CN113715422A - High-wear-resistance epoxy glass fiber cloth laminated board and preparation method thereof - Google Patents
High-wear-resistance epoxy glass fiber cloth laminated board and preparation method thereof Download PDFInfo
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- CN113715422A CN113715422A CN202010446796.9A CN202010446796A CN113715422A CN 113715422 A CN113715422 A CN 113715422A CN 202010446796 A CN202010446796 A CN 202010446796A CN 113715422 A CN113715422 A CN 113715422A
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- 239000004744 fabric Substances 0.000 title claims abstract description 42
- 239000003365 glass fiber Substances 0.000 title claims abstract description 39
- 239000004593 Epoxy Substances 0.000 title claims abstract description 32
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000003822 epoxy resin Substances 0.000 claims abstract description 28
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 28
- 239000003292 glue Substances 0.000 claims abstract description 19
- 239000000945 filler Substances 0.000 claims abstract description 15
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 7
- 239000000049 pigment Substances 0.000 claims abstract description 7
- 238000010030 laminating Methods 0.000 claims abstract description 5
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 14
- 238000003756 stirring Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- 239000002904 solvent Substances 0.000 claims description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 8
- 229910001220 stainless steel Inorganic materials 0.000 claims description 8
- 239000010935 stainless steel Substances 0.000 claims description 8
- 239000012046 mixed solvent Substances 0.000 claims description 6
- 238000004321 preservation Methods 0.000 claims description 6
- 239000011152 fibreglass Substances 0.000 claims description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 238000005299 abrasion Methods 0.000 claims description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 4
- 239000002270 dispersing agent Substances 0.000 claims description 4
- 238000007731 hot pressing Methods 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 claims description 4
- 239000012747 synergistic agent Substances 0.000 claims description 4
- FWLHAQYOFMQTHQ-UHFFFAOYSA-N 2-N-[8-[[8-(4-aminoanilino)-10-phenylphenazin-10-ium-2-yl]amino]-10-phenylphenazin-10-ium-2-yl]-8-N,10-diphenylphenazin-10-ium-2,8-diamine hydroxy-oxido-dioxochromium Chemical compound O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.Nc1ccc(Nc2ccc3nc4ccc(Nc5ccc6nc7ccc(Nc8ccc9nc%10ccc(Nc%11ccccc%11)cc%10[n+](-c%10ccccc%10)c9c8)cc7[n+](-c7ccccc7)c6c5)cc4[n+](-c4ccccc4)c3c2)cc1 FWLHAQYOFMQTHQ-UHFFFAOYSA-N 0.000 claims description 2
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 claims description 2
- YGOFNNAZFZYNIX-UHFFFAOYSA-N 3-N-phenylbenzene-1,2,3-triamine Chemical compound NC=1C(=C(C=CC1)NC1=CC=CC=C1)N YGOFNNAZFZYNIX-UHFFFAOYSA-N 0.000 claims description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims description 2
- GNCJRTJOPHONBZ-UHFFFAOYSA-N 4,4,5,5-tetramethyl-1h-imidazole Chemical compound CC1(C)NC=NC1(C)C GNCJRTJOPHONBZ-UHFFFAOYSA-N 0.000 claims description 2
- YSWBFLWKAIRHEI-UHFFFAOYSA-N 4,5-dimethyl-1h-imidazole Chemical compound CC=1N=CNC=1C YSWBFLWKAIRHEI-UHFFFAOYSA-N 0.000 claims description 2
- CPHGOBGXZQKCKI-UHFFFAOYSA-N 4,5-diphenyl-1h-imidazole Chemical compound N1C=NC(C=2C=CC=CC=2)=C1C1=CC=CC=C1 CPHGOBGXZQKCKI-UHFFFAOYSA-N 0.000 claims description 2
- 244000248349 Citrus limon Species 0.000 claims description 2
- 235000005979 Citrus limon Nutrition 0.000 claims description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 150000008065 acid anhydrides Chemical class 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- MOUPNEIJQCETIW-UHFFFAOYSA-N lead chromate Chemical compound [Pb+2].[O-][Cr]([O-])(=O)=O MOUPNEIJQCETIW-UHFFFAOYSA-N 0.000 claims description 2
- 239000000395 magnesium oxide Substances 0.000 claims description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- -1 phenolic aldehyde Chemical class 0.000 claims description 2
- 229910052698 phosphorus Inorganic materials 0.000 claims description 2
- 239000011574 phosphorus Substances 0.000 claims description 2
- 229920000767 polyaniline Polymers 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 15
- 229920005989 resin Polymers 0.000 abstract description 9
- 239000011347 resin Substances 0.000 abstract description 9
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 14
- 238000012360 testing method Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
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- 238000000227 grinding Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
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- 238000012545 processing Methods 0.000 description 2
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- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Images
Classifications
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- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/067—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of fibres or filaments
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- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- C—CHEMISTRY; METALLURGY
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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Abstract
The invention discloses a high-wear-resistance epoxy glass fiber cloth laminated board and a preparation method thereof, wherein the high-wear-resistance epoxy glass fiber cloth laminated board is prepared by coating mixed glue solution on glass fiber cloth and then laminating and thermally curing, wherein the mixed glue solution comprises the following components in parts by mass: 70-80 parts by mass of high-functional group epoxy resin; 20-30 parts by mass of toughened epoxy resin; 2.7-2.9 parts by mass of a curing agent; 0.14-0.16 parts by mass of an accelerator; 40-60 parts by mass of wear-resistant filler; 0.04-0.06 parts by mass of a dispersing and synergist; and the pigment is trace. According to the invention, the high-functional group resin and the toughening resin are used for improving the hardness and toughness of the system, and the high-wear-resistant filler is used for comprehensively improving the wear resistance of the base material, so that the epoxy glass fiber cloth laminated board material can be modified, the wear resistance of the material can be remarkably improved, the wear rate of the prepared laminated board material is reduced by 50-80%, the mechanical wear resistance of the material is effectively improved, and the service life of the material is effectively prolonged.
Description
[ technical field ] A method for producing a semiconductor device
The invention belongs to the technical field of thermosetting and thermoplastic reinforced materials, and particularly relates to a high-wear-resistance epoxy glass fiber cloth laminated board and a preparation method thereof
[ background of the invention ]
Epoxy resin is a common material in not only daily life but also national defense science and technology at present due to the advantages of light weight, high strength, good corrosion resistance, good electrical insulation performance, easy processing and forming, wide source of production raw materials, high cost performance and the like. The epoxy glass fiber cloth laminated board is used as an epoxy resin material modified and reinforced by glass fiber, and is widely applied due to better mechanical property, insulating property and good processing type. At present, the epoxy glass fiber cloth laminated board is mainly applied to the fields of electronic products, vehicles, buildings and the like.
However, since the pure epoxy fiberglass cloth laminated board does not have high hardness, toughness, higher mechanical properties, impact resistance, wear resistance and the like, researchers have developed various modified epoxy fiberglass cloth laminated board materials, and the existing modified additives mainly include: high cross-linking density resin, high hardness filler, high toughness resin, high wear-resistant filler, etc.
Because the hardness, toughness and wear resistance of the existing epoxy glass fiber cloth laminated board are not high, the invention develops the laminated board which utilizes high functional group resin and high toughening resin to increase the crosslinking density and toughness of a resin system, and simultaneously adds superfine high wear-resistant filler to improve the wear resistance of the epoxy glass fiber cloth laminated board so as to improve the hardness, toughness and wear resistance of the original material and the preparation method thereof.
[ summary of the invention ]
The invention aims to provide a high-wear-resistance epoxy glass fiber cloth laminated board and a preparation method thereof. The invention has the advantages of high hardness, good toughness, excellent wear resistance, simple preparation method and the like.
In order to achieve the purpose, the invention provides the following technical scheme:
the application discloses high wear-resisting epoxy glass fiber cloth laminated board is prepared by coating mixed glue solution on glass fiber cloth and then laminating and thermally curing, wherein the mixed glue solution comprises the following components in parts by mass: 70-80 parts by mass of high-energy-group epoxy resin; 20-30 parts by mass of toughened epoxy resin; 40-60 parts by mass of high-wear-resistant filler; 2.7-2.9 parts by mass of a curing agent; 0.14-0.16 parts by mass of an accelerator; 0.04-0.06 parts by mass of a dispersing and synergist; trace pigment; 30-40 parts by mass of a solvent.
Preferably, the specification model of the glass fiber cloth is 1080, 2116, 7628 or 1506.
Preferably, the high-energy-group epoxy resin and the toughening epoxy resin are selected from one or more of bisphenol A type epoxy resin, bisphenol F type phenolic resin, bisphenol S type phenolic resin, brominated epoxy resin, phosphorus-containing epoxy resin and thermoplastic resin.
Preferably, the curing agent is selected from one or more of dicyandiamide, acid anhydride, phenolic aldehyde, diaminodiphenyl sulfone and diaminodiphenylamine; the accelerant is one or more selected from dimethyl imidazole, tetramethyl imidazole, diphenyl imidazole and undecyl imidazole; the high wear-resistant filler is selected from one or more of magnesium oxide, aluminum oxide and silicon dioxide; the dispersing and synergistic agent is selected from one or more of KH560, KH550 and other silane coupling agents; the pigment is selected from one or more of titanium green, lemon yellow, medium chrome yellow, titanium dioxide and aniline black; the solvent is selected from one or more of DMF, acetone, ethanol and styrene.
The application also discloses a preparation method of the high-wear-resistance epoxy glass fiber cloth laminated board, which comprises the following steps:
a. dissolving a curing agent, an accelerator and a pigment in a solvent to obtain a mixed solvent;
b. adding high-functional group epoxy resin, toughening epoxy resin and a dispersing and synergistic agent into the mixed solvent, uniformly stirring and mixing, adding high-wear-resistant filler, stirring and curing to obtain mixed glue solution;
c. uniformly coating a certain amount of the mixed glue solution on glass fiber cloth, and drying to prepare a prepreg;
d. and (3) taking the prepregs for overlapping and carrying out hot-pressing treatment to obtain the high-wear-resistance epoxy glass fiber cloth laminated board.
Preferably, the main solvent in step a is N, N-dimethylformamide, and the auxiliary component is ethanol.
Preferably, the stirring speed in the step b is 80-120 r/min.
Preferably, the number of the laminating layers of the prepregs in the step d is 4-20, and the hot-pressing treatment specifically comprises the following steps: and (2) placing the overlapped prepreg between two stainless steel plates, pressing at 130-185 ℃, wherein the unit area pressure of pressing is 0.05-6 MPa, and keeping the temperature at 180-190 ℃ after pressing for 60-90 min, wherein the unit area pressure in the heat preservation stage is 4-6 MPa.
Preferably, the overlapped prepreg is placed between two stainless steel plates, and the surface of the prepreg, which is in contact with the stainless steel plates, is covered with a release film.
The invention has the beneficial effects that: compared with the prior art, the high-functional epoxy resin and the toughened epoxy resin are compounded, so that the hardness and toughness of the epoxy glass fiber cloth laminated board material are obviously improved, and the wear rate of the material is reduced by 50-80% compared with that of a conventional board by adding the high-wear-resistant filler, so that the wear resistance of the material is effectively improved.
The features and advantages of the present invention will be described in detail by embodiments in conjunction with the accompanying drawings.
[ description of the drawings ]
FIG. 1 is a flow chart of the preparation of the mixed glue solution of the present invention;
FIG. 2 is a flow chart of the preparation of the high wear-resistant epoxy glass fiber cloth laminated board of the invention
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and examples. It should be understood, however, that the description herein of specific embodiments is only intended to illustrate the invention and not to limit the scope of the invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
Example (b):
referring to fig. 1 and 2, 2.8 parts by mass of curing agent (DICY) and 0.15 parts by mass of accelerator (2-MI) are dissolved in 40 parts by mass of DMF solvent;
adding 704 parts by mass of epoxy resin and 20 parts by mass of vinyl epoxy resin into the prepared mixed solvent of the curing agent and the accelerator;
stirring the mixed solution at the rotating speed of 1500r/min for 4h at normal temperature to prepare mixed glue solution;
adding 50 parts by mass of high-wear-resistance filler into the glue solution, stirring at the rotating speed of 1000r/min for 4 hours at normal temperature, and curing for 8 hours for later use;
uniformly coating the mixed glue solution on 7628 glass fiber cloth with the size of 300 × 300mm, and controlling the resin content to be 44% -48%;
placing the prepared glass fiber cloth coated with the uniformly mixed glue solution in a forced air oven at the temperature of 171 ℃ for baking for 5min, and taking out to prepare a prepreg;
and (3) overlapping 4 prepregs, putting a PET release film on the upper surface and the lower surface, adding a stainless steel plate on the release film, putting the prepreg and the PET release film into a vacuum test press, pressing at the temperature of 130-185 ℃, and then preserving heat at the temperature of 170 ℃ for 60 minutes at the heat preservation stage, wherein the unit area pressure is 4.5Mpa at the heat preservation stage to obtain the final high-wear-resistance epoxy glass fiber cloth laminated board.
Comparative example:
dissolving 2.8 parts by mass of curing agent (DICY) and 0.15 part by mass of accelerator (2-MI) in 40 parts by mass of DMF solvent;
adding 100 parts by mass of 901 epoxy resin into the mixed solvent of the curing agent and the accelerator;
stirring the mixed solution at the normal temperature for 4 hours under the stirring condition with the rotating speed of 1500r/min to prepare mixed glue solution;
adding 50 parts by mass of conventional fillers into the glue solution, stirring at the rotating speed of 1000r/min for 4 hours at normal temperature, and curing for 8 hours for later use;
uniformly coating the mixed glue solution on 7628 glass fiber cloth with the size of 300 × 300mm, and controlling the resin content to be 44% -48%;
placing the prepared glass fiber cloth coated with the uniformly mixed glue solution in a forced air oven at the temperature of 171 ℃ for baking for 5min, and taking out to prepare a prepreg;
and (3) overlapping 4 prepregs, putting a PET release film on the upper surface and the lower surface, adding a stainless steel plate on the release film, putting the prepreg and the PET release film into a vacuum test press, pressing at the temperature of 130-185 ℃, and then preserving heat at the temperature of 170 ℃ for 60 minutes at the heat preservation stage, wherein the unit area pressure is 4.5Mpa at the heat preservation stage to obtain the final conventional epoxy glass fiber cloth laminated board.
And (3) testing the wear resistance:
the abrasion resistance tests of the epoxy glass fiber cloth laminated plates obtained in the above examples and comparative examples show that the grinding thickness of the comparative example plate is 300-360 μm and the grinding thickness of the example plate is 75-150 μm under the same test conditions.
According to the wear-resistant performance test results of the examples and the comparative examples, the epoxy glass fiber laminated board is modified by using the high-functional-group epoxy resin and the high-wear-resistant filler, so that the wear rate of the material can be obviously reduced, and the wear-resistant performance of the laminated board can be well improved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents or improvements made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (9)
1. A high wear-resistant epoxy glass fiber cloth laminated board is prepared by coating glass fiber cloth with mixed glue solution and then laminating and thermally curing, and is characterized in that: the mixed glue solution comprises the following components in parts by mass: 70-80 parts by mass of high-energy-group epoxy resin; 20-30 parts by mass of toughened epoxy resin; 40-60 parts by mass of high-wear-resistant filler; 2.7-2.9 parts by mass of a curing agent; 0.14-0.16 parts by mass of an accelerator; 0.04-0.06 parts by mass of a dispersing and synergist; trace pigment; 30-40 parts by mass of a solvent.
2. The high abrasion resistant epoxy fiberglass cloth laminate of claim 1, wherein: the specification and model of the glass fiber cloth is 1080, 2116, 7628 or 1506.
3. The high abrasion resistant epoxy fiberglass cloth laminate of claim 1, wherein: the high-energy-group epoxy resin and the toughening epoxy resin are selected from one or more of bisphenol A type epoxy resin, bisphenol F type phenolic resin, bisphenol S type phenolic resin, brominated epoxy resin, phosphorus-containing epoxy resin and thermoplastic resin.
4. The high abrasion resistant epoxy fiberglass cloth laminate of claim 1, wherein: the curing agent is selected from one or more of dicyandiamide, acid anhydride, phenolic aldehyde, diaminodiphenyl sulfone and diaminodiphenylamine; the accelerant is one or more selected from dimethyl imidazole, tetramethyl imidazole, diphenyl imidazole and undecyl imidazole; the high wear-resistant filler is selected from one or more of magnesium oxide, aluminum oxide and silicon dioxide; the dispersing and synergistic agent is selected from one or more of KH560, KH550 and other silane coupling agents; the pigment is selected from one or more of titanium green, lemon yellow, medium chrome yellow, titanium dioxide and aniline black; the solvent is selected from one or more of DMF, acetone, ethanol and styrene.
5. A preparation method of a high-wear-resistance epoxy glass fiber cloth laminated board is characterized by comprising the following steps: the method comprises the following steps:
a. dissolving a curing agent, an accelerator and a pigment in a solvent to obtain a mixed solvent;
b. adding high-functional group epoxy resin, toughening epoxy resin and a dispersing and synergistic agent into the mixed solvent, uniformly stirring and mixing, adding high-wear-resistant filler, stirring and curing to obtain mixed glue solution;
c. uniformly coating a certain amount of the mixed glue solution on glass fiber cloth, and drying to prepare a prepreg;
d. and (3) taking the prepregs for overlapping and carrying out hot-pressing treatment to obtain the high-wear-resistance epoxy glass fiber cloth laminated board.
6. The method for preparing the high-abrasion-resistance epoxy glass fiber cloth laminated board according to claim 5, wherein the method comprises the following steps: in the step a, the main solvent is N, N-dimethylformamide, and the auxiliary component is ethanol.
7. The method for preparing the high-abrasion-resistance epoxy glass fiber cloth laminated board according to claim 5, wherein the method comprises the following steps: and the stirring speed in the step b is 80-120 r/min.
8. The method for preparing the high-abrasion-resistance epoxy glass fiber cloth laminated board according to claim 5, wherein the method comprises the following steps: the number of the laminating layers of the prepregs in the step d is 4-20, and the hot-pressing treatment specifically comprises the following steps: and (2) placing the overlapped prepreg between two stainless steel plates, pressing at 130-185 ℃, wherein the unit area pressure of pressing is 0.05-6 MPa, and keeping the temperature at 180-190 ℃ after pressing for 60-90 min, wherein the unit area pressure in the heat preservation stage is 4-6 MPa.
9. The method for preparing the high-abrasion-resistance epoxy glass fiber cloth laminated board according to claim 5, wherein the method comprises the following steps: and placing the overlapped prepreg between two stainless steel plates, wherein the contact surface of the prepreg and the stainless steel plates is covered with a layer of release film.
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