JP6079329B2 - Component built-in wiring board, method of manufacturing component built-in wiring board - Google Patents

Description

  The present invention relates to a wiring board with a built-in component having an electric / electronic component embedded in an insulating plate and a method for manufacturing the wiring board, and particularly to a wiring board with a built-in component suitable for preventing a decrease in reliability that can occur when a component is built in. It relates to the manufacturing method.

  As a prior art of a component built-in wiring board, there is one disclosed in Patent Document 1 below. According to the structure shown in FIG. 1 of the same document, solder (or conductive adhesive) is used for electrical connection of the electrical component to the wiring layer. In the manufacturing method, electrical components are electrically and mechanically connected to a wiring board serving as a core in advance using solder (or a conductive adhesive). In addition, a hole is made in an insulating resin layer different from this, and the hole is filled with a conductive composition, aligned and arranged with the core plate on which the component has been previously mounted, and laminated and integrated.

  In the component built-in wiring board, when another component is externally mounted on this wiring board or when the component built-in wiring board itself is mounted on another wiring board (both referred to as secondary mounting), It is important that the connection reliability is not impaired. Specifically, for example, when solder is used as a connection material for a built-in component, it is necessary to prevent connection failure or short circuit due to remelting of the solder.

  This document describes the use of high-temperature solder having a high melting point in order to prevent such remelting (paragraph 0034 of the document). However, the specific components of solder are not clear. In general, Sn—Pb-based Pb-rich materials are known as high-temperature solders, including Pb-5Sn (melting point: 314 ° C. to 310 ° C.) and Pb-10 Sn (melting point: 302 ° C. to 275 ° C.). However, the soldering temperature requires a high temperature of 300 ° C. or higher. At such a high temperature, a general epoxy resin as an insulating plate material for a wiring board is insufficient in heat resistance and is difficult to apply.

  In addition, when using a conductive adhesive for electrical connection to the wiring layer of the electrical component, because the conductivity is maintained by contact between the fine metal particles as a microscopic structure of the conductive adhesive, Compared to solder connections, the electrical resistance tends to be high. Furthermore, the surface of the copper foil used for the wiring layer is easily oxidized, and the oxidation of copper is further promoted by applying a conductive adhesive on the copper foil. Therefore, there is a possibility that the connection still has a high electrical resistance.

JP 2003-197849 A JP 2010-34588 A

  The present invention relates to a component built-in wiring board having an electric / electronic component embedded in an insulating plate and a method for manufacturing the same, and prevents re-melting of the solder for connecting the built-in component regardless of high-temperature solder, thereby preventing a decrease in reliability. An object of the present invention is to provide a component built-in wiring board and a manufacturing method thereof.

  In order to solve the above problems, a component built-in wiring board according to an aspect of the present invention includes a first main surface and an insulating layer having a second main surface opposite to the first main surface, A copper-based wiring pattern provided on one main surface, and a component having a terminal electrode embedded in the insulating layer so as to be mounted on the surface of the wiring pattern in contact with the insulating layer; A solder part positioned in contact with the terminal electrode so as to electrically and mechanically connect the terminal electrode of the component and the wiring pattern; and covering the surface of the solder part with the solder part and the And a copper film positioned between the insulating layers.

  In this component built-in wiring board, a copper coating is provided so as to cover the surface of the solder portion on which the built-in component is mounted. Therefore, in the heating process as in the secondary mounting, when the solder portion is about to melt, the copper of the copper coating forms an alloy with solder (tin, which is a component thereof). Since such an alloy is an alloy having a melting point considerably higher than that of solder, the melting of the solder portion does not spread further. Therefore, it is possible to prevent remelting of the solder for connecting the built-in components and to prevent a decrease in reliability.

  Further, the method of manufacturing a component built-in wiring board according to another aspect includes a step of electrically and mechanically connecting a component having a terminal electrode on a copper foil using solder, and the copper foil to which the component is connected Forming a copper plating film on the surface of the solder using the electrode, and connecting the component with the solder so that the component is embedded in an insulating layer, and the copper plating film on the surface of the solder. A step of laminating and integrating the insulating layer on the surface of the copper foil on which the component is located, and patterning the copper foil obtained by laminating and integrating the insulating layer. Forming a wiring pattern.

  This manufacturing method is one method for manufacturing the above-described component built-in wiring board.

  According to the present invention, in a component built-in wiring board having an electric / electronic component embedded in an insulating plate and a manufacturing method thereof, remelting of solder for connecting a built-in component is prevented regardless of high-temperature solder, thereby reducing reliability. Can be prevented.

Sectional drawing which shows typically the structure of the component built-in wiring board which is one Embodiment. Process drawing which shows a part of manufacturing process of the component built-in wiring board shown in FIG. Process drawing which shows another part of manufacturing process of the component built-in wiring board shown in FIG. FIG. 9 is a process diagram schematically showing still another part of the manufacturing process of the component built-in wiring board shown in FIG. 1. Sectional drawing which shows typically the structure of the component built-in wiring board which is another embodiment. Process drawing which shows a part of manufacturing process of the component built-in wiring board shown in FIG. 5 with a typical cross section.

  As an embodiment of the present invention, the vicinity of the boundary between the solder portion and the copper film may be an alloy having tin and copper. This is a state caused by heating the solder part covered with copper. That is, for example, when heating is performed for secondary mounting of a component on the main surface of the component built-in wiring board, the internal solder portion is in such a state.

  As an embodiment, the surface of the wiring pattern on the side in contact with the insulating layer may be a roughened surface. Thus, when the surface of the wiring pattern in contact with the insulating layer is a roughened surface, the adhesive strength between the wiring pattern and the insulating layer increases, and the occurrence of defects such as peeling of the wiring pattern can be further reduced.

  Further, as an embodiment, a second insulating layer stacked on the first main surface of the insulating layer so as to sandwich the wiring pattern, and a side of the second insulating layer on which the wiring pattern is located, And a second wiring pattern provided on the second insulating layer on the opposite side.

  This aspect is a structure in which the wiring pattern in which the built-in components are electrically and mechanically connected is not the outermost wiring layer on the main surface but particularly the inner wiring layer. The wiring pattern in which the built-in parts are electrically and mechanically connected is initially formed as a pattern of the outermost wiring layer due to the structure of the manufacturing process of covering the solder layer with the copper layer. However, after that, it is possible to provide the second insulating layer and the second wiring pattern as described above. According to this, the wiring pattern in which the built-in components are electrically and mechanically connected becomes the inner layer. It becomes a wiring layer. That is, the wiring pattern in which the built-in components are electrically and mechanically connected can be either the outermost wiring layer or the inner wiring layer, and there is no restriction in that sense.

  Based on the above, embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view schematically showing a configuration of a component built-in wiring board according to an embodiment. As shown in the figure, this component built-in wiring board includes insulating layers 11 to 16, wiring patterns (wiring layers) 21 to 27, interlayer connection conductors 31 to 36, surface-mounted passive element components 41, semiconductor components (wafer level). (Depending on chip scale package) 42, solder portions 51 and 52, and solder resists 61 and 62. The structure of this component built-in wiring board will be explained in the following, and then the characteristics will be explained.

  Each of the insulating layers 11 to 16 is a layer made of, for example, a glass epoxy resin, and has a thickness of about 60 μm to 100 μm, for example. As a whole, the insulating layers 11 to 16 have a plate-like appearance having opposed main surfaces. For convenience of explanation, in the drawing, the lower surface is the first main surface, and the upper surface is the second main surface.

  On the first main surface, a wiring pattern 21 is provided as one outermost wiring layer, and on the second main surface, a wiring pattern 27 is provided as the other outermost wiring layer. In addition to the wiring patterns 21 and 27 on these main surfaces, wiring patterns 22 to 26 are provided as inner wiring layers at the boundaries in the thickness direction of the insulating layers 11 to 16, respectively. The wiring patterns 21 to 27 on both main surfaces and the inner layers are obtained by patterning a copper foil having a thickness of, for example, 18 μm as a material.

  Various components (not shown) may be mounted on the component mounting lands included in the wiring patterns 21 and 27 on both main surfaces (= secondary mounting). Except for the land portions of the wiring patterns 21 and 27 on which the solder (not shown) on which the solder (not shown) is to be placed in the secondary mounting, the solder melted at the time of solder connection is held on the land portions and functions as a protective layer thereafter. Solder resists 61 and 62 are formed (thickness is about 20 μm, for example). An Ni / Au plating layer (not shown) with high corrosion resistance may be formed on the surface layer of the land portion.

  Interlayer connection conductors 31 to 36 are embedded in the insulating layers 11 to 16 in order to electrically connect the wiring patterns 21 to 27 in the vertical direction. The interlayer connection conductors 31 to 36 pass through one of the insulating layers 11 to 36, respectively, and between the surfaces of the wiring patterns (wiring patterns 21 to 27) located on both sides in the thickness direction of the penetrating insulating layer. It is located so that it is pinched. The interlayer connection conductors 31 to 36 are densely structured conductors obtained by deforming conductive bumps obtained by printing a conductive composition. The outer shape of the interlayer connection conductors 31 to 36 is substantially a truncated cone as shown in the figure, and the diameter thereof is, for example, about 100 μm on the thick side. This shape depends on the manufacturing process.

  In the insulating layers 11 to 16 (particularly, the portions of the insulating layers 11 to 15), surface mount type passive element components 41 are embedded. The component 41 is a so-called chip component for surface mounting, and here is, for example, a chip capacitor, a chip resistor, a chip inductor, or the like. The planar size is, for example, 0.6 mm × 0.3 mm, and terminal electrodes 41a are formed on both end surfaces, upper and lower surfaces and both side surfaces in the vicinity thereof (depending on the part, terminal electrodes are formed on both side surfaces. May not be formed). The lower surface side of the terminal electrode 41 a faces the wiring pattern 21, and the terminal electrode 41 a and the wiring pattern 21 that is the outermost wiring layer are electrically and mechanically connected by the solder portion 51.

  Further, a semiconductor component 42 is embedded in the insulating layers 11 to 16 (particularly portions of the insulating layers 11 to 15). The semiconductor component 42 is a wafer level chip scale package component, and includes at least a semiconductor chip and a grid-like array of surface mounting terminal electrodes 42a formed on the semiconductor chip.

  The surface-mounting terminal electrode 42a is a terminal electrode provided by rearranging its position while electrically conducting from a terminal pad (not shown) originally possessed by the semiconductor chip via a rewiring layer (not shown). . By such rearrangement, the arrangement density as the terminal electrode becomes coarser than that of the terminal pad on the semiconductor chip, so that the semiconductor component 42 is not mounted by flip chip bonding but by a normal surface mounting technique using a mounter. It can be mounted on the copper foil before being processed into the wiring pattern 21 via the solder portion 52.

  In order to embed the components 41 and 42, openings are formed in the insulating layers 12, 13, and 14 at positions corresponding to the components 41 and 42 to provide a space for embedding the components 41 and 42. The insulating layers 11 and 15 positioned above and below the stacking direction of the insulating layers 12, 13, and 14 are deformed so as to fill the space of the openings for the components 41 and 42, and become voids inside. There is no space.

  In addition to the structure described above, this component built-in wiring board is particularly characterized in that the solder portions 51 and 52 on which the components 41 and 42 are mounted are provided with a copper coating 71 covering the surface thereof. The copper coating 71 is located at least between the solder portions 51 and 52 and the insulating layers (insulating layers 11 to 16), but contacts the insulating layer 11 in the wiring pattern 21 depending on the manufacturing process. It is also formed on the surface (however, the wiring pattern 21 is also a copper material so that it does not appear to be a separate layer) or on the surface in contact with the insulating layer 11 of the terminal electrodes 41a and 42a.

  The copper film 71 is positioned at least between the solder portions 51 and 52 and the insulating layers (insulating layers 11 to 16), thereby providing the following effects. That is, in the heating process as in the secondary mounting, when the solder portions 51 and 52 are about to melt, the copper of the copper coating 71 forms an alloy with the solder (the component tin). Since such an alloy is an alloy having a melting point considerably higher than that of solder, the melting of the solder portions 51 and 52 does not further spread. Therefore, the remelting of the solder parts 51 and 52 can be prevented at the time of the secondary mounting, and a decrease in reliability can be remarkably prevented.

  Next, the manufacturing process of the component built-in wiring board shown in FIG. 1 will be described with reference to FIGS. 2 to 4 are process diagrams schematically showing a part of the manufacturing process of the component built-in wiring board shown in FIG. In these figures, the same or equivalent components as those shown in FIG.

  It demonstrates from FIG. FIG. 2 shows a manufacturing process of a part centering on the parts 41 and 42 in each configuration shown in FIG. First, cream solder (including Sn-3Ag-0.5Cu solder particles, for example), which is a material of the solder portions 51 and 52, is applied to a predetermined position on a copper foil 21A having a thickness of 18 μm, for example, by screen printing or a dispenser. Adhere. According to these, cream solder can be efficiently attached to a predetermined pattern. Subsequently, the components 41 and 42 are respectively mounted on the copper foil 21A via a cream solder, for example, with a mounter.

  After the components 41 and 42 are placed on the copper foil 21A via cream solder, heating (reflow: about 225 ° C., for example) is performed to melt the solder contained in the cream solder. Thereby, as shown to Fig.2 (a), the components 41 and 42 are mechanically and electrically connected to the predetermined position on the copper foil 21A via the solder parts 51 and 52. As shown in FIG.

  Next, by using the copper foil 21A to which the components 41 and 42 are connected as electrodes, by electrolytic plating, a copper film 71 is formed on the surfaces of the solder portions 51 and 52 as shown in FIG. 2B, for example, 2 μm to 3 μm. It is formed with a thickness of about. In this electrolytic plating step, copper is deposited on the entire surface region of the conductor portion electrically connected to the copper foil 21A, and a plating layer grows. Although electrolytic plating itself is well known, as a general rule, a copper foil 21A to which the components 41 and 42 are connected is immersed in an electrolytic solution containing copper ions to give a negative potential thereto, and a conductive material is further contained in the electrolytic solution. This is a step of immersing the other electrode to give a positive potential thereto. When current flows between the electrodes immersed in the electrolytic solution, copper ions are reduced and deposited as metallic copper on the surface of the electrode on the side of the copper foil 21A to which the components 41 and 42 are connected.

  The copper film 71 is not a problem as long as it is formed on at least the surfaces of the solder portions 51 and 52. However, in the illustrated process, the copper film 71 is also formed on the surface of the copper foil 21A on the side where the components 41 and 42 are connected. Forming. This is because, for example, it is considered wasteful to form a mask, for example, so as to prevent plating formation on the surface of the copper foil 21A from the viewpoint of cost. On the other hand, the copper film 71 is not formed on the surface of the copper foil 21A where the components 41 and 42 are not connected. This is because, unlike the side where the components 41 and 42 are present, it is easy to apply a uniform dry film, for example, on the copper foil 21A to prevent plating.

  Incidentally, the following can be said with respect to the copper film 71 formed on the surface layer of the terminal electrode 41a of the surface mount type passive element component such as the component 41. Since the surface layer of such a terminal electrode 41a often has a tin layer (which can also be regarded as solder) in many cases, the copper film 71 formed on the surface of the tin layer is formed on the solder portion 51. It becomes a film integral with the copper film 71 formed on the surface.

  2B, the laminated member 1 in a state where the components 41 and 42 are connected to the copper foil 21A via the solder portions 51 and 52 having the copper film 71 is obtained. The subsequent steps using the laminated member 1 will be described with reference to FIG. In addition, you may make it perform a roughening process with respect to the laminated member 1 so that the surface by which the components 41 and 42 of the copper foil 21A were connected becomes a roughening surface further. When the surface is roughened in this way, the adhesive strength between the copper foil 21A and the insulating layer laminated thereon increases, and the occurrence of defects such as peeling of the wiring pattern formed from the copper foil 21A from the insulating layer is further reduced. can do.

  Next, a description will be given with reference to FIG. FIG. 3 shows a manufacturing process of a portion around each of the insulating layers 11 to 14 in each configuration shown in FIG. First, as shown in FIG. 3A, two laminated members are prepared. One of them has an insulating layer 12, a copper foil 22 </ b> A, a wiring pattern 23, and an interlayer connection conductor 32. The other has an insulating layer 14, a wiring pattern 24, a copper foil 25A, an interlayer connection conductor 34, a prepreg 13A, and a conductive bump 33A.

  The latter laminated member is obtained by forming conductive bumps 33A and further laminating a prepreg 13A on a member having the same configuration as the former laminated member. Therefore, a process for manufacturing the former laminated member will be briefly described. First, a paste-like conductive composition to be the interlayer connection conductor 32 is formed in a substantially conical bump shape on the copper foil 22A having a thickness of 18 μm, for example, by screen printing. This conductive composition is obtained by dispersing fine metal particles such as silver, gold and copper or fine carbon particles in a paste-like resin.

  Next, a prepreg layer to be the insulating layer 12 is laminated on the copper foil 22A so as to penetrate the bumps so that the head is exposed. Subsequently, a copper foil to be used as the wiring pattern 23 is laminated on the prepreg layer, and the whole is integrated by pressing and heating. As a result, the bumps are cured to form the interlayer connection conductor 32 in a state where the head is electrically connected to the copper foil to be the wiring pattern 23, and the prepreg layer is completely cured and the insulating layer 12. become. Then, as shown on the lower side of FIG. 3A, if the copper foil on one side is subjected to patterning by, for example, well-known photolithography and processed into the wiring pattern 23, the insulating layer 12, the copper foil 22A, A laminated member having the wiring pattern 23 and the interlayer connection conductor 32 is obtained.

  The process of forming the conductive bump 33A and further laminating the prepreg 13A on the member having the same structure as the laminated member shown at the lower side of FIG. 3A can be easily understood by referring to the above description. is there. When the two laminated members shown in FIG. 3A are prepared as described above, the lamination process is performed in the arrangement shown in FIG. As a result, the conductive bumps 33 </ b> A are hardened and become the interlayer connection conductors 33 whose heads are electrically connected to the wiring pattern 23, and the prepreg 13 </ b> A layer absorbs the steps of the wiring patterns 23 and 24. While being completely cured, the insulating layer 13 is obtained. Thereafter, the copper foils 22A and 25A are patterned by, for example, well-known photolithography, and these are processed into the wiring patterns 22 and 25 (FIG. 3B).

  3B is formed, conductive bumps 31A to be interlayer connection conductors 31 are formed on the surface provided with the wiring pattern 22, and the insulating layer 11 should be formed. The prepreg 11A is laminated. This process can be easily understood by referring to the points already described. And as shown in FIG.3 (c), the opening parts 81 and 82 for the components 41 and 42 to incorporate are penetrated and formed in the predetermined position of the obtained laminated body. As described above, the laminated member 2 having the prepreg 11A and the insulating layers 12 to 14 is obtained.

  Next, a description will be given with reference to FIG. FIG. 4 is a diagram showing an arrangement relationship in which the laminated members 1 and 2 obtained as described above are laminated. Here, the upper laminated member 3 in the figure is a member having the same configuration as the member shown in the upper side of FIG. 3A, and includes an insulating layer 16, a wiring pattern 26, a copper foil 27A, an interlayer connection conductor 36, a prepreg. 15A and conductive bumps 35A.

  Each of the laminated members 1, 2, and 3 is arranged in the arrangement as shown in FIG. 4 and is pressed and heated by a press. Thereby, the prepregs 11A and 15A are completely cured, and the whole is laminated and integrated. At this time, due to the fluidity of the prepregs 11A and 15A obtained by heating, the prepregs 11A and 15A are deformed and enter the spaces around the parts 41 and 42, and no gap is generated. Further, the conductive bump 31A is cured and the head thereof becomes the interlayer connection conductor 31 in a state of being electrically connected to the copper foil 21A, and the conductive bump 35A is cured and the head is electrically connected to the wiring pattern 25. Thus, the interlayer connection conductor 35 is in a state of being connected to each other.

  After the laminating step shown in FIG. 4, the upper and lower copper foils 21A and 27A are patterned into a predetermined pattern using well-known photolithography to be processed into the wiring patterns 21 and 27, and further layers of solder resists 61 and 62 are formed. By doing so, a component built-in wiring board as shown in FIG. 1 can be obtained.

  Next, a component built-in wiring board according to another embodiment will be described with reference to FIG. FIG. 5 is a cross-sectional view schematically showing a configuration of a component built-in wiring board according to another embodiment. Components identical or equivalent to those shown in the already described drawings are denoted by the same reference numerals. It is. The description of the part is omitted unless there is an additional matter.

  In this embodiment, each configuration of the insulating layer 10, the wiring pattern 20, and the interlayer connection conductor 30 is added as compared with that shown in FIG. Other configurations remain the same. The insulating layer 10 is a layer made of, for example, a glass epoxy resin like the insulating layers 11 to 16, and has a thickness of about 60 μm to 100 μm, for example. Since the insulating layer 10 is added, the first main surface as a whole is changed to the surface of the insulating layer 10 on the side where the wiring pattern 20 is provided.

  The wiring pattern 20 is also obtained by patterning a copper foil having a thickness of, for example, 18 μm as a material in the same manner as 21 to 27. The point that various components (not shown) can be mounted on the wiring patterns 20 and 27 on both main surfaces is the same as the description in FIG. In addition, since the insulating layer 10 is provided on the wiring pattern 21, the wiring pattern 21 is a pattern of an inner wiring layer located between the insulating layers 10 and 11.

  An interlayer connection conductor 30 is embedded in the insulating layer 10 in order to electrically connect the wiring patterns 20 and 21 in the vertical direction. The interlayer connection conductor 30 penetrates the insulating layer 10 and is positioned so as to be sandwiched between the surfaces of the wiring patterns 20 and 21 located on both sides in the thickness direction of the penetrating insulating layer 10. Similarly to the interlayer connection conductors 31 to 36, the interlayer connection conductor 30 is also a dense structure conductor obtained by deforming a conductive bump obtained by printing a conductive composition.

  FIG. 6 schematically shows a part of a manufacturing process of the component built-in wiring board shown in FIG. More specifically, it is an illustration of the last layering process. This process is basically performed by using a substantially completed form of the component built-in wiring board shown in FIG. 1 as a material, and this material includes a prepreg 10A to be the insulating layer 10, a copper foil 20A to be the wiring pattern 20, and A member having a conductive bump 30A to be the interlayer connection conductor 30 is laminated.

  The method for forming the member having the prepreg 10A, the copper foil 20A, and the conductive bump 30A can be easily understood by referring to the points described in FIG. The above-mentioned material, which is a substantially completed form of the component built-in wiring board shown in FIG. 1, is a member having a copper foil 27A before patterning and having a structure in which solder resists 61 and 62 are not formed. Changes in the prepreg 10A, the copper foil 20A, and the conductive bumps 30A in the stacking process shown in FIG. 6 can be easily understood by referring to the points already described.

  After this laminating step, the upper and lower copper foils 20A and 27A are predeterminedly patterned using well-known photolithography to form wiring patterns 20 and 27, and further, solder resists 61 and 62 are formed. A component built-in wiring board as shown in FIG. 5 can be obtained.

  In this embodiment, the wiring pattern 21 in which the built-in components 41 and 42 are electrically and mechanically connected is not the outermost wiring layer on the main surface but the inner wiring layer. The wiring pattern 21 in which the built-in components 41 and 42 are electrically and mechanically connected is structurally, initially the outermost wiring layer for the convenience of the manufacturing process of covering the solder portions 51 and 52 with the copper film 71. It is formed as a pattern. However, if the insulating layer 10 and the wiring pattern 20 are provided as described above, the wiring pattern 21 in which the components 41 and 42 are electrically and mechanically connected becomes the inner wiring layer. That is, the wiring pattern 21 in which the built-in components 41 and 42 are electrically and mechanically connected can be either the outermost wiring layer or the inner wiring layer, and there are restrictions in that sense. Will disappear.

  In each of the above embodiments, a conductive bump obtained by printing a conductive composition was provided as an interlayer connection conductor, but a member having a similar function was employed instead. Can be changed. Examples of the interlayer connection conductor having the same function include those derived from the conductive composition filled in the through holes and those obtained by growing a copper layer by plating in the via hole.

  1, 2, 3 ... Laminated member 10, 11, 12, 13, 14, 15, 16 ... Insulating layer, 10A, 11A, 13A, 15A ... Prepreg, 20, 21, 22, 23, 24, 25, 26, 27 ... Wiring pattern (wiring layer), 20A, 21A, 22A, 25A, 27A ... Copper foil, 30, 31, 32, 33, 34, 35, 36 ... Interlayer connection conductor (conductive bumps printed by conductive composition printing) 30A, 31A, 33A, 35A ... conductive bumps (before curing), 41 ... surface mount passive element parts, 41a ... terminal electrodes, 42 ... semiconductor parts (by wafer level chip scale package), 42a ... surface mount terminal electrodes, 51, 52 ... solder parts, 61, 62 ... solder resists, 71 ... copper coatings, 81, 82 ... parts openings.

Claims (5)

An insulating layer having a first main surface and a second main surface opposite to the first main surface;
A copper wiring pattern provided on the first main surface;
A component having a terminal electrode embedded in the insulating layer so as to be mounted on a surface of the wiring pattern in contact with the insulating layer;
A solder part positioned in contact with the terminal electrode so as to electrically and mechanically connect the terminal electrode of the component and the wiring pattern;
A component built-in wiring board comprising: a copper coating that covers a surface of the solder portion and is positioned between the solder portion and the insulating layer.   The component built-in wiring board according to claim 1, wherein the vicinity of the boundary between the solder portion and the copper coating is an alloy having tin and copper.   The component built-in wiring board according to claim 1, wherein a surface of the wiring pattern in contact with the insulating layer is a roughened surface. A second insulating layer laminated on the first main surface of the insulating layer so as to sandwich the wiring pattern;
A second wiring pattern provided on the second insulating layer on the side opposite to the side on which the wiring pattern is located of the second insulating layer;
The component built-in wiring board according to claim 1, further comprising: Electrically and mechanically connecting components having terminal electrodes on copper foil using solder;
Using the copper foil to which the component is connected as an electrode, forming a copper plating film on the surface of the solder; and
The insulation is formed on the surface of the copper foil on which the component is located, in which the component is connected with the solder and the copper plating film is formed on the surface of the solder so that the component is embedded in an insulating layer. Laminating and integrating layers;
Forming a wiring pattern by patterning the copper foil laminated and integrated with the insulating layer.

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