CN101307170A - Fire retardant phosphorus-containing epoxy powder composition - Google Patents

Fire retardant phosphorus-containing epoxy powder composition Download PDF

Info

Publication number
CN101307170A
CN101307170A CNA2008100538004A CN200810053800A CN101307170A CN 101307170 A CN101307170 A CN 101307170A CN A2008100538004 A CNA2008100538004 A CN A2008100538004A CN 200810053800 A CN200810053800 A CN 200810053800A CN 101307170 A CN101307170 A CN 101307170A
Authority
CN
China
Prior art keywords
epoxy
fire retardant
powder composition
epoxy resin
resins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2008100538004A
Other languages
Chinese (zh)
Other versions
CN101307170B (en
Inventor
周庆丰
高卫国
席小悦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tianjin Kaihua Insulating Materials Co ltd
Original Assignee
TIANJIN KAIHUA INSULATION MATERIALS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TIANJIN KAIHUA INSULATION MATERIALS CO Ltd filed Critical TIANJIN KAIHUA INSULATION MATERIALS CO Ltd
Priority to CN2008100538004A priority Critical patent/CN101307170B/en
Publication of CN101307170A publication Critical patent/CN101307170A/en
Application granted granted Critical
Publication of CN101307170B publication Critical patent/CN101307170B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The invention relates to a fire-retardant phosphoric epoxy powder composition, which is an epoxy powder composition prepared by matching solid phosphoric epoxy resin, general solid epoxy resin, curing agent, pigment, filler, fire retardant and so on. The composition prepared does not contain halogenated and antimonic fire retardant, red phosphorus and so on, can meet the fire-retardant standard of UL94 V0, has superior electroinsulating property, and is widely applied in the electronic component packaging field. The fire-retardant phosphoric epoxy powder composition synthesizes solid phosphoric epoxy resin which is then applied to an epoxy powder system, thereby the problem that liquid phosphoric epoxy resin in the prior art can not be applied to the powder system due to the technological requirements is solved and the technical support is provided for converting the prior halogenated and antimonic fire-retardant system into non-halogenation.

Description

A kind of fire retardant phosphorus-containing epoxy powder composition
Technical field
The invention belongs to the electronic package field, especially a kind of fire retardant phosphorus-containing epoxy powder composition.
Background technology
Resins, epoxy is a kind of application thermosetting resin more widely, has performances such as excellent physical and mechanical properties, electrical insulation properties, resistance to chemical reagents and low temperature contraction, is widely used in fields such as coating, tackiness agent.The epoxy powder composition that cooperates other suitable color stuffing preparation with solid epoxy resin and solidifying agent; inherited the series of advantages of Resins, epoxy; good processing performances such as excellent thermotolerance, bounding force, solvent resistance, electric insulating quality are arranged; cost is low, is widely used in sealing and the protection field of electron device.
The limiting oxygen index(LOI) of coventional type Resins, epoxy (LOI) is about 19.8, and the volume fraction of oxygen is 21% in the air, and therefore simple Resins, epoxy is than being easier to incendiary.The flame retardant resistance that the employed epoxy powder of general electric elements is sealed material will reach other requirement of UL94V0 level in American insurance merchant laboratory (UL).
Usually, satisfy the requirement of UL94V0 flame-retarded technology in order to ensure this epoxy composite, generally need and contain antimony fire retardant etc. with halogen-containing fire retardant such as decabromodiphenyl oxide, decabromodiphenyl etc. and combine use, this system is less expensive and flame retarding efficiency is very high.But antimonous oxide has been listed in carcinogenic substance at present, the Resins, epoxy that contains halogen can produce in combustion processes has corrosive halogen free radical and hydrogen halide, and the aryl compound of high bromine content more can produce the bromination furans and the bromination Dioxins compound of severe toxicity, has a strong impact on HUMAN HEALTH and harm environment.On February 13rd, 2003, European Union formally announces " about waste electronic andelectrical equipment " (being called for short WEEE) and " using some objectionable impurities about restriction in electronic electric equipment " (being called for short RoHS) two parts of instructions, declaration forbids using Polybrominated biphenyl (PBB) and Poly Brominated Diphenyl Ethers (PBDE) from July 1st, 2006 in electronic electric equipment.
Basic and above-mentioned factor, in today that the environment cry grows to even greater heights, the development and application of novel halogen-free flame-retardant agent seems more and more urgent.At present, more feasible scheme has following several: (1). and utilize phosphorus nitrogen synergistic to realize the good flame effect.Promptly by phosphorus flame retardant addition type or response type, and with contain nitrogen combustion inhibitor and cooperate.(2). utilize the fire-retardant Resins, epoxy of intrinsic to realize that essence is fire-retardant, with phenol-biphenylene type Resins, epoxy and phenol-p-Xylol type Resins, epoxy is that the phenol-aralkyl-type epoxy resin of representative is development in recent years one of fire-retarded epoxy resin the most rapidly, but this kind Resins, epoxy is because the special cost of structure is very high, and this type of more special Resins, epoxy is only produced by several companies of Japan at present.(3). utilize various additive flame retardants and reactive flame retardant to be used, to reach good flame-retardant effect.
Phosphorous reaction-type flame-retarding Resins, epoxy is incorporated into phosphoric in the molecular chain, every performance is better than direct addition type, because the fire retardant of this response type is not easy to move out, good, less with the consistency of matrix to the mechanical property influence of system, become the research focus of Chinese scholars in recent years in view of above-mentioned various advantages.
CN1861682A discloses the halogen-free flameproof epoxy composite of a kind of liquid phosphorous epoxy resin, nbr carboxyl terminal modified epoxy, phenolic mixed curing agent composition, this material main body is the halogen-free flameproof epoxy glue solution, is mainly used in use in printed circuit board copper-clad laminate field.CN1974658A discloses a kind of manufacture method of halogen-free flameproof glue, mainly contains the solution A of triazines solidifying agent and the solution B of liquid phosphorous epoxy and phenolic curing agent thereof and forms, and can be applied in sealing material and the veneer sheet.
By above patent as can be known, present non-halogen scheme mainly concentrates on nitrogen phosphorus synergistic aspect, and is mainly used in semiconductor sealing material such as printed circuit board (PCB), and phosphorous epoxy resin exists with liquid form mostly, because technological requirement, be difficult to it is used among the solid state powder system.In the product of present domestic bigger Resins, epoxy manufacturers, also there is not the solid-state Halogenless fire retarded epoxy resin product that powder systems is used that is applicable to.Therefore, except liquid phosphorous epoxy resin was applied to Halogen copper-clad plate and printed circuit board industry, epoxy powder was sealed the Halogen industrialization of material and must be sought in the preparation production and application of effective fire-retardant approach and solid-state phosphorous epoxy resin.Can learn that by above-mentioned situation at present the halogen-free, flame-retardant composition of material of study on the industrialization seal to(for) epoxy powder yet there are no report.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, a kind of fire retardant phosphorus-containing epoxy powder composition is provided, said composition adopts solid-state phosphorous epoxy resin to cooperate with nitrogenous class solidifying agent and the nitrogenous based flame retardant of addition type and obtains, solved liquid phosphorous epoxy resin in the prior art because manufacturability requires to be applied in the problem of powder systems, synthesized solid-state phosphorous epoxy resin, and be applied to the epoxy powder system, for existing halogen antimony flame-retardant system provides technical support to non-halogen switching.
The objective of the invention is to be achieved through the following technical solutions:
A kind of fire retardant phosphorus-containing epoxy powder composition, its material and parts by weight thereof that constitute said composition are respectively:
Common solid-state bisphenol A type epoxy resin: 0~26 weight part
Solid-state phosphorous epoxy resin: 20~50 weight parts
Solidifying agent: 1~8 weight part
Promotor: 0~0.5 weight part
Filler: 30~60 weight parts
Fire retardant: 0~10 weight part
Pigment: 0.1~0.5 weight part.
And the softening temperature of described common solid-state bisphenol A type epoxy resin is 50 ℃~130 ℃, as among E12, E14, CYD011, the CYD012 one or several, and the loop-like epoxy resins kind that limits of non-above trade(brand)name.
And the phosphorus content of described solid-state phosphorous epoxy resin is 1.0%~7.6%, and the step of its synthetic method is:
(1). the Resins, epoxy that will be modified join have Controllable Temperature, vacuum-pumping and can feeding in the reactor of nitrogen, be heated to 100 ℃~180 ℃ and make the abundant fusion of the Resins, epoxy that is modified, be evacuated to the relative vacuum degree afterwards to reach-0.075MPa~-0.099MPa;
(2). add phosphorous-containing monomers and make it and the abundant fusion of Resins, epoxy that is modified, add catalyzer and also feed nitrogen protection, slowly be warming up to 130 ℃~190 ℃, insulation reaction 1.0h~6.0h;
(3). cooling discharge, the cooling compressing tablet can obtain the solid-state phosphorous epoxy resin finished product of yellowish transparent sheet-like.
And, the described Resins, epoxy that is modified is bisphenol A type epoxy resin such as E51, E54, E44, CYD127, CYD128, NPEL127, NPEL128, Epiclon850S, or bisphenol f type epoxy resin such as YDF-162, YDF-165, YDF-170, YDF-175, Epiclon 830, Epiclon 830S, or o-cresol formaldehyde epoxy resin such as CYDCN-100, CYDCN-200, N-670, N-665, NPCN703, NPCN704, CNE195XL2, CNE195XL4, CNE195XL5, or novolac epoxy such as YDPN-631, YDPN636, CYDPN-048, CYDPN-051, NPPN-631, NPPN-638S, PNE-177, PNE-177H, DEN431, DEN438, DEN439, and the non-above loop-like epoxy resins kind that limits.
And described phosphorous-containing monomers is 9, the 10-dihydro-9-oxy is assorted-and the assorted phenanthrene of 10-phosphine-10-oxide compound (DOPO) and derivative thereof such as ODOPB, ODOPM, DOPOMA, DDP, DMSA.
And, adding the catalyzer that is added behind the phosphorous-containing monomers at the Resins, epoxy that is modified is phosphine class material such as triphenylphosphine, perhaps amine substance such as thricyclohexyl amine, dimethyl benzylamine, triphenylamine, triethylamine, Tributylamine, pyridine, quinoline, imidazoles, glyoxal ethyline, 2-phenylimidazole, tetrahydroglyoxaline, perhaps quaternary amines material, the material of phosphorus-containing groups, the addition of catalyzer is 0.01%~5.00% of Resins, epoxy and the phosphorous-containing monomers gross weight that be modified, and the addition of optimization is 0.02%~2.00%.
And, described solidifying agent is anhydrides material such as phthalic anhydride, Tetra Hydro Phthalic Anhydride, trimellitic acid 1,2-anhydride, pyromellitic dianhydride, and nitrogenous amine curing agent is as 4,4 '-diaminodiphenylmethane, to ADP sulfone, Dyhard RU 100, hydrazides class material such as adipic dihydrazide, sebacic dihydrazide, and imidazole curing agent such as imidazoles, glyoxal ethyline, 2-phenylimidazole.
And described promotor is quaternary phosphine salts substances or quaternary ammonium salt material, perhaps imidazoles promotor such as imidazoles, glyoxal ethyline, 2-phenylimidazole.
And described filler is crystalline silica, fused silica, talcum powder, lime carbonate, fused silica powder.
And described fire retardant is trimeric cyanamide or melamine cyanurate and aluminium hydroxide or magnesium hydroxide.
Advantage of the present invention and positively effect are:
(1). synthesized several dissimilar solid-state high phosphorus content Resins, epoxy among the present invention, phosphorus content is 1.0%~7.6%, and synthesis technique is simple, and performance index are stable, conform with the application requiring that solid-state epoxy powder is sealed material;
(2). fire retardant phosphorus-containing epoxy powder composition of the present invention adopts the solid-state high phosphorus content Resins, epoxy that is suitable for powder systems and contains nitrogen combustion inhibitor, the fire retardant of nitrogen-containing hardener and addition type cooperates, prepared the epoxy powder that can reach the fire-retardant requirement of UL94V0 level and sealed material, other performance is all than more excellent.Synthesized solid-state phosphorous epoxy resin, and be applied to the epoxy powder system, solved liquid phosphorous epoxy resin in the prior art because manufacturability requires to be applied in the problem of powder systems, for existing halogen antimony flame-retardant system provides technical support to non-halogen switching.
(3). in fire retardant phosphorus-containing epoxy powder composition of the present invention, do not use virose Sb system fire retardant and the halogenated flame retardant that is easy to generate the carinogenicity material, there are not to adopt the red phosphorus series product of moving out easily and influencing product colour, do not use the heavy metal substance of Rohs management and control, meet the requirement of environmental protection electronic material more, the renewal product that belongs to existing halogen flame retardant system has vast market prospect and potentiality in the application in future and development.
Embodiment
The invention will be further described below in conjunction with specific embodiment, and following examples are descriptive, is not determinate, can not limit protection scope of the present invention with this.
Some performance index measuring methods described in the present invention are as follows:
(1). epoxy equivalent (weight): measure according to the method described in the GB4612-84 " mensuration of epoxy compounds epoxy equivalent (weight) ".
(2). melt viscosity: use Brookfield (Brookfield) cone-and-plate viscometer to measure the melt viscosity of synthetic phosphorous epoxy resin under different temperature, general temperature is 150 ℃ or 180 ℃.
(3). softening temperature: measure according to the method described in the GB12007.6-89 " Resins, epoxy softening point measurement method ring and ball method ".
(4). flame retardant resistance is measured: with reference to the testing vertical flammability method among the UL94 " the flammable performance test of equipment and device component material ", determine the flame retardant rating of matrix material.Batten is of a size of: long 125 ± 5mm, wide 13.0 ± 0.5mm, thickness 1.5 ± 0.2mm.
(5). horizontal flow: the measuring method according to the horizontal flow among the GB6554-86 " electric insulation coating powders test method " detects, and design temperature is 150 ℃.
(6). gel time: according to the measuring method of the gel time among the GB6554-86 " electric insulation coating powders test method ", adopt the method for drawing a circle to measure the gel time of epoxy powder, design temperature is 160 ℃.
Essential substance in the fire retardant phosphorus-containing epoxy powder composition of the present invention---details are as follows for solid-state high phosphorus content Resins, epoxy synthetic main component:
(1). phosphorous-containing monomers:
1. .9, the 10-dihydro-9-oxy is assorted-10-phospho hetero phenanthrene-10-oxide compound, be called for short DOPO, molecular weight 216, phosphorus content 14.33%;
2. .10-(2, the 5-dihydroxy phenyl)-10-hydrogen-9-oxa--10-phospho hetero phenanthrene-10-oxide compound, DOPO-HQ is called for short ODOPB, molecular weight 324, phosphorus content 9.55%;
3. methyl oneself ring-6-ketone of (1, the 2)-oxygen phospha of .[(6-oxygen-(6H)-dibenzo-(CE))] the Succinic Acid solid, abbreviation DDP, molecular weight 346, phosphorus content 8.96%.
The molecular formula of above-mentioned substance is as follows:
Figure A20081005380000081
(2). Resins, epoxy is modified:
1.. the o-cresol formaldehyde epoxy resin CYDCN-100 of Resins, epoxy division department of Ba Ling petrochemical complex limited liability company, epoxy equivalent (weight) 195~210g/eq;
2.. the novolac epoxy YDPN631 of national capital chemical industry (Kunshan) company limited, epoxy equivalent (weight) is 165~185g/eq.
3.. the liquid bisphenol A type Resins, epoxy CYD128 of Resins, epoxy division department of Ba Ling petrochemical complex limited liability company, epoxy equivalent (weight) 184~194g/eq;
4.. the liquid bisphenol F type Resins, epoxy YDF-170 of national capital chemical industry (Kunshan) company limited, epoxy equivalent (weight) is 160~180g/eq.
The synthetic method of solid-state high phosphorus content Resins, epoxy provides 6 synthetic embodiment among the present invention, and the solid-state high phosphorus content Resins, epoxy finished product of institute's synthetic marks A, B, C, D, E, F respectively.
Synthetic embodiment 1: the preparation of phosphorous epoxy resin A
Be equipped with electric heater, temperature regulator, electric mixing device, thermometer, nitrogen conduit, vacuumizing and add 144.25g CYDCN-100 in the 500ml four-hole boiling flask of water distilling apparatus, start whipping appts after feeding nitrogen and being heated to 150 ℃, be evacuated to-0.099MPa, remove fugitive constituent residual in the Resins, epoxy; Add 55.75g DOPO then, treat slowly to be warming up to 150 ℃ again after the complete fusion of DOPO powder, add the 0.20g triphenylphosphine as catalyzer, after mixing, feed nitrogen protection, insulation reaction was poured out compressing tablet with melt after 4.0 hours.Finally obtain the transparent lurid chip solid that has a little, be solid-state phosphorous epoxy resin A.
The testing performance index of phosphorous epoxy resin A is as follows: theoretical phosphorus content 4.0%; Theoretical epoxy equivalent (weight) 422g/eq, actual measurement epoxy equivalent (weight) 462g/eq; 114 ℃ of softening temperatures; Melt viscosity in the time of 180 ℃ is 1330mPa.s.
Synthetic embodiment 2: the preparation of phosphorous epoxy resin B
Be equipped with electric heater, temperature regulator, electric mixing device, thermometer, nitrogen conduit, vacuumizing and add 168.51g YDPN631 in the 500ml four-hole boiling flask of water distilling apparatus, start whipping appts after feeding nitrogen and being heated to 150 ℃, be evacuated to-0.099MPa, remove fugitive constituent residual in the Resins, epoxy.Add 121.07g DOPO then, treat slowly to be warming up to 150 ℃ again after the complete fusion of DOPO powder, add the 0.29g triphenylphosphine as catalyzer, after mixing, feed nitrogen protection, insulation reaction was poured out compressing tablet with melt after 3.5 hours.Finally obtain the almost transparent xanchromatic chip solid that has slightly, be solid-state phosphorous epoxy resin B.
The testing performance index of phosphorous epoxy resin B is as follows: theoretical phosphorus content 6.0%; Theoretical epoxy equivalent (weight) 771g/eq, actual measurement epoxy equivalent (weight) 813g/eq; 112 ℃ of softening temperatures; Melt viscosity in the time of 150 ℃ is 5600mPa.s.
Synthetic embodiment 3: the preparation of phosphorous epoxy resin C
Be equipped with electric heater, temperature regulator, electric mixing device, thermometer, nitrogen conduit, vacuumizing and add 231.5g CYD128 in the 500ml four-hole boiling flask of water distilling apparatus, start whipping appts after feeding nitrogen and being heated to 140 ℃, be evacuated to-0.099MPa, remove fugitive constituent residual in the Resins, epoxy.Add 264.6g DOPO then, treat slowly to be warming up to 150 ℃ again after the complete fusion of DOPO powder, feed nitrogen protection, insulation reaction was poured out compressing tablet with melt after 6.0 hours.Finally obtain almost transparent chip solid, be solid-state phosphorous epoxy resin C.
Phosphorous epoxy resin C testing performance index is as follows: theoretical phosphorus content 7.6%; The theoretical epoxy equivalent (weight) of this system is zero, and this resin can be used as the addition type phosphonium flame retardant and comes usefulness, and is relatively good with the consistency of epoxy systems; 86 ℃ of softening temperatures; Melt viscosity in the time of 150 ℃ is 590mPa.s.
Synthetic embodiment 4: the preparation of phosphorous epoxy resin D
164.74g CYD128 joined be equipped with electric heater, temperature regulator, electric mixing device, thermometer, nitrogen conduit, vacuumize in the 500ml four-hole boiling flask of water distilling apparatus, start whipping appts after feeding nitrogen and being heated to 140 ℃, be evacuated to-0.099MPa, remove fugitive constituent residual in the Resins, epoxy.Add 75.25g ODOPB then in four-hole boiling flask, treat the complete fusion of ODOPB powder after, add the 0.18g triphenylamine as catalyzer, mix the back and feed nitrogen protection, slowly be warming up to 170 ℃, insulation reaction was poured out compressing tablet with melt after 4.0 hours.Finally obtain the almost transparent xanchromatic chip solid that has a little, be solid-state phosphorous epoxy resin D.
Phosphorous epoxy resin D testing performance index is as follows: theoretical phosphorus content 3.0%; Theoretical epoxy equivalent (weight) is 590g/eq, and actual epoxy equivalent (weight) is 653g/eq; 117 ℃ of softening temperatures; Melt viscosity in the time of 180 ℃ is 2630mPa.s.
Synthetic embodiment 5: the preparation of phosphorous epoxy resin E
196.54g YDF-170 joined be equipped with electric heater, temperature regulator, electric mixing device, thermometer, nitrogen conduit, vacuumize in the 500ml four-hole boiling flask of water distilling apparatus, start whipping appts after feeding nitrogen and being heated to 140 ℃, be evacuated to-0.099MPa, remove fugitive constituent residual in the Resins, epoxy.Add 89.78g ODOPB then in four-hole boiling flask, treat the complete fusion of ODOPB powder after, add the 0.10g triphenylamine as catalyzer, mix the back and feed nitrogen protection, slowly be warming up to 170 ℃, insulation reaction was poured out compressing tablet with melt after 4.0 hours.Finally obtain the almost transparent xanchromatic chip solid that has a little, be solid-state phosphorous epoxy resin E.
Phosphorous epoxy resin E testing performance index is as follows: theoretical phosphorus content 3.0%; Theoretical epoxy equivalent (weight) is 492g/eq, and actual epoxy equivalent (weight) is 535g/eq; 101 ℃ of softening temperatures; Melt viscosity in the time of 150 ℃ is 4000mPa.s.
Synthetic embodiment 6: the preparation of phosphorous epoxy resin F
In being equipped with electric heater, temperature regulator, electric mixing device, thermometer, nitrogen conduit, vacuumizing and add 253.0g CYD128 in the 500ml four-hole boiling flask of water distilling apparatus, start whipping appts after feeding nitrogen and being heated to 150 ℃, be evacuated to-0.099MPa, remove fugitive constituent residual in the Resins, epoxy.Progressively add 97.91g DDP in four-hole boiling flask, insulation reaction was poured out compressing tablet with melt after 1.0 hours.Finally obtain the yellow transparent chip solid, be solid-state phosphorous epoxy resin F.
Phosphorous epoxy resin F testing performance index is as follows: theoretical phosphorus content 2.5%; Theoretical epoxy equivalent (weight) is 454g/eq, and actual epoxy equivalent (weight) is 492g/eq; Melt viscosity in the time of 150 ℃ is 910mPa.s.
Adopt the prepared fire retardant phosphorus-containing epoxy powder composition of the above-mentioned solid-state phosphorous epoxy resin of institute's synthetic, the present invention provides 10 embodiment altogether:
Embodiment 1: prepare epoxy powder composition according to following material and ratio thereof:
Resins, epoxy E12 22.75 weight parts
Phosphorous epoxy resin A 27.75 weight parts
Tetra hydro Phthalic anhydride 4.63 weight parts
Imidazoles 0.10 weight part
Silicon powder 35.43 weight parts
Melamine cyanurate (MCA) 9.10 weight parts
Phthalocyanine blue 0.24 weight part
Join in the miniature high-speed mixing equipment after the accurate weighing of above-mentioned substance, after fully mixed, use twin screw extruder to melt extrude.Through pulverizing, cross 100 eye mesh screens behind the melt extrusion process cooling compressing tablet, discard the upper strata coarse fodder and can obtain fire retardant phosphorus-containing epoxy powder composition.Then, the epoxy powder that obtains can be carried out performance test.Process mould press strip is made the batten of certain size, behind overcuring, can carry out flame retardant resistance and measure.
The horizontal flow rate of this fire retardant phosphorus-containing epoxy powder composition that records is 12%, and gel time is 174s, and the flame retardant rating of UL94 fire retardancy test evaluation is the V0 level.
Embodiment 2: prepare epoxy powder composition according to following material and ratio thereof:
Phosphorous epoxy resin A 47.73 weight parts
Tetra hydro Phthalic anhydride 6.25 weight parts
Imidazoles 0.15 weight part
Silicon powder 45.68 weight parts
Phthalocyanine blue 0.19 weight part
Above material is mixed, and the operating method processing according to embodiment 1 obtains fire retardant phosphorus-containing epoxy powder composition.
The horizontal flow rate of this fire retardant phosphorus-containing epoxy powder composition that records is 28%, and gel time is 53s, and the flame retardant rating of UL94 fire retardancy test evaluation is the V0 level.
Embodiment 3,4: prepare epoxy powder composition according to following material and ratio thereof:
Table 1
Embodiment 3 Embodiment 4
Resins, epoxy E12 22.04 weight part 23.08 weight part
Phosphorous epoxy resin B 27.04 weight part 28.08 weight part
Dyhard RU 100 (DICY) 1.96 weight part 2.05 weight part
The 2-phenylimidazole 0.50 weight part 0.42 weight part
Melamine cyanurate 0.00 weight part 4.62 weight part
Silicon powder 48.20 weight part 41.51 weight part
Phthalocyanine blue 0.26 weight part 0.24 weight part
Obtain embodiment 3 and 4 according to the material proportioning in the table 1, above material is processed according to the mode of embodiment 1, obtains fire retardant phosphorus-containing epoxy powder composition.
The horizontal flow rate of the epoxy powder composition that records among the embodiment 3 is 51%, and gel time is 180s, and the flame retardant rating of UL94 fire retardancy test evaluation is the V0 level.Record among the embodiment 4 the horizontal flow rate of epoxy powder composition be 48%, gel time is 127s, the flame retardant rating of UL94 fire retardancy test evaluation is the V0 level.
Embodiment 5: prepare epoxy powder composition according to following material and ratio thereof:
Resins, epoxy E12 22.78 weight parts
Phosphorous epoxy resin B 27.78 weight parts
4,4 '-diaminodiphenylmethane (DDM), 3.44 weight parts
Silicon powder 41.20 weight parts
Melamine cyanurate 4.56 weight parts
Phthalocyanine blue 0.24 weight part
Above material is mixed, and the operating method processing according to embodiment 1 obtains fire retardant phosphorus-containing epoxy powder composition.
The horizontal flow rate of this fire retardant phosphorus-containing epoxy powder composition that records is 29%, and gel time is 153s, and the flame retardant rating of UL94 fire retardancy test evaluation is the V0 level.
Embodiment 6,7: prepare epoxy powder composition according to following material and ratio thereof:
Table 2
Embodiment 6 Embodiment 7
Resins, epoxy E12 0.00 weight part 23.19 weight part
Phosphorous epoxy resin B 47.09 weight part 28.19 weight part
Adipic dihydrazide (AADH) 1.85 weight part 2.04 weight part
The 2-phenylimidazole 0.08 weight part 0.09 weight part
Melamine cyanurate 0.00 weight part 4.64 weight part
Silicon powder 50.76 weight part 41.61 weight part
Phthalocyanine blue 0.22 weight part 0.24 weight part
Obtain embodiment 6 and 7 according to the material proportioning in the table 2, above material is processed according to the mode of embodiment 1, obtains fire retardant phosphorus-containing epoxy powder composition.The horizontal flow rate of the epoxy powder composition that records among the embodiment 6 is 70%, and gel time is 172s, and the flame retardant rating of UL94 fire retardancy test evaluation is the V0 level.The horizontal flow rate of the epoxy powder composition that records among the embodiment 7 is 33%, and gel time is 328s, and the flame retardant rating of UL94 fire retardancy test evaluation is the V0 level.
Embodiment 8: prepare epoxy powder composition according to following material and ratio thereof:
Phosphorous epoxy resin D 48.96 weight parts
Tetra hydro Phthalic anhydride 3.76 weight parts
Imidazoles 0.12 weight part
Silicon powder 42.12 weight parts
Melamine cyanurate 4.80 weight parts
Phthalocyanine blue 0.24 weight part
Above material is mixed and, obtain fire retardant phosphorus-containing epoxy powder composition according to the method among the embodiment 1 through after melt extruding.The horizontal flow rate of said composition is 18%, and gel time is 94s, and the flame retardant rating of UL94 fire retardancy test evaluation is the V0 level.
Embodiment 9 prepares epoxy powder composition according to following material and ratio thereof:
Phosphorous epoxy resin E 48.43 weight parts
Tetra hydro Phthalic anhydride 4.75 weight parts
Imidazoles 0.12 weight part
Silicon powder 41.92 weight parts
Melamine cyanurate 4.54 weight parts
Phthalocyanine blue 0.24 weight part
Above material is mixed and, obtain fire retardant phosphorus-containing epoxy powder composition according to the method among the embodiment 1 through after melt extruding.The horizontal flow rate of said composition is 30%, and gel time is 163s, and the flame retardant rating of UL94 fire retardancy test evaluation is the V0 level.
Embodiment 10: prepare epoxy powder composition according to following material and ratio thereof:
Resins, epoxy E12 25.20 weight parts
Phosphorous epoxy resin C 16.80 weight parts
Dyhard RU 100 1.01 weight parts
2-phenylimidazole 0.50 weight part
Silicon powder 56.27 weight parts
Phthalocyanine blue 0.22 weight part
Above material is mixed and, obtain fire retardant phosphorus-containing epoxy powder composition according to the method among the embodiment 1 through after melt extruding.The horizontal flow rate of said composition is 45%, and gel time is 212s, and the flame retardant rating of UL94 fire retardancy test evaluation is the V0 level.
The over-all properties of all embodiment sees Table 3.
Table 3
Test event Embodiment 1 Embodiment 2 Embodiment 3 Embodiment 4 Embodiment 5 Embodiment 6 Embodiment 7 Embodiment 8 Embodiment 9 Embodiment 10
Horizontal flow rate (%) 12 28 51 48 29 70 33 18 30 45
Gel time (Sec) 174 53 180 127 153 172 328 94 163 212
Flame retardant resistance UL94 V0 V0 V0 V0 V0 V0 V0 V0 V0 V0

Claims (10)

1. fire retardant phosphorus-containing epoxy powder composition is characterized in that: the material and the parts by weight thereof that constitute said composition are respectively:
Common solid-state bisphenol A type epoxy resin: 0~26 weight part
Solid-state phosphorous epoxy resin: 20~50 weight parts
Solidifying agent: 1~8 weight part
Promotor: 0~0.5 weight part
Filler: 30~60 weight parts
Fire retardant: 0~10 weight part
Pigment: 0.1~0.5 weight part.
2. fire retardant phosphorus-containing epoxy powder composition according to claim 1, it is characterized in that: the softening temperature of described common solid-state bisphenol A type epoxy resin is 50 ℃~130 ℃, as among E12, E14, CYD011, the CYD012 one or several, and the loop-like epoxy resins kind that limits of non-above trade(brand)name.
3. fire retardant phosphorus-containing epoxy powder composition according to claim 1 is characterized in that: the phosphorus content of described solid-state phosphorous epoxy resin is 1.0%~7.6%, and the step of its synthetic method is:
(1). the Resins, epoxy that will be modified join have Controllable Temperature, vacuum-pumping and can feeding in the reactor of nitrogen, be heated to 100 ℃~180 ℃ and make the abundant fusion of the Resins, epoxy that is modified, be evacuated to the relative vacuum degree afterwards to reach-0.075MPa~-0.099MPa;
(2). add phosphorous-containing monomers and make it and the abundant fusion of Resins, epoxy that is modified, add catalyzer and also feed nitrogen protection, slowly be warming up to 130 ℃~190 ℃, insulation reaction 1.0h~6.0h;
(3). cooling discharge, the cooling compressing tablet can obtain the solid-state phosphorous epoxy resin finished product of yellowish transparent sheet-like.
4. fire retardant phosphorus-containing epoxy powder composition according to claim 3, it is characterized in that: the described Resins, epoxy that is modified is bisphenol A type epoxy resin such as E51, E54, E44, CYD127, CYD128, NPEL127, NPEL128, Epiclon850S, or bisphenol f type epoxy resin such as YDF-162, YDF-165, YDF-170, YDF-175, Epiclon 830, Epiclon830S, or o-cresol formaldehyde epoxy resin such as CYDCN-100, CYDCN-200, N-670, N-665, NPCN703, NPCN704, CNE195XL2, CNE195XL4, CNE195XL5, or novolac epoxy such as YDPN-631, YDPN636, CYDPN-048, CYDPN-051, NPPN-631, NPPN-638S, PNE-177, PNE-177H, DEN431, DEN438, DEN439, and the non-above loop-like epoxy resins kind that limits.
5. fire retardant phosphorus-containing epoxy powder composition according to claim 3 is characterized in that: described phosphorous-containing monomers is 9, the 10-dihydro-9-oxy is assorted-and the assorted phenanthrene of 10-phosphine-10-oxide compound (DOPO) and derivative thereof such as ODOPB, ODOPM, DOPOMA, DDP, DMSA.
6. fire retardant phosphorus-containing epoxy powder composition according to claim 3, it is characterized in that: adding the catalyzer that is added behind the phosphorous-containing monomers at the Resins, epoxy that is modified is phosphine class material such as triphenylphosphine, perhaps amine substance such as thricyclohexyl amine, dimethyl benzylamine, triphenylamine, triethylamine, Tributylamine, pyridine, quinoline, imidazoles, glyoxal ethyline, the 2-phenylimidazole, tetrahydroglyoxaline, perhaps quaternary amines material, the material of phosphorus-containing groups, the addition of catalyzer is 0.01%~5.00% of Resins, epoxy and the phosphorous-containing monomers gross weight that be modified, and the addition of optimization is 0.02%~2.00%.
7. fire retardant phosphorus-containing epoxy powder composition according to claim 1, it is characterized in that: described solidifying agent is anhydrides material such as phthalic anhydride, Tetra Hydro Phthalic Anhydride, trimellitic acid 1,2-anhydride, pyromellitic dianhydride, and nitrogenous amine curing agent is as 4,4 '-diaminodiphenylmethane, to ADP sulfone, Dyhard RU 100, hydrazides class material such as adipic dihydrazide, sebacic dihydrazide, and imidazole curing agent such as imidazoles, glyoxal ethyline, 2-phenylimidazole.
8. fire retardant phosphorus-containing epoxy powder composition according to claim 1 is characterized in that: described promotor is quaternary phosphine salts substances or quaternary ammonium salt material, perhaps imidazoles promotor such as imidazoles, glyoxal ethyline, 2-phenylimidazole.
9. fire retardant phosphorus-containing epoxy powder composition according to claim 1 is characterized in that: described filler is crystalline silica, fused silica, talcum powder, lime carbonate, fused silica powder.
10. fire retardant phosphorus-containing epoxy powder composition according to claim 1 is characterized in that: described fire retardant is trimeric cyanamide or melamine cyanurate and aluminium hydroxide or magnesium hydroxide.
CN2008100538004A 2008-07-10 2008-07-10 Fire retardant phosphorus-containing epoxy powder composition Active CN101307170B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008100538004A CN101307170B (en) 2008-07-10 2008-07-10 Fire retardant phosphorus-containing epoxy powder composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2008100538004A CN101307170B (en) 2008-07-10 2008-07-10 Fire retardant phosphorus-containing epoxy powder composition

Publications (2)

Publication Number Publication Date
CN101307170A true CN101307170A (en) 2008-11-19
CN101307170B CN101307170B (en) 2011-08-10

Family

ID=40123865

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008100538004A Active CN101307170B (en) 2008-07-10 2008-07-10 Fire retardant phosphorus-containing epoxy powder composition

Country Status (1)

Country Link
CN (1) CN101307170B (en)

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7897702B2 (en) * 2008-11-24 2011-03-01 Chung-Shan Institute Of Science And Technology, Armaments Bureau, Ministry Of National Defense Epoxy resin, curing agent and 9,10-Dihydro-9-oxa-10-phosphaphenanthrene derivative
CN102051024A (en) * 2010-12-11 2011-05-11 宏昌电子材料股份有限公司 Halogen-free flame-retardant epoxy resin composition and application thereof
CN102070770A (en) * 2010-11-23 2011-05-25 沈阳化工大学 Phosphorous epoxy resin curing agent and preparation method thereof
CN102206324A (en) * 2011-03-29 2011-10-05 中国科学院宁波材料技术与工程研究所 Full-biobased epoxy resin composition and condensate
CN102260403A (en) * 2011-06-22 2011-11-30 天津市凯华绝缘材料有限公司 Inflaming-retarding epoxy resin for electronic packaging material and copper-clad plate and synthesis method thereof
CN102276959A (en) * 2011-06-22 2011-12-14 天津市凯华绝缘材料有限公司 Halogen-free non-phosphorization flame-retardant epoxy resin composition and preparation method thereof
CN102408676A (en) * 2011-09-16 2012-04-11 无锡创达电子有限公司 Environment-friendly epoxy molding compound and its preparation method
CN103059516A (en) * 2013-01-08 2013-04-24 天津市凯华绝缘材料有限公司 Fast-cure epoxy powder composition
CN103289326A (en) * 2013-06-28 2013-09-11 山东科技大学 Halogen-free flame retardant epoxy resin compound for potting material
CN103694638A (en) * 2013-12-14 2014-04-02 大连理工大学 Halogen-free epoxy resin applicable to liquid oxygen environment and preparation method thereof
CN103772912A (en) * 2012-10-18 2014-05-07 中国石油化工股份有限公司 Epoxy resin membrane for low temperature long-acting hot melt prepreg and preparation method thereof
CN104194047A (en) * 2014-08-27 2014-12-10 青岛前哨新材料科技有限公司 Flame-retardant material additive and preparation method thereof
CN104610704A (en) * 2015-01-28 2015-05-13 清远市普塞呋磷化学有限公司 Halogen-free flame retardant anhydride cured epoxy resin composition
CN104745048A (en) * 2013-12-31 2015-07-01 天津市凯华绝缘材料有限公司 Halogen-free flame retardant epoxy resin powder coating used for coating magnetic ring
CN105111678A (en) * 2015-06-23 2015-12-02 镇江高凯树脂科技有限公司 Polymer composite for insulating protection layer of power electronic component and preparation method thereof
CN105860892A (en) * 2016-04-15 2016-08-17 安庆市晶科电子有限公司 Conductive silver adhesive with high flame retardance
CN106117513A (en) * 2016-07-26 2016-11-16 泰山体育产业集团有限公司 A kind of elastic cured epoxy-resin systems and preparation method thereof
CN106519583A (en) * 2016-12-06 2017-03-22 新誉集团有限公司 Halogen-free flame-retardant hand lay-up epoxy resin composition and preparation method thereof
CN106519296A (en) * 2016-10-31 2017-03-22 贵州省材料产业技术研究院 Transparent halogen-free epoxy resin flame-resistant material and preparation method thereof
CN106752703A (en) * 2016-12-15 2017-05-31 天长市金陵电子有限责任公司 A kind of electrostatic spraying powder coating containing modified 2 methylimidazoles
CN106751501A (en) * 2016-12-06 2017-05-31 新誉集团有限公司 A kind of high tenacity, halogen-free flameproof vacuum diversion composition epoxy resin and preparation method thereof
CN106928653A (en) * 2015-12-29 2017-07-07 比亚迪股份有限公司 A kind of epoxy resin composition for prepreg and preparation method thereof and prepreg
CN108484881A (en) * 2018-03-30 2018-09-04 咸阳伟华绝缘材料有限公司 A kind of halogen-free fire-retardant epoxy resin and its synthetic method
CN108485193A (en) * 2018-03-30 2018-09-04 吴先锋 A kind of fire-retardant epoxy resin composition and preparation method thereof can be used for electronic package material
CN108978224A (en) * 2018-06-30 2018-12-11 江南大学 A kind of preparation method and method for sorting assigning the multi-functional finishing agent of textile
CN110189859A (en) * 2019-05-14 2019-08-30 何活恩 It is a kind of can the anti-wear enameled wire with moisture-proof function
CN111548478A (en) * 2020-05-20 2020-08-18 江门市华锐铝基板股份公司 Preparation method of epoxy resin for aluminum plate copper coating
CN113039231A (en) * 2018-12-14 2021-06-25 Swimc有限公司 Fusion bonded epoxy amine rebar powder coating
CN116284748A (en) * 2023-02-02 2023-06-23 四川东材科技集团股份有限公司 High-flame-retardance macromolecular phosphorus-containing solid phenoxy resin and preparation method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1201053A (en) * 1997-05-30 1998-12-09 住友电木株式会社 Flame-retardant resin composition and semiconductive sealing material made of same
CN1267314A (en) * 1997-06-26 2000-09-20 陶氏化学公司 Flame retardant epoxy resin composition
CN1423678A (en) * 1999-12-13 2003-06-11 陶氏环球技术公司 Flame retardant phosphorus element-containing epoxy resin compositions
CN1621443A (en) * 2003-11-25 2005-06-01 晋一化工股份有限公司 Flame retardant epoxy resin and its composition
CN1659217A (en) * 2002-05-30 2005-08-24 陶氏环球技术公司 Halogen free ignition resistant thermoplastic resin compositions

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1201053A (en) * 1997-05-30 1998-12-09 住友电木株式会社 Flame-retardant resin composition and semiconductive sealing material made of same
CN1267314A (en) * 1997-06-26 2000-09-20 陶氏化学公司 Flame retardant epoxy resin composition
CN1423678A (en) * 1999-12-13 2003-06-11 陶氏环球技术公司 Flame retardant phosphorus element-containing epoxy resin compositions
CN1659217A (en) * 2002-05-30 2005-08-24 陶氏环球技术公司 Halogen free ignition resistant thermoplastic resin compositions
CN1621443A (en) * 2003-11-25 2005-06-01 晋一化工股份有限公司 Flame retardant epoxy resin and its composition

Cited By (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7981980B2 (en) * 2008-11-24 2011-07-19 Chung-Shan Institute of Science and Technology Armaments Bureau, Ministry of National Defense Development of a cross-linked epoxy resin with flame-retardant properties
US7897702B2 (en) * 2008-11-24 2011-03-01 Chung-Shan Institute Of Science And Technology, Armaments Bureau, Ministry Of National Defense Epoxy resin, curing agent and 9,10-Dihydro-9-oxa-10-phosphaphenanthrene derivative
CN102070770B (en) * 2010-11-23 2012-11-28 沈阳化工大学 Phosphorous epoxy resin curing agent and preparation method thereof
CN102070770A (en) * 2010-11-23 2011-05-25 沈阳化工大学 Phosphorous epoxy resin curing agent and preparation method thereof
CN102051024A (en) * 2010-12-11 2011-05-11 宏昌电子材料股份有限公司 Halogen-free flame-retardant epoxy resin composition and application thereof
CN102051024B (en) * 2010-12-11 2012-12-05 宏昌电子材料股份有限公司 Halogen-free flame-retardant epoxy resin composition and application thereof
CN102206324A (en) * 2011-03-29 2011-10-05 中国科学院宁波材料技术与工程研究所 Full-biobased epoxy resin composition and condensate
CN102206324B (en) * 2011-03-29 2012-12-12 中国科学院宁波材料技术与工程研究所 Full-biobased epoxy resin composition and condensate
CN102260403A (en) * 2011-06-22 2011-11-30 天津市凯华绝缘材料有限公司 Inflaming-retarding epoxy resin for electronic packaging material and copper-clad plate and synthesis method thereof
CN102276959A (en) * 2011-06-22 2011-12-14 天津市凯华绝缘材料有限公司 Halogen-free non-phosphorization flame-retardant epoxy resin composition and preparation method thereof
CN102260403B (en) * 2011-06-22 2013-11-06 天津市凯华绝缘材料有限公司 Inflaming-retarding epoxy resin for electronic packaging material and copper-clad plate and synthesis method thereof
CN102408676A (en) * 2011-09-16 2012-04-11 无锡创达电子有限公司 Environment-friendly epoxy molding compound and its preparation method
CN103772912A (en) * 2012-10-18 2014-05-07 中国石油化工股份有限公司 Epoxy resin membrane for low temperature long-acting hot melt prepreg and preparation method thereof
CN103059516A (en) * 2013-01-08 2013-04-24 天津市凯华绝缘材料有限公司 Fast-cure epoxy powder composition
CN103059516B (en) * 2013-01-08 2015-12-23 天津市凯华绝缘材料有限公司 A kind of Fast-cure epoxy powder composition
CN103289326A (en) * 2013-06-28 2013-09-11 山东科技大学 Halogen-free flame retardant epoxy resin compound for potting material
CN103289326B (en) * 2013-06-28 2015-10-07 山东科技大学 For the halogen-free flame retardant epoxy resin composition of potting compound
CN103694638A (en) * 2013-12-14 2014-04-02 大连理工大学 Halogen-free epoxy resin applicable to liquid oxygen environment and preparation method thereof
CN104745048A (en) * 2013-12-31 2015-07-01 天津市凯华绝缘材料有限公司 Halogen-free flame retardant epoxy resin powder coating used for coating magnetic ring
CN104194047A (en) * 2014-08-27 2014-12-10 青岛前哨新材料科技有限公司 Flame-retardant material additive and preparation method thereof
CN104610704A (en) * 2015-01-28 2015-05-13 清远市普塞呋磷化学有限公司 Halogen-free flame retardant anhydride cured epoxy resin composition
CN105111678A (en) * 2015-06-23 2015-12-02 镇江高凯树脂科技有限公司 Polymer composite for insulating protection layer of power electronic component and preparation method thereof
CN106928653A (en) * 2015-12-29 2017-07-07 比亚迪股份有限公司 A kind of epoxy resin composition for prepreg and preparation method thereof and prepreg
CN105860892A (en) * 2016-04-15 2016-08-17 安庆市晶科电子有限公司 Conductive silver adhesive with high flame retardance
CN106117513A (en) * 2016-07-26 2016-11-16 泰山体育产业集团有限公司 A kind of elastic cured epoxy-resin systems and preparation method thereof
CN106117513B (en) * 2016-07-26 2018-07-17 泰山体育产业集团有限公司 A kind of elastic cured epoxy-resin systems and preparation method thereof
CN106519296A (en) * 2016-10-31 2017-03-22 贵州省材料产业技术研究院 Transparent halogen-free epoxy resin flame-resistant material and preparation method thereof
CN106751501B (en) * 2016-12-06 2018-11-13 新誉集团有限公司 A kind of high tenacity, halogen-free flameproof vacuum diversion composition epoxy resin and preparation method thereof
CN106519583A (en) * 2016-12-06 2017-03-22 新誉集团有限公司 Halogen-free flame-retardant hand lay-up epoxy resin composition and preparation method thereof
CN106751501A (en) * 2016-12-06 2017-05-31 新誉集团有限公司 A kind of high tenacity, halogen-free flameproof vacuum diversion composition epoxy resin and preparation method thereof
CN106752703A (en) * 2016-12-15 2017-05-31 天长市金陵电子有限责任公司 A kind of electrostatic spraying powder coating containing modified 2 methylimidazoles
CN108484881A (en) * 2018-03-30 2018-09-04 咸阳伟华绝缘材料有限公司 A kind of halogen-free fire-retardant epoxy resin and its synthetic method
CN108485193A (en) * 2018-03-30 2018-09-04 吴先锋 A kind of fire-retardant epoxy resin composition and preparation method thereof can be used for electronic package material
CN108485193B (en) * 2018-03-30 2020-06-12 吴先锋 Flame-retardant epoxy resin composition for electronic packaging material and preparation method thereof
CN108484881B (en) * 2018-03-30 2020-06-12 咸阳新伟华绝缘材料有限公司 Halogen-free flame-retardant epoxy resin and synthetic method thereof
CN108978224A (en) * 2018-06-30 2018-12-11 江南大学 A kind of preparation method and method for sorting assigning the multi-functional finishing agent of textile
CN113039231A (en) * 2018-12-14 2021-06-25 Swimc有限公司 Fusion bonded epoxy amine rebar powder coating
CN110189859A (en) * 2019-05-14 2019-08-30 何活恩 It is a kind of can the anti-wear enameled wire with moisture-proof function
CN111548478A (en) * 2020-05-20 2020-08-18 江门市华锐铝基板股份公司 Preparation method of epoxy resin for aluminum plate copper coating
CN116284748A (en) * 2023-02-02 2023-06-23 四川东材科技集团股份有限公司 High-flame-retardance macromolecular phosphorus-containing solid phenoxy resin and preparation method thereof

Also Published As

Publication number Publication date
CN101307170B (en) 2011-08-10

Similar Documents

Publication Publication Date Title
CN101307170B (en) Fire retardant phosphorus-containing epoxy powder composition
JP6470400B2 (en) High CTI halogen-free epoxy resin composition for copper clad plate and method of using the same
CN103540101B (en) Non-halogen resin composition and apply its copper clad laminate and printed circuit board (PCB)
JP6129277B2 (en) Composition of low dielectric phosphorus-containing polyester compound and method for preparing the same
CN103059516B (en) A kind of Fast-cure epoxy powder composition
EP2770025B1 (en) Halogen-free low-dielectric resin composition, and prepreg and copper foil laminate made by using same
CN102134376B (en) Halogen-free flame-retardant resin composition and preparation method of prepreg and laminated plate
EP2578613B1 (en) Epoxy resin composition and pre-preg, support-provided resin film, metallic foil clad laminate plate and multilayer printed circuit board utilizing said composition
CN101376735B (en) Halogen-free flame-proof epoxy resin composition and bonding sheet and copper clad laminate prepared thereby
CN102276959B (en) Halogen-free non-phosphorization flame-retardant epoxy resin composition and preparation method thereof
EP2985300B1 (en) Phosphor-containing phenol formaldehyde resin compound and flame-retardant epoxy resin hardener made from thereof
CN105368002A (en) Preparation method for DOPO etherified phenol composition, flame-retardant composition and application
CN111500234A (en) Flame-retardant epoxy resin halogen-free potting material and preparation method thereof
CN111423618B (en) Nitrogen heterocyclic aromatic amine-metal ion complex flame retardant and application thereof in preparation of flame-retardant epoxy resin
CN110128794A (en) A kind of no chlorine is without the high CTI resin combination of bromine and application
CN102051024A (en) Halogen-free flame-retardant epoxy resin composition and application thereof
KR20160082909A (en) Halogen-free thermosetting resin composition, and prepreg and laminate for printed circuits using the same
CN113667276A (en) Halogen-free high-Tg copper-clad substrate and preparation method thereof
CN102382420B (en) High CTI (Comparative Tracking Index) epoxy resin composition for printed circuit copper-clad plate
CN111548478A (en) Preparation method of epoxy resin for aluminum plate copper coating
CN103333464B (en) A kind of phosphor-containing halogen-free fire retarded epoxy resin composition and application
CN102020828A (en) Phosphorus-nitrogen compound intumescence active flame retardant modified epoxy resin and preparation method and application thereof
KR101898365B1 (en) A halogen-free thermosetting resin composition, and a prepreg and a laminate used for printed circuit using the same
CN100400592C (en) Fire tetardant no-halogen epoxy resin glue and its prepn process and use
JP3825715B2 (en) Phosphorus-containing flame retardant epoxy resin and composition thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: TIANJIN KAIHUA INSULATING MATERIALS CO., LTD.

Free format text: FORMER NAME: TIANJIN KAIHUA INSULATION MATERIALS CO., LTD.

CP03 Change of name, title or address

Address after: 300300 No. 27, Jing Lu, economic development zone, Dongli, Tianjin

Patentee after: TIANJIN KAIHUA INSULATING MATERIALS Co.,Ltd.

Address before: 300300 No. 27, Jing Lu, Dongli Economic Development Zone, Tianjin, China

Patentee before: TIANJIN CITY KAIHUA INSULATION MATERIAL Co.,Ltd.

PE01 Entry into force of the registration of the contract for pledge of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: A flame-retardant phosphorus containing epoxy powder composition

Effective date of registration: 20230725

Granted publication date: 20110810

Pledgee: China Resources Shenzhen International Investment Trust Co.,Ltd.

Pledgor: TIANJIN KAIHUA INSULATING MATERIALS Co.,Ltd.

Registration number: Y2023110000309