CN115322715B - Adhesive composition for high-pressure-resistant aluminum substrate and preparation method thereof - Google Patents
Adhesive composition for high-pressure-resistant aluminum substrate and preparation method thereof Download PDFInfo
- Publication number
- CN115322715B CN115322715B CN202211045541.7A CN202211045541A CN115322715B CN 115322715 B CN115322715 B CN 115322715B CN 202211045541 A CN202211045541 A CN 202211045541A CN 115322715 B CN115322715 B CN 115322715B
- Authority
- CN
- China
- Prior art keywords
- adhesive composition
- aluminum substrate
- layer
- adhesive
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 96
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 96
- 239000000203 mixture Substances 0.000 title claims abstract description 84
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 80
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 80
- 239000000758 substrate Substances 0.000 title claims abstract description 79
- 238000002360 preparation method Methods 0.000 title abstract description 15
- 239000003822 epoxy resin Substances 0.000 claims abstract description 26
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 26
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000011863 silicon-based powder Substances 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 84
- 239000012790 adhesive layer Substances 0.000 claims description 41
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 239000011265 semifinished product Substances 0.000 claims description 14
- 238000001035 drying Methods 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 4
- 238000007731 hot pressing Methods 0.000 claims description 3
- 239000002105 nanoparticle Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 238000005303 weighing Methods 0.000 claims description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 34
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 13
- 229920001568 phenolic resin Polymers 0.000 abstract description 13
- 244000043261 Hevea brasiliensis Species 0.000 abstract description 12
- 229920003052 natural elastomer Polymers 0.000 abstract description 11
- 229920001194 natural rubber Polymers 0.000 abstract description 11
- 239000003960 organic solvent Substances 0.000 abstract description 10
- 239000005011 phenolic resin Substances 0.000 abstract description 10
- 239000006087 Silane Coupling Agent Substances 0.000 abstract description 3
- 239000003795 chemical substances by application Substances 0.000 abstract description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 abstract 1
- 239000002585 base Substances 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 230000015556 catabolic process Effects 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000005007 epoxy-phenolic resin Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 2
- 239000013530 defoamer Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229920001195 polyisoprene Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000013008 thixotropic agent Substances 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- -1 alicyclic amine Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 229920006150 hyperbranched polyester Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000012745 toughening agent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention discloses an adhesive composition for a high-pressure-resistant aluminum substrate and a preparation method thereof; relates to the technical field of aluminum substrates; solves the problem of poor pressure resistance of an aluminum substrate in the prior art; the adhesive composition comprises the following components in parts by weight: 30-50 parts of bisphenol A type epoxy resin, 10-30 parts of phenolic resin, 5-15 parts of natural rubber, 3-10 parts of silane coupling agent, 3-8 parts of dicyandiamide curing agent, 30-50 parts of micron-sized silicon powder and 70-80 parts of organic solvent, wherein the viscosity of the adhesive composition is that a No. 4 cup is coated for 1-8min; the adhesive composition can greatly improve the pressure resistance of the aluminum substrate.
Description
Technical Field
The invention belongs to the technical field of aluminum substrates, and particularly relates to an adhesive composition for a high-pressure-resistant aluminum substrate and a preparation method thereof.
Background
The aluminum substrate is a metal-based copper-clad plate with good heat dissipation function, and a single panel is generally composed of a three-layer structure, namely a circuit layer (copper foil), an insulating layer and a metal base layer (aluminum plate). The structure of the double-sided board is a circuit layer, an insulating layer, an aluminum base, an insulating layer and a circuit layer. The rare application is a multi-layer board, and can be formed by attaching a common multi-layer board with an insulating layer and an aluminum base.
A heat conductive insulating layer is needed between the aluminum substrate and the circuit layer to realize insulation and adhesion between the metal substrate and the circuit layer. For example, patent application CN 111040701A discloses a high temperature resistant, high toughness epoxy resin adhesive, prepared from component a and component B, wherein component a is prepared from bisphenol a type epoxy resin, toughener hyperbranched polyester compound, reactive diluent, silane coupling agent, heat resistant filler micron alumina powder, thixotropic agent, defoamer, and component B is prepared from polyamide curing agent, alicyclic amine curing agent, silane coupling agent, heat resistant filler micron alumina powder, thixotropic agent and defoamer; the invention also discloses a preparation method of the high-temperature-resistant high-toughness epoxy resin adhesive, which adopts heating and stirring to respectively prepare the component A and the component B and then mixes the components.
The heat conducting insulating layer in the prior art is mainly prepared by filling single aluminum oxide heat conducting particles with an organic resin material, so that the whole aluminum substrate has lower pressure resistance. Therefore, there is a need for further improvements in the aluminum substrates of the prior art to increase their pressure resistance while maintaining good thermal conductivity.
Disclosure of Invention
Aiming at the technical problems in the prior art, the invention provides an adhesive composition for a high-pressure-resistant aluminum substrate and a preparation method thereof.
The technical scheme adopted by the invention is as follows:
an adhesive composition for high pressure resistant aluminum substrates. The aluminum substrate comprises a metal base layer, a heat-conducting insulating layer and a circuit layer, wherein the heat-conducting insulating layer is obtained by drying an adhesive, and the adhesive composition comprises the following components in parts by weight:
the viscosity of the adhesive composition is that of the 4# cup for 1-8min.
According to the technical scheme, bisphenol A epoxy resin and phenolic resin are compounded to be used as an organic resin matrix, and compared with single bisphenol A epoxy resin, the obtained adhesive composition is beneficial to improving the pressure resistance of the aluminum substrate; in addition, the adhesive composition obtained by compounding natural rubber with an organic resin material is advantageous in improving the pressure resistance of an aluminum substrate. According to the adhesive composition, micron-sized silicon powder is added into an organic resin matrix to serve as heat-conducting filler particles, so that the heat-conducting property of the whole system can be improved. According to the invention, the use level of the organic solvent is increased, the viscosity of the adhesive composition is properly reduced, the thickness of a single-layer adhesive layer is controlled within the range of 90-110 mu m, and the double-layer adhesive layer is overlapped together to form the heat-conducting insulating layer after the hot-pressing procedure, so that the heat-conducting insulating layer is more uniform, and the pressure resistance of the aluminum substrate is ensured.
Bisphenol A type epoxy resin is a common adhesive organic resin material, but the consumption of the epoxy resin is reduced, only 30-50 parts of the epoxy resin is adopted, and the epoxy resin is convenient to add and compound with proper content of phenolic resin. However, the amount of bisphenol A type epoxy resin added should not be less than 30 parts, otherwise the tackiness of the adhesive is affected. Further, the amount of bisphenol A type epoxy resin added is preferably 35 to 45 parts, more preferably 40 parts.
Phenolic resin is a synthetic plastic, colorless or yellow brown transparent solid, and has excellent heat conductivity, flame resistance, water resistance and insulativity, better acid resistance, poor alkali resistance and good mechanical and electrical properties because of the fact that electric equipment is used more often. According to the invention, the phenolic resin is compounded in the bisphenol A type epoxy resin to serve as an organic resin matrix, so that the pressure resistance of the aluminum substrate can be enhanced. If the content of the phenolic resin is less than 10 parts, the pressure resistance of the aluminum substrate is not significantly improved; if the content of the phenolic resin is more than 30 parts, the content of the bisphenol a type epoxy resin is reduced, which affects the adhesiveness of the adhesive. Therefore, 10-30 parts of phenolic resin is selected for use in the present invention in consideration of the overall properties of the aluminum substrate. Further, the addition amount of the phenolic resin is preferably 15 to 25 parts, more preferably 20 parts.
Natural rubber is an elastic solid obtained by processing steps such as coagulation and drying of natural latex collected from Brazilian rubber tree. Natural rubber is a natural high molecular compound with polyisoprene as main component, its rubber hydrocarbon (polyisoprene) content is above 90%, and also contains small quantity of protein, fatty acid, sugar and ash. The natural rubber is nonpolar rubber, so that the electrical insulation property is good. Since the addition of the natural rubber to the adhesive of the present invention contributes to an increase in heat resistance of the aluminum substrate, the addition amount of the natural rubber in the present invention is 5 to 15 parts, and further, the addition amount of the natural rubber is preferably 8 to 12 parts, and more preferably 10 parts.
The kind of the organic solvent in the present invention is not particularly limited as long as a uniform adhesive slurry can be formed, and DMF, ethyl acetate, acetone, and the like can be used, for example. However, the amount of organic solvent added is critical to the present invention, as this relates to the viscosity of the adhesive and the thickness of the final thermally conductive insulating layer. If the addition amount of the organic solvent is less than 70 parts, the viscosity of the adhesive is higher than that of the 4# cup for 8min, and the thickness of the coating film may be uneven and the smoothness is poor; if the amount of the organic solvent added is more than 80 parts, the adhesive viscosity is lower than that of the 4# cup for 1min, and an adhesive layer having a thickness of about 100 μm cannot be formed on the circuit layer, and the pressure resistance is greatly lowered. Therefore, the organic solvent is added in an amount of 70 to 80 parts in the present invention. Further, the amount of the organic solvent added is 73 to 77 parts, and further, the amount of the organic solvent added is 75 parts.
Since a heat conductive insulating layer is necessary between the aluminum substrate and the circuit layer, insulation and adhesion between the metal substrate and the circuit layer are achieved. The current heat-conducting insulating layer is mainly prepared by filling heat-conducting particles with an organic resin material. However, at present, a single alumina is generally adopted as the heat conductive particle filler, but the alumina has limited heat transfer performance. According to the invention, micron-sized silicon powder is used for replacing aluminum oxide, so that the heat conduction performance of the aluminum substrate is greatly improved. Further, the particle diameter of the nano-sized silicon powder is preferably 3 to 7. Mu.m, more preferably 5. Mu.m.
In addition, the invention also provides a preparation method of the adhesive composition for the high-pressure-resistant aluminum substrate. The preparation method comprises the following steps: and weighing and uniformly mixing the components of the adhesive composition according to the proportion to obtain the adhesive composition.
In addition, the invention also provides a high-pressure-resistant aluminum substrate, which comprises a metal base layer, a heat-conducting insulating layer and a circuit layer, wherein the heat-conducting insulating layer is obtained by drying the adhesive composition.
In addition, the invention also provides a preparation method of the high-pressure-resistant aluminum substrate. The preparation method comprises the following steps:
(1) The adhesive composition is roll-coated on the surface of the circuit layer to form an adhesive layer I, and the adhesive composition is roll-coated on the surface of the release film to form an adhesive layer II;
(2) Covering the second adhesive layer on the first adhesive layer, removing the release film, and covering the metal base layer on the second adhesive layer to form an aluminum substrate semi-finished product;
(3) And performing hot pressing on the aluminum substrate semi-finished product to form the aluminum substrate.
In the technical scheme, a heat conduction insulating layer with the thickness of about 200 mu m is laminated by using the double-layer adhesive with the thickness of about 100 mu m, and the obtained heat conduction insulating layer is more uniform and has better quality. If the viscosity of the adhesive composition is increased, then a layer of heat conduction insulating layer with the thickness of about 200 mu m is directly formed by laminating an adhesive layer with the thickness of about 200 mu m, which is theoretically possible, but the technology in actual production is not mature, the quality of the obtained heat conduction insulating layer does not reach the standard, and the impact shear resistance is easily deteriorated due to the excessive thickness, so that the situation of layering and edge burst can occur.
Further, the invention has high pressure resistance requirement, so the thickness of the heat conduction insulating layer is 180-220 μm, more preferably 200 μm, and the heat resistance of the aluminum substrate obtained by the invention can reach the excellent degree of 9-11.5 KV.
Compared with the prior art, the invention has the beneficial effects that:
(1) The adhesive composition adopts bisphenol A type epoxy resin and phenolic resin to compound as an organic resin matrix, and compared with single bisphenol A type epoxy resin, the adhesive composition is beneficial to improving the pressure resistance of the aluminum substrate;
(2) According to the adhesive composition, nanoscale silicon powder is added into an organic resin matrix to serve as heat-conducting filler particles, so that the heat-conducting performance of the whole system can be improved;
(3) The adhesive composition reasonably prepares the dosage of the organic solvent, properly reduces the viscosity of the adhesive composition, ensures that the thickness of a single adhesive layer is controlled within 100 mu m, and ensures that the heat conduction insulating layer obtained by laminating the double adhesive layers has high comprehensive quality, thereby greatly improving the pressure resistance of the aluminum substrate.
Detailed Description
The examples shown below illustrate the invention in more detail. The present invention is not limited to the following examples.
Example 1
An adhesive composition for high pressure resistant aluminum substrates. The adhesive composition comprises the following components in parts by weight:
the viscosity of the adhesive composition is that the adhesive composition is coated on a No. 4 cup for 5min;
the bisphenol A type epoxy resin adopts low molecular solid bisphenol A type epoxy resin, and the grain diameter of the micron-sized silicon powder is 5 mu m.
The high-pressure-resistant aluminum substrate comprises a metal base layer, a heat-conducting insulating layer and a circuit layer, wherein the heat-conducting insulating layer is obtained by drying the adhesive composition. The preparation method comprises the following steps:
(1) The adhesive composition is rolled on the surface of the circuit layer to form an adhesive layer I with the thickness of 100 mu m, and the adhesive composition is rolled on the surface of the release film to form an adhesive layer II with the thickness of 100 mu m;
(2) Covering the second adhesive layer on the first adhesive layer, removing the release film, and covering the metal base layer on the second adhesive layer to form an aluminum substrate semi-finished product;
(3) Performing hot press on the aluminum substrate semi-finished product to form the aluminum substrate; wherein the thickness of the heat conducting insulating layer is 200 mu m.
Example 2
An adhesive composition for high pressure resistant aluminum substrates. The adhesive composition comprises the following components in parts by weight:
the viscosity of the adhesive composition is that the adhesive composition is coated on a No. 4 cup for 5min;
the bisphenol A type epoxy resin adopts low molecular solid bisphenol A type epoxy resin, and the grain diameter of the micron-sized silicon powder is 5 mu m.
The high-pressure-resistant aluminum substrate comprises a metal base layer, a heat-conducting insulating layer and a circuit layer, wherein the heat-conducting insulating layer is obtained by drying the adhesive composition. The preparation method comprises the following steps:
(1) The adhesive composition is rolled on the surface of the circuit layer to form an adhesive layer I with the thickness of 100 mu m, and the adhesive composition is rolled on the surface of the release film to form an adhesive layer II with the thickness of 100 mu m;
(2) Covering the second adhesive layer on the first adhesive layer, removing the release film, and covering the metal base layer on the second adhesive layer to form an aluminum substrate semi-finished product;
(3) Performing hot press on the aluminum substrate semi-finished product to form the aluminum substrate; wherein the thickness of the heat conducting insulating layer is 200 mu m.
Example 3
An adhesive composition for high pressure resistant aluminum substrates. The adhesive composition comprises the following components in parts by weight:
the viscosity of the adhesive composition is that the adhesive composition is coated on a No. 4 cup for 5min;
the bisphenol A type epoxy resin adopts low molecular solid bisphenol A type epoxy resin, and the grain diameter of the micron-sized silicon powder is 5 mu m.
The high-pressure-resistant aluminum substrate comprises a metal base layer, a heat-conducting insulating layer and a circuit layer, wherein the heat-conducting insulating layer is obtained by drying the adhesive composition. The preparation method comprises the following steps:
(1) The adhesive composition is rolled on the surface of the circuit layer to form an adhesive layer I with the thickness of 100 mu m, and the adhesive composition is rolled on the surface of the release film to form an adhesive layer II with the thickness of 100 mu m;
(2) Covering the second adhesive layer on the first adhesive layer, removing the release film, and covering the metal base layer on the second adhesive layer to form an aluminum substrate semi-finished product;
(3) Performing hot press on the aluminum substrate semi-finished product to form the aluminum substrate; wherein the thickness of the heat conducting insulating layer is 200 mu m.
Comparative example 1
An adhesive composition for high pressure resistant aluminum substrates. The adhesive composition comprises the following components in parts by weight:
the viscosity of the adhesive composition is that the adhesive composition is coated on a No. 4 cup for 5min;
the bisphenol A type epoxy resin adopts low molecular solid bisphenol A type epoxy resin, and the grain diameter of the micron-sized silicon powder is 5 mu m.
The high-pressure-resistant aluminum substrate comprises a metal base layer, a heat-conducting insulating layer and a circuit layer, wherein the heat-conducting insulating layer is obtained by drying the adhesive composition. The preparation method comprises the following steps:
(1) The adhesive composition is rolled on the surface of the circuit layer to form an adhesive layer I with the thickness of 100 mu m, and the adhesive composition is rolled on the surface of the release film to form an adhesive layer II with the thickness of 100 mu m;
(2) Covering the second adhesive layer on the first adhesive layer, removing the release film, and covering the metal base layer on the second adhesive layer to form an aluminum substrate semi-finished product;
(3) Performing hot press on the aluminum substrate semi-finished product to form the aluminum substrate; wherein the thickness of the heat conducting insulating layer is 200 mu m.
Comparative example 2
An adhesive composition for high pressure resistant aluminum substrates. The adhesive composition comprises the following components in parts by weight:
the viscosity of the adhesive composition is that the adhesive composition is coated on a No. 4 cup for 5min;
the bisphenol A type epoxy resin adopts low molecular solid bisphenol A type epoxy resin, and the grain diameter of the micron-sized silicon powder is 5 mu m.
The high-pressure-resistant aluminum substrate comprises a metal base layer, a heat-conducting insulating layer and a circuit layer, wherein the heat-conducting insulating layer is obtained by drying the adhesive composition. The preparation method comprises the following steps:
(1) The adhesive composition is rolled on the surface of the circuit layer to form an adhesive layer I with the thickness of 100 mu m, and the adhesive composition is rolled on the surface of the release film to form an adhesive layer II with the thickness of 100 mu m;
(2) Covering the second adhesive layer on the first adhesive layer, removing the release film, and covering the metal base layer on the second adhesive layer to form an aluminum substrate semi-finished product;
(3) Performing hot press on the aluminum substrate semi-finished product to form the aluminum substrate; wherein the thickness of the heat conducting insulating layer is 200 mu m.
The pressure resistance test data of the above examples 1-3 and comparative examples 1-2 are shown in Table 1.
TABLE 1 pressure resistance of examples 1-3 and comparative examples 1-2
| Breakdown voltage (KV) | |
| Example 1 | 11.5 |
| Example 2 | 9 |
| Example 3 | 10 |
| Comparative example 1 | 5 |
| Comparative example 2 | 6 |
As can be seen from Table 1, the pressure resistance of examples 2 to 3 was lower than that of example 1. The phenolic resin content in the adhesive composition of example 2 was lower than that of example 1, resulting in a reduction in the aluminum substrate breakdown voltage of example 2. Whereas the adhesive composition of example 3 has a lower natural rubber content than that of example 1, resulting in a reduction in the breakdown voltage of the aluminum substrate of example 2.
The adhesive composition of comparative example 1 adopts bisphenol A epoxy resin and contains no phenolic resin, which results in obviously reduced breakdown voltage of the aluminum substrate of comparative example 1, and the combination of bisphenol A epoxy resin and phenolic resin can greatly improve the pressure resistance of the aluminum substrate.
The adhesive composition of comparative example 2 does not adopt natural rubber, which results in the obvious reduction of the breakdown voltage of the aluminum substrate of comparative example 1, and the fact that the combination of the natural rubber and the organic resin material can greatly improve the pressure resistance of the aluminum substrate is proved.
Claims (10)
1. The adhesive composition for the high-pressure-resistant aluminum substrate is characterized by comprising the following components in parts by weight:
the viscosity of the adhesive composition is that of the 4# cup for 1-8min.
2. The adhesive composition for the high-pressure-resistant aluminum substrate according to claim 1, wherein the adhesive composition comprises the following components in parts by weight:
the viscosity of the adhesive composition is that of the 4# cup for 3-6min.
3. The adhesive composition for the high-pressure-resistant aluminum substrate according to claim 2, wherein the adhesive composition comprises the following components in parts by weight:
the adhesive composition had a viscosity of 5 minutes on a 4# cup.
4. The adhesive composition for high pressure resistant aluminum substrates as recited in claim 1, wherein the bisphenol a type epoxy resin is a low molecular solid bisphenol a type epoxy resin.
5. An adhesive composition for high pressure resistant aluminum substrates as recited in claim 1, wherein the nano-sized silicon powder has a particle size of 3-7 μm.
6. An adhesive composition for high pressure resistant aluminum substrates as recited in claim 5, wherein said nano-sized silicon powder has a particle size of 5 μm.
7. The method for preparing an adhesive composition for a high pressure-resistant aluminum substrate according to any one of claims 1 to 6, comprising the steps of: and weighing and uniformly mixing the components of the adhesive composition according to the proportion to obtain the adhesive composition.
8. A high pressure resistant aluminum substrate comprising a metal base layer, a thermally conductive insulating layer and a circuit layer, wherein the thermally conductive insulating layer is obtained by drying the adhesive composition of any one of claims 1 to 6.
9. The method for manufacturing a high pressure resistant aluminum substrate as claimed in claim 8, comprising the steps of:
(1) The adhesive composition is roll-coated on the surface of the circuit layer to form an adhesive layer I, and the adhesive composition is roll-coated on the surface of the release film to form an adhesive layer II;
(2) Covering the second adhesive layer on the first adhesive layer, removing the release film, and covering the metal base layer on the second adhesive layer to form an aluminum substrate semi-finished product;
(3) And performing hot pressing on the aluminum substrate semi-finished product to form the aluminum substrate.
10. The method for preparing an adhesive composition for a high pressure-resistant aluminum substrate according to claim 9, wherein the thickness of the heat conductive insulating layer is 180-220 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211045541.7A CN115322715B (en) | 2022-08-29 | 2022-08-29 | Adhesive composition for high-pressure-resistant aluminum substrate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211045541.7A CN115322715B (en) | 2022-08-29 | 2022-08-29 | Adhesive composition for high-pressure-resistant aluminum substrate and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115322715A CN115322715A (en) | 2022-11-11 |
| CN115322715B true CN115322715B (en) | 2023-05-26 |
Family
ID=83928441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211045541.7A Active CN115322715B (en) | 2022-08-29 | 2022-08-29 | Adhesive composition for high-pressure-resistant aluminum substrate and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115322715B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013143440A (en) * | 2012-01-10 | 2013-07-22 | Sekisui Chem Co Ltd | Metal base substrate |
| CN108192291A (en) * | 2017-12-29 | 2018-06-22 | 纽宝力精化(广州)有限公司 | High-fire resistance aluminum substrate composition epoxy resin and preparation method and application |
| CN109575858A (en) * | 2018-10-30 | 2019-04-05 | 广东翔思新材料有限公司 | A kind of aluminum substrate bonding agent and the aluminum substrate using the bonding agent |
-
2022
- 2022-08-29 CN CN202211045541.7A patent/CN115322715B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013143440A (en) * | 2012-01-10 | 2013-07-22 | Sekisui Chem Co Ltd | Metal base substrate |
| CN108192291A (en) * | 2017-12-29 | 2018-06-22 | 纽宝力精化(广州)有限公司 | High-fire resistance aluminum substrate composition epoxy resin and preparation method and application |
| CN109575858A (en) * | 2018-10-30 | 2019-04-05 | 广东翔思新材料有限公司 | A kind of aluminum substrate bonding agent and the aluminum substrate using the bonding agent |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115322715A (en) | 2022-11-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109575523B (en) | High-thermal-conductivity resin composition for copper-clad plate | |
| CN102676109A (en) | Method for preparing flexible heat conducting insulating adhesive film used in LED heat radiation substrate | |
| CN102051023B (en) | Halogen-free resin composition and resin-coated copper foil and copper-clad plate prepared from same | |
| CN113715422A (en) | High-wear-resistance epoxy glass fiber cloth laminated board and preparation method thereof | |
| CN104610707A (en) | Metal-base copper clad laminate manufactured through high-performance RCC (resin coated copper foil) and applied to high-power LED | |
| CN102391818A (en) | Insulated thermal conductive adhesive and preparation method thereof | |
| CN102746798B (en) | High-heat-conductivity semi-cured glue film and preparation method of high-heat-conductivity semi-cured glue film | |
| CN115139589B (en) | High-heat-conductivity copper-clad plate and preparation method thereof | |
| CN111909600A (en) | Manufacturing method of high-thermal-conductivity resin for metal substrate | |
| CN104002538A (en) | Making method for super-thick copper foil and high heat-conducting copper clad laminate | |
| CN115322715B (en) | Adhesive composition for high-pressure-resistant aluminum substrate and preparation method thereof | |
| CN109265920A (en) | A kind of highly thermal-conductive resin composition and its application | |
| CN109181234A (en) | A kind of high thermal conductivity high tenacity resin combination and its application | |
| CN112694719A (en) | Resin composition, preparation method thereof and metal substrate | |
| EP3730532A1 (en) | Resin composition for a metal substrate, and resin varnish and metal base copper-clad laminate comprising the same | |
| DE112016003327B4 (en) | Power module substrate, power module circuit board and power module | |
| CN110862653B (en) | Halogen-free resin composition, RCC, adhesive film and metal foil-clad laminate | |
| CN114716934A (en) | Heat-conducting shielding composite material and preparation method thereof | |
| CN112778562A (en) | Efficient heat-conducting interface material and preparation method and application thereof | |
| CN115284691A (en) | High-pressure-resistance aluminum substrate and preparation method thereof | |
| CN111171771A (en) | Bonding sheet and preparation method thereof | |
| CN115109387B (en) | Resin composition and application thereof | |
| CN115404031A (en) | High-heat-resistance aluminum substrate and preparation method thereof | |
| KR101866562B1 (en) | Epoxy resin composition having excellent formability and metal copper clad laminate having the same | |
| CN117532991A (en) | Copper-clad plate and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |