the manufacturing method of the multilayer circuit board of this invention, and is typical sectional drawing which showed the basic example of arrangement | positioning of the laminated body of a resin film at the time of a heating and pressurization, and each pressurization member. It is typical sectional drawing which showed another example of arrangement | positioning of the laminated body of the resin film at the time of a heating and pressurization, and each pressurization member. It is typical sectional drawing which showed another example of arrangement | positioning of the laminated body of the resin film at the time of a heating and pressurization, and each pressurization member. (A) is the typical perspective view which arranged and showed six laminated resin films 12a-12f of FIG. 3, (b) is a top view of the frame-shaped press board 20 of FIG. It is a figure which shows the approximate dimension of the positioning pin 71. FIG. (A), (b) is a figure which shows another positioning pin 72,73. (A)-(c) is a figure which shows another positioning pin 74-76. It is typical sectional drawing which showed the example of arrangement | positioning of the laminated body of the resin film at the time of heating and pressurization, and each pressurization member by the manufacturing method of the conventional multilayer circuit board.

Explanation of symbols

10a to 10f, 12a to 12f Resin film ks Cutting space 1h Positioning hole (for resin film) 1 Thermoplastic resin 2a, 2b Conductive pattern 3 Conductive paste 9-12 Laminated body 10sa to 12sa, 10sb to 12sb (for laminated body) ) End surface 11a, 11b Surface resin film 11h (Position resin film) positioning hole 20 Frame-shaped pressing plate 20h Positioning hole (of frame-shaped pressing plate) 30a, 30b, 31 Buffer material 40a, 40b Adhesion prevention film 40h (Adhesion prevention film) Positioning hole 50 smooth plate 50h (smooth plate) positioning hole 60a, 60b heat press plate 70-76 positioning pin 71x-76x shaft 71t-76t collar

Claims (11)

Using a positioning pin having a collar on one end of the shaft,
A laminate of a plurality of resin films made of a thermoplastic resin on which a conductor pattern is formed, wherein two laminates each having a shaft hole of the positioning pin penetrated through a positioning hole provided in each resin film Placed between hot press plates,
Between the one end face of the laminate on the flange side of the positioning pin and the heat press plate, a buffer material for reducing a pressure difference applied to each part of the one end face from the hot press plate is interposed,
A smooth plate having a flat surface between the other end surface of the laminate on the side opposite to the flange portion of the positioning pin and the heat press plate, and has a positioning hole provided in the same arrangement as the resin film. The smooth plate is interposed such that the shaft portion of the positioning pin penetrates the positioning hole of the smooth plate,
A method for producing a multilayer circuit board, wherein the resin film is bonded to each other to form a multilayer circuit board by applying pressure while heating the laminate from both sides with the two hot press plates. On at least one end face of the laminate,
A surface resin film that adheres to the end surface and has a positioning hole provided in the same arrangement as the resin film, so that the shaft portion of the positioning pin penetrates the positioning hole of the surface resin film. And laminated
2. The method of manufacturing a multilayer circuit board according to claim 1, wherein the multilayer body and the surface resin film are bonded simultaneously by heating and pressing with the hot press plate to form a multilayer circuit board.   The method for producing a multilayer circuit board according to claim 2, wherein the surface resin film serves as a surface protective layer in the multilayer circuit board.   3. The method of manufacturing a multilayer circuit board according to claim 2, wherein the surface resin film becomes a solder resist layer of a conductor pattern exposed on a surface of the multilayer circuit board.   When heating and pressurizing with the hot press plate, an adhesion preventing film having positioning holes provided in the same arrangement as the resin film between at least one end surface of the laminate and the buffer material and / or the smooth plate, 5. The method of manufacturing a multilayer circuit board according to claim 1, wherein the shaft portion of the positioning pin is interposed so as to penetrate the positioning hole of the adhesion preventing film. 6. The multilayer circuit board is a multilayer circuit board manufactured by cutting out a predetermined region from the adhesive body of a plurality of resin films adhered to each other,
The space for cutting is provided in each resin film that surrounds the predetermined region and constitutes the laminate,
A frame-like pressing plate that abuts in the space for cutting between the other end surface of the laminate and the smooth plate when heated and pressed by the hot press plate, and has the same arrangement as the resin film. 6. The frame-shaped pressing plate having a positioning hole provided is interposed such that a shaft portion of the positioning pin penetrates the positioning hole of the frame-shaped pressing plate. A method for producing a multilayer circuit board according to one item.   7. The method of manufacturing a multilayer circuit board according to claim 1, wherein a surface of the flange portion of the positioning pin on the shaft portion side is a plane perpendicular to the shaft portion.   7. The multilayer circuit board according to claim 1, wherein a surface of the positioning pin on the shaft portion side is formed in a tapered shape toward the shaft portion. 8. Method.   9. The method of manufacturing a multilayer circuit board according to claim 1, wherein a surface of the flange portion of the positioning pin opposite to the shaft portion is a plane perpendicular to the shaft portion. .   9. The multilayer circuit board according to claim 1, wherein a surface of the positioning pin that is opposite to the shaft portion is formed in a conical shape facing outward. Manufacturing method.   9. The multilayer circuit board according to claim 1, wherein a surface of the flange portion of the positioning pin opposite to the shaft portion is formed in a curved shape facing outward. Manufacturing method.

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