JP7461116B2 - Circuit board and its manufacturing method - Google Patents

Description

Application of Article 30, paragraph 2 of the Patent Act A presentation was made at an academic conference (International Symposium on 3D Power Electronics Integration and Manufacturing) on June 26, 2018. A presentation was made at an academic conference (42nd Academic Conference of the Magnetics Society of Japan) on September 13, 2018. A presentation was made at an exhibition (APEC 2019) on March 19, 2019.

The present invention relates to a circuit board in which an upper pattern and a lower pattern are connected by conductor pins, and a method for manufacturing the same. The present invention also relates to a circuit board in which an upper conductor layer and a lower conductor layer are connected by conductor pins, and a method for manufacturing the same.

A technique for connecting upper and lower patterns on a circuit board is disclosed, for example, in Patent Document 1. In detail, Patent Document 1 describes embedding a magnetic material in the circuit board, connecting the upper and lower patterns with through holes to form a coil, and providing the circuit board with a noise filter function.

Utility Model Publication No. 4-46570

In Patent Document 1, it is difficult to reduce the electrical resistance of the through hole connecting the upper pattern and the lower pattern due to its structure. Therefore, a large current cannot flow through the through hole.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a circuit board that can lower the resistance of a connecting body connecting an upper pattern and a lower pattern and allow a large current to flow through the circuit board, and a method for manufacturing the circuit board.

The present invention provides a first method for manufacturing a circuit board, comprising the steps of:
a preparation step of preparing a pre-connection substrate having an upper conductive layer, a lower conductive layer, and a main substrate, the pre-connection substrate being provided with a receiving hole penetrating from the upper conductive layer to the lower conductive layer;
a conductor pin insertion step of inserting a conductor pin thinner than the receiving hole into the receiving hole of the pre-connection substrate;
and a connection process for applying a force in an up-down direction to the conductor pin while passing a current through the conductor pin, thereby deforming the conductor pin and connecting the upper conductor layer and the lower conductor layer with the conductor pin.

The present invention also provides a method for manufacturing a first circuit board as a method for manufacturing a second circuit board, comprising:
The preparation step includes:
a substrate material preparation step of preparing a substrate material having the upper conductor layer, the lower conductor layer, and the main substrate;
Drilling the receiving hole penetrating from the upper conductor layer to the lower conductor layer in the substrate material and etching the upper conductor layer and the lower conductor layer to form an upper pattern and a lower pattern, respectively. and a pre-connection board preparation step of preparing the pre-connection board,
In the connecting step, the conductor pin connects the upper pattern and the lower pattern, providing a method for manufacturing a circuit board.

The present invention also provides a second circuit board manufacturing method as a third circuit board manufacturing method, comprising:
The substrate material preparation step includes:
a cavity forming step of forming a cavity in the main substrate;
a magnetic member step of preparing a magnetic member in which a through hole is formed, and arranging the magnetic member in the cavity so that the through hole extends in the vertical direction;
a conductor layer step of filling the through hole with resin and providing the upper conductor layer and the lower conductor layer above and below the main substrate with an insulating layer interposed therebetween;
In the pre-connection board preparation step, the receiving holes are formed so as to pass through the through holes of the magnetic member, respectively.

The present invention also provides a third circuit board manufacturing method as a fourth circuit board manufacturing method, comprising:
The magnetic member is made by binding soft magnetic metal powder with a binder,
The soft magnetic metal powder has a flat shape,
The present invention provides a method for manufacturing a circuit board in which the binder is mainly composed of an inorganic oxide.

The present invention also provides a third or fourth circuit board manufacturing method as a fifth circuit board manufacturing method, comprising:
The conductor layer step includes:
A lower prepreg step in which a lower prepreg on which the lower conductive layer is formed is prepared, and the lower prepreg is placed under the lower surface of the main substrate so that the lower conductive layer faces downward. and,
a resin filling step of filling the through hole with resin;
an upper prepreg step of preparing an upper prepreg on which the upper conductor layer is formed, and arranging the upper prepreg on the upper surface of the main substrate so that the upper conductor layer faces upward;
and a resin curing step of curing the resin in the through hole,
The present invention provides a method for manufacturing a circuit board, in which a magnetic member arranging step of arranging the magnetic member in the cavity in the magnetic member step is performed after the lower prepreg step and before the resin filling step. .

The present invention also provides a sixth method for producing a circuit board, which is a method for producing the third or fourth circuit board, comprising the steps of:
The conductive layer step includes:
a lower prepreg process of preparing a lower prepreg on which the lower conductive layer is formed, and disposing the lower prepreg under the lower surface of the main board so that the lower conductive layer faces downward;
an upper prepreg process of preparing an upper prepreg on which the upper conductive layer is formed, and placing the upper prepreg on the upper surface of a main board so that the upper conductive layer faces upward;
a resin filling step of pressing the upper prepreg and the lower prepreg from above and below to fill the through-hole with resin contained in the upper prepreg and the lower prepreg;
and a resin curing step of curing the resin in the through hole,
The present invention provides a method for manufacturing a circuit board, wherein a magnetic member arranging step of arranging the magnetic member in the cavity among the magnetic member steps is performed after the lower prepreg step and before the upper prepreg step.

The present invention also provides a sixth circuit board manufacturing method as a seventh circuit board manufacturing method, comprising:
The present invention provides a method for manufacturing a circuit board in which the resin contained in the upper prepreg and the lower prepreg is the same as the resin constituting the main board.

The present invention also provides an eighth method for producing a circuit board, which is any one of the second to seventh methods for producing a circuit board,
The pre-connection substrate preparation step includes:
a receiving hole forming step of opening the receiving hole in the substrate material;
the receiving hole forming step, followed by a pattern forming step of etching the upper conductive layer and the lower conductive layer to form the upper pattern and the lower pattern, respectively.

The present invention also provides a ninth method for producing a circuit board, which is the eighth method for producing a circuit board, comprising the steps of:
The pre-connection substrate preparation step includes:
The present invention also provides a method for manufacturing a circuit board, further comprising a plating step of plating the board material after the receiving hole forming step and before the pattern forming step.

The present invention provides a tenth method for manufacturing a circuit board, which is any one of the second to ninth circuit board manufacturing methods, in which the conductive pin is a pin member having a bonding plating formed on a surface thereof,
In the connecting step, the pin member is connected to the upper pattern and the lower pattern by the bonding plating that is melted by passing the current.

The present invention also provides an eleventh method for producing a circuit board, which is the tenth method for producing a circuit board, comprising the steps of:
The melting point of the bonding plating is lower than the melting point of the pin member.

The present invention also provides a twelfth method for producing a circuit board, which is the eleventh method for producing a circuit board,
The pin members are made of copper, and the bonding plating is made of tin.

The present invention also provides, as a thirteenth circuit board manufacturing method, a method for manufacturing any one of the second to twelfth circuit boards, in which, in the connection step, a voltage of the same polarity as the voltage applied to the upper end of the conductor pin is also applied to the lower pattern.

The present invention also provides a first circuit board,
A circuit board comprising a main board, an upper conductive layer, a lower conductive layer, and a conductive pin,
the upper conductive layer is located above the main substrate in the vertical direction,
the lower conductive layer is located below the main substrate in the vertical direction,
The conductive pin extends in the up-down direction,
The conductive pin has a bonding plating formed on a surface of a pin member,
the bonding plating has a first portion, a second portion, a third portion, and a fourth portion;
The first portion is located at an upper end of the pin member in the up-down direction,
The second portion has a joint portion and an exuding portion,
the joint portion of the second portion joins the pin member and the upper conductive layer in a direction perpendicular to the up-down direction,
the seeping-out portion of the second portion is located directly above the upper conductive layer in the up-down direction,
an upper surface of the joint portion of the second portion is inclined so as to approach an upper end of the exuding portion of the second portion as the upper surface approaches the upper conductive layer from the pin member in the orthogonal direction;
an upper surface of the joint portion of the second portion is inclined in the orthogonal direction so as to approach an upper end of the first portion as the upper surface approaches the pin member from the upper conductive layer;
the third portion has a joint,
the joint portion of the third portion joins the pin member and the lower conductive layer in the orthogonal direction,
The fourth portion provides a circuit board located at a lower end of the pin member in the up-down direction.

The present invention also provides a second circuit board comprising a first circuit board,
The third portion has an exuding portion,
the seeping-out portion of the third portion is located directly below the lower conductive layer in the up-down direction,
a lower surface of the joint portion of the third portion is inclined so as to approach a lower end of the exuding portion of the third portion as the lower surface approaches the lower conductive layer from the pin member in the orthogonal direction,
The circuit board includes a lower surface of the joint of the third portion that is inclined in the orthogonal direction from the lower conductive layer toward the pin member and toward the lower end of the fourth portion.

The present invention also provides a first or second circuit board as the third circuit board,
The conductor pin further has a main portion,
The main portion extends across both ends of the main substrate in the up-down direction,
The present invention provides a circuit board in which there is no gap between the outer periphery of the main portion and the main board in the orthogonal direction.

The present invention also provides a third circuit board as the fourth circuit board, comprising:
The pin member has a substantially cylindrical shape extending in the vertical direction,
The pin member has a central portion,
The central portion is located at an intermediate position between the upper conductive layer and the lower conductive layer in the vertical direction,
The central portion is a part of the main portion,
A circuit board is provided in which a diameter of both ends of the pin member in the vertical direction is smaller than a diameter of the central portion.

According to the present invention, since the upper pattern and the lower pattern are connected by conductor pins, electrical resistance can be lowered compared to through holes, etc., and a larger current can flow.

Further, according to the present invention, when deforming the conductor pin in order to connect the upper pattern and the lower pattern with the conductor pin, a force along the vertical direction is applied to the conductor pin while applying a current to the conductor pin. Adding. Here, when a current is passed through the conductor pin, the conductor pin becomes soft. Therefore, the force applied to the conductor pin can be reduced.

In particular, when incorporating a magnetic member into a circuit board, we decided to use a magnetic member with through holes formed in advance, so there is no insulator between the upper pattern and the conductor pin in the plane where the upper pattern is formed. is not involved. The relationship between the lower pattern and the conductor pins is also the same. Therefore, the electrical connection between the upper pattern and the lower pattern and the conductor pin can be strengthened.

Furthermore, according to the present invention, the upper conductive layer and the lower conductive layer are connected by conductive pins, which reduces electrical resistance compared to through holes, etc., and allows a larger current to flow.

Further, according to the present invention, when deforming the conductor pin in order to connect the upper conductor layer and the lower conductor layer with the conductor pin, the conductor pin is deformed in the vertical direction with respect to the conductor pin while applying a current to the conductor pin. Applying force along the line. Here, when a current is passed through the conductor pin, the conductor pin becomes soft. Therefore, the force applied to the conductor pin can be reduced.

In particular, when incorporating a magnetic member into a circuit board, we decided to use a magnetic member with through holes formed in advance, so that the upper conductor layer and the conductor pins could be connected in the plane where the upper conductor layer was formed. There is no insulator in between. The relationship between the lower conductor layer and the conductor pins is also the same. Therefore, the electrical connection between the upper conductor layer and the lower conductor layer and the conductor pins can be strengthened.

In addition, the circuit board of the present invention has the following features: The conductor pin has a bonding plating formed on the surface of the pin member; the bonding plating is formed on the first portion and the first portion. The second part has a joint part and a seepage part; The joint part of the second part is perpendicular to the vertical direction. The pin member and the upper conductive layer are joined to each other in the orthogonal direction; the third part has a joint part; It is connected to the body layer. That is, in the circuit board of the present invention, the upper conductor layer and the lower conductor layer are connected by conductor pins. As a result, electrical resistance can be lowered compared to through holes, etc., and a larger current can flow between the upper conductor layer and the lower conductor layer.

FIG. 1 is a cross-sectional view showing a circuit board according to a first embodiment of the present invention. In the figure, the upper pattern and the lower pattern are connected by conductor pins. 1 is a top perspective photograph showing a part of a circuit board according to an example of the first embodiment of the present invention. Here, the circuit board has a plating layer. 3 is a cross-sectional photograph showing a portion of the circuit board of FIG. 2. 4 is an enlarged cross-sectional photograph showing a portion of the circuit board of FIG. 3 surrounded by a dashed line 40. 4 is an enlarged cross-sectional photograph showing a portion of the circuit board of FIG. 3 surrounded by a dashed line 80. It is an upper perspective photograph which shows a part of circuit board based on another Example of the 1st Embodiment of this invention. Here, the circuit board does not have a plating layer. 2 is a flowchart showing a manufacturing process of the circuit board of FIG. 1. FIG. FIG. 2 is a cross-sectional view for explaining a cavity forming step in the method of manufacturing the circuit board of FIG. 1. FIG. Fig. 2 is a top view of a magnetic member used in a magnetic member preparing step in the method for manufacturing the circuit board of Fig. 1. In the drawing, a through hole is formed in the magnetic member. 10 is a cross-sectional view showing the magnetic member of FIG. 9 taken along line AA. FIG. 2 is a cross-sectional view for explaining a lower prepreg step in the method for manufacturing the circuit board of FIG. 1. FIG. In the figure, the lower prepreg is placed below the lower surface of the main substrate. Fig. 2 is a cross-sectional view for explaining a magnetic member arranging step in the manufacturing method of the circuit board having the configuration shown in Fig. 1. In the drawing, the magnetic member is arranged in a cavity of the main board. Fig. 2 is a cross-sectional view for explaining a resin filling step in the manufacturing method of the circuit board of Fig. 1. In the drawing, the through hole of the magnetic member is filled with resin. Fig. 2 is a cross-sectional view for explaining an upper prepreg step in the manufacturing method of the circuit board of Fig. 1. In the drawing, the upper prepreg is disposed on the upper surface of the main board. FIG. 2 is a cross-sectional view for explaining a resin filling step in the method of manufacturing the circuit board of FIG. 1. FIG. In the figure, the through hole of the magnetic member is filled with resin. Fig. 2 is a cross-sectional view for explaining a receiving hole forming step in the manufacturing method of the circuit board of Fig. 1. In the drawing, the receiving holes are opened so as to pass through the through holes of the magnetic member, respectively. FIG. 2 is a cross-sectional view for explaining a plating step in the method of manufacturing the circuit board of FIG. 1. FIG. FIG. 2 is a cross-sectional view for explaining a pattern forming step in the method of manufacturing the circuit board of FIG. 1. FIG. In the figure, the upper conductor layer and the lower conductor layer are etched to form an upper pattern and a lower pattern, respectively. Fig. 2 is a cross-sectional view for explaining a conductive pin inserting step in the manufacturing method of the circuit board of Fig. 1. In the drawing, the conductive pin is inserted into the receiving hole of the board before connection. FIG. 2 is a cross-sectional view for explaining a connection step in the manufacturing method of the circuit board of the embodiment in FIG. 1. In the drawing, a first electrode is pressed against an upper end of the conductor pin, and a second electrode is pressed against a lower end of the conductor pin. FIG. 1 is a cross-sectional view for explaining a modified example of a connection step in the manufacturing method of the circuit board according to the embodiment of FIG. 1. In the figure, a first electrode is pressed against the upper end of the conductor pin, a second electrode is pressed against the lower end of the conductor pin, and a third electrode is in contact with the lower pattern. 1 is a cross-sectional view showing a circuit board according to a second embodiment of the present invention, in which an upper pattern and a lower pattern are connected by a conductor pin. 23 is a cross-sectional view for explaining a board material preparing step in the manufacturing method of the circuit board of FIG. 22. 23 is a cross-sectional view for explaining a pre-connection board preparation step in the manufacturing method of the circuit board of Fig. 22. In the figure, a receiving hole is opened in the pre-connection board, and the upper conductive layer and the lower conductive layer are etched to form an upper pattern and a lower pattern, respectively. 23 is a cross-sectional view for explaining a conductor pin insertion step in the method of manufacturing the circuit board of FIG. 22. FIG. In the figure, a conductor pin is inserted into the receiving hole of the board before connection. 23 is a cross-sectional view for explaining a connection step in the method for manufacturing the circuit board of FIG. 22. FIG. In the figure, a first electrode is pressed against the upper end of the conductor pin, and a second electrode is pressed against the lower end of the conductor pin.

First Embodiment
As shown in Fig. 1, the circuit board 10 according to the first embodiment of the present invention includes a main board 160, an insulating layer 170, an upper conductive layer 112, a lower conductive layer 142, a plating layer 180, a conductive pin 500, and a magnetic member 600. That is, the circuit board 10 of the present embodiment has two conductive layers, which are the upper conductive layer 112 and the lower conductive layer 142. However, the present invention is not limited thereto, and may have three or more conductive layers as long as it has at least the upper conductive layer 112 and the lower conductive layer 142. Also, referring to Fig. 6, the circuit board of the present invention does not need to have the plating layer 180.

Referring to FIG. 1, main board 160 of this embodiment is an FR4 board. Note that the present invention is not limited to this, and the main board 160 may be other than the FR4 board.

As shown in FIG. 1, the insulating layer 170 of this embodiment is arranged above and below the main substrate 160. In this embodiment, the up-down direction is the Z direction. Further, the upper direction is defined as the +Z direction, and the lower direction is defined as the -Z direction. The insulating layer 170 of this embodiment is made of solidified epoxy resin.

As shown in FIG. 1, the upper conductor layer 112 of this embodiment is located above the main substrate 160 in the vertical direction. Upper conductor layer 112 is located on top of upper insulating layer 170. Upper conductor layer 112 is copper foil. An upper pattern 114 is formed on the surface of the upper conductor layer 112.

As shown in FIG. 1, the lower conductive layer 142 of this embodiment is located below the main substrate 160 in the up-down direction. The lower conductive layer 142 is located below the lower insulating layer 170. The lower conductive layer 142 is copper foil. A lower pattern 144 is formed on the surface of the lower conductive layer 142.

Referring to FIG. 1, the plating layer 180 in this embodiment is copper plating. Note that the present invention is not limited to this, and the top surface of the plating layer 180 may be gold-plated or silver-plated mainly to prevent the upper conductive layer 112 and the lower conductive layer 142 from eroding the bonding plating 520 described later. For the same reason, an alloy layer may be formed between the plating layer 180 and the upper conductive layer 112 to prevent the upper conductive layer 112 and the lower conductive layer 142 from eroding, and similarly, an alloy layer may be formed between the plating layer 180 and the lower conductive layer 142. Furthermore, in order to prevent the upper conductive layer 112 and the lower conductive layer 142 from eroding, a base plating such as Ni may be provided between the plating layer 180 and the upper conductive layer 112, and similarly, a base plating such as Ni may be provided between the plating layer 180 and the lower conductive layer 142.

As shown in FIG. 1, the conductor pin 500 of this embodiment has a bonding plating 520 formed on the surface of a pin member 510. That is, the conductor pin 500 has a pin member 510 and a bonding plating 520. The melting point of the bonding plating 520 is lower than the melting point of the pin member 510. More specifically, the pin member 510 is made of copper, and the bonding plating 520 is made of tin. Note that the present invention is not limited to this, and lead, bismuth, silver, etc. may be added to the tin of the bonding plating 520 to prevent erosion of the upper conductive layer 112 and the lower conductive layer 142.

As shown in FIG. 1, the conductor pin 500 of this embodiment extends in the vertical direction. The conductor pin 500 connects the upper conductive layer 112 and the lower conductive layer 142. Specifically, the conductor pin 500 connects the upper pattern 114 of the upper conductive layer 112 and the lower pattern 144 of the lower conductive layer 142 through the plating layer 180. Note that the present invention is not limited to this, and if the circuit board 10 does not have the plating layer 180, the conductor pin 500 may directly connect the upper conductive layer 112 and the lower conductive layer 142. In the method of connecting the upper pattern of the upper conductive layer and the lower pattern of the lower conductive layer by plating the via, which is used in the conventional circuit board manufacturing technology, there are problems such as low reliability of the connection between the pattern and the via, increased electrical resistance, and inability to handle large currents. In addition, the method of connecting the upper pattern of the upper conductive layer and the lower pattern of the lower conductive layer with a conductive paste filled in a via, which is used in the conventional circuit board manufacturing technology, has problems such as the conductive paste being expensive, being unsuitable for filling a large diameter via, having a high electrical resistance compared to copper material, and requiring a reflow process. On the other hand, in the circuit board 10 of this embodiment, the configuration in which the conductor pin 500 connects the upper pattern 114 of the upper conductive layer 112 and the lower pattern 144 of the lower conductive layer 142 does not have the problems of the above-mentioned conventional technology. In other words, the circuit board 10 having a configuration in which the conductor pin 500 connects the upper conductive layer 112 and the lower conductive layer 142 does not have the problems of the above-mentioned conventional technology.

As shown in FIG. 3, the conductor pin 500 of this embodiment further has a main portion 530.

As shown in FIG. 3, the main portion 530 of this embodiment extends across both ends of the main board 160 in the vertical direction. There is no gap between the outer periphery 532 of the main portion 530 and the main substrate 160 in the orthogonal direction that is perpendicular to the up-down direction.

Referring to FIG. 3, pin member 510 of this embodiment has a substantially cylindrical shape extending in the vertical direction. Pin member 510 has a central portion 512. The center portion 512 is located at an intermediate position between the upper conductor layer 112 and the lower conductor layer 142 in the vertical direction. Central portion 512 is part of main portion 530 . A diameter R1 of both ends of the pin member 510 in the vertical direction is smaller than a diameter R2 of the central portion 512. This is because when the conductor pins 500 are deformed by applying a force along the vertical direction to the conductor pins 500 while applying a current to the conductor pins 500 in the connection process of the method for manufacturing the circuit board 10 described later, This is because the pin member 510 of the conductor pin 500 is compressed in the vertical direction, and the diameter R2 of the center portion 512 becomes larger than the diameter R1 of both ends.

As shown in Figures 2, 4, and 5, the bonding plating 520 of this embodiment has a first portion 522, a second portion 524, a third portion 526, and a fourth portion 528.

As shown in Figures 2 and 4, the first portion 522 in this embodiment is located at the top end of the pin member 510 in the vertical direction.

As shown in FIG. 4, the second portion 524 in this embodiment has a joint portion 5242 and an exudation portion 525.

As shown in FIG. 4, the joint 5242 of the second portion 524 joins the pin member 510 and the upper conductive layer 112 in a direction perpendicular to the vertical direction. More specifically, the joint 5242 of the second portion 524 joins the pin member 510 and the upper conductive layer 112 via the plating layer 180 in a direction perpendicular to the vertical direction. Note that the present invention is not limited to this, and referring to FIG. 6, when the circuit board 10 does not have the plating layer 180, the joint 5242 of the second portion 524 may directly join the pin member 510 and the upper conductive layer 112 in a direction perpendicular to the vertical direction.

As shown in FIG. 4, the upper surface of the joint portion 5242 of the second portion 524 approaches the upper end of the seeping portion 525 of the second portion 524 as it approaches the upper conductor layer 112 from the pin member 510 in the orthogonal direction. is inclined to. Further, the upper surface of the joint portion 5242 of the second portion 524 is inclined such that the closer it is from the upper conductor layer 112 to the pin member 510 in the orthogonal direction, the closer it is to the upper end of the first portion 522.

As shown in FIG. 4, the size S2 of the joint 5242 of the second portion 524 in the orthogonal direction is larger than the size S1 of the first portion 522 in the vertical direction. This is because, in the connection step of the manufacturing method of the circuit board 10 described below, when a force is applied to the conductor pin 500 in the vertical direction while a current is passed through the conductor pin 500, the conductor pin 500 is deformed, and the first portion 522 of the joining plating 520 of the conductor pin 500 melts and is compressed in the vertical direction, reducing the size of the first portion 522 in the vertical direction.

As shown in FIG. 4, the seepage portion 525 of the second portion 524 is located directly above the upper conductive layer 112 in the vertical direction. More specifically, the seepage portion 525 of the second portion 524 is located on the plating layer 180 covering the upper conductive layer 112 and is in contact with the plating layer 180 covering the upper conductive layer 112 in the vertical direction. Note that the present invention is not limited to this, and when the circuit board 10 does not have the plating layer 180, the seepage portion 525 of the second portion 524 may be configured to be located on the upper conductive layer 112 and in contact with the upper conductive layer 112 in the vertical direction, as shown in FIG. 6.

In the connection process of the method for manufacturing the circuit board 10, when the conductor pin 500 is deformed by applying a force along the vertical direction, the diameter R2 of the central portion 512 of the conductor pin 500 is expanded. As a result, the melted bonding plating 520 is pushed out into the gap between the conductor pin 500 and the upper conductor layer 112, and the extruded bonding plating 520 solidifies to securely connect the conductor pin 500 and the upper conductor layer 112. It will be connected to. Further, the melted bonding plating 520 overflows onto the upper surface of the plating layer 180 covering the upper conductor layer 112, and the overflowing bonding plating 520 solidifies, thereby forming a seepage portion 525.

As shown in FIG. 5, the third portion 526 of this embodiment includes a joint portion 5262 and a seepage portion 527.

As shown in FIG. 5, the joint 5262 of the third portion 526 joins the pin member 510 and the lower conductive layer 142 in the orthogonal direction perpendicular to the vertical direction. More specifically, the joint 5262 of the third portion 526 joins the pin member 510 and the lower conductive layer 142 via the plating layer 180 in the orthogonal direction perpendicular to the vertical direction. Note that the present invention is not limited to this, and referring to FIG. 6, when the circuit board 10 does not have the plating layer 180, the joint 5262 of the third portion 526 may directly join the pin member 510 and the lower conductive layer 142 in the orthogonal direction perpendicular to the vertical direction.

As shown in FIG. 5, the lower surface of the joint portion 5262 of the third portion 526 approaches the lower end of the seeping portion 527 of the third portion 526 as it approaches the lower conductor layer 142 from the pin member 510 in the orthogonal direction. It's slanted like that. The lower surface of the joint portion 5262 of the third portion 526 is inclined such that the closer it is from the lower conductor layer 142 to the pin member 510 in the orthogonal direction, the closer it is to the lower end of the fourth portion 528.

As shown in FIG. 5, the size S3 of the joint portion 5262 of the third portion 526 in the orthogonal direction is larger than the size S4 of the fourth portion 528 in the vertical direction. This is because when the conductor pin 500 is deformed by applying a force along the vertical direction to the conductor pin 500 while applying a current to the conductor pin 500 in the connection process of the method for manufacturing the circuit board 10 described later, This is because the fourth portion 528 of the bonding plating 520 of the conductor pin 500 is melted and compressed in the vertical direction, and the size of the fourth portion 528 in the vertical direction is reduced.

As shown in FIG. 5, the seepage portion 527 of the third portion 526 is located directly below the lower conductor layer 142 in the vertical direction. More specifically, the seepage portion 527 of the third portion 526 is located on the plating layer 180 covering the lower conductor layer 142, and is in contact with the plating layer 180 covering the lower conductor layer 142 in the vertical direction. There is. Note that the present invention is not limited thereto, and with reference to FIG. The conductor layer 142 may be located at the same position and may be configured to be in contact with the lower conductor layer 142 in the vertical direction.

In the connection process of the method for manufacturing the circuit board 10, when the conductor pin 500 is deformed by applying a force along the vertical direction, the diameter R2 of the central portion 512 of the conductor pin 500 is expanded. As a result, the melted bonding plating 520 is pushed out into the gap between the conductor pin 500 and the lower conductor layer 142, and the extruded bonding plating 520 solidifies to form the conductor pin 500 and the lower conductor layer 142. This will ensure a secure connection. Further, the melted bonding plating 520 overflows onto the lower surface of the plating layer 180 covering the lower conductor layer 142, and the overflowing bonding plating 520 solidifies, thereby forming a seepage portion 527.

As shown in FIG. 5, the fourth portion 528 in this embodiment is located at the lower end of the pin member 510 in the up-down direction.

1, 9 and 10, the magnetic member 600 of this embodiment has a through hole 610 penetrating in the vertical direction. The magnetic member 600 is formed by binding soft magnetic metal powder 620 with a binder 630. That is, the magnetic member 600 is mainly formed of soft magnetic metal powder 620 having a flat shape and an insulating binder 630. The binder 630 is mainly composed of an inorganic oxide, for example, silicon oxide. The magnetic member 600 of this embodiment can be produced, for example, by mixing the soft magnetic metal powder 620 with a solvent, a thickener and a binder 630 to produce a slurry, heating the applied slurry to volatilize the solvent to produce a molded product, and then forming a through hole 610 penetrating in the vertical direction in this molded product using a milling machine or the like. It is preferable that the magnetic member 600 has a high relative permeability, for example, 100 or more. In addition, it is preferable that the magnetic member 600 contains 60% or more by volume of soft magnetic metal powder 620, 10% or more by volume and 30% or less by volume of open pores (voids), and a small volume percentage of closed pores.

Referring to Figures 1 and 7 to 20, the circuit board 10 of this embodiment is manufactured as follows.

As shown in FIG. 7, the circuit board 10 of this embodiment is manufactured through step A (preparation process), step 3 (conductor pin insertion process), and step 4 (connection process). In other words, the method for manufacturing the circuit board 10 includes a preparation process, a conductor pin insertion process, and a connection process.

First, with reference to FIGS. 7 to 18, a pre-connection board 400 having an upper conductor layer 112, a lower conductor layer 142, and a main board 160, in which a lower conductor is connected from the upper conductor layer 112 to the Step A (preparation step) is performed to prepare a pre-connection substrate 400 in which a receiving hole 300 penetrating to the body layer 142 is provided. Here, step A (preparation process) includes step 1 (substrate material preparation process) and step 2 (substrate preparation process before connection). That is, the circuit board 10 of this embodiment is manufactured through step 1 (substrate material preparation process), step 2 (substrate preparation before connection process), step 3 (conductor pin insertion process), and step 4 (connection process). In other words, the method for manufacturing the circuit board 10 includes a board material preparation step, a pre-connection board preparation step, a conductor pin insertion step, and a connection step.

First, referring to FIG. 1 and FIG. 7 to FIG. 14, a substrate material preparation process is carried out to prepare a substrate material 100 having an upper conductive layer 112, a lower conductive layer 142, and a main substrate 160. More specifically, the substrate material preparation process includes a cavity formation process, a magnetic member process, and a conductive layer process.

First, in the cavity forming process, referring to FIG. 8, a cavity 162 is formed in the main substrate 160. More specifically, a cavity 162 that opens in the vertical direction is formed in the main substrate 160. That is, the cavity 162 is a hole that penetrates the main substrate 160 in the vertical direction.

Next, after performing the cavity forming process, a magnetic member preparation process of the magnetic member process is performed with reference to FIGS. 9 and 10. In the magnetic member preparation step of this embodiment, a magnetic member 600 in which a through hole 610 is formed is prepared. More specifically, in the magnetic member preparation step, the magnetic member 600 of this embodiment is manufactured as described above, thereby preparing the magnetic member 600 in which the through hole 610 is formed.

After performing the magnetic member preparation process, a conductor layer process is performed with reference to FIGS. 11, 13, and 14. In the conductor layer step, the through hole 610 is filled with resin 700, and an upper conductor layer 112 and a lower conductor layer 142 are provided above and below the main substrate 160 with an insulating layer 170 in between. More specifically, the conductor layer process includes a lower prepreg process, a resin filling process, an upper prepreg process, and a resin curing process. That is, in the conductor layer process, a lower prepreg process, a resin filling process, an upper prepreg process, and a resin curing process are performed in this order.

First, with reference to FIG. 11, in the lower prepreg step, a lower prepreg 140 in which a lower conductor layer 142 is formed on an insulating layer 170 is prepared, and the lower conductor layer 142 is directed downward. The lower prepreg 140 is placed below the lower surface 166 of the main substrate 160.

After performing the lower prepreg process, the magnetic member arrangement process of the magnetic member process is performed with reference to FIGS. 10 to 12. That is, the magnetic member process includes a magnetic member preparation process and a magnetic member arrangement process. In the magnetic member placement step, the magnetic member 600 is placed within the cavity 162 so that the through hole 610 extends in the vertical direction.

After performing the magnetic member arrangement step, referring to FIG. 13, a resin filling step is performed. That is, among the magnetic member steps, the magnetic member arranging step of arranging the magnetic member 600 in the cavity 162 is performed after the lower prepreg step and before the resin filling step. In this resin filling step, the through hole 610 is filled with resin 700.

After the resin filling process is performed, the upper prepreg process is performed as shown in FIG. 14. In the upper prepreg process, an upper prepreg 110 having an upper conductor layer 112 formed on an insulating layer 170 is prepared, and the upper prepreg 110 is placed on the upper surface 164 of the main substrate 160 so that the upper conductor layer 112 faces upward. Here, the resin 750 contained in the upper prepreg 110 and the lower prepreg 140 is the same as the resin that constitutes the main substrate 160.

After performing the upper prepreg process, a resin curing process is performed. In the resin curing step, the resin 700 within the through hole 610 is cured.

Note that although the substrate material preparation step in this embodiment includes a resin filling step, the present invention is not limited to this. That is, the above-described substrate material preparation process may be modified to include a resin filling process instead of the resin filling process. More specifically, after performing the above-mentioned cavity forming step, the above-mentioned lower prepreg step, the above-mentioned magnetic member arrangement step, and the above-mentioned upper prepreg step in order, the upper prepreg 110 and the lower prepreg 140 are formed. A resin filling process is performed in which the inside of the through hole 610 is filled with the resin 750 contained in the upper prepreg 110 and the lower prepreg 140 by pressing from above and below to bring the substrate material 100 into the state shown in FIG. After the resin filling step, the substrate material preparation step may be performed by performing the resin curing step described above.

After the board material preparation process is performed, the pre-connection board preparation process is performed with reference to Figures 16 to 18. In this pre-connection board preparation process, a receiving hole 300 is opened in the board material 100, penetrating from the upper conductive layer 112 to the lower conductive layer 142, and the upper conductive layer 112 and the lower conductive layer 142 are etched to form the upper pattern 114 and the lower pattern 144, respectively, to prepare the pre-connection board 400. More specifically, the pre-connection board preparation process includes a receiving hole formation process, a plating process, and a pattern formation process. That is, in the pre-connection board preparation process, the receiving hole formation process, the plating process, and the pattern formation process are performed in this order.

First, in the receiving hole forming step, a receiving hole 300 is opened in the substrate material 100, with reference to FIG. Here, the receiving holes 300 are opened so as to pass through the through holes 610 of the magnetic member 600, respectively. The receiving hole 300 is a hole that vertically penetrates the substrate material 100, the insulating layer 170, the upper conductor layer 112, and the lower conductor layer 142.

After the receiving hole forming process is performed, the plating process is performed as shown in FIG. 17. In the plating process, the substrate material 100 is plated to form a plating layer 180.

After performing the plating process, referring to FIG. 18, a pattern forming process is performed. That is, the pre-connection board preparation step in the manufacturing process of the circuit board 10 of the present embodiment further includes a plating step of plating the board material 100 after the receiving hole forming step and before the pattern forming step. There is. In this pattern forming step, the upper conductor layer 112 and the lower conductor layer 142 are etched to form an upper pattern 114 and a lower pattern 144, respectively. Note that the present invention is not limited thereto, and in the pre-connection board preparation step, the receiving hole forming step may be performed after the pattern forming step. Further, in the pattern forming process of this embodiment, the upper pattern 114 and the lower pattern 144 are formed by etching, but the upper pattern 114 and the lower pattern 144 may be formed by a method other than etching.

After the pre-connection board preparation process is performed, the conductor pin insertion process is performed as shown in FIG. 19. In this conductor pin insertion process, a conductor pin 500 that is thinner than the receiving hole 300 is inserted into the receiving hole 300 of the pre-connection board 400. As a result, the conductor pin 500 is accommodated in the receiving hole 300 of the pre-connection board 400. Note that by inserting a conductor pin 500 that is larger than the vertical size of the receiving hole 300 into the receiving hole 300, the conductor pin 500 can be made to protrude downward from the lower pattern 144, and the portion of the conductor pin 500 protruding from the lower pattern 144 can be used as a mounting terminal.

After performing the conductor pin insertion process, referring to FIG. 20, a connection process is performed. In this connection process, a force is applied to the conductor pin 500 in the vertical direction while applying a current to the conductor pin 500 to deform the conductor pin 500 and connect the conductor pin 500 to the upper conductor layer 112 and the lower conductor layer 112. The body layer 142 is connected to the body layer 142. More specifically, in this connection step, a force is applied to the conductor pin 500 in the vertical direction while applying a current to the conductor pin 500, thereby deforming the conductor pin 500 and connecting the conductor pin 500 with the upper pattern 114. The side pattern 144 is connected. In addition, in this connection step, the pin member 510 is connected to the upper conductive layer 112 and the lower conductive layer 142 using the bonding plating 520 that is melted by applying current. That is, in this connection process, the pin member 510 is connected to the upper pattern 114 and the lower pattern 144 using the bonding plating 520 that is melted by applying current. More specifically, the first electrode 800 is pressed against the upper end of the conductor pin 500, and the second electrode 810 is pressed against the lower end of the conductor pin 500, respectively, and the first electrode 800 and the second electrode 810 have opposite polarities. While applying a voltage to flow current through the conductor pin 500, press the second electrode 810 upward while pressing the first electrode 800 downward, and press the second electrode 810 upward so that the conductor pin 500 is compressed in the vertical direction. Force is applied to the first electrode 800 and the second electrode 810. As a result, the size of the conductor pin 500 in the orthogonal direction perpendicular to the vertical direction increases, and the conductor pin 500 and the plating layer 180 in the receiving hole 300 come into contact with each other in the orthogonal direction, and the melted bonding plating 520 is transferred to the plating layer. 180 to ensure continuity between the conductor pin 500 and the plating layer 180. In addition, in the connection process of this embodiment, as shown in FIG. 20, two conductor pins 500 can be simultaneously energized and welded. Furthermore, when the circuit board 10 has three or more conductor pins 500, welding can be performed by simultaneously energizing two or more conductor pins 500 according to the size of the electrode and the amount of current.

In the method of fixing pins by press-fitting or caulking, which is used in conventional circuit board manufacturing technology, the contact between the pattern and the pin is only mechanical, resulting in high electrical resistance, and the connection between the pattern and the pin. There is a problem with low reliability. In addition, the method of fixing the pin by press-fitting has problems in that high pressure is required when the pin is press-fitted, and the inner surface of the via may be damaged when the pin is press-fitted. In addition, in the method of fixing pins by soldering, which is used in conventional circuit board manufacturing technology, if a pin that is thinner than a via is inserted and the gap between the via and the pin is connected with solder, there is a need for process processing. The problem is that it takes time. Furthermore, the method of connecting the upper pattern of the upper conductive layer and the lower pattern of the lower conductive layer using conductive paste, which is adopted in conventional circuit board manufacturing technology, has problems such as requiring a reflow process. There is. On the other hand, the connection process of this embodiment does not have the problems that the prior art described above has. In particular, simultaneous bonding of both the upper pattern 114 and the lower pattern 144 and the conductor pin 500, which is difficult in a soldering or reflow process, can be realized in the connection process of this embodiment. That is, simultaneous bonding of both the upper conductor layer 112 and the lower conductor layer 142 and the conductor pin 500, which is difficult in a solder connection or a reflow process, can be realized in the connection process of this embodiment.

Note that the connection process of this embodiment may be modified as follows. That is, as shown in FIG. 21, in the connection process, a voltage of the same polarity as the voltage applied to the upper end of the conductor pin 500 may also be applied to the lower pattern 144. More specifically, in the connection process, in addition to the first electrode 800 and second electrode 810 described above, a third electrode 820 for applying voltage to the lower pattern 144 is prepared, and the third electrode 820 is By bringing the third electrode 820 into contact with the lower pattern 144 while applying a voltage with the same polarity as the voltage applied to the first electrode 800, a voltage with the same polarity as the voltage applied to the upper end of the conductor pin 500 is applied to the lower pattern 144. May be added. This facilitates welding of the conductor pin 500 and the lower pattern 144 in the orthogonal direction. Furthermore, in the connection process, a voltage of opposite polarity to the voltage applied to the upper end of the conductor pin 500 may be applied to the upper pattern 114. More specifically, in the connection process, in addition to the first electrode 800 and the second electrode 810, a fourth electrode 830 for applying voltage to the upper pattern 114 is prepared, and the first electrode 830 is connected to the fourth electrode 830. By bringing the fourth electrode 830 into contact with the upper pattern 114 while applying a voltage with the opposite polarity to the voltage applied to the conductor pin 800, a voltage with the opposite polarity to the voltage applied to the upper end of the conductor pin 500 may be applied to the upper pattern 114. This facilitates welding of the conductor pin 500 and the upper pattern 114 in the orthogonal direction.

Through these steps, the circuit board 10 of this embodiment is manufactured.

Second Embodiment
As shown in FIG. 22, the circuit board 10A according to the second embodiment of the present invention includes a main board 160A, an insulating layer 170, an upper conductive layer 112, a lower conductive layer 142, and a conductive pin 500. That is, the circuit board 10A of this embodiment does not include a magnetic member 600, unlike the circuit board 10 of the first embodiment. Here, the configuration other than the main board 160A is the same as that of the first embodiment. Therefore, the same reference numerals are used for the same configuration as that of the first embodiment, and detailed description is omitted. In addition, the main board 160A has the same configuration as the main board 160 of the first embodiment, except that the cavity 162 is not provided, and detailed description is omitted.

As shown in FIG. 22, the conductor pin 500 of this embodiment extends in the vertical direction. The conductor pin 500 connects the upper conductor layer 112 and the lower conductor layer 142. Specifically, the conductor pin 500 connects the upper pattern 114 of the upper conductor layer 112 and the lower pattern 144 of the lower conductor layer 142. In the method of connecting the upper pattern of the upper conductive layer and the lower pattern of the lower conductive layer using via plating, which is adopted in conventional circuit board manufacturing technology, the connection between the pattern and the via is reliable. There are problems such as low resistance, increased electrical resistance, and inability to handle large currents. In addition, in the method of connecting the upper pattern of the upper conductor layer and the lower pattern of the lower conductor layer with conductive paste embedded in vias, which is adopted in conventional circuit board manufacturing technology, conductive paste There are other problems such as being expensive, being unsuitable for filling large-diameter vias, having higher electrical resistance than copper, and requiring a reflow process. On the other hand, in the configuration in which the upper pattern 114 of the upper conductor layer 112 and the lower pattern 144 of the lower conductor layer 142 are connected by the conductor pin 500 in the circuit board 10A of the present embodiment, the above-mentioned conventional technique does not have the same problems as . That is, the circuit board 10A having a configuration in which the upper conductor layer 112 and the lower conductor layer 142 are connected by the conductor pins 500 does not have the problem that the above-mentioned conventional technology has.

Referring to Figures 7 and 22 to 26, the circuit board 10A of this embodiment is manufactured as follows.

As shown in FIG. 7, the circuit board 10A of this embodiment is manufactured through step A (preparation step), step 3 (conductor pin insertion step), and step 4 (connection step). In other words, the manufacturing method of the circuit board 10A includes a preparation step, a conductor pin insertion step, and a connection step.

7 and 22 to 24, a pre-connection board 400A having an upper conductive layer 112, a lower conductive layer 142, and a main board 160, in which a receiving hole 300 penetrating from the upper conductive layer 112 to the lower conductive layer 142 is provided, is prepared in step A (preparation step). Here, step A (preparation step) includes step 1 (board material preparation step) and step 2 (pre-connection board preparation step). That is, the circuit board 10A of this embodiment is manufactured through step 1 (board material preparation step), step 2 (pre-connection board preparation step), step 3 (conductor pin insertion step), and step 4 (connection step). In other words, the manufacturing method of the circuit board 10A includes a board material preparation step, a pre-connection board preparation step, a conductor pin insertion step, and a connection step.

First, referring to FIG. 23, a substrate material preparation process is carried out to prepare a substrate material 100A having an upper conductive layer 112, a lower conductive layer 142, and a main substrate 160A.

The substrate material preparation process of this embodiment differs from the substrate material preparation process of the first embodiment described above in that it only includes a conductor layer process.

In the conductor layer process of this embodiment, an upper conductor layer 112 and a lower conductor layer 142 are provided above and below the main board 160A with an insulating layer 170 between them. More specifically, the conductor layer process of this embodiment includes a lower prepreg process, an upper prepreg process, and a resin curing process. That is, in the conductor layer process, the lower prepreg process, the upper prepreg process, and the resin curing process are carried out in this order.

First, in the lower prepreg process, a lower prepreg 140 in which a lower conductive layer 142 is formed on an insulating layer 170 is prepared, and the lower prepreg 140 is mainly attached so that the lower conductive layer 142 faces downward. It is placed under the bottom surface 166 of the substrate 160A.

After the lower prepreg process is completed, the upper prepreg process is performed. In the upper prepreg process, the upper prepreg 110 is prepared, in which the upper conductor layer 112 is formed on the insulating layer 170, and the upper prepreg 110 is placed on the upper surface 164 of the main board 160A so that the upper conductor layer 112 faces upward.

After performing the upper prepreg process, a resin curing process is performed. In the resin curing step, the resin 750 contained in the upper prepreg 110 and the lower prepreg 140 is cured.

After performing the substrate material preparation process, a pre-connection substrate preparation process is performed with reference to FIGS. 23 and 24. In this pre-connection board preparation step, a receiving hole 300 penetrating from the upper conductor layer 112 to the lower conductor layer 142 is opened in the substrate material 100A, and the upper conductor layer 112 and the lower conductor layer 142 are etched. An upper pattern 114 and a lower pattern 144 are respectively formed to prepare a pre-connection board 400A. More specifically, the pre-connection board preparation step includes a receiving hole forming step and a pattern forming step. That is, in the pre-connection board preparation step, the receiving hole forming step and the pattern forming step are performed in this order.

First, in the receiving hole forming process, the receiving hole 300 is opened in the substrate material 100A. More specifically, the receiving hole 300 is opened so as to penetrate the substrate material 100A in the vertical direction.

After the receiving hole formation process is performed, a pattern formation process is performed. In this pattern formation process, the upper conductive layer 112 and the lower conductive layer 142 are etched to form the upper pattern 114 and the lower pattern 144, respectively. Note that the present invention is not limited to this, and the upper pattern 114 and the lower pattern 144 may be formed by a method other than etching.

Although the pre-connection board preparation step of this embodiment includes a receiving hole forming step and a pattern forming step, the present invention is not limited to this, and the pattern forming step is performed after the receiving hole forming step. Before the step, a plating step of plating the substrate material 100A may be further provided.

After the pre-connection substrate preparation process is performed, the conductor pin insertion process is performed as shown in FIG. 25. In this conductor pin insertion process, the conductor pin 500, which is thinner than the receiving hole 300, is inserted into the receiving hole 300 of the pre-connection substrate 400A.

After performing the conductor pin insertion process, referring to FIG. 26, a connection process is performed. In this connection process, a force is applied to the conductor pin 500 in the vertical direction while applying a current to the conductor pin 500 to deform the conductor pin 500 and connect the conductor pin 500 to the upper conductor layer 112 and the lower conductor layer 112. The body layer 142 is connected to the body layer 142. More specifically, in this connection step, a force is applied to the conductor pin 500 in the vertical direction while applying a current to the conductor pin 500, thereby deforming the conductor pin 500 and connecting the conductor pin 500 with the upper pattern 114. The side pattern 144 is connected. In addition, in this connection step, the pin member 510 is connected to the upper conductive layer 112 and the lower conductive layer 142 using the bonding plating 520 that is melted by applying current. That is, in this connection process, the pin member 510 is connected to the upper pattern 114 and the lower pattern 144 using the bonding plating 520 that is melted by applying current. More specifically, the first electrode 800 is pressed against the upper end of the conductor pin 500, and the second electrode 810 is pressed against the lower end of the conductor pin 500, respectively, and the first electrode 800 and the second electrode 810 have opposite polarities. While applying a voltage to flow current through the conductor pin 500, press the second electrode 810 upward while pressing the first electrode 800 downward, and press the second electrode 810 upward so that the conductor pin 500 is compressed in the vertical direction. Force is applied to the first electrode 800 and the second electrode 810. As a result, the size of the conductor pin 500 in the orthogonal direction perpendicular to the vertical direction increases, and the conductor pin 500 and the inner wall of the receiving hole 300 come into contact in the orthogonal direction, and the melted bonding plating 520 spreads between the upper pattern 114 and the lower side. The conductor pin 500 is welded to the side pattern 144 to ensure continuity between the conductor pin 500 and the upper pattern 114 and the lower pattern 144. In addition, in the connection process of this embodiment, when the circuit board 10A has two conductor pins 500, the two conductor pins 500 can be simultaneously energized and welded. Furthermore, when the circuit board 10A has three or more conductor pins 500, welding can be performed by simultaneously energizing two or more conductor pins 500 according to the size of the electrode and the amount of current.

In the method of fixing pins by press-fitting or caulking, which is used in conventional circuit board manufacturing technology, the contact between the pattern and the pin is only mechanical, resulting in high electrical resistance, and the connection between the pattern and the pin. There is a problem with low reliability. In addition, the method of fixing the pin by press-fitting has problems in that high pressure is required when the pin is press-fitted, and the inner surface of the via may be damaged when the pin is press-fitted. In addition, in the method of fixing pins by soldering, which is used in conventional circuit board manufacturing technology, if a pin that is thinner than a via is inserted and the gap between the via and the pin is connected with solder, there is a need for process processing. The problem is that it takes time. Furthermore, the method of connecting the upper pattern of the upper conductive layer and the lower pattern of the lower conductive layer using conductive paste, which is adopted in conventional circuit board manufacturing technology, has problems such as requiring a reflow process. There is. On the other hand, the connection process of this embodiment does not have the problems that the prior art described above has. In particular, simultaneous bonding of both the upper pattern 114 and the lower pattern 144 and the conductor pin 500, which is difficult in a soldering or reflow process, can be realized in the connection process of this embodiment. That is, simultaneous bonding of both the upper conductor layer 112 and the lower conductor layer 142 and the conductor pin 500, which is difficult in a solder connection or a reflow process, can be realized in the connection process of this embodiment.

Note that the connection process of this embodiment may be modified as follows. That is, in the connection process, a voltage of the same polarity as the voltage applied to the upper end of the conductor pin 500 may also be applied to the lower pattern 144. More specifically, in the connection process, in addition to the first electrode 800 and the second electrode 810 described above, a third electrode (not shown) for applying voltage to the lower pattern 144 is prepared, and this third electrode By bringing the third electrode into contact with the lower pattern 144 while applying a voltage of the same polarity as the voltage applied to the first electrode 800, a voltage of the same polarity as the voltage applied to the upper end of the conductor pin 500 is applied to the lower pattern. 144 may be added. This facilitates welding of the conductor pin 500 and the lower pattern 144 in the orthogonal direction.

Through these steps, the circuit board 10A of this embodiment is manufactured.

The present invention has been specifically described above using an embodiment, but the present invention is not limited to this and various modifications and variations are possible.

In the upper prepreg process and the lower prepreg process of this embodiment, the upper prepreg 110 and the lower prepreg 140 are placed on the main boards 160 and 160A, but the present invention is not limited to this. That is, instead of placing the upper prepreg 110 and the lower prepreg 140 on the main boards 160 and 160A, a conductive layer may be attached to the main boards 160 and 160A with an adhesive made of an insulating material.

10, 10A Circuit board 100, 100a substrate material 110 Upper side pre -pull 112 Upper electristics layer 114 Upper side pattern 140 lower pre -pull 142 lower conductive layer 144 lower electrical layer 144 lower pattern 1642 162 Upper side 166 lower surface 166 lower surface 170 insulating layer 180 Plated layer 300 Receiving hole 400, 400A Board before connection 500 Conductor pin 510 Pin member 512 Center part 520 Plating for joining 522 First part 524 Second part 5242 Joint part 525 Squeezing part 526 Third part 5262 Joint part 527 Staining part 528 Fourth part 530 Main part 532 Outer circumference 600 Magnetic member 610 Through hole 620 Soft magnetic metal powder 630 Binder 700 Resin 750 Resin 800 First electrode 810 Second electrode 820 Third electrode 830 Fourth electrode R1 Diameter R2 Diameter S1 Size S2 Size S3 size S4 size

Claims (17)

A pre-connection board having an upper conductor layer, a lower conductor layer, and a main board, the pre-connection board being provided with a receiving hole penetrating from the upper conductor layer to the lower conductor layer. preparing, a preparation process;
a conductor pin insertion step of inserting a conductor pin thinner than the receiving hole into the receiving hole of the pre-connection board;
Applying a force along the vertical direction to the conductor pin while applying a current to the conductor pin to deform the conductor pin and connect the upper conductor layer and the lower conductor layer with the conductor pin. A method for manufacturing a circuit board, comprising: a connecting step;
The preparation step includes:
a substrate material preparation step of preparing a substrate material having the upper conductor layer, the lower conductor layer, and the main substrate;
Drilling the receiving hole penetrating from the upper conductor layer to the lower conductor layer in the substrate material and etching the upper conductor layer and the lower conductor layer to form an upper pattern and a lower pattern, respectively. a pre-connection board preparation step of preparing the pre-connection board;
It is equipped with
In the connecting step, the conductor pin connects the upper pattern and the lower pattern,
The substrate material preparation step includes:
a cavity forming step of forming a cavity in the main substrate;
a magnetic member step of preparing a magnetic member in which a through hole is formed, and arranging the magnetic member in the cavity so that the through hole extends in the vertical direction;
a conductor layer step of filling the through hole with resin and providing the upper conductor layer and the lower conductor layer above and below the main substrate with an insulating layer interposed therebetween;
It is equipped with
In the pre-connection board preparation step, the receiving holes are opened so as to pass through the through holes of the magnetic member,
The conductor layer step includes:
A lower prepreg step in which a lower prepreg on which the lower conductive layer is formed is prepared, and the lower prepreg is placed under the lower surface of the main substrate so that the lower conductive layer faces downward. and,
a resin filling step of filling the through hole with resin;
an upper prepreg step of preparing an upper prepreg on which the upper conductor layer is formed, and arranging the upper prepreg on the upper surface of the main substrate so that the upper conductor layer faces upward;
a resin curing step of curing the resin in the through hole;
It is equipped with
Of the magnetic member steps, a magnetic member placement step of arranging the magnetic member in the cavity is performed after the lower prepreg step and before the resin filling step.
Method of manufacturing circuit boards. A pre-connection board having an upper conductor layer, a lower conductor layer, and a main board, the pre-connection board being provided with a receiving hole penetrating from the upper conductor layer to the lower conductor layer. preparing, a preparation process;
a conductor pin insertion step of inserting a conductor pin thinner than the receiving hole into the receiving hole of the pre-connection board;
Applying a force along the vertical direction to the conductor pin while applying a current to the conductor pin to deform the conductor pin and connect the upper conductor layer and the lower conductor layer with the conductor pin. connection process and
A method for manufacturing a circuit board, comprising:
The preparation step includes :
a substrate material preparation step of preparing a substrate material having the upper conductor layer, the lower conductor layer, and the main substrate;
Drilling the receiving hole penetrating from the upper conductor layer to the lower conductor layer in the substrate material and etching the upper conductor layer and the lower conductor layer to form an upper pattern and a lower pattern, respectively. and a pre-connection board preparation step of preparing the pre-connection board,
In the connecting step, the conductor pin connects the upper pattern and the lower pattern,
The substrate material preparation step includes:
a cavity forming step of forming a cavity in the main substrate;
a magnetic member step of preparing a magnetic member in which a through hole is formed, and arranging the magnetic member in the cavity so that the through hole extends in the vertical direction;
a conductor layer step of filling the through hole with resin and providing the upper conductor layer and the lower conductor layer above and below the main substrate with an insulating layer interposed therebetween;
It is equipped with
In the pre-connection board preparation step, the receiving holes are opened so as to pass through the through holes of the magnetic member,
The conductor layer step includes:
A lower prepreg step in which a lower prepreg on which the lower conductive layer is formed is prepared, and the lower prepreg is placed under the lower surface of the main substrate so that the lower conductive layer faces downward. and,
An upper prepreg step of preparing an upper prepreg on which the upper conductive layer is formed, and arranging the upper prepreg on the upper surface of the main substrate so that the upper conductive layer faces upward;
a resin filling step of pressing the upper prepreg and the lower prepreg from above and below to fill the through hole with the resin contained in the upper prepreg and the lower prepreg;
a resin curing step of curing the resin in the through hole;
It is equipped with
Of the magnetic member steps, a magnetic member placement step of arranging the magnetic member in the cavity is performed after the lower prepreg step and before the upper prepreg step.
Method of manufacturing circuit boards. 3. A method for manufacturing a circuit board according to claim 2 , comprising the steps of:
A method for manufacturing a circuit board, wherein a resin contained in the upper prepreg and the lower prepreg is the same as a resin constituting the main board. A method for manufacturing a circuit board according to any one of claims 1 to 3 , comprising:
The magnetic member is made by binding soft magnetic metal powder with a binder,
The soft magnetic metal powder has a flat shape,
The method for manufacturing a circuit board, wherein the binder contains an inorganic oxide as a main component. A method for manufacturing a circuit board according to any one of claims 1 to 4 , comprising the steps of:
A method of manufacturing a circuit board, wherein in the connecting step, a voltage of the same polarity as that applied to the upper end of the conductor pin is also applied to the lower pattern. a preparation step of preparing a pre-connection substrate having an upper conductive layer, a lower conductive layer, and a main substrate, the pre-connection substrate being provided with a receiving hole penetrating from the upper conductive layer to the lower conductive layer;
a conductor pin insertion step of inserting a conductor pin thinner than the receiving hole into the receiving hole of the pre-connection substrate;
Applying a force along the vertical direction to the conductor pin while applying a current to the conductor pin to deform the conductor pin and connect the upper conductor layer and the lower conductor layer with the conductor pin. connection process and
A method for manufacturing a circuit board, comprising:
The preparation step includes:
a substrate material preparation step of preparing a substrate material having the upper conductor layer, the lower conductor layer, and the main substrate;
a pre-connection substrate preparation process in which the receiving hole is opened in the substrate material, the receiving hole penetrating from the upper conductive layer to the lower conductive layer, and the upper conductive layer and the lower conductive layer are etched to form an upper pattern and a lower pattern, respectively, to prepare the pre-connection substrate;
Equipped with
In the connecting step, the conductor pin connects the upper pattern and the lower pattern,
In the connection step, a voltage having the same polarity as the voltage applied to the upper end of the conductor pin is also applied to the lower pattern.
A method for manufacturing a circuit board. 7. The method for manufacturing a circuit board according to claim 6 ,
The substrate material preparation step includes:
a cavity forming step of forming a cavity in the main substrate;
a magnetic member step of preparing a magnetic member in which a through hole is formed, and arranging the magnetic member in the cavity so that the through hole extends in the vertical direction;
a conductor layer step of filling the through hole with resin and providing the upper conductor layer and the lower conductor layer above and below the main substrate with an insulating layer interposed therebetween;
In the circuit board manufacturing method, in the pre-connection board preparation step, the receiving holes are opened so as to pass through the through holes of the magnetic member. A method for manufacturing a circuit board according to claim 7, comprising the steps of:
The magnetic member is made by binding soft magnetic metal powder with a binder,
The soft magnetic metal powder has a flat shape,
The binder is mainly composed of an inorganic oxide.
A method for manufacturing a circuit board. A method for manufacturing a circuit board according to any one of claims 1 to 8 ,
The pre-connection board preparation step includes:
a receiving hole forming step of opening the receiving hole in the substrate material;
A method for manufacturing a circuit board, comprising a pattern forming step of etching the upper conductor layer and the lower conductor layer to form the upper pattern and the lower pattern, respectively, after the receiving hole forming step. A method for manufacturing a circuit board according to claim 9 ,
The pre-connection substrate preparation step includes:
The method for manufacturing a circuit board further comprises a plating step of plating the board material after the receiving hole forming step and before the pattern forming step. A method for manufacturing a circuit board according to any one of claims 1 to 10 , comprising the steps of:
The conductive pin has a bonding plating formed on a surface of a pin member,
In the connecting step, the pin member is connected to the upper pattern and the lower pattern by the bonding plating that is melted by passing the current. A method for manufacturing a circuit board according to claim 11 ,
A method for manufacturing a circuit board, wherein the melting point of the bonding plating is lower than the melting point of the pin member. 13. The method for manufacturing a circuit board according to claim 12 ,
The method for manufacturing a circuit board in which the pin member is made of copper and the bonding plating is made of tin. A circuit board comprising a main board, an upper conductor layer, a lower conductor layer, and a conductor pin,
The upper conductor layer is located above the main substrate in the vertical direction,
The lower conductor layer is located below the main substrate in the up-down direction,
The conductor pin extends in the vertical direction,
The conductor pin has a bonding plating formed on the surface of the pin member,
The bonding plating has a first part, a second part, a third part, and a fourth part,
The first portion is located at an upper end of the pin member in the up-down direction,
The second part has a joint part and a seepage part,
The joint portion of the second portion joins the pin member and the upper conductor layer in a direction orthogonal to the up-down direction,
The seepage portion of the second portion is located directly above the upper conductor layer in the up-down direction,
The upper surface of the joint portion of the second portion is inclined such that the closer it is from the pin member to the upper conductor layer in the orthogonal direction, the closer it is to the upper end of the seepage portion of the second portion,
The upper surface of the joint portion of the second portion is inclined such that the closer it is from the upper conductor layer to the pin member in the orthogonal direction, the closer it is to the upper end of the first portion;
The third portion has a joint,
The joint portion of the third portion joins the pin member and the lower conductor layer in the orthogonal direction,
The fourth portion is a circuit board located at the lower end of the pin member in the vertical direction. 15. The circuit board according to claim 14,
The third part has a seepage part,
The seepage portion of the third portion is located directly below the lower conductor layer in the up-down direction,
The lower surface of the joint part of the third part is inclined such that the closer it gets from the pin member to the lower conductor layer in the orthogonal direction, the closer it gets to the lower end of the seepage part of the third part,
In the circuit board, the lower surface of the joint portion of the third portion is inclined such that as it approaches the pin member from the lower conductor layer in the orthogonal direction, it approaches the lower end of the fourth portion. 16. The circuit board according to claim 14 or 15,
The conductive pin further has a main portion,
The main portion extends across both ends of the main board in the vertical direction,
A circuit board in which there is no gap between the outer periphery of the main portion and the main board in the orthogonal direction. 17. The circuit board according to claim 16,
The pin member has a substantially cylindrical shape extending in the vertical direction,
The pin member has a central portion,
The central portion is located at an intermediate position between the upper conductor layer and the lower conductor layer in the vertical direction,
The central portion is a part of the main portion,
The diameter of both ends of the pin member in the vertical direction is smaller than the diameter of the center portion of the circuit board.

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