CN103096623A - Temperature sensing plate of laminating machine - Google Patents
Temperature sensing plate of laminating machine Download PDFInfo
- Publication number
- CN103096623A CN103096623A CN201110338464.XA CN201110338464A CN103096623A CN 103096623 A CN103096623 A CN 103096623A CN 201110338464 A CN201110338464 A CN 201110338464A CN 103096623 A CN103096623 A CN 103096623A
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- China
- Prior art keywords
- temperature sensing
- temp
- heat transfer
- transfer plate
- sensing
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Abstract
The invention discloses a temperature sensing plate of a laminating machine. The temperature sensing plate of the laminating machine is formed by a heat transfer plate body provided with a plurality of temperature sensing wires in a buried mode. When the laminating machine is used for lamination, the laminating machine does not need to be stopped, the temperature sensing plate is only needed to be placed in an intermediate layer of material layers to be laminated in a parallel and overlaid mode, so that procedures and time for forming grooves in the plate and connecting the temperature sensing wires are eliminated; and after the lamination, the temperature sensing plate can be drawn out for being reused for the next time, and therefore the temperature sensing plate of the laminating machine can save working procedures and working hours of a laminating process.
Description
Technical field
Be used for the temperature sensing device of testing inner pressing-in temp and temperature homogeneity when the present invention relates to a kind of printed circuit board (PCB) and carrying out pressure programming.
Background technology
Requisite in multilayer board (PCB) course of processing is exactly to use pressing machine, and the uniformity of the height of pressing machine pressing-in temp and temperature is quite big on the impact of the quality of pressing, so sensing and control pressing-in temp are the important measures that guarantee product pressing quality.In pressure programming; pressing machine generally uses thermocouple thermometer; and make several temp.-sensing wires (thermocouple wire) more; temp.-sensing wire is connected with thermocouple thermometer; then adopt multiple spot to place (generally can five centimetres place a temp.-sensing wire) according to the position; during placement; need fluting in the circuit board; temp.-sensing wire is placed in groove; record the temperature data of each position after pressurization, this temperature sensing method all needs shutdown to connect temp.-sensing wire before each pressing, and need to slot on plank; approximately ten minutes consuming time, so more time-consuming taking a lot of work.
Summary of the invention
In order to overcome defects, the invention provides a kind of temperature sensing board of press fit machine, this temperature sensing board of press fit machine can be saved operation and the man-hour of pressure programming, and simple in structure, easy to implement.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of temperature sensing board of press fit machine is provided with some temp.-sensing wires, and described temp.-sensing wire is connected with described thermocouple thermometer, is provided with the heat transfer plate with heat transmission function, and described temp.-sensing wire is fixed in described heat transfer plate, and described temp.-sensing wire and described heat transfer plate consist of described temperature sensing board.During pressing, need not to shut down, only parallel being superimposed on by the intermediate layer of pressing material layer of temperature sensing board need to be got final product, saved operation and the time of slotting and connecing temp.-sensing wire on plank, and temperature sensing board can have been extracted out after pressing, for reuse next time.
The present invention for the further technical scheme that solves its technical problem and adopt is:
Described heat transfer plate is metallic plate.
Described temp.-sensing wire lays fixed in described heat transfer plate.
Some described temp.-sensing wires are parallel with described heat transfer plate and laterally equidistantly be embedded in described heat transfer plate.
The invention has the beneficial effects as follows: temperature sensing board of press fit machine of the present invention is made of the heat transfer plate that is embedded with some temp.-sensing wires; during pressing; need not to shut down; only parallel being superimposed on by the intermediate layer of pressing material layer of temperature sensing board need to be got final product; operation and the time of slotting and connecing temp.-sensing wire have been saved on plank; and temperature sensing board can be extracted out after pressing, for reusing next time, so this temperature sensing board of press fit machine can be saved operation and the man-hour of pressure programming.
Description of drawings
Fig. 1 is schematic diagram of the present invention (in figure in order to show that the temp.-sensing wire position demonstrates temp.-sensing wire, but actual temp.-sensing wire is embedded in heat transfer plate).
Embodiment
Embodiment: a kind of temperature sensing board of press fit machine, be provided with some temp.-sensing wires, described temp.-sensing wire 1 is connected with described thermocouple thermometer, is provided with the heat transfer plate 2 with heat transmission function, described temp.-sensing wire 1 is fixed in described heat transfer plate 2, and described temp.-sensing wire 1 and described heat transfer plate 2 consist of described temperature sensing board A.During pressing, need not to shut down, only parallel being superimposed on by the intermediate layer of pressing material layer of temperature sensing board need to be got final product, saved operation and the time of slotting and connecing temp.-sensing wire on plank, and temperature sensing board can have been extracted out after pressing, for reuse next time.
Described heat transfer plate 2 is metallic plate.
Described temp.-sensing wire 1 lays fixed in described heat transfer plate 2.
Some described temp.-sensing wires 1 are parallel with described heat transfer plate 2 and laterally equidistantly be embedded in described heat transfer plate.
Claims (4)
1. temperature sensing board of press fit machine, be provided with some temp.-sensing wires, described temp.-sensing wire (1) is connected with described thermocouple thermometer, it is characterized in that: be provided with the heat transfer plate (2) with heat transmission function, described temp.-sensing wire (1) is fixed in described heat transfer plate (2), and described temp.-sensing wire (1) and described heat transfer plate (2) consist of described temperature sensing board (A).
2. temperature sensing board of press fit machine according to claim 1, it is characterized in that: described heat transfer plate (2) is metallic plate.
3. temperature sensing board of press fit machine according to claim 1 and 2, it is characterized in that: described temp.-sensing wire (1) lays fixed in described heat transfer plate (2).
4. temperature sensing board of press fit machine according to claim 3 is characterized in that: some described temp.-sensing wires (1) are parallel with described heat transfer plate (2) and laterally equidistantly be embedded in described heat transfer plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110338464.XA CN103096623A (en) | 2011-11-01 | 2011-11-01 | Temperature sensing plate of laminating machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110338464.XA CN103096623A (en) | 2011-11-01 | 2011-11-01 | Temperature sensing plate of laminating machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103096623A true CN103096623A (en) | 2013-05-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110338464.XA Pending CN103096623A (en) | 2011-11-01 | 2011-11-01 | Temperature sensing plate of laminating machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103096623A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103974544A (en) * | 2014-04-30 | 2014-08-06 | 沪士电子股份有限公司 | Automatic lamination plate temperature monitoring and measuring method |
| CN105228374A (en) * | 2015-08-13 | 2016-01-06 | 江苏博敏电子有限公司 | A kind of method of printed circuit board mixing pressing |
| CN108593129A (en) * | 2018-02-01 | 2018-09-28 | 生益电子股份有限公司 | A kind of PCB layer pressure temperature measuring equipment and method |
| CN109738081A (en) * | 2018-12-28 | 2019-05-10 | 广州兴森快捷电路科技有限公司 | Vacuum film pressing machine and its thermometric accessory |
-
2011
- 2011-11-01 CN CN201110338464.XA patent/CN103096623A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103974544A (en) * | 2014-04-30 | 2014-08-06 | 沪士电子股份有限公司 | Automatic lamination plate temperature monitoring and measuring method |
| CN103974544B (en) * | 2014-04-30 | 2017-05-17 | 沪士电子股份有限公司 | Automatic lamination plate temperature monitoring and measuring method |
| CN105228374A (en) * | 2015-08-13 | 2016-01-06 | 江苏博敏电子有限公司 | A kind of method of printed circuit board mixing pressing |
| CN105228374B (en) * | 2015-08-13 | 2018-01-19 | 江苏博敏电子有限公司 | A kind of method of printed circuit board mixing pressing |
| CN108593129A (en) * | 2018-02-01 | 2018-09-28 | 生益电子股份有限公司 | A kind of PCB layer pressure temperature measuring equipment and method |
| CN108593129B (en) * | 2018-02-01 | 2020-02-28 | 生益电子股份有限公司 | PCB lamination temperature measuring device and method |
| CN109738081A (en) * | 2018-12-28 | 2019-05-10 | 广州兴森快捷电路科技有限公司 | Vacuum film pressing machine and its thermometric accessory |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130508 |