CN208445828U - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN208445828U CN208445828U CN201820366493.4U CN201820366493U CN208445828U CN 208445828 U CN208445828 U CN 208445828U CN 201820366493 U CN201820366493 U CN 201820366493U CN 208445828 U CN208445828 U CN 208445828U
- Authority
- CN
- China
- Prior art keywords
- conductive layer
- pad
- printed circuit
- circuit board
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000011889 copper foil Substances 0.000 claims abstract description 8
- 238000009413 insulation Methods 0.000 claims description 5
- 229920000620 organic polymer Polymers 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 6
- 230000005611 electricity Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 11
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 239000001569 carbon dioxide Substances 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model provides a kind of printed circuit board.The printed circuit board includes the following: offer insulating layer, and the insulating layer has opposite two surfaces；Copper-foil conducting electricity is provided, the copper-foil conducting electricity is respectively the first conductive layer and the second conductive layer, and first conductive layer and the second conductive layer set up separately in the insulating layer with respect to two surfaces；Multiple first pads and the second pad is arranged in first conductive layer and the second conductive layer exposed surface；First pad is connect with the second pad scolding tin, and first conductive layer and the second conductive layer is made to realize electrical connection.Printed circuit board provided by the utility model, simple process, product is reliable, solves the problems, such as the harmomegathus that prior art products production process occurs.
Description
Technical field
The utility model relates to art of printed circuit boards more particularly to a kind of flexible printed circuit boards.
Background technique
Flexible printed circuit board (Flexible Printed Circuit, FPC), also known as flexible circuit board, soft route
Plate, flex circuit application, soft board are a kind of special printed circuit boards, have that light-weight, thickness is thin, the spies such as soft, flexible
Point.It is widely used in the electronic products such as mobile phone, laptop, PDA, digital camera, liquid crystal display.
With the development of hyundai electronics science and technology, electronic product plays the part of more importantly role, people in people's lives
The demand of electronic product is also continuously increased, each electronic product, is required to printed circuit board and realizes various electronic components
Layout and logical connection.
The production processing technology of flexible printed circuit board in the prior art generallys use the mode of equipment through-hole conducting, and
The two-sided conductive layer of printed circuit board is made in conductive layer is arranged in the through-hole in insulating substrate setting through-hole using bore process
It realizes and is electrically connected.
However, the prior art has the following problems:
Firstly, existing flexible printed circuit board production technology needs to give birth to by kinds of processes such as drilling, plating, etchings
Flexible printed circuit board described in output, production efficiency are low；
Secondly, flexible printed circuit board is easy to appear deformation in prior art technology process, so as to cause wiring board
It is easy to appear harmomegathus when continuous production, increases the product rejection rate of production；
Therefore, it is necessary to provide a kind of flexible printed circuit board to solve the above problems.
Utility model content
The utility model need to be to solve that prior art production efficiency is low and production process in product be easy to appear and rise
The problem of contracting.The utility model provides a kind of high production efficiency, solves the problems, such as the printed circuit board for occurring harmomegathus in production process.
A kind of printed circuit board, including the first conductive layer, the first pad, insulating layer, the second conductive layer, the second pad and weldering
Tin, first conductive layer are set to one side surface of insulating layer, and the multiple first pad is set to the first conductive layer table
Face, second conductive layer are set to another side surface of the insulating layer, and first conductive layer and second conductive layer are straggly
Setting forms step structure, and multiple circular holes, which are arranged, in the insulating layer on the step structure surface keeps second conductive layer naked
Dew, the circular hole are arranged the second pad, scolding tin are arranged between first pad and second pad.
The further improvement of above-mentioned printed circuit board as the utility model, first conductive layer edge are recessed in institute
The second conductive layer edge is stated to be arranged at random to form step structure.
The further improvement of above-mentioned printed circuit board as the utility model, first conductive layer edge and described the
It is arranged at random to form stage structure of falling from power on the inside of two conductive layer edges.
The further improvement of above-mentioned printed circuit board as the utility model, first conductive layer edge and described the
Maintain an equal level setting on the inside of two conductive layer edges.
The further improvement of above-mentioned printed circuit board as the utility model, first weldering of the first conductive layer setting
Disk, multiple circular holes, which are arranged, in the step structure surface insulation layer keeps second Conductive layer portions exposed, the circular hole setting the
Two pads.
The further improvement of above-mentioned printed circuit board as the utility model, the second conductive layer surface setting second
Pad, multiple circular holes, which are arranged, in the stage structure surface insulation layer of falling from power keeps first Conductive layer portions exposed, and the circular hole is set
Set the first pad.
The further improvement of above-mentioned printed circuit board as the utility model, the first conductive layer surface setting are multiple
Multiple second pads are arranged in first pad, second conductive layer surface.
The further improvement of above-mentioned printed circuit board as the utility model, first conductive layer are led with described second
Electric layer is arranged in the insulating layer by organic polymer with respect to two surfaces.
The further improvement of above-mentioned printed circuit board as the utility model, the multiple first pad spaced array are set
It sets, the multiple second pad spaced array setting.
The further improvement of above-mentioned printed circuit board as the utility model, first conductive layer is copper foil layer, institute
Stating the second conductive layer is copper foil layer.
A kind of production method of printed circuit board, include the following steps: provide the first conductive layer, the first pad, insulating layer,
Second conductive layer, the second pad and soldering, first conductive layer and the second conductive layer are divided into the insulating layer with respect to two tables
The multiple first pad is arranged in face, first conductive layer surface, and it is another that second conductive layer is set to the insulating layer
Side, the second conductive layer surface insulating layer setting circular hole keep second Conductive layer portions exposed, are arranged at the circular hole
Second pad, scolding tin is arranged between first pad and second pad makes first conductive layer and second conduction
Layer realizes electrical connection.
The further improvement of production method as the above-mentioned printed circuit board of the utility model, the laser processing technology packet
Include carbon dioxide laser technology, YAG laser technology and ultraviolet laser processing technology.
Compared with prior art, printed circuit board provided by the utility model and preparation method thereof is to bond insulating layer
Bilayer conductive layer is processed, and is increased printed circuit board and is processed thickness, improves the ability of anti-deformation of printed circuit board, is continuously being added
During work, external force is small to the influence of crust deformation of printed circuit board, overcomes the problems, such as that Continuous maching is easy to appear harmomegathus, can be to printing electricity
Road plate Continuous maching improves production efficiency.
Meanwhile printed circuit board provided by the utility model is burnt using laser technology and carves substitution punching and chemical etching step
Suddenly, remove discharging of waste liquid from, it is environmentally friendly, it can be processed automatically by equipment, simplify making step, reduce human cost.
Detailed description of the invention
Illustrate the technical scheme in the embodiment of the utility model to become apparent from, is used required for being described below to embodiment
Attached drawing do and simply introduce, it should be apparent that, the drawings in the following description are merely some embodiments of the present invention, right
For those of ordinary skill in the art, under the premise of without involving an inventive effort, it can also be obtained according to these following attached drawings
Obtain other accompanying drawings, in which:
Fig. 1 is the side sectional view of the utility model printed circuit board；
Fig. 2 is the floor map of the utility model printed circuit board；
Fig. 3 is the side sectional view of the utility model printed circuit board another kind embodiment；And
Fig. 4 is the side sectional view of another embodiment of the utility model printed circuit board.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out detailed complete description to this case, it is clear that
Ground, below it is described be only the utility model section Example, instead of all the embodiments.Based on the reality in utility model
Apply example, those of ordinary skill in the art's every other embodiment obtained without making creative work, all
Belong to the range of the utility model protection.
Fig. 1 and Fig. 2 is please referred to, Fig. 1 is printed circuit board side provided by the utility model cross-sectional view, and Fig. 2 is this
The printed circuit board plan view that utility model provides.The printed circuit board 10 includes the first conductive layer 11, the first pad
111, the second conductive layer 13, the second pad 131, insulating layer 15 and scolding tin 17.
In 15 side of insulating layer, first pad 111 is arranged described first for the setting of first conductive layer 11
11 surface of conductive layer, the setting of the second conductive layer 13 (are not marked in 15 other side of insulating layer, the insulating layer setting circular hole
Show) keep second conductive layer exposed, second pad 131 setting is on the 13 circular hole surface of the second conductive layer, and described the
Scolding tin 17 is set between one pad 111 and second pad 131.
First conductive layer, 11 edge and second conductive layer 13 are arranged at random to form step structure.
First conductive layer, 11 surface is provided with the multiple first pad 111, and 13 surface of the second conductive layer is exhausted
Multiple circular holes (not indicating), which are arranged, in edge layer 15 keeps second conductive layer 13 exposed, and second pad is arranged in the circular hole surface
131。
The multiple first pad, 111 spaced array setting is in 11 surface of the first conductive layer, the multiple second weldering
131 spaced array of disk is arranged on 13 surface of the second conductive layer.
First pad 111 and second pad 131 by scolding tin 17 realize first conductive layer 11 with it is described
The electrical connection of second conductive layer 13.
Referring to Fig. 3, provide another embodiment of the printed circuit board, 23 edge of the second conductive layer with it is described
It is arranged at random to form stage structure of falling from power on the inside of first conductive layer, 21 edge.
Multiple circular holes (not indicating), which are arranged, in first conductive layer, 21 surface insulation layer keeps first conductive layer 21 exposed,
First pad 211 is arranged in the circular hole surface, and the multiple second pad 231 is arranged in 23 surface of the second conductive layer.
The multiple first pad, 211 spaced array setting is in 21 surface of the first conductive layer, the multiple second weldering
231 spaced array of disk is arranged on 23 surface of the second conductive layer.
First pad 211 and second pad 231 by scolding tin 27 realize first conductive layer 21 with it is described
The electrical connection of second conductive layer 23.
Again referring to Fig. 4, providing another embodiment of the printed circuit board, 31 edge of the first conductive layer and institute
State the setting that maintains an equal level on the inside of 33 edge of the second conductive layer.
First conductive layer, 31 surface is provided with the multiple first pad 311, and 33 surface of the second conductive layer is set
It is equipped with the multiple second pad 331.
The multiple first pad, 311 spaced array setting is in 31 surface of the first conductive layer, the multiple second weldering
331 spaced array of disk is arranged on 33 surface of the second conductive layer.
First pad 311 and second pad 331 by scolding tin 37 realize first conductive layer 31 with it is described
The electrical connection of second conductive layer 33.
In a kind of most preferred embodiment of the utility model, first conductive layer 11 or 21 or 31 be copper foil layer, described
Two conductive layers 13 or 23 33 are copper foil layers.
When being processed to the printed circuit board 10, include the following steps:
First conductive layer 11 is provided；
The insulating layer 15 is provided, first conductive layer 11 is arranged in 15 side of insulating layer；
Second conductive layer 13 is provided, second conductive layer 13 is arranged in 15 other side of insulating layer；
First conductive layer, 11 edge and 13 edge of the second conductive layer are arranged at random to form the step structure；
Multiple circular holes are arranged in the insulating layer 15 with carbon dioxide laser technology on the step structure surface, make described
Second pad 131 is arranged in second conductive layer, 13 partial denudation, the circular hole surface.
The scolding tin 17 is set between first pad 111 and second pad 131, makes first conductive layer 11
It is electrically connected with second conductive layer 13 realization.
Compared to the prior art, in printed circuit board 10 provided by the utility model, using carbon dioxide laser technology
Insulating layer 15 described in burn off, are arranged first pad 111 and second pad 131, the scolding tin 17 connect described first
The mode of pad 111 and second pad 131 realizes the electrical connection of first conductive layer 11 and second conductive layer 13,
The step of substitution in the prior art drills to insulating layer and the first conductive layer simplifies technique, save the cost, while also improving product
Reliability reduces difficulty of processing.
The above description is only the embodiments of the present invention, and therefore it does not limit the scope of the patent of the utility model, all
Equivalent structure or equivalent flow shift made based on the specification and figures of the utility model, is applied directly or indirectly in
Other related technical areas are also included in the patent protection scope of the utility model.
Claims (10)
1. a kind of printed circuit board, comprising:
Insulating layer, the insulating layer have opposite two surfaces；
First conductive layer and the second conductive layer, first conductive layer and the second conductive layer set up the insulating layer separately with respect to two tables
Face；
First pad, first pad are set to first conductive layer surface；
Second pad, second pad are set to second conductive layer surface；
Scolding tin；
It is characterized in that, the scolding tin is arranged between first pad and second pad makes first conductive layer and institute
It states the second conductive layer and realizes electrical connection.
2. printed circuit board according to claim 1, which is characterized in that led with described second at first conductive layer edge
It is arranged at random to form step structure on the inside of electric layer edge.
3. printed circuit board according to claim 1, which is characterized in that led with described second at first conductive layer edge
It is arranged at random to form stage structure of falling from power on the inside of electric layer edge.
4. printed circuit board according to claim 1, which is characterized in that led with described second at first conductive layer edge
Maintain an equal level setting on the inside of electric layer edge.
5. printed circuit board according to claim 2, which is characterized in that the first pad, institute is arranged in first conductive layer
Stating the multiple circular holes of step structure surface insulation layer setting keeps second Conductive layer portions exposed, second weldering of circular hole setting
Disk.
6. printed circuit board according to claim 3, which is characterized in that second weldering of the second conductive layer surface setting
Disk, multiple circular holes, which are arranged, in the stage structure surface insulation layer of falling from power keeps first Conductive layer portions exposed, the circular hole setting
First pad.
7. printed circuit board according to claim 4, which is characterized in that the first conductive layer surface setting multiple first
Multiple second pads are arranged in pad, second conductive layer surface.
8. printed circuit board according to claim 1, which is characterized in that first conductive layer and second conductive layer
By organic polymer setting in the insulating layer with respect to two surfaces.
9. printed circuit board according to claim 1, which is characterized in that the multiple first pad spaced array setting,
The multiple second pad spaced array setting.
10. printed circuit board according to claim 1, which is characterized in that first conductive layer is copper foil layer, described
Two conductive layers are copper foil layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820366493.4U CN208445828U (en) | 2018-03-16 | 2018-03-16 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820366493.4U CN208445828U (en) | 2018-03-16 | 2018-03-16 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208445828U true CN208445828U (en) | 2019-01-29 |
Family
ID=65093262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820366493.4U Active CN208445828U (en) | 2018-03-16 | 2018-03-16 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208445828U (en) |
-
2018
- 2018-03-16 CN CN201820366493.4U patent/CN208445828U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200731898A (en) | Circuit board structure and method for fabricating the same | |
| EP1283662A4 (en) | It laminating double-side circuit board and production method therefor and multi-layer printed circuit board using | |
| US9730328B2 (en) | Printed circuit board with embedded component and method for manufacturing same | |
| TW200742518A (en) | Flexible printed circuit board and method for manufacturing the same | |
| US20200120805A1 (en) | Embedded circuit board and method of making same | |
| CN111328192A (en) | Method for additive manufacturing of glass substrate PCB and LED display | |
| CN108076584A (en) | The production method of flexible PCB, circuit board component and flexible PCB | |
| CN102316681B (en) | Circuit board and manufacturing method thereof | |
| CN104681531A (en) | Package substrate and method for fabricating the same | |
| TW200420203A (en) | Multilayer board and its manufacturing method | |
| CN102665372A (en) | Two-sided hollow flexible circuit board and manufacturing method thereof | |
| CN200941707Y (en) | High heat conductive metallic substrate | |
| CN103857176A (en) | Circuit board and manufacture method for the same | |
| CN208445828U (en) | Printed circuit board | |
| US10653015B2 (en) | Multilayer circuit board and method of manufacturing the same | |
| CN202178915U (en) | Blind hole double-face heat conducting circuit board | |
| CN108601210A (en) | Printed circuit board and preparation method thereof | |
| CN208016103U (en) | A kind of goldfinger bevel circuit board | |
| CN102378489B (en) | Soft and hard circuit board and manufacturing method thereof | |
| CN219876257U (en) | PCB and LED display module | |
| TWI749672B (en) | Embedded circuit board and manufacturing method thereof | |
| CN205017684U (en) | Adopt one -course three -layer flexible circuit board of fine copper preparation inlayer | |
| CN108811337A (en) | A kind of production method of double-sided PCB board | |
| CN206879217U (en) | Mobile terminal and its circuit board assemblies | |
| CN216217701U (en) | High-hardness anti-fracture high-power circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190806 Address after: 516000 Dongjiang Hi-tech Industrial Park, Zhongkai Hi-tech Zone, Huizhou City, Guangdong Province, No. 3, Xingping West Road Patentee after: Huizhou Over-Frequency Sanquan Intelligent Lighting Technology Co., Ltd. Address before: 528437 One of the Second Bottom Floors of Qiwan Sha, Qiwan Road, East District, Zhongshan City, Guangdong Province Patentee before: Shen Xuefang |