CN115322715A - Adhesive composition for high-voltage-resistance aluminum substrate and preparation method thereof - Google Patents
Adhesive composition for high-voltage-resistance aluminum substrate and preparation method thereof Download PDFInfo
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- CN115322715A CN115322715A CN202211045541.7A CN202211045541A CN115322715A CN 115322715 A CN115322715 A CN 115322715A CN 202211045541 A CN202211045541 A CN 202211045541A CN 115322715 A CN115322715 A CN 115322715A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention discloses an adhesive composition for a high-voltage-resistant aluminum substrate and a preparation method thereof; relates to the technical field of aluminum substrates; the problem of poor pressure resistance of an aluminum substrate in the prior art is solved; the adhesive composition comprises the following components in parts by weight: 30-50 parts of bisphenol A epoxy resin, 10-30 parts of phenolic resin, 5-15 parts of natural rubber, 3-10 parts of a silane coupling agent, 3-8 parts of a dicyandiamide curing agent, 30-50 parts of micron-sized silicon powder and 70-80 parts of an organic solvent, wherein the viscosity of the adhesive composition is 1-8min for coating a No. 4 cup; the adhesive composition can greatly improve the pressure resistance of the aluminum substrate.
Description
Technical Field
The invention belongs to the technical field of aluminum substrates, and particularly relates to an adhesive composition for a high-voltage aluminum substrate and a preparation method thereof.
Background
The aluminum substrate is a metal-based copper-clad plate with good heat dissipation function, and a single-sided board generally comprises a three-layer structure, namely a circuit layer (copper foil), an insulating layer and a metal base layer (aluminum plate). The high-end application is also designed to be a double-sided board, and the structure of the double-sided board is a circuit layer, an insulating layer, an aluminum base, an insulating layer and a circuit layer. Very few applications are multilayer boards, which can be formed by laminating a common multilayer board with an insulating layer and an aluminum base.
A heat conduction and insulation layer is required between the aluminum substrate and the circuit layer to realize insulation and adhesion between the metal substrate and the circuit layer. For example, patent application document CN 111040701A discloses a high-temperature-resistant and high-toughness epoxy resin adhesive, which is prepared from a component a and a component B, wherein the component a is prepared from bisphenol a epoxy resin, a flexibilizer hyperbranched polyester compound, an active diluent, a silane coupling agent, heat-resistant filler micron-sized alumina powder, a thixotropic agent and an antifoaming agent, and the component B is prepared from a polyamide curing agent, an alicyclic amine curing agent, a silane coupling agent, heat-resistant filler micron-sized alumina powder, a thixotropic agent and an antifoaming agent; the invention also discloses a preparation method of the high-temperature-resistant and high-toughness epoxy resin adhesive, which comprises the steps of respectively preparing the component A and the component B by heating and stirring, and then mixing.
The heat conducting insulating layer in the prior art is mainly prepared by filling single alumina heat conducting particles with an organic resin material, so that the whole aluminum substrate has low pressure resistance. Therefore, there is a need for further improvement of the aluminum substrate of the related art to improve the withstand voltage performance while maintaining good thermal conductivity.
Disclosure of Invention
Aiming at the technical problems in the prior art, the invention provides an adhesive composition for a high-voltage-resistance aluminum substrate and a preparation method thereof.
The technical scheme adopted by the invention is as follows:
an adhesive composition for a high-voltage-resistant aluminum substrate. The aluminum substrate comprises a metal base layer, a heat conduction insulating layer and a circuit layer, wherein the heat conduction insulating layer is obtained by drying an adhesive, and the adhesive composition comprises the following components in parts by weight:
the viscosity of the adhesive composition is 1-8min after coating a No. 4 cup.
By adopting the technical scheme, the bisphenol A type epoxy resin and the phenolic resin are compounded to serve as the organic resin matrix, and compared with single bisphenol A type epoxy resin, the obtained adhesive composition is beneficial to improving the pressure resistance of the aluminum substrate; in addition, the adhesive composition obtained by compounding the natural rubber and the organic resin material is beneficial to improving the pressure resistance of the aluminum substrate. According to the adhesive composition, micron-sized silicon powder is added into an organic resin matrix to serve as heat-conducting filler particles, so that the heat-conducting property of the whole system can be improved. According to the invention, the using amount of the organic solvent is increased, the viscosity of the adhesive composition is properly reduced, the thickness of a single-layer adhesive layer is controlled within the range of 90-110 mu m, and double-layer adhesive layers are superposed together to form the heat-conducting insulating layer after a hot-pressing process, so that the heat-conducting insulating layer is more uniform, and the pressure resistance of the aluminum substrate is ensured.
The bisphenol A type epoxy resin is a common adhesive organic resin material, but the consumption of the bisphenol A type epoxy resin is reduced, and only 30-50 parts of the bisphenol A type epoxy resin is adopted, so that the bisphenol A type epoxy resin is convenient to add and compound with the phenolic resin with proper content. However, the amount of the bisphenol A epoxy resin added cannot be less than 30 parts, otherwise the adhesiveness of the adhesive is affected. Further, the amount of the bisphenol A type epoxy resin added is preferably 35 to 45 parts, more preferably 40 parts.
Phenolic resin is a synthetic plastic, colorless or yellowish brown transparent solid, is also commonly called bakelite because of more electric equipment, and has the advantages of excellent heat conductivity, flame resistance, water resistance and insulating property, better acid resistance, poor alkali resistance and good mechanical and electrical properties. The invention discovers that the pressure resistance of the aluminum substrate can be enhanced by compounding the bisphenol A type epoxy resin with the phenolic resin as the organic resin matrix. If the content of the phenolic resin is less than 10 parts, the pressure resistance of the aluminum substrate is not obviously improved; if the content of the phenolic resin is more than 30 parts, the content of the bisphenol a type epoxy resin is reduced, which affects the adhesiveness of the adhesive. Therefore, in consideration of the comprehensive performance of the aluminum substrate, 10-30 parts of phenolic resin is selected and used in the invention. Further, the amount of the phenol resin added is preferably 15 to 25 parts, more preferably 20 parts.
The natural rubber is an elastic solid obtained by subjecting a natural latex collected from a Brazilian rubber tree to a processing step such as coagulation and drying. Natural rubber is a natural polymer compound containing polyisoprene as a main component, and contains rubber hydrocarbon (polyisoprene) in an amount of 90% or more and a small amount of protein, fatty acid, sugar, ash, and the like. Natural rubber is a nonpolar rubber, so the electrical insulation property is good. Since the addition of natural rubber to the adhesive of the present invention contributes to the increase in heat resistance of the aluminum substrate, the amount of natural rubber added in the present invention is 5 to 15 parts, and further, the amount of natural rubber added is preferably 8 to 12 parts, and more preferably 10 parts.
In the present invention, the type of the organic solvent is not particularly limited as long as a uniform adhesive slurry can be formed, and for example, DMF, ethyl acetate, acetone, or the like can be used. The amount of organic solvent added is critical to the present invention because of the viscosity of the adhesive and the thickness of the finally formed heat conductive and insulating layer. If the addition amount of the organic solvent is less than 70 parts, the viscosity of the adhesive is higher than that of a 4# cup for 8min, and the coating film may have uneven thickness and poor finish; if the addition amount of the organic solvent is more than 80 parts, the viscosity of the adhesive is lower than that of a 4# cup for 1min, an adhesive layer with the thickness of about 100 mu m cannot be formed on the circuit layer, and the pressure resistance is greatly reduced. Therefore, the amount of the organic solvent added in the present invention is 70 to 80 parts. The amount of the organic solvent added is 73 to 77 parts, and the amount of the organic solvent added is 75 parts.
Because a heat conduction insulating layer is required between the aluminum substrate and the circuit layer, the metal substrate and the circuit layer are insulated and bonded. The existing heat-conducting insulating layer is mainly prepared by filling heat-conducting particles with an organic resin material. However, at present, the heat-conducting particle filler generally adopts single alumina, but the heat transfer performance of the alumina is limited. According to the invention, micron-sized silicon powder is used for replacing aluminum oxide, so that the heat-conducting property of the aluminum substrate is greatly improved. Further, the particle size of the nano-sized silicon powder is preferably 3 to 7 μm, and more preferably 5 μm.
In addition, the invention also provides a preparation method of the adhesive composition for the high-voltage-resistance aluminum substrate. The preparation method comprises the following steps: weighing and uniformly mixing the components of the adhesive composition according to a ratio to obtain the adhesive composition.
In addition, the invention also provides a high-voltage-resistance aluminum substrate which comprises a metal base layer, a heat conduction insulating layer and a circuit layer, wherein the heat conduction insulating layer is obtained by drying the adhesive composition.
In addition, the invention also provides a preparation method of the high-pressure-resistant aluminum substrate. The preparation method comprises the following steps:
(1) Roll coating the adhesive composition on the surface of the circuit layer to form a first adhesive layer, and roll coating the adhesive composition on the surface of a release film to form a second adhesive layer;
(2) Covering the adhesive layer II on the surface of the adhesive layer I, removing the release film, and covering the metal base layer on the surface of the adhesive layer II to form a semi-finished product of the aluminum substrate;
(3) And thermally pressing the semi-finished product of the aluminum substrate to form the aluminum substrate.
In the technical scheme, the heat conduction insulating layer with the thickness of about 200 mu m is laminated and synthesized by double layers of adhesive with the thickness of about 100 mu m, and the obtained heat conduction insulating layer is more uniform and has better quality. If the viscosity of the adhesive composition is increased, and then a layer of adhesive layer with the thickness of about 200 microns is directly laminated to form a layer of heat conduction insulating layer with the thickness of about 200 microns, the heat conduction insulating layer is theoretically possible, but the technology is not mature in actual production, the quality of the obtained heat conduction insulating layer does not reach the standard, the punching and shearing resistance is easily deteriorated due to the excessive thickness, and the conditions of delamination and edge burst can be caused.
Furthermore, the requirement on the pressure resistance is higher, so that the thickness of the heat-conducting insulating layer is 180-220 μm, more preferably 200 μm, and the heat resistance of the aluminum substrate obtained by the invention can reach an excellent degree of 9-11.5 KV.
Compared with the prior art, the invention has the beneficial effects that:
(1) The adhesive composition adopts bisphenol A type epoxy resin and phenolic resin to be compounded as an organic resin matrix, and is favorable for improving the pressure resistance of the aluminum substrate compared with single bisphenol A type epoxy resin;
(2) The adhesive composition can improve the heat-conducting property of the whole system by adding the nano-scale silicon powder as heat-conducting filler particles into an organic resin matrix;
(3) The adhesive composition reasonably adjusts the dosage of the organic solvent, properly reduces the viscosity of the adhesive composition, controls the thickness of a single-layer adhesive layer within a range of 100 mu m, and then ensures that the heat-conducting insulating layer obtained by laminating double-layer adhesive layers has high comprehensive quality, thereby greatly improving the pressure resistance of the aluminum substrate.
Detailed Description
The following examples illustrate the present invention in more detail. The present invention is not limited to the following examples.
Example 1
An adhesive composition for a high-voltage-resistant aluminum substrate. The adhesive composition comprises the following components in parts by weight:
the viscosity of the adhesive composition is 5min after coating a No. 4 cup;
the bisphenol A epoxy resin is low-molecular solid bisphenol A epoxy resin, and the particle size of micron-sized silicon powder is 5 mu m.
A high-voltage-resistance aluminum substrate comprises a metal base layer, a heat conduction insulating layer and a circuit layer, wherein the heat conduction insulating layer is obtained by drying the adhesive composition. The preparation method comprises the following steps:
(1) Roll coating the adhesive composition on the surface of the circuit layer to form a first adhesive layer with the thickness of 100 microns, and roll coating the adhesive composition on the surface of a release film to form a second adhesive layer with the thickness of 100 microns;
(2) Covering an adhesive layer II on the surface of the adhesive layer I, removing a release film, and covering the metal base layer on the surface of the adhesive layer II to form a semi-finished product of the aluminum substrate;
(3) Hot-pressing the semi-finished product of the aluminum substrate to form the aluminum substrate; wherein the thickness of the heat conduction insulating layer is 200 μm.
Example 2
An adhesive composition for a high-voltage-resistant aluminum substrate. The adhesive composition comprises the following components in parts by weight:
the viscosity of the adhesive composition is 5min after coating a No. 4 cup;
the bisphenol A epoxy resin is low-molecular solid bisphenol A epoxy resin, and the particle size of micron-sized silicon powder is 5 mu m.
A high-voltage-resistance aluminum substrate comprises a metal base layer, a heat conduction insulating layer and a circuit layer, wherein the heat conduction insulating layer is obtained by drying the adhesive composition. The preparation method comprises the following steps:
(1) Roll coating the adhesive composition on the surface of the circuit layer to form a first adhesive layer with the thickness of 100 microns, and roll coating the adhesive composition on the surface of a release film to form a second adhesive layer with the thickness of 100 microns;
(2) Covering an adhesive layer II on the surface of the adhesive layer I, removing a release film, and covering the metal base layer on the surface of the adhesive layer II to form a semi-finished product of the aluminum substrate;
(3) Hot-pressing the semi-finished product of the aluminum substrate to form the aluminum substrate; wherein the thickness of the heat conduction insulating layer is 200 μm.
Example 3
An adhesive composition for a high withstand voltage aluminum substrate. The adhesive composition comprises the following components in parts by weight:
the viscosity of the adhesive composition is 5min after coating a No. 4 cup;
the bisphenol A epoxy resin is low-molecular solid bisphenol A epoxy resin, and the particle size of micron-sized silicon powder is 5 mu m.
A high-voltage-resistance aluminum substrate comprises a metal base layer, a heat conduction insulating layer and a circuit layer, wherein the heat conduction insulating layer is obtained by drying the adhesive composition. The preparation method comprises the following steps:
(1) Roll coating the adhesive composition on the surface of the circuit layer to form a first adhesive layer with the thickness of 100 microns, and roll coating the adhesive composition on the surface of a release film to form a second adhesive layer with the thickness of 100 microns;
(2) Covering an adhesive layer II on the surface of the adhesive layer I, removing a release film, and covering the metal base layer on the surface of the adhesive layer II to form a semi-finished product of the aluminum substrate;
(3) Hot-pressing the semi-finished product of the aluminum substrate to form the aluminum substrate; wherein the thickness of the heat conduction insulating layer is 200 μm.
Comparative example 1
An adhesive composition for a high-voltage-resistant aluminum substrate. The adhesive composition comprises the following components in parts by weight:
the viscosity of the adhesive composition is 5min after coating a No. 4 cup;
the bisphenol A epoxy resin is low molecular solid bisphenol A epoxy resin, and the particle size of the micron-sized silicon powder is 5 μm.
A high-voltage-resistance aluminum substrate comprises a metal base layer, a heat conduction insulating layer and a circuit layer, wherein the heat conduction insulating layer is obtained by drying the adhesive composition. The preparation method comprises the following steps:
(1) Roll coating the adhesive composition on the surface of the circuit layer to form a first adhesive layer with the thickness of 100 microns, and roll coating the adhesive composition on the surface of a release film to form a second adhesive layer with the thickness of 100 microns;
(2) Covering an adhesive layer II on the surface of the adhesive layer I, removing a release film, and covering the metal base layer on the surface of the adhesive layer II to form a semi-finished product of the aluminum substrate;
(3) Hot-pressing the semi-finished product of the aluminum substrate to form the aluminum substrate; wherein the thickness of the heat conduction insulating layer is 200 μm.
Comparative example 2
An adhesive composition for a high-voltage-resistant aluminum substrate. The adhesive composition comprises the following components in parts by weight:
the viscosity of the adhesive composition is 5min after coating a No. 4 cup;
the bisphenol A epoxy resin is low-molecular solid bisphenol A epoxy resin, and the particle size of micron-sized silicon powder is 5 mu m.
A high-voltage-resistance aluminum substrate comprises a metal base layer, a heat conduction insulating layer and a circuit layer, wherein the heat conduction insulating layer is obtained by drying the adhesive composition. The preparation method comprises the following steps:
(1) Roll coating the adhesive composition on the surface of the circuit layer to form a first adhesive layer with the thickness of 100 microns, and roll coating the adhesive composition on the surface of a release film to form a second adhesive layer with the thickness of 100 microns;
(2) Covering an adhesive layer II on the surface of the adhesive layer I, removing a release film, and covering the metal base layer on the surface of the adhesive layer II to form a semi-finished product of the aluminum substrate;
(3) Hot-pressing the semi-finished product of the aluminum substrate to form the aluminum substrate; wherein the thickness of the heat conduction insulating layer is 200 μm.
The data of the withstand voltage test of examples 1 to 3 and comparative examples 1 to 2 above are shown in table 1.
TABLE 1 pressure resistance of examples 1-3 and comparative examples 1-2
| Breakdown voltage (KV) | |
| Example 1 | 11.5 |
| Example 2 | 9 |
| Example 3 | 10 |
| Comparative example 1 | 5 |
| Comparative example 2 | 6 |
As can be seen from Table 1, the pressure resistance of examples 2 to 3 was lower than that of example 1. The lower content of the phenolic resin in the adhesive composition of example 2 than that of example 1 resulted in a decrease in the breakdown voltage of the aluminum substrate of example 2. The adhesive composition of example 3 had a lower natural rubber content than that of example 1, resulting in a lower breakdown voltage of the aluminum substrate of example 2.
The adhesive composition of the comparative example 1 completely adopts bisphenol A type epoxy resin and does not contain phenolic resin, so that the breakdown voltage of the aluminum substrate of the comparative example 1 is obviously reduced, and the compounding of the bisphenol A type epoxy resin and the phenolic resin is proved to greatly improve the pressure resistance of the aluminum substrate.
The adhesive composition of the comparative example 2 does not adopt natural rubber, so that the breakdown voltage of the aluminum substrate of the comparative example 1 is obviously reduced, and the fact that the pressure resistance of the aluminum substrate can be greatly improved by compounding the natural rubber and the organic resin material is proved.
Claims (10)
1. The adhesive composition for the high-voltage-resistant aluminum substrate is characterized by comprising the following components in parts by weight:
the viscosity of the adhesive composition is 1-8min after coating a No. 4 cup.
2. The adhesive composition for the high-voltage aluminum substrate as claimed in claim 1, wherein the adhesive composition comprises the following components in parts by weight:
the viscosity of the adhesive composition is 3-6min after coating a No. 4 cup.
3. The adhesive composition for the high withstand voltage aluminum substrate as recited in claim 2, wherein the adhesive composition comprises the following components in parts by weight:
the viscosity of the adhesive composition was 5min for coating a 4# cup.
4. The adhesive composition for a high withstand voltage aluminum substrate according to claim 1, wherein the bisphenol A epoxy resin is a low molecular solid bisphenol A epoxy resin.
5. The adhesive composition for the high withstand voltage aluminum substrate as recited in claim 1, wherein the nano-scale silicon powder has a particle size of 3-7 μm.
6. The adhesive composition for the high withstand voltage aluminum substrate as recited in claim 5, wherein the nano-scale silicon powder has a particle size of 5 μm.
7. The method for preparing the adhesive composition for the high withstand voltage aluminum substrate according to any one of claims 1 to 6, comprising the steps of: weighing and uniformly mixing the components of the adhesive composition according to a ratio to obtain the adhesive composition.
8. A high withstand voltage aluminum substrate comprising a metal base layer, a heat conductive insulating layer and a circuit layer, wherein the heat conductive insulating layer is obtained by drying the adhesive composition according to any one of claims 1 to 6.
9. The method for preparing a high withstand voltage aluminum substrate according to claim 8, comprising the steps of:
(1) Roll coating the adhesive composition on the surface of the circuit layer to form a first adhesive layer, and roll coating the adhesive composition on the surface of a release film to form a second adhesive layer;
(2) Covering an adhesive layer II on the surface of the adhesive layer I, removing a release film, and covering the metal base layer on the surface of the adhesive layer II to form a semi-finished product of the aluminum substrate;
(3) And thermally pressing the semi-finished product of the aluminum substrate to form the aluminum substrate.
10. The method as claimed in claim 9, wherein the thickness of the thermal conductive and insulating layer is 180-220 μm.
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| CN202211045541.7A CN115322715B (en) | 2022-08-29 | 2022-08-29 | Adhesive composition for high-pressure-resistant aluminum substrate and preparation method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013143440A (en) * | 2012-01-10 | 2013-07-22 | Sekisui Chem Co Ltd | Metal base substrate |
| CN108192291A (en) * | 2017-12-29 | 2018-06-22 | 纽宝力精化(广州)有限公司 | High-fire resistance aluminum substrate composition epoxy resin and preparation method and application |
| CN109575858A (en) * | 2018-10-30 | 2019-04-05 | 广东翔思新材料有限公司 | A kind of aluminum substrate bonding agent and the aluminum substrate using the bonding agent |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013143440A (en) * | 2012-01-10 | 2013-07-22 | Sekisui Chem Co Ltd | Metal base substrate |
| CN108192291A (en) * | 2017-12-29 | 2018-06-22 | 纽宝力精化(广州)有限公司 | High-fire resistance aluminum substrate composition epoxy resin and preparation method and application |
| CN109575858A (en) * | 2018-10-30 | 2019-04-05 | 广东翔思新材料有限公司 | A kind of aluminum substrate bonding agent and the aluminum substrate using the bonding agent |
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