CN100400592C - Fire tetardant no-halogen epoxy resin glue and its prepn process and use - Google Patents
Fire tetardant no-halogen epoxy resin glue and its prepn process and use Download PDFInfo
- Publication number
- CN100400592C CN100400592C CNB200610155095XA CN200610155095A CN100400592C CN 100400592 C CN100400592 C CN 100400592C CN B200610155095X A CNB200610155095X A CN B200610155095XA CN 200610155095 A CN200610155095 A CN 200610155095A CN 100400592 C CN100400592 C CN 100400592C
- Authority
- CN
- China
- Prior art keywords
- solution
- epoxy resin
- fire
- tetardant
- halogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB200610155095XA CN100400592C (en) | 2006-12-08 | 2006-12-08 | Fire tetardant no-halogen epoxy resin glue and its prepn process and use |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB200610155095XA CN100400592C (en) | 2006-12-08 | 2006-12-08 | Fire tetardant no-halogen epoxy resin glue and its prepn process and use |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1974658A CN1974658A (en) | 2007-06-06 |
CN100400592C true CN100400592C (en) | 2008-07-09 |
Family
ID=38125033
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200610155095XA Expired - Fee Related CN100400592C (en) | 2006-12-08 | 2006-12-08 | Fire tetardant no-halogen epoxy resin glue and its prepn process and use |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100400592C (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102206401A (en) * | 2011-04-14 | 2011-10-05 | 北京理工大学 | Halogen-free flame-retardant epoxy resin composition and preparation method thereof |
CN102276961A (en) * | 2011-07-22 | 2011-12-14 | 苏州生益科技有限公司 | Halogen-free phosphorus-free epoxy resin composition, and semi-curing sheet and laminated sheet manufactured thereby |
CN108215247A (en) * | 2018-01-11 | 2018-06-29 | 惠州市纵胜电子材料有限公司 | A kind of preparation method of moulded board |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6617029B2 (en) * | 2001-08-31 | 2003-09-09 | Chang Chun Plastics Co., Ltd. | Nitrogen-containing flame retarding epoxy resin and an epoxy resin composition containing the same |
CN1474961A (en) * | 2000-11-15 | 2004-02-11 | ���ƹɷ�����˾ | Positive type photosensitive epoxy resin composition and printed circuit board using same |
CN1556136A (en) * | 2003-12-30 | 2004-12-22 | 上海化工研究院 | Halogen less expansion type polyolefine incombustible agent and its preparation method |
CN1587295A (en) * | 2004-07-20 | 2005-03-02 | 浙江大学 | Flame-retardant epoxy resin and its preparing method |
JP2006022179A (en) * | 2004-07-07 | 2006-01-26 | Dainippon Ink & Chem Inc | Thermosetting resin composition and its cured product |
CN1807483A (en) * | 2006-02-10 | 2006-07-26 | 康富春 | High nitrogen content epoxide resin an its preparation method and uses |
-
2006
- 2006-12-08 CN CNB200610155095XA patent/CN100400592C/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1474961A (en) * | 2000-11-15 | 2004-02-11 | ���ƹɷ�����˾ | Positive type photosensitive epoxy resin composition and printed circuit board using same |
US6617029B2 (en) * | 2001-08-31 | 2003-09-09 | Chang Chun Plastics Co., Ltd. | Nitrogen-containing flame retarding epoxy resin and an epoxy resin composition containing the same |
CN1556136A (en) * | 2003-12-30 | 2004-12-22 | 上海化工研究院 | Halogen less expansion type polyolefine incombustible agent and its preparation method |
JP2006022179A (en) * | 2004-07-07 | 2006-01-26 | Dainippon Ink & Chem Inc | Thermosetting resin composition and its cured product |
CN1587295A (en) * | 2004-07-20 | 2005-03-02 | 浙江大学 | Flame-retardant epoxy resin and its preparing method |
CN1807483A (en) * | 2006-02-10 | 2006-07-26 | 康富春 | High nitrogen content epoxide resin an its preparation method and uses |
Non-Patent Citations (4)
Title |
---|
三聚氰胺在膨胀型阻燃剂中的应用. 杨中兴.天津化工,第20卷第3期. 2006 |
三聚氰胺在膨胀型阻燃剂中的应用. 杨中兴.天津化工,第20卷第3期. 2006 * |
氮系阻燃剂的研究及应用概况. 王海军.热固性树脂,第20卷第4期. 2005 |
氮系阻燃剂的研究及应用概况. 王海军.热固性树脂,第20卷第4期. 2005 * |
Also Published As
Publication number | Publication date |
---|---|
CN1974658A (en) | 2007-06-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6470400B2 (en) | High CTI halogen-free epoxy resin composition for copper clad plate and method of using the same | |
CN101307170B (en) | Fire retardant phosphorus-containing epoxy powder composition | |
CN101418204B (en) | Halogen-free flameproof adhesive and application thereof in bonding sheet and copper clad laminate | |
CN101746102B (en) | Compound base copper-clad laminate and manufacturing method thereof | |
CN102051025B (en) | Halogen-free flame-retardant epoxy resin composition and application thereof | |
CN102051026B (en) | Halogen-free flame-retardant epoxy resin composition and application thereof | |
US6180695B1 (en) | Flame-retardant resin composition and semiconductor sealant using the same | |
EP2896653B1 (en) | Epoxy resin composition, and, prepreg and copper clad laminate manufactured using the composition | |
CN103382242A (en) | Phosphorus-containing flame-retardant phenolic resin and flame-retardant cured epoxy resin prepared with phosphorus-containing flame-retardant phenolic resin as raw material | |
KR20130103331A (en) | Epoxy resin composition and pre-preg, support-provided resin film, metallic foil clad laminate plate and multilayer printed circuit board utilizing said composition | |
CN101418205B (en) | Halogen-free flameproof adhesive and application thereof in prepreg and multiple layer printed plate | |
CN103992622A (en) | Halogen-free resin composition, prepreg prepared from halogen-free resin composition and laminated board prepared from halogen-free resin composition and used for printed circuit | |
CN102051024B (en) | Halogen-free flame-retardant epoxy resin composition and application thereof | |
CN102093672A (en) | Halogen-phosphorus-free flame retardant epoxy resin composition and application thereof in bonding sheet and copper-clad plate | |
CN101906239A (en) | Halogen-free flame-retardant resin composition and application thereof in manufacturing copper-clad plate | |
CN111500234A (en) | Flame-retardant epoxy resin halogen-free potting material and preparation method thereof | |
CN101580627B (en) | Halogen-free phosphorus-containing fire retardant epoxy base material for printed circuit copper clad laminate and preparation method thereof | |
CN100400592C (en) | Fire tetardant no-halogen epoxy resin glue and its prepn process and use | |
CN105801814A (en) | Halogen-free thermosetting resin composition and prepreg and printed circuit laminated board using the same | |
JP2012224787A (en) | Epoxy resin composition and epoxy resin curing agent, and respective products using them | |
CN105131597A (en) | Halogen-free resin composition and prepreg using halogen-free resin composition and printed circuit laminated board | |
CN105802128A (en) | Halogen-free thermosetting resin composition and prepreg and printed circuit laminated board using the same | |
JP5399733B2 (en) | Flame retardant phosphorus-containing epoxy resin composition and cured product thereof | |
WO2003042291A1 (en) | Halogen-free phosphorous- and nitrogen-containing flame-resistant epoxy resin compositions, and prepregs derived from thereof | |
CN110845706B (en) | Thermosetting resin composition, prepreg using same, laminated board and printed circuit board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Kingboard Chemical Holdings Ltd. Assignor: Zhejiang University Contract fulfillment period: 2008.8.1 to 2013.7.31 contract change Contract record no.: 2009320001060 Denomination of invention: Fire tetardant no-halogen epoxy resin glue and its prepn process and use Granted publication date: 20080709 License type: Exclusive license Record date: 2009.7.7 |
|
LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.8.1 TO 2013.7.31; CHANGE OF CONTRACT Name of requester: JIANTAO LAMINATE( KUNSHAN ) CO., LTD. Effective date: 20090707 |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080709 Termination date: 20161208 |
|
CF01 | Termination of patent right due to non-payment of annual fee |