CN106255326B - A kind of multilayer impedance circuit board producing method improving edges of boards impedance strip - Google Patents
A kind of multilayer impedance circuit board producing method improving edges of boards impedance strip Download PDFInfo
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- CN106255326B CN106255326B CN201610732033.4A CN201610732033A CN106255326B CN 106255326 B CN106255326 B CN 106255326B CN 201610732033 A CN201610732033 A CN 201610732033A CN 106255326 B CN106255326 B CN 106255326B
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- circuit board
- choked flow
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention discloses a kind of multilayer impedance circuit board producing method and its control method for improving edges of boards impedance strip, including multi-layer board pressing working procedure, and the multi-layer board pressing working procedure includes that a. provides two panels A template, several Type B plates and c-type plate；B. pre- lamination and lamination；C. PE punching is carried out in multilayer circuit board edge；D. it fuses；E. riveted；F. it presses.The present invention is gradually reinforced multilayer circuit board by way of fusion, riveted in pressing working procedure and finally makes multilayer line sheet metal forming using heating pressing, effectively solve the problems, such as that easily generation layer is inclined when multilayer circuit board pressing, is particularly suitable for the production of high-rise multilayer circuit board；The present invention rises abnormal compensating to the contracting of inner plating by way of carrying out PE punching to multilayer circuit board edge simultaneously, and it is inclined to further prevent occurring between inner plating in pressing working procedure layer, reduces product defect rate, improves the precision of multilayer circuit board.
Description
Technical field
The present invention relates to wiring board arts, and in particular to a kind of multilayer impedance wiring board producer for improving edges of boards impedance strip
Method and its control method.
Background technique
Notebook host plate needs mating different core plate modules, and the two need to guarantee impedance in consistent range, if the two is deposited
In difference, system is be easy to cause the bad phenomenons such as not to be switched on.It is generally simulated using impedance strip is designed outside unit in PCB production
Impedance in unit, in order to produce control；When impedance strip design is in edges of boards, in bonding processes due to the height of impedance strip
Difference, causes dielectric thickness relatively low, there are deviations for impedance at the phenomenon that being easy to appear gummosis.The especially production process of multilayer circuit board
In, the phenomenon that wiring board number of plies is more, and when pressing is more easy to appear gummosis, dielectric thickness is more difficult to control.Current PC B industry competition
It is more severe, availability ratio of the armor plate, production efficiency are improved, reducing production cost is each PCB enterprise problems faced；When plate benefit
When being conflicted with rate with the presence of impedance strip position, to make full use of plate, impedance strip can only be designed in edges of boards, at this moment how to be guaranteed
Dielectric thickness becomes PCB enterprise urgent problem.
Summary of the invention
In view of this, the present invention disclose it is a kind of improve edges of boards impedance strip multilayer impedance circuit board producing method and its control
Method, the depth of displayable drilling are easy to use.
The purpose of the present invention is achieved through the following technical solutions:
A kind of multilayer impedance circuit board producing method and its control method improving edges of boards impedance strip, including multi-layer board pressing
Process, it is characterised in that: the multi-layer board pressing working procedure includes
A., two panels A template, several Type B plates and c-type plate are provided；
B. pre- lamination and lamination；
C. PE punching is carried out in multilayer circuit board edge；
D fusion；
E. riveted；
F. it presses；
The A template includes outside the unit of wiring board edges of boards, includes the A resistance for being provided with A impedance strip outside the unit
A choked flow area other than anti-area and the impedance area A, the impedance area A periphery are provided with the A copper sheet ring of encirclement, and A choked flow area is provided with
Multiple dotted A choked flow PAD, A choked flow area and A impedance strip opposite side are provided with the A choked flow with wiring board sides aligned parallel
Copper bar, the A choked flow copper bar are evenly arranged with several air guide ports；
The Type B plate includes that multiple dotted B choked flows are provided with outside the unit outside the unit of wiring board edges of boards
PAD；
The c-type plate includes outside the unit of wiring board edges of boards, includes the C resistance for being provided with C impedance strip outside the unit
C choked flow area other than anti-area and the impedance area C, the impedance area C periphery are provided with the C copper sheet ring of encirclement, and C choked flow area is provided with
C copper bar choked flow area outside unit, the C copper bar choked flow area is evenly arranged with several C air guide ports；
The present invention is by A template, Type B plate and c-type plate and the inner plating overlapped successively fuses, riveted and heating are pressed
It closes, inner plating is firmly combined gradually.Fusion process can be such that inner plating tentatively combines, to avoid multilayer circuit board plate in riveted
It is inclined that layer occurs for process.Riveted process then further reinforces multilayer circuit board, make its high temperature, high pressure heating pressing working procedure in
Layer does not occur and finally presses success partially.PE punching is carried out in multilayer circuit board edge, on the one hand can be subsequent fusion, riveting
It closes and provides location hole with heating pressing, on the other hand can compensate for the contracting that inner plating generates in process and rise exception, into one
It is inclined that layer occurs when step prevention multilayer circuit board pressing.
The fusion is carried out at a temperature of 230-290 DEG C；The fusion duration is 80-120S.
It further include the drilling operating carried out after multi-layer board pressing working procedure；The drilling operating its cut speed be 45-
60IPM；Its time knife speed of the drilling operating is 750-850IPM.
Since fusion process of the invention is the purpose is to reinforce and indirect pressing multilayer circuit board, to prevent in fusion
It heats between too quickly inner plating and occurs that contracting rises by exception and layer is inclined, the temperature that the temperature of fusion process is reduced fusion process by designer is same
Its time of Shi Yanchang.It is so not only able to meet the purpose of the preliminary fixed multilayer circuit board of the present invention, also can farthest prevent
Only deviated between inner plating.
In the number of plies of the lamination process, secondary lamina rara externa uses A template, and odd number number of plies plate uses Type B plate, even number number of plies plate
Using c-type plate.
The A choked flow PAD is uniform and is equally spaced in A choked flow area；A choked flow PAD, A copper sheet ring of encirclement, A choked flow copper
Item and A impedance strip height are equal；The A copper sheet ring of encirclement opposite sides is respectively arranged with A flow-guiding mouth, the A copper sheet ring of encirclement
Be provided with the either side of A flow-guiding mouth not with wiring board sides aligned parallel.
By the way that the A copper sheet ring of encirclement is arranged in the impedance area A periphery, changes medium flow direction, media flow is avoided to be obstructed in A impedance
The accumulation of edge excessively impacts；It is provided with A choked flow PAD and A choked flow copper bar simultaneously, passes through A choked flow PAD and A choked flow copper bar
It solves the problems, such as to flow medium can gently because there are differences in height for A impedance strip；A choked flow PAD can not only play the effect of choked flow
Fruit, and the gap between dotted A choked flow PAD forms effective air guide port, and gas is quickly discharged.A choked flow copper bar and A impedance
Item is oppositely arranged, the pressure that can be uniformly subject in pressing, and A choked flow copper bar and the A copper sheet ring of encirclement can balance relatively
The choked flow of two sides acts on.Since A choked flow PAD is used for choked flow and air guide, uniform and equidistant distribution, which is more advantageous to, improves medium
The uniformity improves the precision of dielectric thickness.A copper sheet ring of encirclement setting A flow-guiding mouth plays the role of water conservancy diversion, air guide, can make medium
It flows into the A copper sheet ring of encirclement, avoiding the formation of cavity influences to combine.The either side of A flow-guiding mouth, can not with wiring board sides aligned parallel
It effectively avoids medium from flowing into the excessive velocities in the A copper sheet ring of encirclement, is conducive to the uniformity for controlling A impedance strip surrounding medium.
The B choked flow PAD is uniform and is equally spaced outside unit.
The C copper bar choked flow area, the C copper sheet ring of encirclement and C impedance strip height are equal；The C copper sheet ring of encirclement opposite sides
Be respectively arranged with C flow-guiding mouth, the C copper sheet ring of encirclement be provided with the either side of C flow-guiding mouth not with wiring board sides aligned parallel.
By the way that the C copper sheet ring of encirclement is arranged in the impedance area C periphery, changes medium flow direction, media flow is avoided to be obstructed in C impedance
The accumulation of edge excessively impacts；It is provided with C copper bar choked flow area in C choked flow area simultaneously, is solved by the copper bar choked flow area C because of C
There is difference in height in impedance strip, flow medium can gently；C copper bar choked flow area can not only play the effect of choked flow, and
And gas can be quickly discharged in the C air guide port in C copper bar choked flow area, prevent pressing cavity.C water conservancy diversion is arranged in the C copper sheet ring of encirclement
Mouth plays the role of water conservancy diversion, air guide, and medium can be made to flow into the C copper sheet ring of encirclement, and avoiding the formation of cavity influences to combine.C flow-guiding mouth
Either side not with wiring board sides aligned parallel, can effectively avoid medium flow into the C copper sheet ring of encirclement in excessive velocities, be conducive to
Control the uniformity of C impedance strip surrounding medium.
Drilling operating institute's boring aperture is 0 .2-0 .4mm.
The aperture that the present invention is drilled drilling operating is contracted to 0 .2-0 .4mm, further reduces burr, ailhead goes out
A possibility that existing, improves drilling smoothness, improves product quality.
It further, further include primary plating copper process and secondary plating copper process；The primary plating copper process and secondary plating
Copper process is carried out under 8-12ASF current density.
The primary plating copper process and secondary plating copper process duration are 30-120min.
By reducing electroplating current, extending electroplating time, it can be improved plating grout ability, it is obstructed inclined with hole copper to reduce hole
The quality problems such as thin, it is ensured that product conduction is good.
The beneficial effects of the present invention are:
The present invention is provided with three kinds of templates such as A template, Type B plate and c-type plate for the pressing working procedure of multilayer circuit board, and right
Every kind of template makes corresponding pressing optimization processing, and pressing is avoided the scene of gummosis occur, dielectric thickness when being the pressing of each template
More uniformly, and Type B plate and c-type plate using intersect stack by the way of more full and uniform pressure force, press multilayer circuit board
When the power that is subject to it is more uniform.
Detailed description of the invention
Fig. 1 is A shaping plate structure schematic diagram of the present invention.
Fig. 2 is Type B plate structural schematic diagram of the present invention.
Fig. 3 is c-type plate structural schematic diagram of the present invention.
Specific embodiment
In order to facilitate the understanding of those skilled in the art, below in conjunction with embodiment, present invention is further described in detail:
Embodiment 1
The present embodiment provides a kind of 12 sandwich circuit board production methods, as shown in Figure 1-3, include following process:
Pressing；
Drilling；
Copper facing；
Outer layer dry film；
Secondary copper facing；
Lose copper；
It is anti-welding.
Above-mentioned pressing working procedure includes
A., two panels A template, several Type B plates and c-type plate are provided；
B. pre- lamination and lamination；
C. PE punching is carried out in 12 sandwich circuit board edges using PE perforating press；
D. 12 sandwich circuit boards are positioned by above-mentioned PE punching, carries out contact in 12 sandwich circuit board edges of boards using Heat sealing machine
Dotted fusion, fusion temperature are 260 DEG C, and the fusion time is 99s；
E. 12 sandwich circuit boards riveted on lock seaming machine using above-mentioned PE punching, position simultaneously riveted；
F. heating pressing is carried out to 12 sandwich circuit boards reinforced through fusion, riveted on pressing machine.
Above-mentioned drilling operating, with time knife speed progress for cutting speed, 800IPM of 50IPM, is drilled in unit
Diameter is 0 .3mm.
Reduction, which cuts speed, go back to knife speed and reduced bore, can reduce the probability of drilled edge burring machine ailhead appearance.
In addition, the burr and nail of drilled edge can also be effectively reduced by reducing the production bore limit of drill point used, reduction while the folded number of drilling
Head.
The A template includes outside the unit of wiring board edges of boards, includes the A for being provided with A impedance strip A3 outside the unit
A choked flow area A2 other than the A1 of the impedance area impedance area A1 and A, the impedance area the A periphery A1 is provided with the A copper sheet ring of encirclement A4, the A
Choked flow area A2 is provided with multiple dotted A choked flow PADA5, and A choked flow area A2 and A impedance strip A3 opposite side are provided with and line
A choked flow the copper bar A6, the A choked flow copper bar A6 of road plate sides aligned parallel are evenly arranged with several air guide port A7.The A choked flow
PADA5 is uniform and is equally spaced in A choked flow area A2；A choked flow PADA5, A copper sheet choked flow of ring of encirclement A4, A copper bar A6 and the A resistance
Anti- A3 height is equal；The A copper sheet ring of encirclement A4 opposite sides is respectively arranged with A flow-guiding mouth A8, the A copper sheet ring of encirclement A4
Be provided with the either side of A flow-guiding mouth A8 not with wiring board sides aligned parallel.
The Type B plate includes that multiple dotted B choked flows are provided with outside the unit outside the unit of wiring board edges of boards
PADB1.The B choked flow PADB1 is uniform and is equally spaced outside unit.
The c-type plate includes outside the unit of wiring board edges of boards, includes the C for being provided with C impedance strip C3 outside the unit
C choked flow area C2 other than the C1 of the impedance area impedance area C1 and C, the impedance area the C periphery C1 is provided with the C copper sheet ring of encirclement C6, the C
Choked flow area C2 is provided with the C copper bar choked flow area C4 outside the unit, and the C copper bar choked flow area C4 is evenly arranged with several C and leads
Port C5.The choked flow of C copper bar area C4, C copper sheet ring of encirclement C6 and C impedance strip C3 height is equal；The C copper sheet ring of encirclement C6 phase
C flow-guiding mouth C7 is respectively arranged with to two sides, the C copper sheet ring of encirclement C6 be provided with the either side of C flow-guiding mouth C7 not with wiring board
Sides aligned parallel.
In the number of plies of the lamination process, secondary lamina rara externa uses A template, and odd number number of plies plate uses Type B plate, even number number of plies plate
Using c-type plate.
In the present embodiment, an above-mentioned copper facing and secondary its electroplating current current density of plating copper process are 11ASF, when plating
Between be 45MIN.
The processes such as above-mentioned outer layer dry film, erosion copper, anti-welding can be realized using conventional method.
The present embodiment is directed to the characteristic of 12 sandwich circuit boards, to pressing working procedure, drilling operating and a copper facing, secondary plating coppersmith
The parameter of sequence optimizes, and has 12 sandwich circuit board produced and layer is inclined, drilled edge is smooth, on-state rate is good etc. does not occur
Advantage, to realize the purpose for reducing product defect rate, controlling production cost.The present embodiment is easily achieved simultaneously, existing
It is improved on production line, is particularly advantageous to large-scale promotion.
Embodiment 2
The present embodiment provides a kind of production method of 16 sandwich circuit boards, process is consistent with embodiment 1.
Its pressing working procedure includes
A., two panels A template, several Type B plates and c-type plate are provided；
B. pre- lamination and lamination；
C. PE punching is carried out in 16 sandwich circuit board edges using PE perforating press；
D. 16 sandwich circuit boards are positioned by above-mentioned PE punching, carries out contact in 16 sandwich circuit board edges of boards using Heat sealing machine
Dotted fusion, fusion temperature are 235 DEG C, and the fusion time is 89s；
E. 16 sandwich circuit boards riveted on lock seaming machine using above-mentioned PE punching, position simultaneously riveted；
F. 16 sandwich circuit boards that alignment fusion, riveted are reinforced on pressing machine carry out heating pressing.
In the present embodiment, drilling operating be in perforating press, with 45IPM cut speed, 760IPM return knife speed into
Row, institute's hole diameter are 0 .2mm.
In the present embodiment, an above-mentioned copper facing and secondary its electroplating current current density of plating copper process are 9ASF, when plating
Between be 40MIN.
16 sandwich circuit boards provided by the present embodiment are without the inclined phenomenon of layer, no gummosis, wiring board section thickness of dielectric layers
Uniformly without cavity, on-state rate is good.
Embodiment 3
The present embodiment provides a kind of production method of 20 sandwich circuit boards, process is consistent with embodiment 1.
Its pressing working procedure includes
A., two panels A template, several Type B plates and c-type plate are provided；
B. pre- lamination and lamination；
C. PE punching is carried out in 20 sandwich circuit board edges using PE perforating press；
D. 20 sandwich circuit boards are positioned by above-mentioned PE punching, carries out contact in 20 sandwich circuit board edges of boards using Heat sealing machine
Dotted fusion, fusion temperature are 290 DEG C, and the fusion time is 115s；
E. 20 sandwich circuit boards riveted on lock seaming machine using above-mentioned PE punching, position simultaneously riveted；
F. heating pressing is carried out to 20 sandwich circuit boards reinforced through fusion, riveted on pressing machine.
In the present embodiment, drilling operating be in perforating press, with 58IPM cut speed, 850IPM return knife speed into
Row, institute's hole diameter are 0 .4mm.
In the present embodiment, an above-mentioned copper facing and secondary its electroplating current current density of plating copper process are 12ASF, when plating
Between be 40MIN.
20 sandwich circuit boards provided by the present embodiment are without the inclined phenomenon of layer, no gummosis, wiring board section thickness of dielectric layers
Uniformly without cavity, on-state rate is good.
The above are wherein specific implementations of the invention, and the description thereof is more specific and detailed, but can not therefore manage
Solution is limitations on the scope of the patent of the present invention.It should be pointed out that for those of ordinary skill in the art, not departing from
Under the premise of present inventive concept, various modifications and improvements can be made, these obvious alternative forms belong to this hair
Bright protection scope.The technical detail being not described in detail in the present invention can be realized by any one of prior art.
Claims (8)
1. a kind of multilayer impedance circuit board producing method for improving edges of boards impedance strip, including multi-layer board pressing working procedure, feature exist
In: the multi-layer board pressing working procedure includes that a. provides two panels A template, several Type B plates and c-type plate；B. pre- lamination and lamination；C. in
Multilayer circuit board edge carries out PE punching；D. it fuses；E. riveted；F. it presses；
The A template includes outside the unit of wiring board edges of boards, includes the impedance area A for being provided with A impedance strip outside the unit
And the A choked flow area other than the impedance area A, the impedance area A periphery are provided with the A copper sheet ring of encirclement, A choked flow area is provided with multiple
Dotted A choked flow PAD, A choked flow area and A impedance strip opposite side are provided with the A choked flow copper bar with wiring board sides aligned parallel,
The A choked flow copper bar is evenly arranged with several air guide ports；The Type B plate includes the unit outside the unit of wiring board edges of boards
Outside is provided with multiple dotted B choked flow PAD；The c-type plate includes packet outside the unit outside the unit of wiring board edges of boards
The impedance area C for being provided with C impedance strip and the C choked flow area other than the impedance area C are included, the impedance area C periphery is provided with the encirclement of C copper sheet
Circle, C choked flow area are provided with the C copper bar choked flow area outside unit, and the C copper bar choked flow area is evenly arranged with several C
Air guide port；The fusion is carried out at a temperature of 230-290 DEG C；The fusion duration is 80-120s；It further include multi-layer board
The drilling operating carried out after pressing working procedure；The drilling operating its cut speed be 45-60IPM；Its time knife of the drilling operating
Speed is 750-850IPM.
2. according to a kind of multilayer impedance circuit board producing method for improving edges of boards impedance strip described in claim 1, it is characterised in that:
In the number of plies of the lamination process, secondary lamina rara externa uses A template, and odd number number of plies plate uses Type B plate, and even number number of plies plate uses c-type
Plate.
3. a kind of multilayer impedance circuit board producing method for improving edges of boards impedance strip according to claim 1, feature exist
In: the A choked flow PAD is uniform and is equally spaced in A choked flow area；A choked flow PAD, A copper sheet ring of encirclement, A choked flow copper bar and A
Impedance strip height is equal；The A copper sheet ring of encirclement opposite sides is respectively arranged with A flow-guiding mouth, and the A copper sheet ring of encirclement is provided with
The either side of A flow-guiding mouth not with wiring board sides aligned parallel.
4. a kind of multilayer impedance circuit board producing method for improving edges of boards impedance strip according to claim 1, feature exist
In: the B choked flow PAD is uniform and is equally spaced outside unit.
5. a kind of multilayer impedance circuit board producing method for improving edges of boards impedance strip according to claim 1, feature exist
In: the C copper bar choked flow area, the C copper sheet ring of encirclement and C impedance strip height are equal；The C copper sheet ring of encirclement opposite sides is set respectively
Be equipped with C flow-guiding mouth, the C copper sheet ring of encirclement be provided with the either side of C flow-guiding mouth not with wiring board sides aligned parallel.
6. a kind of multilayer impedance circuit board producing method for improving edges of boards impedance strip according to claim 1, feature exist
In: drilling operating institute's boring aperture is 0.2-0.4mm.
7. a kind of multilayer impedance circuit board producing method for improving edges of boards impedance strip according to claim 1, feature exist
In: it further include primary plating copper process and secondary plating copper process；The primary plating copper process and secondary plating copper process are in 8-12ASF
It is carried out under current density.
8. a kind of multilayer impedance circuit board producing method for improving edges of boards impedance strip according to claim 7, feature exist
In: the primary plating copper process and secondary plating copper process duration be 30-50min.
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| CN201610732033.4A CN106255326B (en) | 2016-08-26 | 2016-08-26 | A kind of multilayer impedance circuit board producing method improving edges of boards impedance strip |
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| CN106604575B (en) * | 2016-12-22 | 2019-03-05 | 深圳崇达多层线路板有限公司 | A method of improving Rogers plate wiring board edges of boards cracking |
| CN109640547B (en) * | 2018-12-01 | 2022-11-22 | 广东骏亚电子科技股份有限公司 | Method for improving interlayer alignment precision of multilayer circuit board |
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| CN201797644U (en) * | 2010-09-21 | 2011-04-13 | 磊鑫达电子(深圳)有限公司 | Printed circuit board (PCB) with impedance module |
| CN102458033A (en) * | 2010-10-18 | 2012-05-16 | 上海嘉捷通电路科技有限公司 | Inner-layer plate side structure of thick-copper printed circuit board |
| CN103249266A (en) * | 2013-04-03 | 2013-08-14 | 胜宏科技（惠州）股份有限公司 | Multilayer circuit board production method capable of preventing layer deviation |
| CN204859745U (en) * | 2015-08-04 | 2015-12-09 | 金禄（清远）精密科研投资有限公司 | PCB board of high reliability |
| CN105636368A (en) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | Control method for uniformly laminating multi-layered PCB |
| CN205305222U (en) * | 2016-01-13 | 2016-06-08 | 深圳市迅捷兴电路技术有限公司 | Impedance arrangement structure |
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2016
- 2016-08-26 CN CN201610732033.4A patent/CN106255326B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201797644U (en) * | 2010-09-21 | 2011-04-13 | 磊鑫达电子(深圳)有限公司 | Printed circuit board (PCB) with impedance module |
| CN102458033A (en) * | 2010-10-18 | 2012-05-16 | 上海嘉捷通电路科技有限公司 | Inner-layer plate side structure of thick-copper printed circuit board |
| CN103249266A (en) * | 2013-04-03 | 2013-08-14 | 胜宏科技（惠州）股份有限公司 | Multilayer circuit board production method capable of preventing layer deviation |
| CN204859745U (en) * | 2015-08-04 | 2015-12-09 | 金禄（清远）精密科研投资有限公司 | PCB board of high reliability |
| CN205305222U (en) * | 2016-01-13 | 2016-06-08 | 深圳市迅捷兴电路技术有限公司 | Impedance arrangement structure |
| CN105636368A (en) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | Control method for uniformly laminating multi-layered PCB |
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