CN108192291A - High-fire resistance aluminum substrate composition epoxy resin and preparation method and application - Google Patents
High-fire resistance aluminum substrate composition epoxy resin and preparation method and application Download PDFInfo
- Publication number
- CN108192291A CN108192291A CN201711487685.7A CN201711487685A CN108192291A CN 108192291 A CN108192291 A CN 108192291A CN 201711487685 A CN201711487685 A CN 201711487685A CN 108192291 A CN108192291 A CN 108192291A
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- epoxy resin
- fire resistance
- aluminum substrate
- substrate composition
- composition epoxy
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses a kind of high-fire resistance aluminum substrate composition epoxy resins and preparation method and application.Wherein described high-fire resistance aluminum substrate composition epoxy resin, by weight including following raw material components：55~65 parts of novolac epoxy resin, 20~24 parts of phenolic resin, diluent are 17~21 parts.By LED aluminum base plate wiring board obtained by the high-fire resistance aluminum substrate composition epoxy resin of the present invention, there is superior heat resistance energy, requirement of the welding processing to heat resistance can be met, ensure the reliability of welding.
Description
Technical field
The present invention relates to a kind of aluminum substrate composition epoxy resin, more particularly to a kind of high-fire resistance aluminum substrate epoxy
The preparation method of resin combination and its LED aluminum base plate wiring board.
Background technology
The material of general wiring board is glass, but because LED fevers are larger, therefore the wiring board of LED lamp is usually aluminium base
Plate, can heat conduction it is fast.
Aluminum substrate is generally reacted using bisphenol A type epoxy resin with curing agent, and aluminum substrate heat resistance obtained is not very
It is good.Wiring board is processed and assemble welding, will settle since wiring board welding is unleaded, the fusing point of solder is more molten than solder containing pb
Point is high, to ensure the reliability of welding, material to be welded is needed to have higher heat resistance.
Therefore it is badly in need of developing a kind of high-fire resistance aluminum substrate composition epoxy resin, so as to prepare the aluminium of heat resistance
Substrate, to meet the requirement to processing technologys such as the welding of aluminum substrate.
Invention content
In order to solve above-mentioned technical problem of the prior art, the present invention provides a kind of high-fire resistance aluminum substrate asphalt mixtures modified by epoxy resin
Oil/fat composition.
The technical purpose of the present invention is to be achieved through the following technical solutions：
High-fire resistance aluminum substrate composition epoxy resin of the present invention, by weight including following raw material group
Point：55~65 parts of novolac epoxy resin, 20~24 parts of phenolic resin, diluent are 17~21 parts.
As the preferred embodiment of invention, the novolac epoxy resin is electron level bisphenol A-type novolac epoxy resin.
As the preferred embodiment of invention, the hydrolyzable chloride content of the novolac epoxy resin is less than 300ppm, and epoxide number 4.7~
5.3eq/kg。
As the preferred embodiment of invention, the softening point of the phenolic aldehyde tree is 95-105 DEG C.
The present invention is it is highly preferred that the diluent is acetone.
Another technical purpose of the present invention is to provide a kind of preparation side of high-fire resistance aluminum substrate composition epoxy resin
Method includes the following steps：
S1, each component substance is weighed by formula；
S2, the novolac epoxy resin and phenolic resin are added in diluent, heating stirring is complete to dissolving, and is cooled to
Room temperature is stirred evenly after filtering to obtain the final product.
Another technical purpose of the present invention is to provide a kind of high heat-resisting LED aluminum base plate wiring board, makes as follows
It is standby to form：
1) is by above-mentioned high-fire resistance aluminum substrate composition epoxy resin and accelerating agent and diluent by weight 100：
(0.001~0.05)：The ratio of (50~60) mixes, and is made into glue；
2) passes through gluing machine, makes glue semi-solid preparation obtained by step 1) that semi-solid preparation PP be made on glass fabric, after baking
Piece；
3) then. stacks semi-solid preparation PP pieces obtained by step 2) with copper foil on vacuum press, is pressed into high heat-resisting LED aluminium
Base plate line plate.
Preferably, accelerating agent is 2-methylimidazole to the present invention in the step 1)；The diluent is acetone；The step
1) weight percent of the solid content of glue is 40~50% in；Press temperature is 170~190 DEG C in the step 3), pressure
For 2~4MPa, the pressing time is 60~120 minutes.
The present invention it is highly preferred that baking temperature is 170 DEG C in the step 2), the gel times 80 of semi-solid preparation PP pieces~
100s。
By LED aluminum base plate wiring board obtained by the high-fire resistance aluminum substrate composition epoxy resin of the present invention, have
Superior heat resistance energy can meet requirement of the welding processing to heat resistance, ensure the reliability of welding.
Specific embodiment
The present invention is described in further detail below by way of specific preferred embodiment, but the present invention be not limited in it is following
Embodiment.
Embodiment 1：
1st, the formula of high-fire resistance aluminum substrate composition epoxy resin
Each component is weighed by following parts by weight：55 parts of bisphenol A-type novolac epoxy resin, phenolic resin KPH-L2002 (purchases
From can Longhua work) 20 parts；17 parts of diluent acetone.
The hydrolyzable chloride content of the bisphenol A-type novolac epoxy resin (NPPN-438) be less than 300ppm, epoxide number 4.7~
5.3eq/kg。
2nd, the preparation process of high-fire resistance aluminum substrate composition epoxy resin
The preparation process of high-fire resistance aluminum substrate composition epoxy resin of the present invention includes the following steps：
S1, formula weigh each component substance；
S2, the novolac epoxy resin and phenolic resin are added in into diluent, heating stirring extremely dissolves under the conditions of 50 DEG C
Completely, it is cooled to room temperature, stirs evenly after filtering to obtain the final product.
3rd, the preparation process of high heat-resisting LED aluminum base plate wiring board
1) is by the high-fire resistance aluminum substrate composition epoxy resin and 2-methylimidazole and acetone by weight 100：
0.02：55 ratio mixes, and is made into glue (solid content weight percent 45%)；
2) passes through gluing machine, makes glue semi-solid preparation obtained by step 1) on glass fabric, is 170 DEG C in temperature condition
The gel time 80s of semi-solid preparation PP piece PP pieces is made after baking；
3) then. stacks PP pieces obtained by step 2) with copper foil on vacuum press, in 175 DEG C of temperature, pressure 2MPa items
60min is suppressed under part and obtains high heat-resisting LED aluminum base plate wiring board.
Embodiment 2：
1st, the formula of high-fire resistance aluminum substrate composition epoxy resin
Each component is weighed by following parts by weight：(purchase is certainly by 65 parts of bisphenol A-type epoxy novolac tree, phenolic resin KPH-L2002
Can Longhua work) 24 parts, 21 parts of diluent acetone.Wherein：The hydrolysis chlorine of the bisphenol A-type novolac epoxy resin (NPPN-438) contains
Amount is less than 300ppm, 4.7~5.3eq/kg of epoxide number.
2nd, the preparation process of high-fire resistance aluminum substrate composition epoxy resin
The preparation process of high-fire resistance aluminum substrate composition epoxy resin of the present invention includes the following steps：
S1, formula weigh each component substance；
S2, the novolac epoxy resin and phenolic resin are added in into diluent, heating stirring extremely dissolves under the conditions of 50 DEG C
Completely, it is cooled to room temperature, stirs evenly after filtering to obtain the final product.
3rd, the preparation process of high heat-resisting LED aluminum base plate wiring board
1) is by the high-fire resistance aluminum substrate composition epoxy resin and 2-methylimidazole and acetone by weight 100：
0.02：60 ratio mixes, and is made into glue (solid content weight percent 45%)；
2) passes through gluing machine, makes glue semi-solid preparation obtained by step 1) on glass fabric, is 170 DEG C in temperature condition
Semi-solid preparation PP pieces are made after baking；
3) then. stacks PP pieces obtained by step 2) with copper foil on vacuum press, is 175 DEG C, pressure 2MPa in temperature
Under the conditions of compacting 60min obtain high heat-resisting LED aluminum base plate wiring board.
Embodiment 3：
First, the formula of high-fire resistance aluminum substrate composition epoxy resin
Each component is weighed by following parts by weight：60 parts of bisphenol A-type novolac epoxy resin, phenolic resin KPH-L2002 (purchases
From can Longhua work) 22 parts, 19 parts of diluent acetone.The hydrolyzable chloride content of the bisphenol A-type novolac epoxy resin (NPPN-438)
Less than 300ppm, 4.7~5.3eq/kg of epoxide number.
2nd, the preparation process of high-fire resistance aluminum substrate composition epoxy resin
The preparation process of high-fire resistance aluminum substrate composition epoxy resin of the present invention includes the following steps：
S1, formula weigh each component substance；
S2, the novolac epoxy resin and phenolic resin are added in into diluent, heating stirring extremely dissolves under the conditions of 50 DEG C
Completely, it is cooled to room temperature, stirs evenly after filtering to obtain the final product.
3rd, the preparation process of high heat-resisting LED aluminum base plate wiring board
1) is by the high-fire resistance aluminum substrate composition epoxy resin and 2-methylimidazole and acetone by weight 100：
0.02：55 ratio mixes, and is made into glue (solid content weight percent 45%)；
2) passes through gluing machine, makes glue semi-solid preparation obtained by step 1) on glass fabric, is 170 DEG C in temperature condition
Semi-solid preparation PP pieces, the gel time 80s of PP pieces are made after baking；
3) then. stacks PP pieces obtained by step 2) with copper foil on vacuum press, is 175 DEG C, pressure 2MPa in temperature
Under the conditions of compacting 60min obtain high heat-resisting LED aluminum base plate wiring board.
Performance test
Can T288 be to assess PCB bear the important quantization parameter of resistance to temperature, is reflection pcb substrate proper alignment condition
A technical indicator, the base material of finger mark making sheet is subjected to welding high temperature without generating the decomposition such as blistering, layering under the conditions of 288 DEG C
The the maximum duration of phenomenon, the time the more advantageous to long welding.
High-fire resistance aluminium base panel products progressive obtained by Examples 1 to 3 can be detected, detection data is as shown in table 1：
The heat resistance test of 1 Examples 1 to 3 of table
| Detection project | Embodiment 1 | Embodiment 2 | Embodiment 3 |
| Soldering resistance (sec, 288 DEG C) | >300s | >300s | >300s |
It understands that the T288 test datas of the present invention are good by the test data of table 1, shows that products obtained therefrom of the present invention has
Higher heat resistance can meet requirement of the welding processing to heat resistance, ensure the reliability of welding.
The above described is only a preferred embodiment of the present invention, not make limitation in any form to the present invention, therefore
It is every without departing from technical solution of the present invention content, technical spirit according to the present invention any is simply repaiied to what above example was made
Change, equivalent variations and modification, in the range of still falling within technical solution of the present invention.
Claims (9)
1. a kind of high-fire resistance aluminum substrate composition epoxy resin, which is characterized in that by weight including following raw material group
Point：55~65 parts of novolac epoxy resin, 20~24 parts of phenolic resin, diluent are 17~21 parts.
2. high-fire resistance aluminum substrate composition epoxy resin according to claim 1, which is characterized in that the phenolic aldehyde ring
Oxygen resin is electron level bisphenol A-type novolac epoxy resin.
3. high-fire resistance aluminum substrate composition epoxy resin according to claim 2, which is characterized in that the phenolic aldehyde ring
The hydrolyzable chloride content of oxygen resin is less than 300ppm, 4.7~5.3eq/kg of epoxide number.
4. high-fire resistance aluminum substrate composition epoxy resin according to claim 1, which is characterized in that the phenolic aldehyde tree
Softening point be 95-105 DEG C.
5. high-fire resistance aluminum substrate composition epoxy resin according to claim 1, the diluent is acetone.
6. a kind of preparation method of high-fire resistance aluminum substrate composition epoxy resin, which is characterized in that include the following steps：
S1, each component substance is weighed by formula；
S2, the novolac epoxy resin and phenolic resin are added in diluent, heating stirring is complete to dissolving, and is cooled to room
Temperature is stirred evenly after filtering to obtain the final product.
7. a kind of high heat-resisting LED aluminum base plate wiring board, which is characterized in that it is made by the steps：
1) is by the high-fire resistance aluminum substrate composition epoxy resin and accelerating agent as obtained by any one in Claims 1 to 5
And diluent by weight 100：(0.001~0.05)：The ratio of (50~60) mixes, and is made into glue；
2) passes through gluing machine, makes glue semi-solid preparation obtained by step 1) that semi-solid preparation PP pieces be made on glass fabric, after baking；
3) then. stacks semi-solid preparation PP pieces obtained by step 2) with copper foil on vacuum press, is pressed into high heat-resisting LED aluminum base plate
Wiring board.
8. the heat-resisting LED aluminum base plate wiring board of height according to claim 7, which is characterized in that accelerating agent in the step 1)
For 2-methylimidazole；The diluent is acetone；The weight percent of the solid content of glue is 40~50% in the step 1)；
Press temperature is 170~190 DEG C in the step 3), and pressure is 2~4MPa, and the pressing time is 60~120 minutes.
9. high heat-resisting LED aluminum base plate wiring board as claimed in claim 7, which is characterized in that baking temperature in the step 2)
It is 170 DEG C, 80~100s of gel time of the semi-solid preparation PP pieces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711487685.7A CN108192291A (en) | 2017-12-29 | 2017-12-29 | High-fire resistance aluminum substrate composition epoxy resin and preparation method and application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711487685.7A CN108192291A (en) | 2017-12-29 | 2017-12-29 | High-fire resistance aluminum substrate composition epoxy resin and preparation method and application |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108192291A true CN108192291A (en) | 2018-06-22 |
Family
ID=62587252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711487685.7A Pending CN108192291A (en) | 2017-12-29 | 2017-12-29 | High-fire resistance aluminum substrate composition epoxy resin and preparation method and application |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115322715A (en) * | 2022-08-29 | 2022-11-11 | 焦作市凯诺电子有限公司 | Adhesive composition for high-voltage-resistance aluminum substrate and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103897350A (en) * | 2014-04-17 | 2014-07-02 | 苏州生益科技有限公司 | Thermosetting resin composition and prepreg and laminated board prepared therefrom |
| CN104610708A (en) * | 2015-01-19 | 2015-05-13 | 珠海全宝电子科技有限公司 | High-temperature-resistant and aging-resistant substrate and production method thereof |
| CN106280261A (en) * | 2016-08-25 | 2017-01-04 | 纽宝力精化(广州)有限公司 | Composition epoxy resin with high tg values and preparation method thereof |
| CN106751507A (en) * | 2016-12-13 | 2017-05-31 | 宏昌电子材料股份有限公司 | A kind of high heat epoxy and combinations thereof and application |
-
2017
- 2017-12-29 CN CN201711487685.7A patent/CN108192291A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103897350A (en) * | 2014-04-17 | 2014-07-02 | 苏州生益科技有限公司 | Thermosetting resin composition and prepreg and laminated board prepared therefrom |
| CN104610708A (en) * | 2015-01-19 | 2015-05-13 | 珠海全宝电子科技有限公司 | High-temperature-resistant and aging-resistant substrate and production method thereof |
| CN106280261A (en) * | 2016-08-25 | 2017-01-04 | 纽宝力精化(广州)有限公司 | Composition epoxy resin with high tg values and preparation method thereof |
| CN106751507A (en) * | 2016-12-13 | 2017-05-31 | 宏昌电子材料股份有限公司 | A kind of high heat epoxy and combinations thereof and application |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115322715A (en) * | 2022-08-29 | 2022-11-11 | 焦作市凯诺电子有限公司 | Adhesive composition for high-voltage-resistance aluminum substrate and preparation method thereof |
| CN115322715B (en) * | 2022-08-29 | 2023-05-26 | 焦作市凯诺电子有限公司 | Adhesive composition for high-pressure-resistant aluminum substrate and preparation method thereof |
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Application publication date: 20180622 |
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