CN105353915B - A kind of touch screen production method - Google Patents
A kind of touch screen production method Download PDFInfo
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- CN105353915B CN105353915B CN201510875991.2A CN201510875991A CN105353915B CN 105353915 B CN105353915 B CN 105353915B CN 201510875991 A CN201510875991 A CN 201510875991A CN 105353915 B CN105353915 B CN 105353915B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- General Engineering & Computer Science (AREA)
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- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
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Abstract
The invention discloses a kind of touch screen production methods, by will print vertical anisotropic conductive adhesive in the bindings bit of the conductive film of several simple grain sensors that can arrange after cutting, etching and arrange cabling, cover the exposed conducting wire in bindings bit.On the one hand, it realizes and vertical anisotropic conductive adhesive is directly printed on conductive film, avoid and the vertical anisotropic conductive adhesive of rear simple grain covering is cut to conductive film, improve production efficiency；On the other hand, vertical anisotropic conductive adhesive is directly covered on conductive film, avoids and insulating layer is printed to conductive film, saves material.
Description
Technical field
The present invention relates to touch screen production technical field more particularly to a kind of touch screen production methods.
Background technology
At present, the touch screen of conventional method needs：Step A：If by by cutting, etching and arranging can arranging for cabling
Printing insulating layer forms the first plate in the bindings bit of the conductive film of dry simple grain sensor；Step B：By optical clear offset plate with
First plate is bonded, and is emptied at optical clear offset plate and the bindings bit cooperation of the first plate；Step C：By in above-mentioned steps B
One plate cuts into touch screen semi-finished product；Step D：Anisotropic conductive adhesive film coating is pasted at the bindings bit by step C；Step F：
Flexible circuit board is bound at the bindings bit by step D.
It due to existing touch screen production method, needs to print insulating oil, and also needs to simple grain and paste vertical anisotropic conductive adhesive
Coating, low production efficiency.
Therefore, how to improve touch screen production efficiency is the technical issues of those skilled in the art are urgently to be resolved hurrily.
Invention content
In view of this, the present invention provides a kind of touch screen production method, to realize the mesh for improving touch screen production efficiency
's.
To achieve these goals, the present invention provides following technical solution：
A kind of touch screen production method, includes the following steps：
Step A：Vertical unilateal conduction will be printed in the bindings bit of conductive film after cutting, etching and arrange cabling
Glue forms the first plate, and the conductive film can arrange several simple grain sensors；
Step B：Optical clear offset plate is fitted on first plate, and on the optical clear offset plate with the binding
Multiple binding holes are provided at the cooperation of position；
Step C：The first plate cutting by step B is divided into several touch screens for being only capable of one simple grain sensor of arrangement
Semi-finished product；
Step D：Flexible circuit board is tied on the touch screen semi-finished product, forms touch screen.
Preferably, in above-mentioned touch screen production method, step A includes the following steps：
Step A1：Package conductive film is cut into the conductive thin diaphragm plate for several simple grain sensors that can arrange；
Step A2：It is etching through the conductive film of step A1；
Step A3：Cabling is arranged on the conductive film by step A2；
Step A4：Vertical anisotropic conductive adhesive is printed on the bindings bit by the conductive film of step A3, forms the
One plate.
Preferably, in above-mentioned touch screen production method, the step A includes the following steps：
Step a1：Etching package conductive film；
Step a2：Cabling is arranged on the package conductive film by step a1；
Step a3：Several simple grain sensors that can arrange will be cut by the package conductive film of step a2
Conductive thin diaphragm plate；
Step a4：Vertical anisotropic conductive adhesive is printed on the bindings bit by the conductive film of step a3, forms the
One plate.
Preferably, in above-mentioned touch screen production method, the vertical anisotropic conductive adhesive in the step A is led for aeolotropic
Electric glue.
Preferably, in above-mentioned touch screen production method, the vertical anisotropic conductive adhesive in the step A is anisotropic conductive adhesive
Film.
Preferably, in above-mentioned touch screen production method, what is be provided on the optical clear offset plate in the step B described ties up
Determine hole to empty to be formed by laser.
It can be seen from the above technical scheme that touch screen production method provided by the invention, by will through cutting,
It prints in the bindings bit of the conductive film of several simple grain sensors that can arrange after etching and arrangement cabling and vertically unidirectionally leads
Electric glue covers the exposed conducting wire in bindings bit.On the one hand, it realizes and vertical unilateal conduction is directly printed on conductive film
Glue avoids and the vertical anisotropic conductive adhesive of rear simple grain covering is cut to conductive film, improves production efficiency；On the other hand, directly
Vertical anisotropic conductive adhesive is covered on conductive film, avoids and insulating layer is printed to conductive film, saves material.
The invention also discloses a kind of touch screen production methods, include the following steps：
Step a：Vertical unilateal conduction will be printed in the bindings bit of conductive film after cutting, etching and arrange cabling
Glue forms the first plate, and the conductive film can arrange several simple grain sensors；
Step b：2 blocks of first plates are taken out, this 2 blocks first plates are stacked, pass through middle layer optical clear offset plate
It fits together to form the second plate, and the fitting upper strata optical clear offset plate of first plate in upper strata, the middle layer light
It learns transparent offset plate, trepanning on first plate in upper strata and the upper strata optical clear offset plate, exposes described the of lower floor
The bindings bit of one plate with trepanning at the bindings bit cooperation on the upper strata optical clear offset plate, exposes the described of upper strata
The bindings bit of first plate；
Step c：Second plate cutting is divided into several each described first plates and is only capable of one simple grain sensor of arrangement
Touch screen semi-finished product；
Step d：Flexible circuit board is tied on the touch screen semi-finished product, forms touch screen.
Preferably, in above-mentioned touch screen production method, step a includes the following steps：
Step a1：Package conductive thin diaphragm plate is cut into the conductive thin diaphragm plate for several simple grain sensors that can arrange；
Step a2：It is etching through the conductive film of step a1；
Step a3：Cabling is arranged on the conductive film by step a2；
Step a4：Vertical anisotropic conductive adhesive is printed on the bindings bit by the conductive film of step a3, forms the
One plate.
Preferably, in above-mentioned touch screen production method, the step a includes the following steps：
Step aa1：Etching package conductive thin diaphragm plate；
Step aa2：Cabling is arranged on the package conductive film by step aa1；
Step aa3：Several simple grain sensors that can arrange will be cut by the package conductive film of step aa2
Conductive film；
Step aa4：Vertical anisotropic conductive adhesive is printed on the bindings bit by the conductive film of step aa3, is formed
First plate.
Preferably, in above-mentioned touch screen production method, the vertical anisotropic conductive adhesive in the step a is led for aeolotropic
Electric glue or Anisotropically conductive glued membrane.
Preferably, in above-mentioned touch screen production method, middle layer optical clear offset plate described in the step b is in
It the hole opened on first plate on upper strata and the upper strata Optical transparent adhesive and is tied up on the upper strata optical clear offset plate with described
The Kong Jun opened at location fit empties to be formed by laser.
It can be seen from the above technical scheme that touch screen production method provided by the invention, by will through cutting,
It prints in the bindings bit of the conductive film of several simple grain sensors that can arrange after etching and arrangement cabling and vertically unidirectionally leads
Electric glue covers the exposed conducting wire in bindings bit.On the one hand, it realizes and vertical unilateal conduction is directly printed on conductive film
Glue avoids and the vertical anisotropic conductive adhesive of rear simple grain covering is cut to conductive film, improves production efficiency；On the other hand, directly
Vertical anisotropic conductive adhesive is covered on conductive film, avoids and insulating layer is printed to conductive film, saves material.
Description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention, for those of ordinary skill in the art, without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the touch screen production method flow chart that the embodiment of the present invention one provides；
Fig. 2 is touch screen production method flow chart provided by Embodiment 2 of the present invention；
Fig. 3 is the touch screen production method flow chart that the embodiment of the present invention three provides；
Fig. 4 is the touch screen production method flow chart that the embodiment of the present invention four provides；
Fig. 5 is the touch screen production method flow chart that the embodiment of the present invention five provides；
Fig. 6 is the touch screen production method flow chart that the embodiment of the present invention six provides.
Specific embodiment
It is below in conjunction with the accompanying drawings and specific real in order to which those skilled in the art is made to be better understood from technical scheme of the present invention
Applying mode, the present invention is described in further detail.
Explanation of nouns：
Conductive film：By plating last layer conductive film (ito film) on the surface of the materials such as simple glass or PET, FILM,
It can be made to have electric conductivity, here it is conductive films.Conductive film is widely used for liquid crystal display (LCD), solar energy
Battery, microelectronics ITO electropanes, photoelectron and various optical fields.
Optical transparent adhesive：Also known as OCA or OCR is one of raw material of touch screen.
Flexible circuit board：Also known as flex circuit application (FPC), be it is a kind of mainly by CU (Copper foil) (E.D. or
R.A. copper foil), (polyimides are thin by A (Adhesive) (acryl and epoxy resin hot-setting adhesive) and PI (Kapton, Polyimide)
Film) form circuit board.
Aeolotropic conductive film：Abbreviation ACF, feature are the resistance in Z axis electrically conducting direction and XY insulating planars
Characteristic has apparent otherness.After the difference of Z axis conduction resistance value and X/Y plane insulating resistance value is more than certain ratio, both
Good conductive anisotropy is can be described as, i.e. Z-direction is connected, and XY axis directions are not turned on.
Anisotropically conductive glued membrane：Abbreviation ACP has single conducting direction perpendicular to the direction of Z axis, i.e. Z-direction is connected,
XY axis directions are not turned on.
Referring to Fig. 1, the touch screen production method flow chart provided for the embodiment of the present invention one.The embodiment specifically includes
Following steps：
Step S1：Printing in the bindings bit of conductive film after cutting, etching and arrange cabling is vertically unidirectionally led
Electric glue forms the first plate, and conductive film can arrange several simple grain sensors；
Package conductive film is cut, becomes the conductive film for several simple grain sensors that can arrange, and
And cabling is etched and arranged on conductive film.
It is vertical single by being printed in multiple bindings bits on conductive film in order to be protected to the conducting wire that bindings bit exposes
The first plate is formed to conducting resinl, since vertical anisotropic conductive adhesive has corrosion-resistant, anti-oxidant, high temperature resistant and high water resistance, because
This, plays a very good protection to conducting wire.
In the present embodiment, by the way that above vertical anisotropic conductive adhesive is screen printed onto on conductive film；It substitutes existing
Conductive film is cut into after simple grain in technology and pastes vertical anisotropic conductive adhesive in bindings bit, improves production efficiency；Again due to vertical
Anisotropic conductive adhesive completely covers bindings bit, protection conducting wire is more stable, more comprehensively, imitates by being screen printed onto on conductive film
Fruit is more preferable, reliability higher, and avoids the silk-screen printing insulating oil on conductive film, saves insulating oil material.
Wherein, the coating that vertical anisotropic conductive adhesive is formed can be aeolotropic conductive coating, or different
To conductive adhesive film coating.It can be selected according to specific needs.
Step S2：Optical clear offset plate is fitted on the first plate, and with being opened at bindings bit cooperation on optical clear offset plate
There are multiple binding holes；
Optical clear offset plate has the characteristics that：1) high transparency, and then improve the photopermeability between optics material and consolidate
It is fixed.2) unusual even transparent reduces the loss that light between optical material penetrates.Even if 3) under the conditions of high temperature high fever, have good
Good adhesiveness, material are excellent.4) easily fitting operation at normal temperatures.5) be capable of matching optics material it is rough and uneven in surface it
Place, patch volt appearance are good.Therefore, it is fitted with optical clear offset plate on the first panel.
The multiple binding holes being provided on optical clear offset plate plate can be emptied by laser, can also be by other manner shape
Into.
Step S3：The first plate cutting by step S2 is divided into several touches for being only capable of one simple grain sensor of arrangement
Shield semi-finished product；
After optical clear offset plate is fitted on the first plate by step S2, then by conductive film cutting be divided into it is several
The touch screen semi-finished product of a simple grain sensor that can only arrange.
Step S4：Flexible circuit board is tied on touch screen semi-finished product, forms touch screen.
Finally, touch screen will be formed after flexible circuit board and the binding of touch screen semi-finished product.
Touch screen production method provided by the invention, by above-mentioned steps S1, step S2, step S3 and step S4, finally
Obtain touch screen.Method provided by the invention, by the way that several will can be being arranged after cutting, etching and arrange cabling
Vertical anisotropic conductive adhesive is printed in the bindings bit of the conductive film of simple grain sensor, covers the exposed conducting wire in bindings bit.One
Aspect realizes and vertical anisotropic conductive adhesive is directly printed on conductive film, avoids and rear simple grain covering is cut to conductive film
Vertical anisotropic conductive adhesive, improves production efficiency；On the other hand, vertical anisotropic conductive adhesive is directly covered on conductive film, is kept away
Exempt to print insulating layer to conductive film, saved material.
Referring to Fig. 2, for touch screen production method flow chart provided by Embodiment 2 of the present invention.Touch in the present embodiment
As soon as it is similar with the touch screen production method in embodiment to shield production method, something in common is repeated no more, is only introduced different
Part.
In the present embodiment, step S1 includes the following steps：
Step S11：Package conductive thin diaphragm plate is cut into the conductive thin diaphragm plate for several simple grain sensors that can arrange；
Package conductive film, which is cut into, can install the conductive film of several simple grain sensors, of simple grain sensor
Number is set according to concrete condition.
Wherein, conductive film can be film conductive film, or common conductive film.User can also basis
It needs to change conductive film into other materials, is not limited only to conductive film.
Step S12：It is etching through the conductive film of step S11；
According to practical conducting wire needs, conducting wire is etched on conductive film.
Step S13：Cabling is arranged on the conductive film by step S12；
According to specific needs, cabling is arranged on conductive film.
Step S14：Vertical anisotropic conductive adhesive is printed on the bindings bit by the conductive film of step S13, forms first
Plate.
It is vertical single by being printed in multiple bindings bits on conductive film in order to be protected to the conducting wire that bindings bit exposes
To conducting resinl, and vertical anisotropic conductive adhesive has corrosion-resistant, anti-oxidant, high temperature resistant and high water resistance, and conducting wire is played very
Good protective effect.
In the present embodiment, by the way that above vertical anisotropic conductive adhesive is screen printed onto on conductive film；It substitutes existing
Conductive film is cut into after simple grain in technology and pastes vertical anisotropic conductive adhesive in bindings bit, improves production efficiency；Again due to vertical
Anisotropic conductive adhesive completely covers bindings bit, protection conducting wire is more stable, more comprehensively, imitates by being screen printed onto on conductive film
Fruit is more preferable, reliability higher, and avoids the silk-screen insulating oil on conductive film, saves insulating oil material.
Wherein, vertical anisotropic conductive adhesive can be aeolotropic conductive, or Anisotropically conductive glued membrane.It can basis
Specifically selected.
Touch screen production method provided by the invention has corrosion resistant by being printed in multiple bindings bits on conductive film
The vertical anisotropic conductive adhesive of erosion, anti-oxidant, high temperature resistant and high water resistance covers the exposed conducting wire in bindings bit.One side
Face realizes and vertical anisotropic conductive adhesive is directly covered on conductive film, avoids simple grain covering after being cut to conductive film and hangs down
Straight anisotropic conductive adhesive coating, improves efficiency；On the other hand, vertical anisotropic conductive adhesive is directly covered on conductive film, is kept away
Exempt to cover insulating layer to conductive film, saved material.
Referring to Fig. 3, the touch screen production method flow chart provided for the embodiment of the present invention three.Touch in the present embodiment
As soon as it is similar with the touch screen production method in embodiment to shield production method, something in common is repeated no more, is only introduced different
Part.
In the embodiment, step S1 includes the following steps：
Step S10：Etching package conductive film；
According to practical conducting wire needs, conducting wire is etched on package conductive film.
Step S20：Cabling is arranged on the package conductive film by step S10；
According to specific needs, cabling is arranged on package conductive film.
Step S30：Several simple grain sensors that can arrange will be cut by the package conductive thin diaphragm plate of step S20
Conductive film；
Package conductive film, which is cut into, can install the conductive film of several simple grain sensors, of simple grain sensor
Number is set according to concrete condition.
Wherein, conductive film can be film conductive film, or common conductive film.User can also basis
It needs to change conductive film into other materials, is not limited only to conductive film.
Step S40：Vertical anisotropic conductive adhesive is printed on the bindings bit by the conductive film of step S30, forms first
Plate.
It is vertical single by being printed in multiple bindings bits on conductive film in order to be protected to the conducting wire that bindings bit exposes
To conducting resinl, and vertical anisotropic conductive adhesive has corrosion-resistant, anti-oxidant, high temperature resistant and high water resistance, and conducting wire is played very
Good protective effect.
Wherein, vertical anisotropic conductive adhesive can be aeolotropic conductive, or Anisotropically conductive glued membrane.It can basis
Specifically selected.
Touch screen production method in the present embodiment is similar with the touch screen production method in embodiment one, advantageous effect phase
Together, details are not described herein again.
Referring to Fig. 4, the touch screen production method flow chart provided for the embodiment of the present invention four.The embodiment specifically includes
Following steps：
Step S100：It is vertical unidirectional by being printed in the bindings bit of the conductive film after cutting, etching and arrange cabling
Conducting resinl forms the first plate, and conductive film can arrange several simple grain sensors；
Package conductive film is cut, becomes the conductive film for several simple grain sensors that can arrange, and
And cabling is etched and arranged on conductive film.
It is vertical single by being printed in multiple bindings bits on conductive film in order to be protected to the conducting wire that bindings bit exposes
The first plate is formed to conducting resinl, since vertical anisotropic conductive adhesive has corrosion-resistant, anti-oxidant, high temperature resistant and high water resistance, because
This, plays a very good protection to conducting wire.
In the present embodiment, by the way that above vertical anisotropic conductive adhesive is screen printed onto on conductive film；It substitutes existing
Conductive film is cut into after simple grain in technology and pastes vertical anisotropic conductive adhesive in bindings bit, improves production efficiency；Again due to vertical
Anisotropic conductive adhesive completely covers bindings bit, protection conducting wire is more stable, more comprehensively, imitates by being screen printed onto on conductive film
Fruit is more preferable, reliability higher, and avoids the silk-screen printing insulating oil on conductive film, saves insulating oil material.
Wherein, the coating that vertical anisotropic conductive adhesive is formed can be aeolotropic conductive coating, or different
To conductive adhesive film coating.It can be selected according to specific needs.
Step S200：2 piece of first plate is taken out, this 2 piece of first plate is stacked, is fitted in by middle layer optical clear offset plate
The second plate is formed together, and the fitting upper strata optical clear offset plate of the first plate in upper strata, middle layer optical clear offset plate are in
The bindings bit of the first plate of lower floor, upper strata Optical transparent adhesive are exposed in trepanning on first plate on upper strata and upper strata optical clear offset plate
With trepanning at bindings bit cooperation on plate, expose the bindings bit of first plate on upper strata；
2 blocks of first plates by step S100 are taken out, this 2 piece of first plate is fit together by optical clear offset plate,
And the first plate on upper strata is bonded upper strata optical clear offset plate.
The hole opened on middle layer optical clear offset plate, the first plate in upper strata and upper strata optical clear offset plate and upper strata light
It learns and can be emptied on transparent offset plate with the hole opened at bindings bit cooperation by laser, can also be formed by other manner.
Step S300：The cutting of second plate is divided into several each first plates and is only capable of touching for one simple grain sensor of arrangement
Touch screen semi-finished product；
Step S400：Flexible circuit board is tied on touch screen semi-finished product, forms touch screen.
Finally, touch screen will be formed after flexible circuit board and the binding of touch screen semi-finished product.
Touch screen production method provided by the invention passes through above-mentioned steps S100, step S200, step S300 and step
S400 finally obtains the touch screen of biradical plate.Touch screen production method provided by the invention, by cutting, etching will pass through
And vertical anisotropic conductive adhesive is printed in the bindings bit of the conductive film of several simple grain sensors that can arrange after arrangement cabling,
Cover the exposed conducting wire in bindings bit.On the one hand, it realizes and vertical anisotropic conductive adhesive is directly printed on conductive film, avoid
It cuts to conductive film rear simple grain and covers vertical anisotropic conductive adhesive, improve production efficiency；On the other hand, directly in conductive thin
Vertical anisotropic conductive adhesive is covered on film, avoids and insulating layer is printed to conductive film, saves material.
Referring to Fig. 5, the touch screen production method flow chart provided for the embodiment of the present invention five.Touch in the present embodiment
It is similar with the touch screen production method in example IV to shield production method, something in common is just repeated no more, only introduces different
Part.
In the present embodiment, step S100 includes the following steps：
Step S101：Package conductive thin diaphragm plate is cut into the conductive thin diaphragm plate for several simple grain sensors that can arrange；
Package conductive film, which is cut into, can install the conductive film of several simple grain sensors, of simple grain sensor
Number is set according to concrete condition.
Wherein, conductive film can be film conductive film, or common conductive film.User can also basis
It needs to change conductive film into other materials, is not limited only to conductive film.
Step S102：It is etching through the conductive film of step S101；
According to practical conducting wire needs, conducting wire is etched on conductive film.
Step S103：Cabling is arranged on the conductive film by step S102；
According to specific needs, cabling is arranged on conductive film.
Step S104：Vertical anisotropic conductive adhesive is printed on the bindings bit by the conductive film of step S103, forms the
One plate.
It is vertical single by being printed in multiple bindings bits on conductive film in order to be protected to the conducting wire that bindings bit exposes
To conducting resinl, and vertical anisotropic conductive adhesive has corrosion-resistant, anti-oxidant, high temperature resistant and high water resistance, and conducting wire is played very
Good protective effect.
In the present embodiment, by the way that above vertical anisotropic conductive adhesive is screen printed onto on conductive film；It substitutes existing
Conductive film is cut into after simple grain in technology and pastes vertical anisotropic conductive adhesive in bindings bit, improves production efficiency；Again due to vertical
Anisotropic conductive adhesive completely covers bindings bit, protection conducting wire is more stable, more comprehensively, imitates by being screen printed onto on conductive film
Fruit is more preferable, reliability higher, and avoids the silk-screen insulating oil on conductive film, saves insulating oil material.
Wherein, vertical anisotropic conductive adhesive can be aeolotropic conductive, or Anisotropically conductive glued membrane.It can basis
Specifically selected.
Touch screen production method provided by the invention has corrosion resistant by being printed in multiple bindings bits on conductive film
The vertical anisotropic conductive adhesive of erosion, anti-oxidant, high temperature resistant and high water resistance covers the exposed conducting wire in bindings bit.On the one hand,
It realizes and vertical anisotropic conductive adhesive is directly covered on conductive film, it is vertical single to avoid simple grain covering after being cut to conductive film
To conducting resinl coating, efficiency is improved；On the other hand, vertical anisotropic conductive adhesive is directly covered on conductive film, is avoided
Insulating layer is covered to conductive film, saves material.
Referring to Fig. 6, the touch screen production method flow chart provided for the embodiment of the present invention six.Touch in the present embodiment
It is similar with the touch screen production method in example IV to shield production method, something in common is just repeated no more, only introduces different
Part.
In the embodiment, step S1 includes the following steps：
Step S110：Etching package conductive film；
According to practical conducting wire needs, conducting wire is etched on package conductive film.
Step S120：Cabling is arranged on the package conductive film by step S110；
According to specific needs, cabling is arranged on package conductive film.
Step S130：Several simple grain sensors that can arrange will be cut by the package conductive thin diaphragm plate of step S120
Conductive film；
Package conductive film, which is cut into, can install the conductive film of several simple grain sensors, of simple grain sensor
Number is set according to concrete condition.
Wherein, conductive film can be film conductive film, or common conductive film.User can also basis
It needs to change conductive film into other materials, is not limited only to conductive film.
Step S140：Vertical anisotropic conductive adhesive is printed on the bindings bit by the conductive film of step S130, forms the
One plate.
It is vertical single by being printed in multiple bindings bits on conductive film in order to be protected to the conducting wire that bindings bit exposes
To conducting resinl, and vertical anisotropic conductive adhesive has corrosion-resistant, anti-oxidant, high temperature resistant and high water resistance, and conducting wire is played very
Good protective effect.
Wherein, vertical anisotropic conductive adhesive can be aeolotropic conductive, or Anisotropically conductive glued membrane.It can basis
Specifically selected.
Touch screen production method in the present embodiment is similar with the touch screen production method in example IV, advantageous effect phase
Together, details are not described herein again.
" first " in the present invention, " second " etc. are to be distinguished in description, without others particular meanings.
The foregoing description of the disclosed embodiments enables professional and technical personnel in the field to realize or use the present invention.
A variety of modifications of these embodiments will be apparent for those skilled in the art, it is as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and inventive features phase
Consistent most wide range.
Claims (10)
1. a kind of touch screen production method, which is characterized in that include the following steps：
Step A：Vertical anisotropic conductive adhesive shape will be printed in the bindings bit of conductive film after cutting, etching and arrange cabling
Into the first plate, the conductive film can arrange several simple grain sensors；
Step B：Optical clear offset plate is fitted on first plate, and is matched on the optical clear offset plate with the bindings bit
Multiple binding holes are provided at conjunction；
Step C：By the first plate cutting by step B be divided into touch screen half that several are only capable of one simple grain sensor of arrangement into
Product；
Step D：Flexible circuit board is tied on the touch screen semi-finished product, forms touch screen.
2. touch screen production method according to claim 1, which is characterized in that step A includes the following steps：
Step A1：Package conductive thin diaphragm plate is cut into the conductive thin diaphragm plate for several simple grain sensors that can arrange；
Step A2：It is etching through the conductive film of step A1；
Step A3：Cabling is arranged on the conductive film by step A2；
Step A4：Vertical anisotropic conductive adhesive is printed on the bindings bit by the conductive film of step A3, forms the first plate.
3. touch screen production method according to claim 1, which is characterized in that the step A includes the following steps：
Step a1：Etching package conductive thin diaphragm plate；
Step a2：Cabling is arranged on the package conductive film by step a1；
Step a3：The conduction for several simple grain sensors that can arrange will be cut by the package conductive film of step a2
Film；
Step a4：Vertical anisotropic conductive adhesive is printed on the bindings bit by the conductive film of step a3, forms the first plate.
4. touch screen production method according to claim 1, which is characterized in that the vertical unilateal conduction in the step A
Glue is aeolotropic conductive or Anisotropically conductive glued membrane.
5. touch screen production method according to claim 1, which is characterized in that the optical clear offset plate in the step B
On the binding hole that is provided with empty to be formed by laser.
6. a kind of touch screen production method, which is characterized in that include the following steps：
Step a：Vertical anisotropic conductive adhesive shape will be printed in the bindings bit of conductive film after cutting, etching and arrange cabling
Into the first plate, the conductive film can arrange several simple grain sensors；
Step b：2 blocks of first plates are taken out, this 2 blocks first plates are stacked, are bonded by middle layer optical clear offset plate
The second plate, and the fitting upper strata optical clear offset plate of first plate in upper strata, the middle layer optical lens are formed together
First plate of lower floor is exposed in trepanning on gelatin plate, first plate in upper strata and the upper strata optical clear offset plate
The bindings bit, with trepanning at the bindings bit cooperation on the upper strata optical clear offset plate, expose described the first of upper strata
The bindings bit of plate；
Step c：Second plate cutting is divided into several each described first plates and is only capable of touching for one simple grain sensor of arrangement
Touch screen semi-finished product；
Step d：Flexible circuit board is tied on the touch screen semi-finished product, forms touch screen.
7. touch screen production method according to claim 6, which is characterized in that step a includes the following steps：
Step a1：Package conductive thin diaphragm plate is cut into the conductive thin diaphragm plate for several simple grain sensors that can arrange；
Step a2：It is etching through the conductive film of step a1；
Step a3：Cabling is arranged on the conductive film by step a2；
Step a4：Vertical anisotropic conductive adhesive is printed on the bindings bit by the conductive film of step a3, forms the first plate.
8. touch screen production method according to claim 6, which is characterized in that the step a includes the following steps：
Step aa1：Etching package conductive thin diaphragm plate；
Step aa2：Cabling is arranged on the package conductive film by step aa1；
Step aa3：Leading for several simple grain sensors that can arrange will be cut by the package conductive film of step aa2
Conductive film；
Step aa4：Vertical anisotropic conductive adhesive is printed on the bindings bit by the conductive film of step aa3, forms first
Plate.
9. touch screen production method according to claim 6, which is characterized in that the vertical unilateal conduction in the step a
Glue is aeolotropic conductive or Anisotropically conductive glued membrane.
10. touch screen production method according to claim 6, which is characterized in that middle layer optics described in the step b
The hole opened in transparent offset plate, first plate in upper strata and the upper strata Optical transparent adhesive and the upper strata Optical transparent adhesive
It empties to be formed by laser with the Kong Jun opened at the bindings bit cooperation on plate.
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| CN106095176B (en) * | 2016-06-08 | 2020-04-10 | 广东南海启明光大科技有限公司 | Copper-plated nano silver wire touch screen and manufacturing method thereof |
| CN106201145B (en) * | 2016-07-21 | 2018-10-30 | 京东方科技集团股份有限公司 | A kind of touch screen, its production method and display device |
| CN110764637B (en) * | 2018-07-27 | 2023-03-07 | 广州视源电子科技股份有限公司 | Manufacturing device, manufacturing method and application of conductive mesh-type touch sensing layer |
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|---|---|---|---|---|
| CN201947538U (en) * | 2011-03-04 | 2011-08-24 | 厦门高威尔电子科技有限公司 | Flexible circuit board with anisotropic conductive adhesive |
| CN202166997U (en) * | 2011-07-15 | 2012-03-14 | 牧东光电（苏州）有限公司 | Touch control panel for pins on the same layer |
| CN103853395A (en) * | 2012-11-30 | 2014-06-11 | 比亚迪股份有限公司 | Capacitive screen and manufacturing method thereof |
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| CN103345317B (en) * | 2013-03-25 | 2014-10-29 | 深圳欧菲光科技股份有限公司 | Touch screen |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201947538U (en) * | 2011-03-04 | 2011-08-24 | 厦门高威尔电子科技有限公司 | Flexible circuit board with anisotropic conductive adhesive |
| CN202166997U (en) * | 2011-07-15 | 2012-03-14 | 牧东光电（苏州）有限公司 | Touch control panel for pins on the same layer |
| CN103853395A (en) * | 2012-11-30 | 2014-06-11 | 比亚迪股份有限公司 | Capacitive screen and manufacturing method thereof |
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