JP2003273511A - Press technique and method for manufacturing member for press - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To bond a plurality of resin films in a batch by a heading/pressurizing process by preventing the occurrence of displacement in a conductor pattern formed on a resin film. <P>SOLUTION: A plurality of single-sided conductor pattern films 21 are laminated, and heated/pressurized from both sides so that the conductor pattern films 21 can be bonded to each other to form a multi-layer board 100. In heating/ pressurizing those conductive pattern films, members 12a and 12b for press having buffering effects are interposed between thermal press boards 10a and 10b and the single-sided conductor pattern films 21. Thus, pressures to be applied to the respective parts of the laminated single-sided conductor pattern films 21 can be made almost uniform. Therefore, the whole laminated single-sided conductive pattern films 21 are almost simultaneously deformed so that the displacement in a conductor pattern 22 formed on each of those films 21 can be prevented. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressing method suitable for manufacturing a multi-layer substrate formed by laminating a plurality of resin films having conductor patterns and heating and pressing the laminated resin films. And a method for producing a pressing member suitable for use in the pressing method.

[0002]

2. Description of the Related Art Conventionally, as a method of manufacturing a multilayer substrate, a resin film having a conductor pattern is laminated and a plurality of resin films are collectively bonded by heating and pressing them to manufacture a multilayer substrate. It is known how to do it.

For example, according to the method of manufacturing a multilayer substrate disclosed in Japanese Patent Laid-Open No. 2000-38464, first, conductor patterns are formed on both sides of a resin film made of a thermoplastic resin, and the conductor patterns on both sides are electrically conductive. A plurality of double-sided boards with interlayer connection made by paste are manufactured. next,
The plurality of double-sided substrates are laminated via a thermoplastic resin film that has been subjected to interlayer connection processing. Then, by heating the laminated double-sided substrate and the resin film at a predetermined temperature and applying a predetermined pressure, the thermoplastic resin forming the resin film is softened and adhered. In this heating / pressurizing step, for example, a current is applied to a press plate made of a conductive metal material such as titanium to generate heat, and the heat-pressed press plate is pressed against the laminated resin film, It is carried out by applying a predetermined pressure.

[0004]

However, as described above, when the heat-pressed press plate is pressed against the resin film and the laminated resin films are heated and pressed, the position shift of the conductor pattern formed on the resin film is caused. Is likely to occur.

Further, when there is an air pocket between the laminated resin films due to the undulation of the resin films, the above-mentioned press plate cannot transmit the air, so that the resin films are adhered to each other while the air remains between the resin films. Sometimes it ends up. In this case, voids are generated between the resin films, which causes a problem such as delamination.

The present invention has been made in view of the above points, and a plurality of resin films can be collectively bonded by a heating / pressing process without causing displacement of the conductor pattern formed on the resin film. A first object of the present invention is to provide a pressing method capable of manufacturing a multilayer substrate by using the above method.
A second object of the present invention is to provide a method for producing a pressing member which is used in the pressing method and which can prevent dust from adhering to the conductor pattern film. Further, a third object is to provide a pressing method capable of suppressing the generation of voids between resin films.

[0007]

First, before describing the means for solving the problems of the present invention, the cause of the displacement of the conductor pattern formed on the resin film will be described.

When the resin film is made of a thermoplastic resin, the thermoplastic resin is softened by heating the resin film at a temperature not lower than the glass transition temperature of the thermoplastic resin. For thermoplastic resin softened to a predetermined elastic modulus,
By applying a predetermined pressure in a state where the thermoplastic resin films are laminated, the thermoplastic resins adhere to each other. Therefore, the resin films can be bonded to each other without using an adhesive or the like.

However, when the laminated resin film is heated and pressed, if the resin film surface has irregularities due to the conductor patterns formed on the resin films of the respective layers, the surface of the press plate is flat, so that the convex portion is formed. Pressure and heat will be concentrated on. For example, when the conductor pattern is formed on the resin film located on the outermost surface of the laminated resin films, the press plate contacts only the convex portion of the conductor pattern and applies pressure and heat to the convex portion. Further, even if the surface of the laminated resin film is flat, if the resistance force in the direction of compressing the laminated resin film varies depending on the part due to the uneven pattern on the resin film of the inner layer, the part with high resistance force Pressure will be applied in a concentrated manner.

As a result, the pressure is concentrated on the convex portion or the portion having high resistance, so that the thermoplastic resin softened by heating is not the thermoplastic resin of the portion where the pressure is concentrated. The flow rate becomes larger than the flow rate of the thermoplastic resin in other parts. When a part of the thermoplastic resin forming the resin film has a large flow amount, the conductor pattern formed thereon also moves together with the thermoplastic resin. This is the cause of the displacement of the conductor pattern.

Therefore, in order to achieve the first object, the pressing method according to claim 1 comprises a step of preparing a conductor pattern film in which a conductor pattern is formed on at least one surface of a film made of a thermoplastic resin. A laminating step of laminating a plurality of resin films including the conductor pattern film, and heating by heating the laminated resin films with a hot press plate to bond the resin films to each other to form a multilayer substrate・ Provides a pressurizing process,
When heating and pressing the laminated resin film by a hot press plate, in order to reduce the pressure difference applied to each part of the resin film from the hot press plate, the hot press plate and the laminated resin film It is characterized in that a pressing member having a cushioning effect is interposed therebetween.

As described above, by providing a pressing member having a cushioning effect between the hot press plate and the laminated conductor pattern film to perform heating and pressurization, the pressure applied to each part of the resin film is increased. Since the difference is reduced, it is possible to suppress the local flow of the resin, thereby preventing the displacement of the conductor pattern.

According to a second aspect of the present invention, the pressing member having a cushioning effect is deformed according to the surface unevenness of the laminated resin film and is applied to the laminated resin film from the hot press plate. It is desirable to transmit pressure. This makes it possible to reduce the pressure difference applied to each part of the resin film even when the surface of the resin film has irregularities.

For example, when the film surface has irregularities due to a conductor pattern or the like formed on the film, the pressing member is deformed according to the irregularities. That is, since the pressing member absorbs the unevenness of the film surface located on the outermost surface, it is possible to prevent an excessive pressure difference in each part of the film with respect to the pressure for pressing the film located on the outermost surface by the hot press plate. . Even if the resin film on the surface is flat, if the inner layer of the laminated resin films has a portion having a large resistance force in the compression direction, the pressing member at the portion corresponding to the portion shrinks and the resistance Since the pressure is applied to the portion having a small force through the pressing member, the pressure difference applied between the portion having a large resistance force and the other portion can be reduced.

As a result, in the laminated resin films, it is possible to prevent the flow amount of a part of the thermoplastic resin forming each film from increasing, and the entire laminated resin films are deformed at the same time. It is possible to prevent the displacement of the conductor pattern formed on the upper side.

As described in claim 3, it is preferable that the pressing member having the cushioning effect is a plate-shaped metal fiber, a glass fiber, a resin fiber, or a plate-shaped rubber. As a result, the pressing member can absorb irregularities on the film surface or can be deformed so as to partially contract when there is a difference in the resistance force in the compression direction.

In the heating / pressurizing step for adhering the laminated resin films, the heating temperature is 200 to
The pressure may be set to 350 ° C. and 0.1 to 10 MPa. Considering repeated use under such high temperature and high pressure manufacturing conditions, it is particularly preferable that the pressing member is made of a metal material.

According to a fourth aspect of the present invention, the pressing member having the cushioning effect is formed by molding metal fibers, glass fibers or resin fibers into a plate shape and is wrapped with a resin cover made of a thermoplastic resin. Is preferred. As a result, it is possible to reliably prevent the debris of fibers generated from the pressing member during hot pressing from adhering to the conductor pattern film.

As described in claim 5, a heated resin film and a non-adhesive and flexible sheet are further provided between the pressing member having the cushioning effect and the laminated resin film. It is preferable to provide it and perform the heating and pressurization. By using this non-sticky and flexible sheet, it is possible to prevent the pressing member from adhering to the thermoplastic resin of the softened multilayer substrate.

As described in claim 6, the sheet can be formed of a material having a melting point higher than the heating temperature in the heating / pressurizing step. Materials having such characteristics include metals such as stainless steel, Ni, and A.
Examples of common foil-like metals such as l and Ti and resins include polyimide, polytetrafluoroethylene, and silicone rubber. In particular, polyimide is preferable because it has high tensile strength, is not easily broken even when it is separated from the multilayer substrate, and can be repeatedly used.

As described in claim 7, a heated resin cover and a non-adhesive and flexible sheet are further provided between the pressing member having the cushioning effect and the hot press plate. It is preferable to perform the heating / pressurizing step. By using this hard-to-adhere and flexible sheet, it is possible to prevent the hot press plate from adhering to the thermoplastic resin cover of the softening press member.

As described in claim 8, the sheet can be formed of a material having a melting point higher than a heating temperature in the heating / pressurizing step. Materials having such characteristics include metals such as stainless steel, Ni, and A.
Examples of common foil-like metals such as l and Ti and resins include polyimide, polytetrafluoroethylene, and silicone rubber. In particular, polyimide is preferable because it has high tensile strength, is not easily broken even when separated from the pressing member, and can be repeatedly used.

According to a ninth aspect of the present invention, in the pressing member having the cushioning effect, metal fiber, glass fiber, or resin fiber is molded into a plate shape, and the inner layer is a resin cover made of a thermoplastic resin. It is preferable that the outer layer is wrapped with a resin cover having a two-layer structure, which is a resin cover that is hard to adhere to the heated thermoplastic resin. By wrapping a metal fiber, glass fiber or resin fiber molded in a plate shape with the thermoplastic resin cover of the inner layer, it is sure that the fiber scraps generated from the pressing member during hot pressing will adhere to the conductor pattern film Can be prevented. Further, by making the outer layer a cover that is hard to adhere to the heated thermoplastic resin film, it is possible to prevent the multilayer substrate and the hot press plate from adhering to each other.

According to the tenth aspect, the resin cover that is hard to adhere to the heated thermoplastic resin may be formed of a material having a melting point higher than the heating temperature in the heating / pressurizing step. it can. Materials having such characteristics include polyimide, polytetrafluoroethylene,
There are silicone rubber and the like. In particular, polyimide is preferable because it has high tensile strength, is not easily broken even when separated from a multilayer substrate or a hot press plate, and can be repeatedly used.

As described in claim 11, a step of forming a resist film on a surface of the laminated resin film where the conductor pattern is exposed, and an electrode of the conductor pattern covered with the resist film. Corresponding to a position to be formed, a step of forming a hole in the resist film is provided, and after forming a hole in the resist film, the laminated resin film and the resist film are heated and pressed to form a multilayer substrate. good.

When a conductor pattern other than an electrode for electrically connecting to an electronic component to be mounted is formed on the surface of the substrate, a portion other than the electrode portion may be covered with a resist film. Also in this case, since holes are formed in the resist film at the portions corresponding to the electrodes, unevenness is formed in the resist film. Therefore, even when the resist film is provided, the use of the pressing member having the above-described cushioning effect has the effect of preventing the displacement of the conductor pattern.

It is preferable that the resist film is made of the same material as the thermoplastic resin forming the film. This ensures the adhesiveness between the resist film and the resin film and facilitates the recycling of the substrate material.

As described in the thirteenth aspect, the conductor pattern exposed on the surface may be formed only of the electrodes used for connection with the electronic component to be mounted.
In this case, since it is not necessary to separately form a resist film and the multilayer substrate can be formed only from the conductor pattern film, the manufacturing equipment can be simplified.

As described in claim 14, a via hole is formed in the conductor pattern film, and by filling the via hole with a conductive paste, the conductor pattern of each layer can be conducted through the conductive paste. preferable. In this case, since the multilayer substrate receives a force in the compression direction due to the heating / pressurizing process, each conductor paste and the conductor pattern are sufficiently in contact with each other, so that electrical conduction can be reliably achieved.

According to a fifteenth aspect of the present invention, the conductor pattern film has a conductor pattern formed on only one surface, and a bottomed via hole having the conductor pattern as a bottom surface is formed. It is preferable that the conductive pattern is filled in the via hole so that the conductive patterns of the conductive pattern films laminated via the conductive paste are electrically connected to each other.

By using the conductor pattern film having the conductor pattern formed on only one surface, the steps of manufacturing the conductor pattern film can be made common, which is effective in simplifying the manufacturing equipment and reducing the manufacturing cost. Further, by filling the bottomed via hole having the conductor pattern as the bottom surface with the conductive paste, the conductor patterns of the respective films can be surely conducted.

When a predetermined number of the conductor pattern films are laminated as described in claim 16, an arbitrary 2
The conductor pattern films are laminated so that the surfaces on which the conductor pattern is not formed face each other, and the remaining conductor pattern films are arranged so that the surface on which the conductor pattern is formed and the surface on which the conductor pattern is not formed face each other. It is preferable that electrodes are formed by the conductor pattern on both surfaces of the multilayer substrate.

With this structure, electrodes for connecting electronic components and external circuits can be formed on both surfaces of the multilayer board while using the conductive pattern film having the conductive pattern formed on only one side, so that high density mounting or miniaturization of the multilayer board can be achieved. Can be realized.

As described in claims 17 and 18,
When laminating a predetermined number of the conductor pattern film,
It is preferable that the conductor pattern films located on both outermost surfaces have the conductor foil before pattern formation on the outermost surface side. As a result, since the thermoplastic resin is not exposed on the outermost surface when the laminated conductor pattern films are heated and pressed, it is possible to prevent the softened thermoplastic resin forming the multilayer substrate and the pressing member from adhering to each other. .

According to a nineteenth aspect of the present invention, in the step of forming the multilayer substrate, heat and pressure from the hot press plate are applied to the central portion of the laminated resin films, and the resin surrounding the central portion is applied. It is preferable that heat and pressure are not applied to the peripheral portion of the film. This allows
The resin does not flow around the periphery of the resin film. For this reason, even if the resin in the central portion of the resin film tries to flow excessively, the flow is hindered by the resin in the peripheral portion, so that the conductor pattern can be more reliably prevented from being displaced.

As described above, in order to apply heat and pressure only to the central portion of the resin film, as described in claim 20, the hot press plate and the pressing member having the cushioning effect are provided. At least one may have an area corresponding to the central portion of the laminated resin films. Further, as described in claim 21, an intermediate plate having an area corresponding to the central portion of the laminated resin films may be provided between the hot press plate and the pressing member.

Further, in order to reliably prevent the displacement of the conductor pattern, as described in claim 22, a ring-shaped conductor is formed in the peripheral portion of each layer of the laminated resin films so as to surround the central portion. A pattern may be provided, and the hot press plate may heat and press the central part and the peripheral part of the laminated resin films via the pressing member having the cushioning effect. By providing an annular conductor pattern in each layer of the resin film, these annular conductor patterns are embedded in the resin film of each layer and are formed inside the annular conductor pattern to prevent excessive flow of the resin inside thereof. The positional displacement of the formed conductor pattern can be reliably prevented. The annular conductor pattern portion may be formed outside the region to be the product and separated from the product portion after the step of forming the multilayer substrate.

According to a twenty-third aspect, it is preferable that the annular conductor patterns formed on the peripheral portions of the respective layers of the resin film are connected to each other through a conductive paste over substantially the entire circumference thereof. . Thus, the resin in the central portion of the resin film is surrounded by the conductive pattern and the conductive paste, so that the excessive flow of the resin in the central portion of the resin film can be prevented more reliably.

A pressing member having a cushioning effect in which a metal fiber, a glass fiber, or a resin fiber molded into a plate shape is wrapped in a resin film made of a thermoplastic resin has the same cushioning effect as the pressing method for forming a multilayer substrate. If it can be manufactured by the above-mentioned forming method, it is desirable that new equipment for manufacturing the press member becomes unnecessary and the cost for the equipment and the labor for equipment maintenance can be reduced.

Therefore, in order to achieve the second object of the present invention, the method for producing a pressing member according to claim 24 is
At least a step of preparing a cushioning material made of a metal fiber, a glass fiber, or a resin fiber molded into a plate shape, and a resin film made of a thermoplastic resin having an attachment margin portion for wrapping the cushioning material in a peripheral portion thereof. A step of preparing two sheets, a step of preparing two resin films that are difficult to adhere to the heated thermoplastic resin, and a step of preparing at least two thermoplastic resins between the two resin films that are difficult to adhere to. A step of inserting and laminating a resin film made of a resin, and forming the mounting margin portion between the resin film made of the at least two thermoplastic resins, and the buffer material, at a peripheral portion of each resin film. The step of arranging the spacers in the central portion, the step of preparing a spacer having the same thickness as the cushioning material, and the step of arranging the spacers outside the laminated resin film. The step of arranging at the position corresponding to the marginal portion, the laminated cushioning material, the resin film made of a thermoplastic resin, the hard-to-adhere resin film, and the spacer are heated and pressed by a hot press plate, and the cushioning material, heat And a step of heat-sealing a resin film made of a plastic resin and a non-adhesive resin film.

According to this manufacturing method, metal fiber, glass fiber, or resin fiber molded into a plate shape is a resin film having an inner layer made of a thermoplastic resin, and an outer layer is difficult to adhere to a heated thermoplastic resin. Is a flexible resin film,
A pressing member having a buffering effect, which is wrapped with a resin film having a two-layer structure, can be produced by using a forming method similar to the pressing method for forming a multilayer substrate.

Further, in the above-mentioned pressing member, since the resin film of the outer layer, which is difficult to adhere, is attached only by the anchor effect due to the thermoplastic resin entering the concave portion of the surface, it can be easily peeled and removed. . Therefore, as described in claim 25, the cushioning material is removed by peeling and removing the non-sticking resin film from the fused cushioning material, the resin film made of a thermoplastic resin, and the non-sticking resin film. A pressing member that is wrapped in a resin film made of a thermoplastic resin can be easily manufactured.

Next, in order to achieve the third object, the pressing method according to claim 26 is a step of preparing a conductor pattern film in which a conductor pattern is formed on at least one surface of a film made of a thermoplastic resin. And a laminating step of laminating a plurality of resin films including the conductor pattern film, and pressing the laminated resin films while heating with a hot press plate to bond the resin films to each other to form a multilayer substrate. A press having air permeability between the hot press plate and the laminated resin film when the laminated resin film is pressed while being heated by the hot press plate, which comprises a heating / pressurizing step. It is characterized by interposing a member.

According to the above-mentioned pressing method, the resin film laminated by the hot press plate is overheated and pressed through the pressing member having air permeability.
Therefore, even if there is air pool between the laminated resin films due to the undulation of the resin film, the air passes through the resin film during heating and pressurization and is pressed in the direction along the surface of the hot press plate. It moves in the member for application and is discharged to the outside of the laminate of resin films (multilayer substrate).
Therefore, it is possible to prevent air from remaining between the resin films and generating a void in the multilayer substrate.

As described in the twenty-seventh aspect, it is desirable that the pressing member has a buffering effect of reducing the pressure difference applied from the hot press plate to each part of the resin film. As a result, it is possible to prevent the displacement of the conductor pattern as well.

As the pressing member having both air permeability and cushioning effect, as described in claim 28, a member obtained by molding at least one of metal fiber, glass fiber and resin fiber into a plate shape is applicable. Further, as described in claim 29, at least one of metal fiber, glass fiber and resin fiber formed in a plate shape may be wrapped with a resin cover having air permeability. By wrapping with a resin cover, it is possible to prevent fiber waste from adhering to the multilayer substrate.

Further, as described in claim 30, the resin cover has a two-layer structure in which an inner layer is a resin cover made of a thermoplastic resin and an outer layer is a resin cover which is hard to adhere to the heated resin film. It is preferable to have a structure. This can prevent the pressing member from adhering to the hot press plate and the multilayer substrate.

According to a thirty-first aspect, between the pressing member and the laminated resin film, the heated resin film is hard to adhere to and has flexibility and breathability. You may provide the sheet which has and carry out the said heating and pressurization process. By using such a sheet, it is possible to prevent the pressing member from adhering to the thermoplastic resin of the softened resin film.

[0049]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIGS. 1A to 1C are cross-sectional views showing a manufacturing process of a multilayer substrate according to this embodiment.

In FIG. 1A, reference numeral 21 denotes a conductor pattern 22 obtained by patterning a conductor foil (copper foil having a thickness of 18 μm in this example) attached to one side of a resin film 23 made of a thermoplastic resin by etching. It is a single-sided conductor pattern film having. In this example, as the resin film 23, a resin film having a thickness of 25 to 75 μm and composed of 65 to 35% by weight of polyetheretherketone resin and 35 to 65% by weight of polyetherimide resin is used. Also,
As the conductor foil, other metal foil such as aluminum foil can be used in addition to copper foil.

As shown in FIG. 1A, the conductor pattern 2
When the formation of 2 is completed, next, as shown in FIG. 1B, a carbon dioxide laser is irradiated from the resin film 23 side to form a via hole 24 which is a bottomed via hole having the conductor pattern 22 as a bottom surface. In forming the via hole 24, the output of the carbon dioxide laser, the irradiation time, and the like are adjusted so that no hole is formed in the conductor pattern 22.

For forming the via hole 24, an excimer laser or the like can be used in addition to the carbon dioxide gas laser. A method of forming a via hole such as drilling other than laser is also possible, but drilling with a laser beam is preferable because the hole can be drilled with a fine diameter and the conductor pattern 22 is less likely to be damaged.

As shown in FIG. 1B, the via hole 24
When the formation of is completed, next, as shown in FIG.
Conductive paste 5 which is an interlayer connecting material in the via hole 24
Fill with 0. The conductive paste 50 is made by adding a binder resin and an organic solvent to metal particles such as copper, silver and tin, and kneading the paste to form a paste.

The conductive paste 50 is formed by a screen printing machine using a metal mask with the via holes 24 with the conductor pattern 22 side of the single-sided conductor pattern film 21 facing downward.
Printed and filled inside. This is to prevent the conductive paste 50 filled in the via holes 24 from falling. The single-sided conductor pattern film 21 may be oriented with the conductor pattern 22 side other than the lower side as long as the conductive paste 50 has such a viscosity that it does not drop. In addition, the conductive paste 50 is filled into the via holes 24 by using a screen printer in this example, but other methods using a dispenser or the like may be adopted as long as the filling can be surely performed.

When the filling of the conductive paste 50 into the via holes 24 is completed, a plurality of single-sided conductor pattern films 21 (four in this example) are laminated as shown in FIG. 1 (d). At this time, the lower two single-sided conductor pattern films 21 have the side on which the conductor patterns 22 are provided as the lower side, and the upper two single-sided conductor pattern films 21 have the side on which the conductor patterns 22 are provided. Stack as the upper side.

That is, the center two single-sided conductor pattern films 21 are laminated so that the surfaces on which the conductor patterns 22 are not formed face each other, and the surfaces on which the conductor patterns 22 are formed and the conductor patterns 22 are formed on both surfaces. The two single-sided conductor patterns are laminated so that the surfaces not formed face each other.

As described above, in this embodiment, the single-sided conductor pattern film 21 having the conductor pattern 22 formed on only one side is used to form a multilayer substrate. For this reason, the film that constitutes the multilayer substrate can be formed only by the process and equipment for manufacturing the single-sided conductor pattern film 21, which is effective in simplifying the manufacturing equipment and reducing the manufacturing cost.

In this embodiment, the two central one-sided conductor pattern films 21 are laminated so that the surfaces on which the conductor patterns 22 are not formed face each other, and the remaining one-sided conductor pattern films 21 are the conductor patterns 22. The surface on which the conductor pattern 22 is formed and the surface on which the conductor pattern 22 is not formed are laminated so as to face each other. Therefore, while using the single-sided conductor pattern film 21, electrodes can be formed by the conductor pattern 22 on both surfaces of the multilayer substrate. Thus, electrodes for connecting to electronic components and external circuits can be formed on both surfaces of the multilayer substrate, so that high-density mounting or downsizing of the multilayer substrate can be achieved.

Regarding the single-sided conductor pattern film 21 located on the outermost surface, the conductor pattern 22 formed on the film is formed so as to include only the electrodes used for connection with the electronic components to be mounted. Preferably. In this case, the conductor pattern 22 including only electrodes
Wiring is performed by the conductor pattern 22 formed inside the multilayer substrate through the conductive paste 50.
This eliminates the need to form a resist film even when soldering or the like is performed on the electrodes.

After laminating the single-sided conductor pattern films 21 as shown in FIG. 1 (d), pressure is applied from both upper and lower sides of the film while heating with a heating press machine. This heating / pressurizing step will be described in detail with reference to FIG.

In FIG. 2, 10a and 10b are a pair of hot press plates, which are arranged so as to sandwich the laminated single-sided conductor pattern films 21 from both sides. The pair of hot press plates 10a and 10b are made of a conductive metal such as titanium, and generate heat when a current is applied. Alternatively, a heater is embedded in the hot press plates 10a and 10b and heated by the heater, or a hydraulic oil flow path is provided in the hot press plates 10a and 10b, and the heated hydraulic oil is fed into the flow path. The hot press plates 10a and 10b may be heated by flowing.

Since the contact surfaces of the pair of hot press plates 10a and 10b to the single-sided conductor pattern film 21 are formed flat, the single-sided conductor pattern film 21 laminated directly on the hot-pressed plates 10a and 10b is added. When pressed, the pressure applied to each part of the laminated film 21 may vary due to the unevenness of the surface of the single-sided conductor pattern film 21 located at the outermost surface or the unevenness of the inner-sided single-sided conductor pattern film 21. . As a result, the film 21
Only a part of the thermoplastic resin forming the part flows and the conductor pattern 22 is displaced.

Further, due to the waviness of the film 21 and the conductor patterns 22 arranged between the films 21, a gap may be formed between the single-sided conductor pattern films 21, and air may enter this gap. In such a case, the laminated film 21 with air remaining between the films 21
If they are adhered to each other, voids are generated in the formed multilayer substrate, which causes a problem such as delamination.

Therefore, in this embodiment, the hot press plate 1 is used.
0a, 10b directly to the single-sided conductor pattern film 2
Instead of pressurizing 1, the press members 12a, 12b having a cushioning effect and air permeability are provided between the hot press plates 10a, 10b and the laminated single-sided conductor pattern film 21. Member 1 for press having
Pressure is applied via 2a, 12b.

As the pressing members 12a and 12b having the cushioning effect and air permeability, for example, a metal such as stainless steel is cut into a fibrous shape, and the fibrous metal is molded into a plate shape, generally asbestos. What is called can be used. The hot press plates 10a, 10 are pressed by a press machine (not shown).
The pressure applied to the single-sided conductor pattern film 21 via b is a value in the range of 0.1 to 10 MPa, and the heat generation temperature of the hot press plates 10a and 10b is a value in the range of 200 to 350 ° C. Furthermore, the heating / pressurizing time is 10-40
Set to minutes. In order to be repeatedly used while being exposed to such high temperature and high pressure, the above-mentioned fibrous metal formed into a plate shape is most suitable. However,
As long as it can withstand the above high temperature and high pressure, it can be used as long as it functions as a pressing member having a cushioning effect and air permeability such as a resin sheet, a glass fiber or a resin fiber molded into a plate shape. is there.

Further, when the air between the films 21 is eliminated in advance by, for example, storing it in a decompression container or the like, the pressing members 12a and 12b only need to exert a cushioning effect, and therefore, for example, have heat resistance. It is also possible to use a rubber sheet or the like. On the other hand, when the cushioning effect is not necessary, for example, the pressing members 12a, 12 are made of porous ceramics having air permeability but no cushioning effect.
It is also possible to construct b.

Press members 12a, 1 having a cushioning effect
By using 2b, even if the surface of the laminated conductor pattern film 21 has irregularities, the pressing member 12
Since a and 12b are deformed according to the unevenness, it is possible to prevent an excessive pressure difference from occurring in each part of the single-sided conductor pattern film 21 with respect to the pressure applied from the hot press plates 10a and 10b. As a result, in the laminated single-sided conductor pattern films 21, it is possible to prevent only a part of the thermoplastic resin forming each single-sided conductor pattern film 21 from flowing. That is, since the entire laminated single-sided conductor pattern films 21 are subjected to pressure and are deformed substantially at the same time, it is possible to prevent the displacement of the conductor patterns 22 formed on the respective one-sided conductor pattern films 21.

Asbestos is pressed into the pressing members 12a, 12b.
When used as, a minute unevenness is formed on the surfaces of the pressing members 12a and 12b, and since the minute unevenness easily matches the unevenness on the surface of the single-sided conductor pattern film 21, it is easy to apply a more uniform pressure. There is also.

Further, the pressing member 12 having air permeability
By using a and 12b, the air that has entered the gap between the single-sided conductor pattern films 21 can be removed. The resin film 23 forming the one-sided conductor pattern film 21 has a property of allowing air to pass therethrough. Therefore, when the laminate of the single-sided conductor pattern film 21 is heated and pressed, the resin film 23 is pressed by the pressure.
The air that has entered the gap between the single-sided conductor pattern films 21 due to the close contact between the single-sided conductor pattern films 21 tries to move to the outside of the laminated body of the single-sided conductor pattern films 21 and permeates the resin film 23. At this time, since the pressing members 12a and 12b have air permeability, the air that has permeated the resin film 23 is not compressed by the pressing members 12Aa and 12Aa.
After reaching 12 b, it moves in the pressing members 12 a, 12 b in the direction along the surfaces of the hot press plates 10 a, 10 b and is discharged to the outside. Therefore, the single-sided conductor pattern film 21
It is possible to suppress the generation of voids in the multi-layer substrate due to air remaining in the gap.

The resin sheets 14a and 14b are made of polyimide.
Since b also has a property of transmitting air, the air that has passed through the resin film 23 of the single-sided conductor pattern film 21 reaches the pressing members 12a and 12b via the resin sheets 14a and 14b.

In the resin sheets 14a and 14b, even if the thermoplastic resin forming the conductor pattern film 21 is heated to the above temperature and softened, the melting temperature of the polyimide is higher than that temperature, and the elasticity due to the temperature rise is high. Since the decrease in the rate is small, the thermoplastic resin has the property of being hard to adhere to. Furthermore, since the resin sheet has a thickness of 100 μm or less and is very thin, it can be bent according to the surface irregularities of the single-sided conductor pattern film 21.

By providing the resin sheets 14a and 14b between the pressing members 12a and 12b having a cushioning effect and air permeability and the laminated one-sided conductor pattern film 21, the one-sided conductor pattern film located on the outermost surface is provided. It is possible to prevent the thermoplastic resin forming 21 from entering the inside of the pressing members 12a and 12b made of asbestos and adhering them. The resin sheets 14a, 14
As b, a high heat resistant resin such as polytetrafluoroethylene can be used, but polyimide is preferable because it has a high tensile strength and does not easily tear when it is separated from the single-sided conductor pattern film 21, and thus can be used repeatedly.

In the case of the pressing members 12a and 12b having a cushioning effect and air permeability, when the cushioning material is composed of metal fibers, glass fibers, resin fibers or the like, the fiber scraps may adhere to the multilayer substrate. Therefore, for example, a resin film made of polyimide or the like may be formed into a bag shape, and a cushioning material may be placed inside the bag, and the opening may be hermetically sealed.

As a result of the heating / pressurizing process described above, FIG.
As shown in (e), each single-sided conductor pattern film 21
Are glued to each other. That is, the resin film 23 is heat-sealed and integrated, and the conductive paste 50 in the via hole 24 connects the adjacent conductor patterns 22 to each other, and the electrodes 32 and 37 are provided on both surfaces of the multilayer substrate 1.
00 is obtained.

(Second Embodiment) Next, a second embodiment will be described with reference to the drawings.

In the first embodiment, the pressing method in which the conductor pattern of the single-sided conductor pattern film 21 located on the outermost surfaces on both sides of the laminate of the single-sided conductor pattern film 21 is already patterned at the time of lamination has been described. In the pressing method of the second embodiment, the single-sided conductor pattern film 21 located on the outermost surfaces on both sides is covered with the unpatterned copper foil 22a at the time of stacking, and the heating / pressurizing step is performed in this state. It is something to do. The same parts as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

Conductor pattern 2 shown in FIGS. 3 (a) to 3 (c)
The steps of forming 2, forming the via hole 24, and filling the conductive paste 50 are the same as those in FIGS. 1A to 1C.

When the filling of the conductive paste 50 into the via holes 24 is completed, as shown in FIG.
Similar to (d), a plurality of single-sided conductor pattern films (four in this example) are laminated. At this time, the single-sided conductor pattern film 41 located on the outermost surfaces on both sides has the copper foil 22a on which no pattern is formed attached. And
Two single-sided conductor pattern films 21, 41 on the lower side
Is the two single-sided conductor pattern films 2 on the upper side, with the side on which the conductor pattern 22 and the copper foil 22a are provided being the lower side.
1, 41 are stacked with the side on which the conductor pattern 22 and the copper foil 22a are provided as the upper side.

The one-sided conductor pattern film 41 having the unpatterned copper foil 22a was formed by adhering the copper foil 22a, which is the conductor foil before pattern formation, without forming the conductor pattern 22 shown in FIG. 3 (a). Figure 3 on the film
The via hole 24 shown in (b) is formed and the conductive paste 50 shown in FIG. 3 (c) is filled.

After laminating the single-sided conductor pattern films 21 and 41 as shown in FIG. 3D, the hot press plate 10 is formed from the upper and lower surfaces of these films in the same manner as described in FIG.
Pressurize while heating with a and 10b.

As a result, the single-sided conductor pattern film 21 and the single-sided conductor pattern film 41 are bonded to each other, as shown in FIG. 3 (e). That is, the resin films 23 are heat-sealed and integrated, and the conductive paste 50 in the via holes 24 connects the adjacent conductor patterns 22 and the copper foils 22a to each other, and the copper foils 22a are formed on the outermost surfaces on both sides. A multi-layer substrate 103 for covering is obtained.

In the method of manufacturing the above-mentioned multilayer substrate, the process shown in FIG.
In the heating / pressurizing step shown in (e), since the copper foils 22a are attached to the outermost surfaces on both sides of the multilayer substrate 103, the surface is flat. However, even if the surface is flat, the film 21 laminated by the concavo-convex pattern on the single-sided conductor pattern film 21 of the inner layer of the multilayer substrate 103
The resistance force in the direction of compressing may vary depending on the site. In such a case, in the heating / pressurizing process, the pressure is concentrated on the portion having high resistance.

Therefore, the hot press plate 1 is also used in this embodiment.
Pressing members 12a and 12b having a buffering effect are provided between 0a and 10b and the multilayer substrate 103, and a heating / pressurizing process is performed. As a result, even if the inner layer of the laminated single-sided conductor pattern film 21 has a portion having a large resistance force in the compression direction, the pressing members 12a and 12b having the cushioning effect at the portion corresponding to the portion shrinks and the resistance is increased. A member 1 for a press having a cushioning effect in a region where the force is small.
The copper foil 22a is pressed without the shrinkage of 2a and 12b. At this time, since the copper foil 22a is formed to be very thin and heat is applied, it is easily deformed according to the magnitude of the above-mentioned resistance.

As described above, by providing the pressing members 12a and 12b having a cushioning effect, it is possible to apply pressure not only to a portion having a large resistance force in the compression direction but also to a portion having a small resistance force at the same time. The pressure difference applied to each part can be reduced. As a result, in the laminated single-sided conductor pattern films 21 and 41, it is possible to prevent the flow amount of a part of the thermoplastic resin forming each of the films 21 and 41 from increasing, and the entire laminated conductor pattern films 21 Since they are deformed at the same time, the displacement of the conductor pattern 22 formed on each film can be prevented.

Further, in this way, the outermost surfaces on both sides are covered with the copper foil 22.
In the pressing method of the multilayer substrate 103 covered by a, when the laminated single-sided conductor pattern films 21 and 41 are heated and pressed, the thermoplastic resin is not exposed on the outermost surface of the laminated body, so Press members 12a, 12
It can prevent b from adhering.

Then, the copper foils 2 on both surfaces of the multilayer substrate 103
The pattern 2a is formed by etching or the like after the heating / pressurizing step. As a result, a multi-layered substrate having conductor patterns including electrodes or wirings on both surfaces can be obtained.

(Third Embodiment) Next, a third embodiment will be described with reference to the drawings.

In the first embodiment, the conductor pattern 22 is formed on the one-sided conductor pattern film 21 located on the outermost surface, and the conductor pattern 22 constitutes a convex portion.

In the third embodiment, the resist film 36 is formed so as to expose only the portion of the conductor pattern 22 that will be an electrode, and this resist film 36 becomes a convex portion. The same parts as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

Conductor pattern 2 shown in FIGS. 4 (a) to 4 (c)
The steps of forming 2, forming the via hole 24, and filling the conductive paste 50 are the same as those in FIGS. 1A to 1C.

When the filling of the conductive paste 50 into the via holes 24 is completed, as shown in FIG. 4D, a plurality of single-sided conductor pattern films 21 with the side on which the conductor patterns 22 are provided as the lower side (this example) are used. Then, the single-sided conductor pattern film 31 having through holes not filled with the conductive paste 50 is laminated on the upper side of these layers with the side on which the conductor pattern 22 is provided as the lower side.

Here, the single-sided conductor pattern film 31
In the same manner as the step of forming the via hole 24 shown in FIG. 4B, the through hole 33 is drilled so as to expose the electrode 32.

Further, the lowermost conductor pattern 2 is provided on the lower side of the laminated single-sided conductor pattern films 21.
A resist film 36 is laminated so as to cover 2. The resist film 36 has a hole 38 formed at a position corresponding to the electrode 37 of the lowermost conductor pattern 22. The resist film 36 has a resin film 2 in consideration of ensuring adhesiveness with the resin film 23 and easiness of recycling.
It is composed of the same material as 3.

After the single-sided conductor pattern film 21, the single-sided conductor pattern film 31, and the resist film 36 are laminated as shown in FIG. 4 (d), the same method as described with reference to FIG. Heat press plate 10a,
Pressurize while heating with 10b.

As a result, as shown in FIG. 4E, the single-sided conductor pattern films 21 and 31 and the resist film 3 are formed.
6 are glued together.

As described above, even when the single-sided conductor pattern film 31 having the through holes 33 formed therein or the resist film 36 having the openings 38 formed therein causes unevenness,
By applying pressure through the pressing members 12a and 12b having a buffering effect, the pressure applied to each part of the laminated single-sided conductor pattern films 21 and 31 and the resist film 36 can be brought close to uniform, so that the conductor pattern 2
The position shift of 2 can be prevented.

(Fourth Embodiment) Next, a fourth embodiment will be described with reference to the drawings.

In the fourth embodiment, the conductor patterns on both surfaces of the multilayer substrate 102 including the electrodes 32 and 37 are formed after forming the multilayer structure. The same parts as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

Conductor pattern 2 shown in FIGS. 5 (a) to 5 (c)
The steps of forming 2, forming the via hole 24, and filling the conductive paste 50 are the same as those in FIGS. 1A to 1C.

When the filling of the conductive paste 50 into the via holes 24 is completed, as shown in FIG. 5D, a plurality of single-sided conductor pattern films 21 are formed with the side on which the conductor patterns 22 are provided being the lower side (this example). Then, two copper foils are laminated, and a copper foil (copper foil having a thickness of 18 μm in this example) 61 which is a conductor foil is laminated on the upper side thereof.

On the lower side of the laminated multi-sided single-sided conductor pattern film 21, the conductor pattern 22 shown in FIG. A single-sided conductor film 41, on which the via holes 24 shown in FIG. 5B and the conductive paste 50 shown in FIG. 5C are filled, is laminated on the attached film.

After the copper foil 61, the one-sided conductor pattern film 21 and the one-sided conductor film 41 are laminated as shown in FIG. 5 (d), they are hot-pressed from the upper and lower surfaces thereof in the same manner as described with reference to FIG. Pressurization is performed while heating with the plates 10a and 10b.

As a result, the copper foil 61, the one-sided conductor pattern film 21 and the one-sided conductor pattern film 41 are bonded to each other, as shown in FIG. 5 (e). The resin films 23 are heat-sealed to be integrated with each other, and the conductive paste 50 in the via holes 24 performs interlayer connection between the adjacent conductor patterns 22 and the copper foils 22a and 61,
A multilayer substrate 102 having both surfaces covered with the copper foils 22a and 61 is obtained.

As described above, in the pressing method for the multilayer substrate 102 whose both surfaces are covered with the copper foils 22a and 61, the thermoplastic resin is exposed on the outermost surfaces on both sides of the laminated body when the laminated conductor pattern films are heated and pressed. Therefore, the softened thermoplastic resin and the pressing members 12a and 12b can be prevented from adhering to each other.

When the multilayer substrate 102 is obtained, FIG.
The copper foils 22a and 61 are patterned by etching as shown in FIG. Next, a resist film 36a is laminated so as to cover the uppermost conductor pattern 62 of the multilayer substrate 102, and a resist film 36b is so covered as to cover the lowermost conductor pattern 22.
Are stacked.

An opening 39 is formed in the resist film 36a so as to expose the electrode 32 at a position corresponding to the electrode of the uppermost conductor pattern 62. In addition, the lowermost conductor pattern 22 is formed on the resist film 36b.
The opening 38 is drilled so as to expose the electrode 37, corresponding to the position to be the electrode. In this example, the resist films 36a and 36b are made of the same material as the resin film 23.

After stacking the resist films 36a and 36b,
Pressurization is applied from both the upper and lower surfaces while heating with the hot press plates 10a and 10b. As a result, as shown in FIG. 5H, the multilayer substrate 102 and the resist films 36a and 36b are adhered to each other, and the multilayer substrates 1 provided with the electrodes 32 and 37 on both surfaces.
02 is obtained.

In the manufacturing method of the above-mentioned multilayer substrate, as shown in FIG.
In the heating / pressurizing step shown in (e), since the copper foils 22a and 61 are attached to both surfaces of the multilayer substrate 102, the surface thereof is flat. However, similar to the second embodiment, even if the surface is flat, the resistance force in the direction of compressing the film 21 laminated by the uneven pattern on the single-sided conductor pattern film 21 of the inner layer of the multilayer substrate 102 may vary depending on the part. May be different. In such a case, in the heating / pressurizing process, the pressure is concentrated on the portion having high resistance.

Therefore, also in this embodiment, the hot press plate 1 is used.
Press members 12a and 12b having a cushioning effect are provided between 0a and 10b and the multilayer substrate 102, and a heating / pressurizing step is performed. As a result, in the laminated single-sided conductor pattern films 21, it is possible to prevent the flow rate of a part of the thermoplastic resin forming each film 21 from increasing, and the entire laminated conductor pattern films 21 are simultaneously deformed. The position shift of the conductor pattern 22 formed on each film can be prevented.

(Fifth Embodiment) In the present embodiment, in order to prevent the displacement of the conductor pattern 22 more reliably in the heating / pressurizing step of the laminated resin film in the above-mentioned first to fourth embodiments, Only the central part of the resin film is heated and pressed.

The hot press plates 10a and 10b and the pressing members 12a and 12b having a cushioning effect shown in FIG. 2 have a larger area than the single-sided conductor pattern film 21 to be laminated, and the entire surface of the single-sided conductor pattern film 21 is heated. And pressure was being applied. In this case, the single-sided conductor pattern film 2
The resin film 23 constituting 1 flows as a whole from the central portion toward the peripheral portion when heat and pressure are applied. If the flow amount becomes excessive, the position of the conductor pattern may be displaced from the initial position even if the entire multilayer substrate is deformed at the same time.

Therefore, in this embodiment, heat and pressure are applied only to the central portion of the laminated single-sided conductor pattern film 21, and heat and pressure are not applied to the peripheral portion surrounding the central portion. As a result, it is possible to prevent the resin from excessively flowing from the central portion to the peripheral portion,
The displacement of the conductor pattern 22 can be prevented more reliably.

The present embodiment will be specifically described below with reference to FIGS. 6 to 8.

In the example shown in FIG. 6, pressing members 12a and 12b having an area corresponding to the central portion 80 of the laminated single-sided conductor pattern film 21 and having a cushioning effect are used. Therefore, the hot press plate is used as the press members 12a, 1
Even if it has an area larger than 2b, the pressing member 12
laminated single-sided conductor pattern film 21 via a and 12b
Is heated and pressurized, heat and pressure are applied only to the central portion 80. In other words, since heat and pressure are not applied to the peripheral portion 70 that surrounds the central portion 80 from the four sides, the resin of the peripheral portion 70 does not deform.

Therefore, the central portion 8 to which heat and pressure are applied
Since the resin of 0 cannot flow toward the peripheral portion 70, excessive flow of the resin in the central portion 80 can be prevented. Thereby, the displacement of the conductor pattern 22 formed on the resin film 23 in the central portion 80 can be more reliably prevented.

In the example shown in FIG. 6, the central portion 80
Is a product part used as a multi-layer substrate, and the peripheral part 70 that is not bonded to each other is separated from the product part after the heating / pressurizing process.

Laminated single-sided conductor pattern film 21
In order to apply heat and pressure only to the central portion 80 of the press member 12a, 12b having a cushioning effect, the central portion 80
7, the hot press plates 10a and 10b may have an area corresponding to the central portion 80 as shown in FIG. 7, or as shown in FIG. In addition, the central portion 80 is provided between the hot press plates 10a and 10b and the pressing members 12a and 12b having a cushioning effect.
Intermediate plates 90a and 90b having an area corresponding to the above may be provided. The intermediate plates 12a and 12b have good heat conduction efficiency, and the intermediate plates 12a and 12b can be connected to the pressing member 12 from the hot press plates 10a and 10b.
It is composed of a SUS plate or the like capable of transmitting a pressing force to a and 12b.

(Sixth Embodiment) Similar to the fifth embodiment described above, this embodiment is also intended to more reliably prevent the displacement of the conductor pattern 22 in the heating / pressurizing step of the laminated resin film. .

The sixth embodiment will be described below with reference to FIG.

In FIG. 9, a rectangular ring-shaped conductor pattern 25 is provided in the peripheral portion of the laminated single-sided conductor pattern films 21 so as to surround the central portion 80. The hot press plates 10a, 10b and the pressing members 12a, 12b having a cushioning effect have an area that covers the central portion 80 and the peripheral portion 70, and the central portion 80 and the peripheral portion of the laminated single-sided conductor pattern film 21. The part 70 is heated and pressurized.

In the present embodiment, since the quadrangular ring-shaped conductor pattern 25 is provided on each film of the single-sided conductor pattern film 21 to be laminated, at the time of heating / pressurizing, these conductor patterns 25 are made of resin of each layer. It is embedded in the film 23. For this reason, the conductor pattern 25 surrounds the periphery of the central portion 80 from all sides, which impedes the flow of the resin from the central portion 80 to the peripheral portion 70. Therefore, it is possible to prevent the positional displacement of the conductor pattern 22 formed on the resin film 23 inside the rectangular annular conductor pattern 25.

The ring-shaped conductor pattern 25 may be formed outside the region to be a product as a multi-layer substrate and separated from the product portion after the process of forming the multi-layer substrate.

Further, the annular conductor patterns 25 formed on the peripheral portion of each one-sided conductor pattern film 21 are preferably connected to each other through a conductive paste over substantially the entire circumference thereof. As a result, the resin in the central portion 80 is completely surrounded by the conductor pattern 25 and the conductive paste, so that the excessive flow of the resin in the central portion 80 can be prevented more reliably.

(Seventh Embodiment) This embodiment is intended to prevent dust generated from the cushioning material from adhering to the conductor pattern film in the heating / pressurizing step of the laminated resin films.

The seventh embodiment will be described below with reference to FIG.

In FIG. 10, 120a and 120b are cushioning materials, which are covered with resin covers 110a and 110b. That is, when the laminated resin film 21 is hot-pressed by the hot-press plates 10a and 10b, the pressing members 12a and 12b interposed between the two are:
Instead of the mere cushioning materials 120a and 120b, a cushioning material whose entire circumference is covered with the resin covers 110a and 110b is used. In addition, the resin cover 110 during heating and pressurization
a and 110b are multilayer substrates or hot press plates 10a and 1
0b, in order to prevent adhesion with 0b.
Resin sheet 1 made of polyimide on both sides of a and 12b
4a and 14b are inserted. Other configurations are similar to those in FIG.

In this embodiment, the cushioning materials 120a and 120b are used.
As the material, metal fiber, glass fiber, resin fiber or the like can be used. The cushioning materials 120a and 120b are resin covers 110.
Since it is completely wrapped by a and 110b, debris such as fibers are not discharged to the outside from the cushioning materials 120a and 120b during hot pressing, so that debris can be prevented from adhering to the single-sided conductor pattern film 21. Further, when the heating / pressurizing step is carried out in a vacuum atmosphere, waste is not discharged, so that the filter of the vacuum pump is not polluted.

As the resin covers 110a and 110b,
Thermoplastic resins such as polyetheretherketone, polyetherimide, polyethersulfone, thermoplastic polyimide, and thermoplastic liquid crystal polymer can be used. Further, as the resin covers 110a and 110b, the inner layer is a thermoplastic resin cover such as polyetheretherketone, polyetherimide, polyethersulfone, thermoplastic polyimide, or thermoplastic liquid crystal polymer, and the outer layer is a polyimide or polytetrafluoroethylene. It is possible to use a resin cover having a two-layer structure which is a heated thermoplastic resin such as silicone rubber and a non-stick resin cover.

In particular, when a resin cover having a two-layer structure is used as the resin covers 110a and 110b, the multi-layer substrate and the hot press plate 10 are operated by the action of the resin cover which is hard to adhere to the outer layer.
Adhesion with a and 10b can be prevented. Therefore, in FIG. 10, it is possible to eliminate the resin sheets 14a and 14b for preventing adhesion to the multilayer substrate and the hot press plates 10a and 10b.

(Eighth Embodiment) In this embodiment, pressing members 12a and 12b having a cushioning effect, which are wrapped in a resin cover shown in FIG. 10, are formed in the same manner as the pressing method for forming a multilayer substrate. It is manufactured by the method. This eliminates the need for new equipment for producing the pressing members 12a and 12b, thereby reducing the cost of equipment and labor for equipment maintenance.

The eighth embodiment will be described below with reference to FIG.

In FIG. 11A, 10a and 10b are a pair of hot press plates, which are similar to those shown in FIG. In FIG. 11A, 120 is a cushioning material, and 111 is a resin film made of a thermoplastic resin. The cushioning material 120 is composed of the two thermoplastic resin films 11
1 and is arranged in the central part so as to form a marginal part to be attached to the peripheral part of each thermoplastic resin film 111.

As the cushioning material 120, metal fiber, glass fiber, resin fiber or the like can be used. In this embodiment, a metal such as stainless steel is cut into a fiber shape and the fibrous metal is molded into a plate shape. Further, as the thermoplastic resin film 111, polyether ether ketone, polyether imide, polyether sulfone, thermoplastic polyimide, thermoplastic liquid crystal polymer, or the like can be used. In this embodiment, a thermoplastic resin film composed of 65 to 35% by weight of polyetheretherketone resin and 35 to 65% by weight of polyetherimide resin, which is the same as the multilayer substrate, is used.

In FIG. 11A, reference numeral 112 is a resin film which is difficult to adhere to the heated thermoplastic resin. Resin film 112 that is difficult to adhere to the heated thermoplastic resin
A resin film made of polyimide, polytetrafluoroethylene, silicone rubber or the like can be used. In this embodiment, a resin film made of polyimide is used.

Reference numeral 130 is a spacer having the same thickness as the cushioning material, and one of the difficult-to-adhere resin film 112 and the hot press plate 1
It is placed between 0a and at a position corresponding to the mounting margin. The material of the spacer is not particularly limited as long as it can ensure heat resistance during hot pressing. For example, the same material as the cushioning material 120, such as stainless steel, may be cut into a fibrous shape, and the fibrous metal may be molded into a plate shape.

As shown in FIG. 11B, the hot press plate 1
The resin films 111 and 112 are thermocompression-bonded with 0a and 10b, and the cushioning material 120 is attached to the resin film 1 for preventing dust adhesion.
A pressing member 12 in which 11 and the thermoplastic resin are wrapped in a resin film 112 that is hard to adhere can be manufactured.

As the thermoplastic resin film 111, the same polyetheretherketone resin 65 to 35% by weight as the multilayer substrate of this embodiment and the polyetherimide resin 35 to 35 are used.
When a film made of a thermoplastic resin composition consisting of 65% by weight is used, the hot pressing condition is that the pressure is 0.1 to 1
The value is in the range of 0 MPa, and the hot press plates 10a, 10b
The exothermic temperature is in the range of 200 to 350 ° C., and the heating / pressurizing time is about 10 minutes.

By the heating / pressurizing process described above, FIG.
As shown in (c), the buffer material 120 and the non-adhesive resin film 112 are gently adhered by the thermoplastic resin film 111 so that the buffer material 120 covers the thermoplastic resin film 111 and the non-adhesive resin. The pressing member 12 is obtained by being wrapped in a resin cover having a two-layer structure with the cover of the film 112.

The pressing member 12 having the two-layer structure can be used as it is for a pressing method for a multilayer substrate. On the other hand, in this two-layer structure press member, the resin film 112, which is difficult to adhere to the outer layer, is simply attached to the thermoplastic resin film 111 due to the anchor effect due to the thermoplastic resin entering into the recesses on the surface. It can be peeled off and removed. Therefore, as shown in FIG. 11D, the outer layer of the resin film 112 that is hard to adhere is peeled off from the two-layer structure pressing member 12 and used only for the cushioning material 120 and the thermoplastic resin film 111. The member 12 can also be subjected to a pressing method for a multilayer substrate.

(Other Embodiments) In each of the above embodiments, the resin film 23 and the resist films 36, 36a,
Polyether ether ketone resin 65-3 as 36b
Although a resin film composed of 5 wt% and a polyetherimide resin of 35 to 65 wt% was used, the present invention is not limited to this, and may be a film obtained by filling a polyether ether ketone resin and a polyether imide resin with a filler. It is also possible to use polyetheretherketone (PEEK) or polyetherimide (PEI) alone.

Further, as a resin film or a resist film,
Polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyether sulfone (P
ES), thermoplastic polyimide, so-called liquid crystal polymer, or the like may be used. Alternatively, P on the polyimide film
You may use the structure which laminated | stacked the layer which consists of a thermoplastic resin of EEK, PEI, PEN, PET, PES, a thermoplastic polyimide, and a liquid crystal polymer at least. Any resin film can be suitably used as long as it can be adhered by hot pressing and has a heat resistance necessary for a soldering process which is a post process.

When a laminate of a thermoplastic resin layer on a polyimide film is used, the coefficient of thermal expansion of polyimide is about 15 to 20 ppm and the coefficient of thermal expansion of copper (17 .About.20 ppm), it is possible to prevent the occurrence of peeling, warpage of the substrate, and the like.

Further, in each of the above-mentioned embodiments, the material for interlayer connection is the conductive paste 50, but if it is possible to fill the via hole, it may be in the form of a paste instead of a paste.

Further, in the above-mentioned first to fourth embodiments,
Although the multilayer substrates 100, 101, 102, and 103 were four-layer substrates, it goes without saying that the number of layers is not limited as long as they have a plurality of conductor pattern layers.

Furthermore, in each of the above-mentioned embodiments, an example of forming a multi-layer substrate from the single-sided conductor pattern film 21 has been described, but a double-sided conductor pattern film may be used to form the multi-layer substrate. For example, a plurality of double-sided conductor pattern films may be prepared, and they may be laminated via a film in which an interlayer connecting material is filled in via holes,
You may laminate a single-sided conductor pattern film on both surfaces of one double-sided conductor pattern film, respectively.

[Brief description of drawings]

FIG. 1 is a cross-sectional view for each process showing a schematic manufacturing process of a multilayer substrate according to a first embodiment of the present invention.

FIG. 2 is an explanatory diagram for explaining a heating / pressurizing step.

FIG. 3 is a cross-sectional view for each process showing a schematic manufacturing process of a multilayer substrate according to a second embodiment of the present invention.

FIG. 4 is a sectional view for each step showing the schematic manufacturing process of the multilayer substrate according to the third embodiment of the present invention.

FIG. 5 is a sectional view for each step showing a part of the schematic manufacturing process of a multilayer substrate according to a fourth embodiment of the present invention.

FIG. 6 is an explanatory diagram for explaining a heating / pressurizing step in the fifth embodiment.

FIG. 7 is an explanatory diagram for explaining a first modified example of the heating / pressurizing step in the fifth embodiment.

FIG. 8 is an explanatory diagram for explaining a second modified example of the heating / pressurizing step in the fifth embodiment.

FIG. 9 is an explanatory diagram for explaining a heating / pressurizing step in the sixth embodiment.

FIG. 10 is an explanatory diagram for explaining a heating / pressurizing step in a seventh embodiment.

FIG. 11 is a sectional view for each step showing the schematic manufacturing process of the pressing member in the eighth embodiment.

[Explanation of symbols]

21, 31, 41 Single-sided conductor pattern film 22, 62 conductor pattern 22a, 61 Copper foil (conductor foil) 23 Resin film 24 beer hall 32, 37 electrodes 36, 36a, 36b Resist film 50 Conductive paste (interlayer connection material) 100, 101, 102, 103 Multilayer substrate 120, 120a, 120b cushioning material 110a, 110b resin cover 12, 12a, 12b Pressing member having cushioning effect

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) B29C 43/32 B29C 43/32 H05K 1/11 H05K 1/11 N 3/28 3/28 B 3/40 3/40 K // B29L 9:00 B29L 9:00 (72) Inventor Kazuyoshi Nakamura 1-1, Showa-machi, Kariya city, Aichi prefecture DENSO (72) Inventor Yoshiaki Sakai 1-Showa-machi, Kariya city, Aichi prefecture 1-chome DENSO Co., Ltd. (72) Inventor Hidetada Kajino 1-1-chome Showa-cho, Kariya city, Aichi Prefecture Stock company DENSO (72) Inventor Shintaro Asanuma 1-chome, Showa-cho, Kariya city, Aichi share-company F term in DENSO (reference) 4F204 AA32 AA40 AA49 AD03 AD16 AG03 AH36 AM32 FA01 FB01 FB11 FB22 FN11 FN15 FQ19 5E314 AA26 BB06 CC15 DD07 FF01 GG03 5E317 AA24 BB01 BB12 BB14 BB19 GG20EGG14 GG14 346 AA26 AA29 AA43 CC02 CC08 CC10 CC32 CC33 CC39 DD02 DD12 DD32 EE02 EE06 EE07 EE08 EE15 FF18 GG19 GG22 GG23 GG28 HH07 HH11 HH17 HH33 HH40

Claims (32)

[Claims] 1. A step of preparing a conductor pattern film in which a conductor pattern is formed on at least one surface of a film made of a thermoplastic resin, a step of laminating a plurality of resin films containing the conductor pattern film, and a step of laminating A heating / pressing step of adhering the resin films to each other to form a multilayer substrate by heating and pressing the resin film with a hot pressing plate, and heating the laminated resin film with the hot pressing plate. And a press member having a buffering effect is interposed between the hot press plate and the laminated resin film in order to reduce the pressure difference applied from the hot press plate to each part of the resin film when applying pressure. The press method characterized by that. 2. The pressing member having a cushioning effect,
The pressing method according to claim 1, wherein a pressing force is transmitted from the hot press plate to the laminated resin film while deforming according to the surface irregularities of the laminated resin film. 3. The pressing member having the cushioning effect,
3. The pressing method according to claim 1, wherein the pressing method is a plate-shaped rubber formed of metal fiber, glass fiber, or resin fiber, or plate-shaped rubber. 4. The pressing member having the cushioning effect,
3. The pressing method according to claim 1, wherein a metal fiber, a glass fiber, or a resin fiber molded into a plate shape is wrapped with a resin cover made of a thermoplastic resin. 5. A heated resin film and a non-adhesive and flexible sheet are further provided between the pressing member having the cushioning effect and the laminated resin film,
2. The heating / pressurizing step is performed.
The pressing method according to any one of 1 to 4. 6. The heated resin film and the non-adhesive and flexible sheet have a melting point higher than the heating temperature in the heating / pressurizing step.
The described press method. 7. The heating / pressurizing step is further provided by further providing a heated resin cover and a non-adhesive flexible sheet between the pressing member having the cushioning effect and the hot press plate. The pressing method according to any one of claims 4 to 6, which is performed. 8. The heated resin film and the hard-to-adhere and flexible sheet have a melting point higher than the heating temperature in the heating / pressurizing step.
The described press method. 9. The pressing member having a cushioning effect,
A metal cover, a glass fiber, or a resin fiber formed into a plate shape is a resin cover having an inner layer made of a thermoplastic resin, and an outer layer is a resin cover that is hard to adhere to the heated thermoplastic resin. The press method according to claim 1 or 2, wherein the resin cover is wrapped in a layered resin cover. 10. The pressing method according to claim 9, wherein the resin cover that is hard to adhere to the heated thermoplastic resin has a melting point higher than a heating temperature in the heating / pressurizing step. 11. Corresponding to the step of forming a resist film on the surface of the laminated resin film where the conductor pattern is exposed, and the position of the conductor pattern covered by the resist film to be an electrode. And a step of forming a hole in the resist film, wherein after forming the hole in the resist film, the laminated resin film and the resist film are heated and pressed to form a multilayer substrate. The pressing method according to any one of 10. 12. The pressing method according to claim 11, wherein the resist film is formed of the same material as the film. 13. The conductive pattern formed on the conductive pattern film located on the outermost surface of the laminated resin films comprises only electrodes used for connection with electronic components to be mounted. The pressing method according to any one of 1 to 10. 14. A via hole is formed in the resin film to be laminated, and by filling the via hole with a conductive paste, the conductor pattern of each layer is electrically connected through the conductive paste. The described press method. 15. The conductor pattern film has a conductor pattern formed on only one surface thereof, and a bottomed via hole having the conductor pattern as a bottom surface is formed, and the bottomed via hole is filled with a conductive paste. 15. The pressing method according to claim 1, wherein the conductor pattern of the conductor pattern film laminated via the conductive paste is brought into conduction. 16. When laminating a predetermined number of the conductor pattern films, two arbitrary conductor pattern films are laminated so that the surfaces on which the conductor patterns are not formed face each other, and the remaining conductor pattern films are 16. The layer according to claim 15, wherein the surface on which the conductor pattern is formed and the surface on which the conductor pattern is not formed are laminated so as to face each other, and electrodes based on the conductor pattern are formed on both surfaces of the multilayer substrate. Press construction method. 17. When laminating a predetermined number of the conductor pattern films, the conductor pattern films located on the outermost surfaces on both sides of the multilayer substrate are conductor pattern films having conductor foil before pattern formation. The pressing method according to claim 16. 18. When laminating a predetermined number of the conductor pattern films, the conductor pattern films are laminated in the same direction so that the resin film side and the conductor pattern side of adjacent conductor pattern films face each other, and are located on the outermost surface of one side. Is a conductor pattern film having a conductor foil before pattern formation on the outermost surface side, wherein the conductor foil is laminated so as to cover the resin film of the conductor pattern film located on the other outermost surface. 15. The pressing method described in 15. 19. In the step of forming the multilayer substrate, heat and pressure are applied to the central portion of the laminated resin films from the hot press plate, and heat and pressure are applied to the peripheral portion of the resin film surrounding the central portion. 2. The pressing method according to claim 1, wherein no is added. 20. At least one of the hot press plate and the pressing member having a cushioning effect has an area corresponding to the central portion of the laminated resin films, so that heat and pressure are applied only to the central portion. 20. The pressing method according to claim 19, characterized in that 21. An intermediate plate having an area corresponding to the central portion of the laminated resin films is provided between the hot press plate and the pressing member having the cushioning effect, so that only the central portion is provided. The pressing method according to claim 19, wherein heat and pressure are applied. 22. An annular conductor pattern is provided in the peripheral portion of each layer of the laminated resin films so as to surround the central portion, and the hot press plate is laminated via the pressing member having the cushioning effect. 2. A central portion and a peripheral portion of the resin film are heated and pressed.
The described press method. 23. The ring-shaped conductor pattern formed on the peripheral portion of each layer of the resin film is connected to each other via a conductive paste over substantially the entire circumference thereof. The described press method. 24. A step of preparing a cushioning material made of metal fibers, glass fibers, or resin fibers molded in a plate shape, and a thermoplastic resin having a mounting margin portion for wrapping the cushioning material in a peripheral portion. The step of preparing at least two resin films made of
A step of preparing one sheet, a step of inserting and laminating a resin film made of the at least two sheets of thermoplastic resin between the two pieces of non-stick resin film; Between the resin films made of a thermoplastic resin, a step of arranging the resin films in the central portion so as to form the mounting margin portion in the peripheral portion of each resin film, and a spacer having the same thickness as the cushioning material are prepared. A step of arranging the spacer at a position corresponding to the mounting margin portion on the outer side of the laminated resin film, a cushioning material laminated as described above, a resin film made of a thermoplastic resin, A step of heating and pressing the adhesive resin film and the spacer with a hot press plate to heat-bond the cushioning material, the resin film made of a thermoplastic resin, and the difficult-to-adhere resin film. It characterized Rukoto, a method for manufacturing a press member which buffer material is encased in the resin film and the flame-adhesive resin film made of thermoplastic resin. 25. A step of preparing a cushioning material made of metal fibers, glass fibers, or resin fibers molded in a plate shape, and a thermoplastic resin having a mounting margin portion for wrapping the cushioning material in a peripheral portion. The step of preparing at least two resin films made of
A step of preparing one sheet, a step of inserting and laminating a resin film made of the at least two sheets of thermoplastic resin between the two pieces of non-stick resin film, Between the resin films made of a thermoplastic resin, a step of arranging the resin films in the central portion so as to form the attachment margin portion in the peripheral portion of each resin film, and a spacer having the same thickness as the cushioning material are prepared. A step of arranging the spacer at a position corresponding to the mounting margin portion on the outer side of the laminated resin film, a cushioning material laminated as described above, a resin film made of a thermoplastic resin, A step of heating and pressing the adhesive resin film and the spacer with a hot press plate to heat-bond the cushioning material, the resin film made of a thermoplastic resin, and the difficult-to-adhere resin film; The cushioning material is made of a thermoplastic resin, and a step of peeling and removing the non-adhesive resin film from the attached cushioning material, a resin film made of a thermoplastic resin, and the non-adhesive resin film. A method for producing a pressing member which is wrapped in a resin film. 26. A step of preparing a conductor pattern film in which a conductor pattern is formed on at least one surface of a film made of a thermoplastic resin, a step of laminating a plurality of resin films containing the conductor pattern film, and a step of laminating A heating / pressing step of adhering the resin films to each other to form a multilayer substrate by heating and pressing the resin film with a hot pressing plate, and heating the laminated resin film with the hot pressing plate. A pressing method characterized in that a pressing member having air permeability is interposed between the hot press plate and the laminated resin film when pressing is performed. 27. The pressing method according to claim 26, wherein the pressing member has a buffering effect of reducing a pressure difference applied from the hot press plate to each part of the resin film. 28. The pressing member is formed by molding at least one of a metal fiber, a glass fiber, and a resin fiber into a plate shape.
Press method described in. 29. The pressing member is characterized in that at least one of metal fiber, glass fiber, and resin fiber is formed into a plate shape and is wrapped with a resin cover having air permeability. Claim 26 to Claim 28
The pressing method described in any one of 1. 30. The resin cover has a two-layer structure in which an inner layer is a resin cover made of a thermoplastic resin, and an outer layer is a resin cover that is hard to adhere to a heated resin film. Item 29. The press method according to Item 29. 31. Between the pressing member and the laminated resin film, a sheet that is hard to adhere to the heated resin film and has flexibility and breathability is further provided, and 30. The pressing method according to claim 26, wherein a heating / pressurizing step is performed. 32. The pressing method according to claim 31, wherein the sheet has a melting point higher than a heating temperature in the heating / pressurizing step.