CN115322715B - Adhesive composition for high-pressure-resistant aluminum substrate and preparation method thereof - Google Patents
Adhesive composition for high-pressure-resistant aluminum substrate and preparation method thereof Download PDFInfo
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- CN115322715B CN115322715B CN202211045541.7A CN202211045541A CN115322715B CN 115322715 B CN115322715 B CN 115322715B CN 202211045541 A CN202211045541 A CN 202211045541A CN 115322715 B CN115322715 B CN 115322715B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The invention discloses an adhesive composition for a high-pressure-resistant aluminum substrate and a preparation method thereof; relates to the technical field of aluminum substrates; solves the problem of poor pressure resistance of an aluminum substrate in the prior art; the adhesive composition comprises the following components in parts by weight: 30-50 parts of bisphenol A type epoxy resin, 10-30 parts of phenolic resin, 5-15 parts of natural rubber, 3-10 parts of silane coupling agent, 3-8 parts of dicyandiamide curing agent, 30-50 parts of micron-sized silicon powder and 70-80 parts of organic solvent, wherein the viscosity of the adhesive composition is that a No. 4 cup is coated for 1-8min; the adhesive composition can greatly improve the pressure resistance of the aluminum substrate.
Description
Technical Field
The invention belongs to the technical field of aluminum substrates, and particularly relates to an adhesive composition for a high-pressure-resistant aluminum substrate and a preparation method thereof.
Background
The aluminum substrate is a metal-based copper-clad plate with good heat dissipation function, and a single panel is generally composed of a three-layer structure, namely a circuit layer (copper foil), an insulating layer and a metal base layer (aluminum plate). The structure of the double-sided board is a circuit layer, an insulating layer, an aluminum base, an insulating layer and a circuit layer. The rare application is a multi-layer board, and can be formed by attaching a common multi-layer board with an insulating layer and an aluminum base.
A heat conductive insulating layer is needed between the aluminum substrate and the circuit layer to realize insulation and adhesion between the metal substrate and the circuit layer. For example, patent application CN 111040701A discloses a high temperature resistant, high toughness epoxy resin adhesive, prepared from component a and component B, wherein component a is prepared from bisphenol a type epoxy resin, toughener hyperbranched polyester compound, reactive diluent, silane coupling agent, heat resistant filler micron alumina powder, thixotropic agent, defoamer, and component B is prepared from polyamide curing agent, alicyclic amine curing agent, silane coupling agent, heat resistant filler micron alumina powder, thixotropic agent and defoamer; the invention also discloses a preparation method of the high-temperature-resistant high-toughness epoxy resin adhesive, which adopts heating and stirring to respectively prepare the component A and the component B and then mixes the components.
The heat conducting insulating layer in the prior art is mainly prepared by filling single aluminum oxide heat conducting particles with an organic resin material, so that the whole aluminum substrate has lower pressure resistance. Therefore, there is a need for further improvements in the aluminum substrates of the prior art to increase their pressure resistance while maintaining good thermal conductivity.
Disclosure of Invention
Aiming at the technical problems in the prior art, the invention provides an adhesive composition for a high-pressure-resistant aluminum substrate and a preparation method thereof.
The technical scheme adopted by the invention is as follows:
an adhesive composition for high pressure resistant aluminum substrates. The aluminum substrate comprises a metal base layer, a heat-conducting insulating layer and a circuit layer, wherein the heat-conducting insulating layer is obtained by drying an adhesive, and the adhesive composition comprises the following components in parts by weight:
the viscosity of the adhesive composition is that of the 4# cup for 1-8min.
According to the technical scheme, bisphenol A epoxy resin and phenolic resin are compounded to be used as an organic resin matrix, and compared with single bisphenol A epoxy resin, the obtained adhesive composition is beneficial to improving the pressure resistance of the aluminum substrate; in addition, the adhesive composition obtained by compounding natural rubber with an organic resin material is advantageous in improving the pressure resistance of an aluminum substrate. According to the adhesive composition, micron-sized silicon powder is added into an organic resin matrix to serve as heat-conducting filler particles, so that the heat-conducting property of the whole system can be improved. According to the invention, the use level of the organic solvent is increased, the viscosity of the adhesive composition is properly reduced, the thickness of a single-layer adhesive layer is controlled within the range of 90-110 mu m, and the double-layer adhesive layer is overlapped together to form the heat-conducting insulating layer after the hot-pressing procedure, so that the heat-conducting insulating layer is more uniform, and the pressure resistance of the aluminum substrate is ensured.
Bisphenol A type epoxy resin is a common adhesive organic resin material, but the consumption of the epoxy resin is reduced, only 30-50 parts of the epoxy resin is adopted, and the epoxy resin is convenient to add and compound with proper content of phenolic resin. However, the amount of bisphenol A type epoxy resin added should not be less than 30 parts, otherwise the tackiness of the adhesive is affected. Further, the amount of bisphenol A type epoxy resin added is preferably 35 to 45 parts, more preferably 40 parts.
Phenolic resin is a synthetic plastic, colorless or yellow brown transparent solid, and has excellent heat conductivity, flame resistance, water resistance and insulativity, better acid resistance, poor alkali resistance and good mechanical and electrical properties because of the fact that electric equipment is used more often. According to the invention, the phenolic resin is compounded in the bisphenol A type epoxy resin to serve as an organic resin matrix, so that the pressure resistance of the aluminum substrate can be enhanced. If the content of the phenolic resin is less than 10 parts, the pressure resistance of the aluminum substrate is not significantly improved; if the content of the phenolic resin is more than 30 parts, the content of the bisphenol a type epoxy resin is reduced, which affects the adhesiveness of the adhesive. Therefore, 10-30 parts of phenolic resin is selected for use in the present invention in consideration of the overall properties of the aluminum substrate. Further, the addition amount of the phenolic resin is preferably 15 to 25 parts, more preferably 20 parts.
Natural rubber is an elastic solid obtained by processing steps such as coagulation and drying of natural latex collected from Brazilian rubber tree. Natural rubber is a natural high molecular compound with polyisoprene as main component, its rubber hydrocarbon (polyisoprene) content is above 90%, and also contains small quantity of protein, fatty acid, sugar and ash. The natural rubber is nonpolar rubber, so that the electrical insulation property is good. Since the addition of the natural rubber to the adhesive of the present invention contributes to an increase in heat resistance of the aluminum substrate, the addition amount of the natural rubber in the present invention is 5 to 15 parts, and further, the addition amount of the natural rubber is preferably 8 to 12 parts, and more preferably 10 parts.
The kind of the organic solvent in the present invention is not particularly limited as long as a uniform adhesive slurry can be formed, and DMF, ethyl acetate, acetone, and the like can be used, for example. However, the amount of organic solvent added is critical to the present invention, as this relates to the viscosity of the adhesive and the thickness of the final thermally conductive insulating layer. If the addition amount of the organic solvent is less than 70 parts, the viscosity of the adhesive is higher than that of the 4# cup for 8min, and the thickness of the coating film may be uneven and the smoothness is poor; if the amount of the organic solvent added is more than 80 parts, the adhesive viscosity is lower than that of the 4# cup for 1min, and an adhesive layer having a thickness of about 100 μm cannot be formed on the circuit layer, and the pressure resistance is greatly lowered. Therefore, the organic solvent is added in an amount of 70 to 80 parts in the present invention. Further, the amount of the organic solvent added is 73 to 77 parts, and further, the amount of the organic solvent added is 75 parts.
Since a heat conductive insulating layer is necessary between the aluminum substrate and the circuit layer, insulation and adhesion between the metal substrate and the circuit layer are achieved. The current heat-conducting insulating layer is mainly prepared by filling heat-conducting particles with an organic resin material. However, at present, a single alumina is generally adopted as the heat conductive particle filler, but the alumina has limited heat transfer performance. According to the invention, micron-sized silicon powder is used for replacing aluminum oxide, so that the heat conduction performance of the aluminum substrate is greatly improved. Further, the particle diameter of the nano-sized silicon powder is preferably 3 to 7. Mu.m, more preferably 5. Mu.m.
In addition, the invention also provides a preparation method of the adhesive composition for the high-pressure-resistant aluminum substrate. The preparation method comprises the following steps: and weighing and uniformly mixing the components of the adhesive composition according to the proportion to obtain the adhesive composition.
In addition, the invention also provides a high-pressure-resistant aluminum substrate, which comprises a metal base layer, a heat-conducting insulating layer and a circuit layer, wherein the heat-conducting insulating layer is obtained by drying the adhesive composition.
In addition, the invention also provides a preparation method of the high-pressure-resistant aluminum substrate. The preparation method comprises the following steps:
(1) The adhesive composition is roll-coated on the surface of the circuit layer to form an adhesive layer I, and the adhesive composition is roll-coated on the surface of the release film to form an adhesive layer II;
(2) Covering the second adhesive layer on the first adhesive layer, removing the release film, and covering the metal base layer on the second adhesive layer to form an aluminum substrate semi-finished product;
(3) And performing hot pressing on the aluminum substrate semi-finished product to form the aluminum substrate.
In the technical scheme, a heat conduction insulating layer with the thickness of about 200 mu m is laminated by using the double-layer adhesive with the thickness of about 100 mu m, and the obtained heat conduction insulating layer is more uniform and has better quality. If the viscosity of the adhesive composition is increased, then a layer of heat conduction insulating layer with the thickness of about 200 mu m is directly formed by laminating an adhesive layer with the thickness of about 200 mu m, which is theoretically possible, but the technology in actual production is not mature, the quality of the obtained heat conduction insulating layer does not reach the standard, and the impact shear resistance is easily deteriorated due to the excessive thickness, so that the situation of layering and edge burst can occur.
Further, the invention has high pressure resistance requirement, so the thickness of the heat conduction insulating layer is 180-220 μm, more preferably 200 μm, and the heat resistance of the aluminum substrate obtained by the invention can reach the excellent degree of 9-11.5 KV.
Compared with the prior art, the invention has the beneficial effects that:
(1) The adhesive composition adopts bisphenol A type epoxy resin and phenolic resin to compound as an organic resin matrix, and compared with single bisphenol A type epoxy resin, the adhesive composition is beneficial to improving the pressure resistance of the aluminum substrate;
(2) According to the adhesive composition, nanoscale silicon powder is added into an organic resin matrix to serve as heat-conducting filler particles, so that the heat-conducting performance of the whole system can be improved;
(3) The adhesive composition reasonably prepares the dosage of the organic solvent, properly reduces the viscosity of the adhesive composition, ensures that the thickness of a single adhesive layer is controlled within 100 mu m, and ensures that the heat conduction insulating layer obtained by laminating the double adhesive layers has high comprehensive quality, thereby greatly improving the pressure resistance of the aluminum substrate.
Detailed Description
The examples shown below illustrate the invention in more detail. The present invention is not limited to the following examples.
Example 1
An adhesive composition for high pressure resistant aluminum substrates. The adhesive composition comprises the following components in parts by weight:
the viscosity of the adhesive composition is that the adhesive composition is coated on a No. 4 cup for 5min;
the bisphenol A type epoxy resin adopts low molecular solid bisphenol A type epoxy resin, and the grain diameter of the micron-sized silicon powder is 5 mu m.
The high-pressure-resistant aluminum substrate comprises a metal base layer, a heat-conducting insulating layer and a circuit layer, wherein the heat-conducting insulating layer is obtained by drying the adhesive composition. The preparation method comprises the following steps:
(1) The adhesive composition is rolled on the surface of the circuit layer to form an adhesive layer I with the thickness of 100 mu m, and the adhesive composition is rolled on the surface of the release film to form an adhesive layer II with the thickness of 100 mu m;
(2) Covering the second adhesive layer on the first adhesive layer, removing the release film, and covering the metal base layer on the second adhesive layer to form an aluminum substrate semi-finished product;
(3) Performing hot press on the aluminum substrate semi-finished product to form the aluminum substrate; wherein the thickness of the heat conducting insulating layer is 200 mu m.
Example 2
An adhesive composition for high pressure resistant aluminum substrates. The adhesive composition comprises the following components in parts by weight:
the viscosity of the adhesive composition is that the adhesive composition is coated on a No. 4 cup for 5min;
the bisphenol A type epoxy resin adopts low molecular solid bisphenol A type epoxy resin, and the grain diameter of the micron-sized silicon powder is 5 mu m.
The high-pressure-resistant aluminum substrate comprises a metal base layer, a heat-conducting insulating layer and a circuit layer, wherein the heat-conducting insulating layer is obtained by drying the adhesive composition. The preparation method comprises the following steps:
(1) The adhesive composition is rolled on the surface of the circuit layer to form an adhesive layer I with the thickness of 100 mu m, and the adhesive composition is rolled on the surface of the release film to form an adhesive layer II with the thickness of 100 mu m;
(2) Covering the second adhesive layer on the first adhesive layer, removing the release film, and covering the metal base layer on the second adhesive layer to form an aluminum substrate semi-finished product;
(3) Performing hot press on the aluminum substrate semi-finished product to form the aluminum substrate; wherein the thickness of the heat conducting insulating layer is 200 mu m.
Example 3
An adhesive composition for high pressure resistant aluminum substrates. The adhesive composition comprises the following components in parts by weight:
the viscosity of the adhesive composition is that the adhesive composition is coated on a No. 4 cup for 5min;
the bisphenol A type epoxy resin adopts low molecular solid bisphenol A type epoxy resin, and the grain diameter of the micron-sized silicon powder is 5 mu m.
The high-pressure-resistant aluminum substrate comprises a metal base layer, a heat-conducting insulating layer and a circuit layer, wherein the heat-conducting insulating layer is obtained by drying the adhesive composition. The preparation method comprises the following steps:
(1) The adhesive composition is rolled on the surface of the circuit layer to form an adhesive layer I with the thickness of 100 mu m, and the adhesive composition is rolled on the surface of the release film to form an adhesive layer II with the thickness of 100 mu m;
(2) Covering the second adhesive layer on the first adhesive layer, removing the release film, and covering the metal base layer on the second adhesive layer to form an aluminum substrate semi-finished product;
(3) Performing hot press on the aluminum substrate semi-finished product to form the aluminum substrate; wherein the thickness of the heat conducting insulating layer is 200 mu m.
Comparative example 1
An adhesive composition for high pressure resistant aluminum substrates. The adhesive composition comprises the following components in parts by weight:
the viscosity of the adhesive composition is that the adhesive composition is coated on a No. 4 cup for 5min;
the bisphenol A type epoxy resin adopts low molecular solid bisphenol A type epoxy resin, and the grain diameter of the micron-sized silicon powder is 5 mu m.
The high-pressure-resistant aluminum substrate comprises a metal base layer, a heat-conducting insulating layer and a circuit layer, wherein the heat-conducting insulating layer is obtained by drying the adhesive composition. The preparation method comprises the following steps:
(1) The adhesive composition is rolled on the surface of the circuit layer to form an adhesive layer I with the thickness of 100 mu m, and the adhesive composition is rolled on the surface of the release film to form an adhesive layer II with the thickness of 100 mu m;
(2) Covering the second adhesive layer on the first adhesive layer, removing the release film, and covering the metal base layer on the second adhesive layer to form an aluminum substrate semi-finished product;
(3) Performing hot press on the aluminum substrate semi-finished product to form the aluminum substrate; wherein the thickness of the heat conducting insulating layer is 200 mu m.
Comparative example 2
An adhesive composition for high pressure resistant aluminum substrates. The adhesive composition comprises the following components in parts by weight:
the viscosity of the adhesive composition is that the adhesive composition is coated on a No. 4 cup for 5min;
the bisphenol A type epoxy resin adopts low molecular solid bisphenol A type epoxy resin, and the grain diameter of the micron-sized silicon powder is 5 mu m.
The high-pressure-resistant aluminum substrate comprises a metal base layer, a heat-conducting insulating layer and a circuit layer, wherein the heat-conducting insulating layer is obtained by drying the adhesive composition. The preparation method comprises the following steps:
(1) The adhesive composition is rolled on the surface of the circuit layer to form an adhesive layer I with the thickness of 100 mu m, and the adhesive composition is rolled on the surface of the release film to form an adhesive layer II with the thickness of 100 mu m;
(2) Covering the second adhesive layer on the first adhesive layer, removing the release film, and covering the metal base layer on the second adhesive layer to form an aluminum substrate semi-finished product;
(3) Performing hot press on the aluminum substrate semi-finished product to form the aluminum substrate; wherein the thickness of the heat conducting insulating layer is 200 mu m.
The pressure resistance test data of the above examples 1-3 and comparative examples 1-2 are shown in Table 1.
TABLE 1 pressure resistance of examples 1-3 and comparative examples 1-2
| Breakdown voltage (KV) | |
| Example 1 | 11.5 |
| Example 2 | 9 |
| Example 3 | 10 |
| Comparative example 1 | 5 |
| Comparative example 2 | 6 |
As can be seen from Table 1, the pressure resistance of examples 2 to 3 was lower than that of example 1. The phenolic resin content in the adhesive composition of example 2 was lower than that of example 1, resulting in a reduction in the aluminum substrate breakdown voltage of example 2. Whereas the adhesive composition of example 3 has a lower natural rubber content than that of example 1, resulting in a reduction in the breakdown voltage of the aluminum substrate of example 2.
The adhesive composition of comparative example 1 adopts bisphenol A epoxy resin and contains no phenolic resin, which results in obviously reduced breakdown voltage of the aluminum substrate of comparative example 1, and the combination of bisphenol A epoxy resin and phenolic resin can greatly improve the pressure resistance of the aluminum substrate.
The adhesive composition of comparative example 2 does not adopt natural rubber, which results in the obvious reduction of the breakdown voltage of the aluminum substrate of comparative example 1, and the fact that the combination of the natural rubber and the organic resin material can greatly improve the pressure resistance of the aluminum substrate is proved.
Claims (10)
1. The adhesive composition for the high-pressure-resistant aluminum substrate is characterized by comprising the following components in parts by weight:
the viscosity of the adhesive composition is that of the 4# cup for 1-8min.
2. The adhesive composition for the high-pressure-resistant aluminum substrate according to claim 1, wherein the adhesive composition comprises the following components in parts by weight:
the viscosity of the adhesive composition is that of the 4# cup for 3-6min.
3. The adhesive composition for the high-pressure-resistant aluminum substrate according to claim 2, wherein the adhesive composition comprises the following components in parts by weight:
the adhesive composition had a viscosity of 5 minutes on a 4# cup.
4. The adhesive composition for high pressure resistant aluminum substrates as recited in claim 1, wherein the bisphenol a type epoxy resin is a low molecular solid bisphenol a type epoxy resin.
5. An adhesive composition for high pressure resistant aluminum substrates as recited in claim 1, wherein the nano-sized silicon powder has a particle size of 3-7 μm.
6. An adhesive composition for high pressure resistant aluminum substrates as recited in claim 5, wherein said nano-sized silicon powder has a particle size of 5 μm.
7. The method for preparing an adhesive composition for a high pressure-resistant aluminum substrate according to any one of claims 1 to 6, comprising the steps of: and weighing and uniformly mixing the components of the adhesive composition according to the proportion to obtain the adhesive composition.
8. A high pressure resistant aluminum substrate comprising a metal base layer, a thermally conductive insulating layer and a circuit layer, wherein the thermally conductive insulating layer is obtained by drying the adhesive composition of any one of claims 1 to 6.
9. The method for manufacturing a high pressure resistant aluminum substrate as claimed in claim 8, comprising the steps of:
(1) The adhesive composition is roll-coated on the surface of the circuit layer to form an adhesive layer I, and the adhesive composition is roll-coated on the surface of the release film to form an adhesive layer II;
(2) Covering the second adhesive layer on the first adhesive layer, removing the release film, and covering the metal base layer on the second adhesive layer to form an aluminum substrate semi-finished product;
(3) And performing hot pressing on the aluminum substrate semi-finished product to form the aluminum substrate.
10. The method for preparing an adhesive composition for a high pressure-resistant aluminum substrate according to claim 9, wherein the thickness of the heat conductive insulating layer is 180-220 μm.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013143440A (en) * | 2012-01-10 | 2013-07-22 | Sekisui Chem Co Ltd | Metal base substrate |
| CN108192291A (en) * | 2017-12-29 | 2018-06-22 | 纽宝力精化(广州)有限公司 | High-fire resistance aluminum substrate composition epoxy resin and preparation method and application |
| CN109575858A (en) * | 2018-10-30 | 2019-04-05 | 广东翔思新材料有限公司 | A kind of aluminum substrate bonding agent and the aluminum substrate using the bonding agent |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013143440A (en) * | 2012-01-10 | 2013-07-22 | Sekisui Chem Co Ltd | Metal base substrate |
| CN108192291A (en) * | 2017-12-29 | 2018-06-22 | 纽宝力精化(广州)有限公司 | High-fire resistance aluminum substrate composition epoxy resin and preparation method and application |
| CN109575858A (en) * | 2018-10-30 | 2019-04-05 | 广东翔思新材料有限公司 | A kind of aluminum substrate bonding agent and the aluminum substrate using the bonding agent |
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