CN103857183B - Combined type flexible printed circuit board structure - Google Patents
Combined type flexible printed circuit board structure Download PDFInfo
- Publication number
- CN103857183B CN103857183B CN201210516797.1A CN201210516797A CN103857183B CN 103857183 B CN103857183 B CN 103857183B CN 201210516797 A CN201210516797 A CN 201210516797A CN 103857183 B CN103857183 B CN 103857183B
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit board
- board
- flexible printed
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a combined type flexible printed circuit board structure which comprises a flexible printed circuit board, a first combination board and a second combination board. The flexible printed circuit board comprises a top surface and a bottom surface, wherein the top surface and the bottom surface are opposite to each other; the top surface is provided with a first circuit layer; the bottom surface is provided with a second circuit layer; a first cover film is formed in the top surface, and the first circuit layer is covered with the first cover film; a second first cover film is formed in the bottom surface, and the second circuit layer is covered with the second first cover film; the surface of the first cover film and the surface of the second cover film are provided with a first combination area and a second combination area respectively, wherein the area of the first combination area and the area of the second combination area are smaller than that of the flexible printed circuit board, and the first combination area and the second combination area are opposite to each other; the first combination board and the second combination board area are respectively composed of a bonding layer, a polyimide layer and a copper layer and are formed in the first combination area and the second combination through the bonding layers respectively. Since the combined type flexible printed circuit board structure is formed by laminating the non-adhesive double-layer boards and the flexible board through the bonding layers, the combined type flexible printed circuit board structure not only has the reliability of the non-adhesive double-layer boards and the flexibility of the flexible board but also has the advantages of high size stability, heat resistance, high reliability, high-density thinning and the like.
Description
Technical field
The present invention relates to a kind of combined type flexible printed wiring board, it is espespecially a kind of by polylith without answering that glue system soft board is constituted
Box-like flexible printed circuit board structure.
Background technology
Printed circuit board (PCB) is material indispensable in electronic product, and as consumption electronic products demand is grown up, it is right
In the demand of printed circuit board (PCB) be also to grow with each passing day.Because flexible printed wiring board has flexibility and can three-dimensional space distribution
Etc. characteristic, emphasize that compact, flexibility development is driven under gesture in technicalization electronic product, be widely used at present computer
And its ancillary equipment, communication product and consumption electronic products etc..The species of flexible printed wiring board mainly has following several
Kind, single sided board, dual platen, multi-layer sheet and Rigid Flex, wherein again with simultaneously with the supportive of class hardboard and scratching for soft board
The utilization rate of the Rigid Flex of song is the most extensive.
But, in prior art, the thermostability of the hard portion in Rigid Flex structure is neither good with dimensional stability.Cause
This, pole need to be developed a kind of while having hardboard reliability and soft board flexure concurrently, can there is high dimensional stability, thermostability, Gao Ke again
By degree, highdensity flexible printed wiring board.
The content of the invention
In order to overcome drawbacks described above, the invention provides a kind of combined type flexible printed circuit board structure, the present invention's answers
Box-like flexible printed circuit board structure is will to be made by following layer pressing with soft board without glue system doubling plate, and it is not only possessed without glue
It is the reliability of doubling plate and possesses the flexibility of soft board, it is more high dimensional stability, thermostability, high-reliability, highdensity
The excellent specific properties such as graph thinning.
The technical scheme that adopted to solve its technical problem of the present invention is：
A kind of combined type flexible printed circuit board structure, including flexible circuit board, the first board and the second board, its
In, the flexible circuit board has relative top surface and bottom surface, and the top surface of the flexible circuit board has first line layer and bottom
Face has the second line layer, is additionally provided with the first coverlay and the second coverlay, and first coverlay is formed at the soft electricity
The top surface of road plate simultaneously covers the first line floor, and second coverlay is formed at the bottom surface of the flexible circuit board and covers
Second line layer, wherein, the first coverlay surface has area less than the first land of the flexible circuit board,
There is area to be less than the second land of the flexible circuit board, and first land and institute on the second coverlay surface
State the second land relative, first board is made up of successively the first following layer, the first polyimide layer and the first layers of copper,
First board is formed on first land by first following layer, and second board is successively by
Two following layers, the second polyimide layer and the second layers of copper are constituted, and second board is formed at by second following layer
On second land.
In prior art, in order to have preferably reliability, its board is used mostly epoxy resin/glass to Rigid Flex
Glass fibrous layer is formed with layers of copper pressing.And first board and the second board of the present invention is using by layers of copper and polyimides
Layer it is combined without glue system doubling plate, reduce integral thickness.Additionally, compared to the hard of epoxy resin/glass layer
Scutum or circuit board, polyimide layer used in the present invention has more preferably thermostability, soldering resistance and higher size peace
It is qualitative.
The further technical scheme that adopted to solve its technical problem of the present invention is：
Further say, the structure of the flexible circuit board of the present invention can be as follows：The flexible circuit board has this
Body layer, the body layer has relative first surface and second surface, and the first line layer is formed at the first surface
On, second line layer is formed on the second surface.
Further say, the structure of the flexible circuit board of the present invention can also be as follows：The flexible circuit board has
Body layer, the body layer has relative first surface and second surface, and the first adhesion layer is formed with the first surface,
The first line layer is formed on the first surface by first adhesion layer, and on the second surface second is formed with
Adhesion layer, second line layer is formed on the second surface by second adhesion layer.
It is preferred that the body layer is polyimide layer.
It is preferred that the thickness of the body layer is 12.5 to 25 microns.The first line layer and the second line layer compared with
Good material is copper, and preferred thickness is respectively 9 to 35 microns.
It is preferred that the thickness of the flexible circuit board is 30 to 95 microns, more preferably it is 30.5 to 95 microns.
It is preferred that the thickness of first coverlay is 16 to 50 microns；The thickness of second coverlay is 16 to 50
Micron.The preferable material of first coverlay and the second coverlay is polyimides.
It is preferred that the gross thickness of the combined type flexible printed circuit board structure is 92 to 195 microns, be more preferably 94.5 to
194.5 micron.
It is preferred that the thickness of first board is 30 to 50 microns, wherein, first following layer, the first polyamides
The thickness of imine layer and the first layers of copper is respectively 15 to 25 microns, 8 to 12 microns and 9 to 12.5 microns.
It is preferred that the thickness of second board is 30 to 50 microns, wherein, second following layer, the second polyamides
The thickness of imine layer and the second layers of copper is respectively 15 to 25 microns, 8 to 12 microns and 9 to 12.5 microns.
It is preferred that being using cathode copper or calendering copper as the layers of copper in first board and the second board.
The preferable material of first following layer and second following layer is thermosetting resin.
The thickness of first board and second board is more preferably 32 to 49.5 microns.
Additionally it is preferred that being, the thickness of first board is identical with the thickness of second board.
The invention has the beneficial effects as follows：The present invention combined type flexible printed circuit board structure be by without glue system doubling plate with
Soft board is made by following layer pressing, and it is not only possessed the reliability without glue system doubling plate and possesses the flexibility of soft board, more
The excellent specific properties such as high dimensional stability, thermostability, high-reliability, highdensity graph thinning.
Description of the drawings
Fig. 1 is the combined type flexible printed circuit board structure schematic diagram of embodiments of the invention 1；
Fig. 2 is the combined type flexible printed circuit board structure schematic diagram of embodiments of the invention 2.
Specific embodiment
Embodiments of the present invention are illustrated below by way of specific instantiation, those of ordinary skill in the art can be by this theory
Content disclosed in bright book understands easily advantages of the present invention and effect.The present invention also can give reality by other different modes
Apply, i.e., do not depart from it is disclosed under the scope of, can carry out different modifications with change.
Embodiment 1：As shown in figure 1, be the combined type flexible printed circuit board structure 100 of the present embodiment, including：Soft electricity
Road plate 120, including：Body layer 121 with relative first surface 121a and second surface 121b, and first surface 121a
And with the line layer 122 ' of first line layer 122 and second on second surface 121b；Including：It is formed at the flexible circuit board 120
Top surface 120a on, and be covered in the first coverlay 123 of first line layer 122；Also include：It is formed at the flexible circuit board
On 120 bottom surface 120b, to be covered in the second coverlay 123 ' of second line layer 122 ', wherein, first coverlay 123
There is respectively area less than the flexible circuit board 120 and the first relative land 1A1 and the with the surface of the second coverlay 123 '
Two land 1A2, for arranging the first board 110 and the second board 110 ', wherein, the first board 110 is included sequentially
The first following layer 113, the first polyimide layer 112 and the first layers of copper 111 on the 1A1 of first land；Second knot
Plywood 110 ', be include being sequentially disposed on the 1A2 of second land the second following layer 113 ', the second polyimide layer 112 ' and
Second layers of copper 111 '.
In the present embodiment, be to make flexible circuit board, the first board and the second board respectively, then by this first and
The following layer of the second board is binded to flexible circuit board.
In the present embodiment, the material of the body layer of flexible circuit board of the invention is polyimide film（AEM Corp.；Type
Number DL-1212E）, etched first line layer and the material of the second line layer is copper, and first and second coverlay is that polyamides is sub-
Amine film（AEM Corp.；Model AHICX015）, its thickness is as shown in table 1.The following layer of the first board and the second board is ring
Oxygen tree fat（AEM Corp.；Model AHEBXX25）, polyimide layer is to use polyimide film（AEM Corp.；Model
2NUSR1318）, its thickness is as shown in table 1.
Embodiment 2：As shown in Fig. 2 be the combined type flexible printed circuit board structure 200 of the present embodiment, including：Soft electricity
Road plate 220, it includes：Body layer 221 with relative first surface 221a and second surface 221b, and the first surface
There is the line layer 222 ' of first line layer 222 and second on 221a and second surface 221b, wherein, in body layer 221 and first
There is the first adhesion layer 224 between line layer 222, have the second adhesion layer 224 ' between the line layer 222 ' of body layer 221 and second；
Including：It is formed on the top surface 220a of the flexible printed wiring board 20, and is covered in the first coverlay of first line layer 222
223；Including：It is formed on the bottom surface 220b of the flexible printed wiring board 220, covers with cover second line layer 222 ' second
Epiphragma 223 ', wherein, there is respectively area to be less than the flexible circuit board on the surface of 223 and second coverlay of the first coverlay 223 '
220 and the first relative land 2A1 and the second land 2A2, for arranging the first board 210 and the second board 210 ',
Wherein, the first board 210 includes the first following layer 213, the first polyimide layer being sequentially disposed on the 2A1 of first land
212 and first layers of copper 211；And second board 210 ', be include being sequentially disposed on the 2A2 of second land second then
The 213 ', second polyimide layer 212 ' of layer and the second layers of copper 211 '.
The preparation method of the combined type flexible printed circuit board structure of the present embodiment adopts preparation method same as Example 1,
Difference is only that the flexible circuit board that the present embodiment is used is adhesive three ply board, and its first line layer and the second line layer are logical
Cross first and second adhesion layer to be pressed in body layer, wherein, this first integrates the material of the second adhesion layer as epoxy resin（AEM is public
Department；Model C CL-007）.
Comparative example：In this comparative example, the flexible circuit board for being used is same as Example 1, and its thickness is as shown in table 1.
Difference is, to be made up of with one side layers of copper epoxy resin/glass fibre, thickness is for the first board and the second board
The FR4 plates of 0.05 mm, and combined with middle flexible circuit board by following layer, wherein, the material of following layer is polypropylene film
（Lian Mao companies；Model IF-FB）, its thickness is as shown in table 1.
Table 1
Test case：Data prepares the combined type flexible printed wiring board of the present invention according to the method and table 1 of embodiment
Structure sample, and mechanical property and electrical characteristics test are carried out to the sample, test event includes chemical proofing test, resistance to
Solderability is tested and dimensional stability test, and result is recorded in into table 2.
First, chemical proofing test
According to the method for IPC-TM-650 2.3.2 institutes specification, sample is cut into into width 1cm, length is the test piece of 10cm,
And test piece is fully embedded into butanone（methyl ethyl ketone, MEK）Solvent in soak 30 minutes, by test piece from solvent
Taking-up is first rinsed with clear water, and whether observation test piece produces the swelling phenomenons such as foaming, delamination, stripping or discoloration.
2nd, soldering resistance test
According to the method for IPC-TM-650 2.4.13 institutes specification, sample is cut into into the test piece of size 5cm × 5cm, and with
After 135 °C ± 10 DEG C are toasted 1 hour, the constant temperature high temperature tin-lead liquid of temperature as described in Table 2 is immersed, each test piece immersion constant temperature high temperature
Tin-lead liquid drift stannum 10 seconds.Whether changed in submergence stannum furnace rear with visually observation sample substrate outward appearance.Carry out with the following method
Assessment：
○:There is not completely change in outward appearance
×:Outward appearance produces Qi Pao ﹑ decorative patterns or melting
3rd, dimensional stability test
According to the method for 2. 2. 4 specifications of IPC-TM-650, the Copper Foil with Kapton is cut into into 27
Four a diameter of 0.889 are charged and attacked out with the distance away from each side 1.25cm in the sample of cm × 29 cm, four on sample corner
The hole of cm, subsequently etches away Copper Foil, then measures the operating direction between each same side cavities with Quadratic Finite Element measuring instrument（machine
direction, MD）With horizontal direction（transverse direction, TD）Distance.Then, by sample in 150 DEG C of bakings
Roasting 30 minutes, after placing 24 hours, then measure the distance in MD directions TD directions between each same side cavities, by the MD before and after baking and
The distance in TD directions（Each distance is in terms of the distance by between the center of two relative openings of all directions）, calculate change in size.
Table 2
Description above and embodiment are only the principle and its effect of the illustrative present invention, not for limiting this
It is bright.The scope of the present invention, should be as listed by claims.
Claims (9)
1. a kind of combined type flexible printed circuit board structure, it is characterised in that：Including flexible circuit board, the first board and second
Board, wherein, the flexible circuit board has relative top surface and bottom surface, and the top surface of the flexible circuit board has First Line
Road floor and bottom surface have the second line layer, are additionally provided with the first coverlay and the second coverlay, and first coverlay is formed at institute
State the top surface of flexible circuit board and cover the first line layer, second coverlay is formed at the bottom of the flexible circuit board
Face simultaneously covers second line layer, wherein, the first coverlay surface has area less than the of the flexible circuit board
There is area to be less than the second land of the flexible circuit board, and described first on one land, the second coverlay surface
Land and second land are relative, and first board is successively by the first following layer, the first polyimide layer and the
One layers of copper is constituted, and first board is formed on first land by first following layer, second knot
Plywood is made up of successively the second following layer, the second polyimide layer and the second layers of copper, and second board passes through described second
Following layer is formed on second land, and the thickness of first board is 30 to 50 microns, wherein, described first
The thickness of following layer, the first polyimide layer and the first layers of copper is respectively 15 to 25 microns, 8 to 12 microns and 9 to 12.5 microns.
2. combined type flexible printed circuit board structure as claimed in claim 1, it is characterised in that：The flexible circuit board has
Body layer, the body layer has relative first surface and second surface, and the first line layer is formed at first table
On face, second line layer is formed on the second surface.
3. combined type flexible printed circuit board structure as claimed in claim 1, it is characterised in that：The flexible circuit board has
Body layer, the body layer has relative first surface and second surface, and the first adhesion layer is formed with the first surface,
The first line layer is formed on the first surface by first adhesion layer, and on the second surface second is formed with
Adhesion layer, second line layer is formed on the second surface by second adhesion layer.
4. combined type flexible printed circuit board structure as claimed in claim 2 or claim 3, it is characterised in that：The body layer is poly-
Imide layer.
5. combined type flexible printed circuit board structure as claimed in claim 1, it is characterised in that：The thickness of the flexible circuit board
Degree is 30 to 95 microns.
6. combined type flexible printed circuit board structure as claimed in claim 1, it is characterised in that：The thickness of first coverlay
Degree is 16 to 50 microns；The thickness of second coverlay is 16 to 50 microns.
7. combined type flexible printed circuit board structure as claimed in claim 1, it is characterised in that：The combined type soft printing
The gross thickness of board structure of circuit is 92 to 195 microns.
8. combined type flexible printed circuit board structure as claimed in claim 1, it is characterised in that：The thickness of second board
Degree is 30 to 50 microns, wherein, the thickness of second following layer, the second polyimide layer and the second layers of copper is respectively 15 to 25
Micron, 8 to 12 microns and 9 to 12.5 microns.
9. combined type flexible printed circuit board structure as claimed in claim 1, it is characterised in that：The thickness of first board
Degree is identical with the thickness of second board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210516797.1A CN103857183B (en) | 2012-12-05 | 2012-12-05 | Combined type flexible printed circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210516797.1A CN103857183B (en) | 2012-12-05 | 2012-12-05 | Combined type flexible printed circuit board structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103857183A CN103857183A (en) | 2014-06-11 |
| CN103857183B true CN103857183B (en) | 2017-05-03 |
Family
ID=50864254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210516797.1A Active CN103857183B (en) | 2012-12-05 | 2012-12-05 | Combined type flexible printed circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103857183B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201626864A (en) * | 2015-01-13 | 2016-07-16 | 台虹科技股份有限公司 | Cover film with high dimensional stability and manufacturing method of flexible printed circuit board |
| CN105763168B (en) * | 2016-02-22 | 2019-02-19 | 汉得利（常州）电子股份有限公司 | It is a kind of containing whether there is or not the piezo-electric resonators of gum base materials flexible circuit board |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101193495A (en) * | 2006-11-30 | 2008-06-04 | 长春人造树脂厂股份有限公司 | Polyimide compound soft board and its making method |
| CN101472390A (en) * | 2007-12-28 | 2009-07-01 | 富葵精密组件(深圳)有限公司 | Reinforcing plate and reinforced flexible circuit board including the same |
| CN101511147A (en) * | 2008-04-23 | 2009-08-19 | 深圳市精诚达电路有限公司 | Physical design for four-layer soft and hard combined board |
| CN201839522U (en) * | 2010-10-19 | 2011-05-18 | 博罗县精汇电子科技有限公司 | Connecting structure for joint portions of flexible circuit board and hard circuit board |
| CN102256438A (en) * | 2011-05-09 | 2011-11-23 | 厦门市英诺尔电子科技有限公司 | Novel rigid-flexible PCB (printed circuit board) and manufacturing method thereof |
| CN202475931U (en) * | 2012-01-31 | 2012-10-03 | 扬州华盟电子有限公司 | Fingerprint sensor FPC (flexible printed circuit) |
| CN202979466U (en) * | 2012-12-05 | 2013-06-05 | 昆山雅森电子材料科技有限公司 | Composite flexible printed circuit board structure |
-
2012
- 2012-12-05 CN CN201210516797.1A patent/CN103857183B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101193495A (en) * | 2006-11-30 | 2008-06-04 | 长春人造树脂厂股份有限公司 | Polyimide compound soft board and its making method |
| CN101472390A (en) * | 2007-12-28 | 2009-07-01 | 富葵精密组件(深圳)有限公司 | Reinforcing plate and reinforced flexible circuit board including the same |
| CN101511147A (en) * | 2008-04-23 | 2009-08-19 | 深圳市精诚达电路有限公司 | Physical design for four-layer soft and hard combined board |
| CN201839522U (en) * | 2010-10-19 | 2011-05-18 | 博罗县精汇电子科技有限公司 | Connecting structure for joint portions of flexible circuit board and hard circuit board |
| CN102256438A (en) * | 2011-05-09 | 2011-11-23 | 厦门市英诺尔电子科技有限公司 | Novel rigid-flexible PCB (printed circuit board) and manufacturing method thereof |
| CN202475931U (en) * | 2012-01-31 | 2012-10-03 | 扬州华盟电子有限公司 | Fingerprint sensor FPC (flexible printed circuit) |
| CN202979466U (en) * | 2012-12-05 | 2013-06-05 | 昆山雅森电子材料科技有限公司 | Composite flexible printed circuit board structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103857183A (en) | 2014-06-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9092096B2 (en) | Low-cost mass-produced touch sensors | |
| CN104429173B (en) | Screened film and shielding printed wiring board | |
| WO2006091463A3 (en) | Method of making multilayered construction for use in resistors and capacitors | |
| KR20200015643A (en) | Flexible printed circuit | |
| CN103857183B (en) | Combined type flexible printed circuit board structure | |
| CN103838407B (en) | Monolithic glass Trackpad and preparation method thereof | |
| US8551812B2 (en) | Manufacturing method of rigid and flexible composite printed circuit board | |
| CN202979466U (en) | Composite flexible printed circuit board structure | |
| CN111642068A (en) | RCC substrate and multi-layer laminated flexible board | |
| CN102316681A (en) | Circuit board and manufacturing method thereof | |
| CN101296557B (en) | Flexible printing circuit board | |
| TWI308854B (en) | Rigid flexible printed circuit board and method of fabricating same | |
| JPH03246986A (en) | Flexible and rigid printed wiring board | |
| CN100551201C (en) | Flexible printed wiring board | |
| CN202276545U (en) | High-frequency substrate structure | |
| CN105353915B (en) | A kind of touch screen production method | |
| CN104859223B (en) | A kind of two-layered medium non-gel flexible copper-clad plate | |
| KR20110002527A (en) | A multilayer flexible printed cirkit board and manufacturing method thereof | |
| CN106585046A (en) | Manufacturing process of ultramicro thin copper-clad plate and five-axis laminating machine matched with same | |
| CN202353923U (en) | Composite covering film | |
| CN103200771A (en) | Non-glue single face copper clad laminate with bonding function and manufacturing method thereof | |
| CN102490435B (en) | Method for manufacturing asymmetric factor multi-layer hardboard in soft and hard combination board by adopting separation lamination method | |
| CN202773177U (en) | Copper foil substrate having composite type structure | |
| CN103547132B (en) | Electromagnetic interference shielding structure and flexible printed circuit board with same | |
| CN110650597B (en) | Circuit board, manufacturing method thereof and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |