CN115403805B - High-strength computer rear cover with middle frame and processing technology thereof - Google Patents

High-strength computer rear cover with middle frame and processing technology thereof Download PDF

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Publication number
CN115403805B
CN115403805B CN202210965238.2A CN202210965238A CN115403805B CN 115403805 B CN115403805 B CN 115403805B CN 202210965238 A CN202210965238 A CN 202210965238A CN 115403805 B CN115403805 B CN 115403805B
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middle frame
epoxy resin
rear cover
steps
glass fiber
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CN115403805A (en
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何辉春
陈建
卢淼
余凡
蔡春华
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Guangdong Zongsheng New Materials Co ltd
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Huizhou Zongsheng Electronic Material Co ltd
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    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/248—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using pre-treated fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/74—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area
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    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
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    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
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    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
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    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
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    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
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    • B32B2255/00—Coating on the layer surface
    • B32B2255/02—Coating on the layer surface on fibrous or filamentary layer
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B32B2255/26—Polymeric coating
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    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/28—Multiple coating on one surface
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    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
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    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
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    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
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Abstract

The invention discloses a high-strength computer rear cover with a middle frame and a processing technology thereof, wherein an epoxy glass fiber plate is cut to obtain a middle frame plate and a cover plate; milling a mounting cavity from the middle frame plate to form a middle frame; and welding the middle frame and the cover plate to obtain the high-strength computer rear cover. The preparation process of the epoxy glass fiber board comprises the following steps: step 1: uniformly mixing vinyl epoxy resin mercapto filler and solvent according to parts by weight; adding epoxy resin, uniformly mixing, adding a photoinitiator, a curing agent and a curing accelerator, and homogenizing to obtain a dipping solution; step 2: cleaning the glass fiber cloth, coating silica sol on two surfaces, and drying to obtain glass fiber cloth A; coating the dipping solution on both sides, photo-curing and thermosetting to obtain a prepreg; step 3: and stacking and hot-pressing the N prepregs to obtain the epoxy glass fiber board. In the scheme, the strength and the toughness are balanced by utilizing the light-click reaction between the vinyl epoxy resin and the sulfhydryl filler, and the heat dissipation performance is effectively improved.

Description

High-strength computer rear cover with middle frame and processing technology thereof
Technical Field
The invention relates to the technical field of computers, in particular to a high-strength computer rear cover with a middle frame and a processing technology thereof.
Background
The development of the information society promotes the technical innovation of electronic products and accelerates the development of the electronic manufacturing industry; the computer is one of electronic products which cannot be separated in modern life and work. Wherein, the computer back cover is one of the main components for protecting the computer body, and the development of the computer back cover gradually tends to be light; therefore, more research has been conducted on plastic computer rear covers than on alloy series computer rear covers.
In the prior art, the computer shell is generally prepared from materials such as polycarbonate and the like, and has portability, but because part of polymers have poor elastic modulus and higher brittleness, the computer shell cannot bear more severe impact and vibration, and the application under certain conditions is limited. On the other hand, glass fiber board, that is, glass fiber board, is an artificial fiber board having good heat resistance, mechanical properties, dielectric processability, and has been increasingly used in mobile phone products. Compared with the rear cover of the mobile phone, the battery with larger volume inside the computer has higher weight and more heat inside, so the glass fiber board applied to the rear cover of the computer needs to have better heat dissipation and impact resistance. However, in order to produce excellent heat dissipation performance, a high content of inorganic filler is generally filled, and the addition of inorganic filler increases the strength of a computer, but has rigidity, and has problems of dispersibility and compatibility, which results in a decrease in toughness and a decrease in impact resistance. Therefore, on the basis of heat dissipation and strength, the balance of toughness and the improvement of impact resistance are of great significance.
In summary, solving the above problems, the preparation of a high-strength computer rear cover with a middle frame has important significance.
Disclosure of Invention
The invention aims to provide a high-strength computer rear cover with a middle frame and a processing technology thereof, so as to solve the problems in the background technology.
In order to solve the technical problems, the invention provides the following technical scheme: a high-strength computer rear cover with a middle frame and a processing technology thereof are characterized in that: comprising the following steps:
a processing technology of a high-strength computer rear cover with a middle frame comprises the steps of cutting an epoxy glass fiber plate to obtain a middle frame plate and a cover plate; milling a mounting cavity from the middle frame plate to form a middle frame; and welding the middle frame and the cover plate to obtain the high-strength computer rear cover.
More optimally, the preparation of the epoxy glass fiber board comprises the following steps:
step 1: uniformly mixing 10-12 parts by weight of vinyl epoxy resin, 18-22 parts by weight of sulfhydryl filler and 50-60 parts by weight of solvent; adding 100 parts of epoxy resin, uniformly mixing, adding 0.5-0.8 part of photoinitiator, 25-30 parts of curing agent and 0.1-0.5 part of curing accelerator, and homogenizing to obtain a dipping solution;
step 2: cleaning the glass fiber cloth, coating silica sol on two surfaces, and drying to obtain glass fiber cloth A; coating the dipping solution on both sides, photo-curing and thermosetting to obtain a prepreg;
step 3: and stacking and hot-pressing the N prepregs to obtain the epoxy glass fiber board.
More preferably, in step 2, the photo-curing conditions are: the preset magnetic field is 0.2-0.5T; under 365nm ultraviolet light, the radiation intensity is 80-100 mW/cm 2 Photo-curing for 8-10 minutes; heat curing conditions: curing for 1-2 hours at 120-150 ℃.
Preferably, in step 2, the silica sol is coatedThe amount is 20-40 g/m2; the coating amount of the dipping solution is 150-250 g/m 2 The method comprises the steps of carrying out a first treatment on the surface of the In step 3, hot pressing conditions: the pressure is 25 to 45kgf/cm 2 The temperature is 145-155 ℃ and the time is 4-6 minutes.
More optimally, the preparation method of the vinyl epoxy resin comprises the following steps: s1: sequentially adding tannic acid and epoxy bromopropane into a reaction kettle, adding tetrabutylammonium bromide, and reacting for 30-40 minutes at the temperature of 50-60 ℃; cooling to room temperature, adding potassium hydroxide solution, continuing to react for 2-4 hours, washing and drying to obtain low-viscosity epoxy resin; s2: dispersing the low-viscosity epoxy resin in a solvent, adding phosphoric acid, uniformly mixing, setting the temperature to be 80-90 ℃, adding a mixed solution of glycidyl methacrylate and a polymerization inhibitor, reacting for 6-8 hours, washing and drying to obtain the vinyl epoxy resin.
More optimally, the mass ratio of tannic acid, epoxybromopropane, tetrabutylammonium bromide and potassium hydroxide in potassium hydroxide solution is 1 (7-10): 0.1:0.3; the mass ratio of the low-viscosity epoxy resin to the phosphoric acid to the glycidyl methacrylate is 1:
(0.08～0.12):(0.25～0.35)。
more optimally, the preparation method of the sulfhydryl filler comprises the following steps: s1: dispersing graphene oxide in ethylene glycol, sequentially adding ferric chloride, anhydrous sodium acetate, polyvinylpyrrolidone and boron nitride, and uniformly stirring; transferring the obtained solution into a high-pressure reaction kettle, setting the temperature to be 180 ℃, and carrying out solvothermal reaction for 8 hours; washing and drying to obtain composite filler; s2: dispersing 3-mercaptopropyl trimethoxy silane in an organic solvent-water solvent, and regulating pH to be 5.6-6.0 by using acetic acid to hydrolyze to obtain silane hydrolysate; adding the composite filler, dispersing uniformly, and drying to obtain the sulfhydryl filler.
More optimally, the mass ratio of the graphene oxide to the ferric chloride to the boron nitride is 1 (8-9) (0.5-0.6); the mass ratio of the composite filler to the 3-mercaptopropyl trimethoxy silane is 1 (1.5-2).
More optimally, the preparation method of the silica sol comprises the following steps: according to the mol ratio of 1 (1-2), 40 (20-30), weighing tetraethyl silicate, 3- (2, 3-epoxypropoxy) propyl trimethoxy silane, ethanol and deionized water, uniformly mixing, dropwise adding acetic acid to adjust pH=2-3, and uniformly stirring to obtain silica sol.
More optimally, the high-strength computer rear cover with the middle frame is prepared by the processing technology of the high-strength computer rear cover.
In the technical scheme, the strength and toughness are balanced by utilizing the light-click reaction between vinyl epoxy resin and mercapto filling material, so that the impact resistance of the epoxy glass fiber plate is improved; the fillers are orderly arranged by utilizing the reaction, so that the heat conductivity is effectively improved and the heat dissipation performance is improved on the basis of relatively less fillers; meanwhile, a dual curing process of photo-curing and thermal curing is formed, curing stress is reduced, and impact resistance is enhanced.
(1) The vinyl epoxy resin is a low viscosity epoxy resin (25 ℃ C., viscosity 500-600 mPa) prepared based on tannic acid and epibromohydrin . S), then, utilizing hydroxyl groups in phosphoric acid (three hydroxyl groups are contained in single-molecule phosphoric acid) and epoxy groups (epoxy groups are contained in low-viscosity epoxy resin); glycidyl methacrylate contains epoxy groups and double bonds), branching grafting is carried out on low-viscosity epoxy resin, double bonds are introduced, and grafting reaction can be carried out with mercapto fillers.
Wherein, due to the low viscosity of the low viscosity epoxy resin, the epoxy resin is simultaneously mixed with the main epoxy resin (bisphenol A type epoxy resin, nanya 128, 25 ℃ C., viscosity 10000-15000 mPa . S) has similar compatibility; therefore, the dispersibility is good; meanwhile, the low-viscosity epoxy resin is of a branched structure, can be effectively toughened, and is optimized and complemented with the filler, so that the strength and toughness are balanced, and the shock resistance is improved. It should be noted that: 1. the preparation temperature of the low-viscosity epoxy resin is not too high, which increases the viscosity and is unfavorable for the dispersibility. 2. The amount of phosphoric acid and glycidyl methacrylate needs to be optimized, which affects the double bonds and the epoxy groups in the vinyl epoxy resin, which has an effect on the properties.
(2) The sulfhydryl filler is prepared by graphene oxide, ferric chloride and boron nitride through a hydrothermal method, and then is grafted and modified by a sulfhydryl-containing silane coupling agent.
The graphene oxide and the boron nitride are sheet structures, the graphene oxide is reduced to form epoxy graphene oxide by a hydrothermal method, and magnetic ferroferric oxide particles are intercalated between the sheet structures to form a 'point-surface' structure, so that the dispersibility of the graphene and the boron nitride is improved; more important is: on the basis of low-content filler, the heat dissipation performance is synergistically improved. And the modification of the silane coupling agent increases the compatibility and can reduce the interface thermal resistance. And because of the intercalation of the ferroferric oxide, the ferroferric oxide has magnetism, and in the photo-curing process, the filler can be orderly arranged under the action of a magnetic field, so that the heat dissipation performance is further improved. In the scheme, the ultraviolet light intensity in the photo-curing process is reduced, the photo-curing time is prolonged, the ordering of the filler is effectively increased, and the photo-crosslinking network is reinforced. Meanwhile, sulfonium salt is a latent cationic thermal initiator in the process of thiol-ene click reaction and in the process of light irradiation, so that thermal curing can be promoted.
(3) In the scheme, silica sol is coated in advance, and then the dipping solution is coated, so that the adhesiveness between the glass fiber cloth and the dipping solution is effectively improved, the mechanical property is enhanced, and meanwhile; the glass fiber board is coated in advance, so that the heat conductivity of the glass fiber board is improved, and the heat dissipation is improved.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
FIG. 1 is a block diagram of a high strength computer back cover of the present invention;
the diagram is: 1, a middle frame; 2, a cover plate; and 3, installing a cavity.
Detailed Description
The preferred embodiments of the present invention will be described below with reference to the accompanying drawings, it being understood that the preferred embodiments described herein are for illustration and explanation of the present invention only, and are not intended to limit the present invention.
Boron nitride (99.8%, 1-2 μm), graphene oxide (95%) were purchased from aladine; south asia 128 is purchased from Shanghai power chemical industry.
Example 1:
step 1:
(1) Preparation of silica sol:
the preparation method of the silica sol comprises the following steps: weighing tetraethyl silicate, 3- (2, 3-epoxypropoxy) propyl trimethoxy silane, ethanol and deionized water according to the molar ratio of 1:1.5:25:40, uniformly mixing the materials, dropwise adding acetic acid to adjust the pH value to be 2.5, and stirring for 6 hours to obtain silica sol.
(2) Vinyl epoxy resin preparation:
s1: sequentially adding 100g of tannic acid and 800g of epoxy bromopropane into a reaction kettle, adding 10g of tetrabutylammonium bromide, and reacting for 40 minutes at the temperature of 55 ℃; cooling to room temperature, adding 30g of potassium hydroxide solution, continuing to react for 3 hours, washing and drying to obtain low-viscosity epoxy resin;
s2: dispersing 100g of low-viscosity epoxy resin in a solvent (the volume ratio of the solvent is 2:1, namely, a mixed solvent of ethyl acetate and acetone, 210 mL), adding 10g of phosphoric acid, uniformly mixing, setting the temperature to 85 ℃, adding a mixed solution (solvent acetone, 100 mL) of 30g of glycidyl methacrylate and 0.8g of polymerization inhibitor (hydroquinone), reacting for 7 hours, washing and drying to obtain the vinyl epoxy resin.
(3) Preparation of mercapto filler:
s1: dispersing 1g of graphene oxide in 500mL of ethylene glycol, sequentially adding 8.5g of ferric chloride, 160g of anhydrous sodium acetate, 10g of polyvinylpyrrolidone and 0.55g of boron nitride, and uniformly stirring; transferring the obtained solution into a high-pressure reaction kettle, setting the temperature to be 180 ℃, and carrying out solvothermal reaction for 8 hours; washing and drying to obtain composite filler;
s2: dispersing 1.8g of 3-mercaptopropyl trimethoxysilane in an organic solvent-water solvent (isopropyl alcohol and water in a volume ratio of 2:8, 40 mL), adjusting the ph=5.8 with acetic acid, and stirring and hydrolyzing for 2 hours to obtain a silane hydrolysate; adding 1g of composite filler, stirring and dispersing for 2 hours, and drying to obtain the sulfhydryl filler.
(4) Uniformly mixing 10 parts of vinyl epoxy resin, 20 parts of sulfhydryl filler and 55 parts of solvent (toluene and acetone with the mass ratio of 1:1) according to parts by weight; adding 100 parts of epoxy resin (Nanya 128), uniformly mixing, adding 0.6 part of photoinitiator (cationic photoinitiator 320), 28 parts of curing agent (4, 4-diaminodiphenol) and 0.3 part of curing accelerator (dimethyl imidazole), and homogenizing to obtain a dipping liquid;
step 2: cleaning glass fiber cloth, coating silica sol on both sides, and coating 30g/m 2 The method comprises the steps of carrying out a first treatment on the surface of the Drying at 60 ℃ for 2 hours to obtain glass fiber cloth A; double-side coating dipping solution, 200g/m 2 The method comprises the steps of carrying out a first treatment on the surface of the The preset magnetic field is 0.4T; under 365nm ultraviolet light, the radiation intensity is 90mW/cm 2 Photo-curing for 10 minutes; thermally curing at 140 ℃ for 2 hours; obtaining the prepreg.
Step 3: laminating N prepregs under a pressure of 40kgf/cm 2 And (5) hot-pressing at 150 ℃ for 5 minutes to obtain the epoxy glass fiber board.
Step 4: cutting an epoxy glass fiber board to obtain a middle frame board and a cover board 2; milling a middle frame plate into an installation cavity 3 to form a middle frame 1; and welding the middle frame 1 and the cover plate 2 to obtain the high-strength computer rear cover.
Example 2:
step 1:
(1) Preparation of silica sol:
the preparation method of the silica sol comprises the following steps: weighing tetraethyl silicate, 3- (2, 3-epoxypropoxy) propyl trimethoxy silane, ethanol and deionized water according to the molar ratio of 1:1:20:40, uniformly mixing, dripping acetic acid to adjust the pH value to be 2.8, and stirring for 6 hours to obtain silica sol.
(2) Vinyl epoxy resin preparation:
s1: 100g of tannic acid and 700g of epoxy bromopropane are sequentially added into a reaction kettle, 10g of tetrabutylammonium bromide is added, and the temperature is set to be 60 ℃ for reaction for 30 minutes; cooling to room temperature, adding 30g of potassium hydroxide solution, continuing to react for 2 hours, washing and drying to obtain low-viscosity epoxy resin;
s2: dispersing 100g of low-viscosity epoxy resin in a solvent (the volume ratio of the solvent is 2:1, namely, a mixed solvent of ethyl acetate and acetone, 210 mL), adding 8g of phosphoric acid, uniformly mixing, setting the temperature to 80 ℃, adding a mixed solution (solvent acetone, 100 mL) of 25g of glycidyl methacrylate and 0.8g of polymerization inhibitor (hydroquinone), reacting for 8 hours, washing and drying to obtain the vinyl epoxy resin.
(3) Preparation of mercapto filler:
s1: dispersing 1g of graphene oxide in 500mL of ethylene glycol, sequentially adding 8g of ferric chloride, 160g of anhydrous sodium acetate, 10g of polyvinylpyrrolidone and 0.5g of boron nitride, and uniformly stirring; transferring the obtained solution into a high-pressure reaction kettle, setting the temperature to be 180 ℃, and carrying out solvothermal reaction for 8 hours; washing and drying to obtain composite filler;
s2: 1.5g of 3-mercaptopropyl trimethoxysilane was dispersed in an organic solvent-water solvent (isopropyl alcohol and water in a volume ratio of 2:8, 40 mL), ph=5.6 was adjusted with acetic acid, and the mixture was stirred and hydrolyzed for 2 hours to obtain a silane hydrolysate; adding 1g of composite filler, stirring and dispersing for 2 hours, and drying to obtain the sulfhydryl filler.
(4) Uniformly mixing 10 parts of vinyl epoxy resin, 18 parts of sulfhydryl filler and 50 parts of solvent (toluene and acetone with the mass ratio of 1:1) according to parts by weight; adding 100 parts of epoxy resin (Nanya 128), uniformly mixing, adding 0.5 part of photoinitiator (cationic photoinitiator 320), 30 parts of curing agent (4, 4-diaminodiphenol) and 0.5 part of curing accelerator (dimethyl imidazole), and homogenizing to obtain a dipping liquid;
step 2: cleaning glass fiber cloth, coating silica sol on both sides, and coating the glass fiber cloth with the coating amount of 20g/m 2 The method comprises the steps of carrying out a first treatment on the surface of the Drying at 60 ℃ for 2 hours to obtain glass fiber cloth A; double-side coating dipping solution, 250g/m 2 The method comprises the steps of carrying out a first treatment on the surface of the The preset magnetic field is 0.5T; under 365nm ultraviolet light, the radiation intensity is 100mW/cm 2 Photo-curing for 10 minutes; thermally curing at a temperature of 150 ℃ for 2 hours; obtaining the prepreg.
Step 3: stacking N prepregs under 45kgf/cm pressure 2 And hot-pressing at 145 ℃ for 4 minutes to obtain the epoxy glass fiber board.
Step 4: cutting an epoxy glass fiber board to obtain a middle frame board and a cover board 2; milling a middle frame plate into an installation cavity 3 to form a middle frame 1; and welding the middle frame 1 and the cover plate 2 to obtain the high-strength computer rear cover.
Example 3:
step 1:
(1) Preparation of silica sol:
the preparation method of the silica sol comprises the following steps: weighing tetraethyl silicate, 3- (2, 3-epoxypropoxy) propyl trimethoxy silane, ethanol and deionized water according to the molar ratio of 1:2:30:40, uniformly mixing, dripping acetic acid to adjust the pH value to be 2.2, and stirring for 6 hours to obtain silica sol.
(2) Vinyl epoxy resin preparation:
s1: sequentially adding 100g of tannic acid and 1000g of epoxy bromopropane into a reaction kettle, adding 10g of tetrabutylammonium bromide, and reacting for 40 minutes at the temperature of 50 ℃; cooling to room temperature, adding 30g of potassium hydroxide solution, continuing to react for 4 hours, washing and drying to obtain low-viscosity epoxy resin;
s2: dispersing 100g of low-viscosity epoxy resin in a solvent (the volume ratio of the solvent is 2:1, namely, a mixed solvent of ethyl acetate and acetone, 210 mL), adding 12g of phosphoric acid, uniformly mixing, setting the temperature to 90 ℃, adding a mixed solution (solvent acetone, 100 mL) of 35g of glycidyl methacrylate and 0.8g of polymerization inhibitor (hydroquinone), reacting for 6 hours, washing and drying to obtain the vinyl epoxy resin.
(3) Preparation of mercapto filler:
s1: dispersing 1g of graphene oxide in 500mL of ethylene glycol, sequentially adding 9g of ferric chloride, 160g of anhydrous sodium acetate, 10g of polyvinylpyrrolidone and 0.6g of boron nitride, and uniformly stirring; transferring the obtained solution into a high-pressure reaction kettle, setting the temperature to be 180 ℃, and carrying out solvothermal reaction for 8 hours; washing and drying to obtain composite filler;
s2: 2g of 3-mercaptopropyl trimethoxysilane was dispersed in an organic solvent-water solvent (isopropyl alcohol and water in a volume ratio of 2:8, 40 mL), ph=6.0 was adjusted with acetic acid, and the mixture was stirred and hydrolyzed for 2 hours to obtain a silane hydrolysate; adding 1g of composite filler, stirring and dispersing for 2 hours, and drying to obtain the sulfhydryl filler.
(4) According to the weight parts, uniformly mixing 12 parts of vinyl epoxy resin, 22 parts of sulfhydryl filler and 60 parts of solvent (toluene and acetone with the mass ratio of 1:1); adding 100 parts of epoxy resin (Nanya 128), uniformly mixing, adding 0.8 part of photoinitiator (cationic photoinitiator 320), 25 parts of curing agent (4, 4-diaminodiphenol) and 0.1 part of curing accelerator (dimethyl imidazole), and homogenizing to obtain a dipping liquid;
step 2: cleaning glass fiber cloth, coating silica sol on both sides, and coating 40g/m 2 The method comprises the steps of carrying out a first treatment on the surface of the Drying at 60 ℃ for 2 hours to obtain glass fiber cloth A; double-side coating dipping solution of 150g/m 2 The method comprises the steps of carrying out a first treatment on the surface of the The preset magnetic field is 0.2T; under 365nm ultraviolet light, the radiation intensity is 80mW/cm 2 Photo-curing for 8 minutes; thermally curing at 120 ℃ for 1 hour; obtaining the prepreg.
Step 3: laminating N prepregs under a pressure of 25kgf/cm 2 And hot-pressing at 155 ℃ for 6 minutes to obtain the epoxy glass fiber board.
Step 4: cutting an epoxy glass fiber board to obtain a middle frame board and a cover board 2; milling a middle frame plate into an installation cavity 3 to form a middle frame 1; and welding the middle frame 1 and the cover plate 2 to obtain the high-strength computer rear cover.
Comparative example 1: the glass cloth was not coated with silica sol, and the rest was the same as in example 1.
Comparative example 2: tannic acid in the vinyl epoxy resin was replaced with gallic acid, and the rest was the same as in example 1.
Comparative example 3: the temperature of the vinyl epoxy resin was set to 110℃and the rest was the same as in example 1.
Comparative example 4: in the vinyl epoxy resin, phosphoric acid was increased to 15g, glycidyl methacrylate was increased to 40g, and the other components were the same as in example 1.
Comparative example 5: the magnetic field during the irradiation was set during the heat curing, and the rest was the same as in example 1.
Comparative example 6: the non-mercapto filler was prepared by substituting graphene oxide for added boron nitride without introducing boron nitride, and the rest was the same as in example 1.
Experiment: the epoxy glass fiber boards prepared in examples and comparative examples were tested for tensile strength at a tensile rate of 5mm/min using a universal tensile tester with reference to GB/T2567; referring to ASTM D5470, a thermal conductivity tester is used to detect thermal conductivity; after impact compressive strength was measured according to ASTM D7137; the data obtained are shown below:
examples Tensile strength MPa Coefficient of thermal conductivity W/M . K Compression strength after impact MPa
Example 1 586 2.43 271
Example 2 575 2.38 267
Example 3 577 2.41 268
Comparative example 1 552 2.32 253
Comparative example 2 546 2.38 251
Comparative example 3 534 2.32 246
Comparative example 4 559 2.47 256
Comparative example 5 546 2.17 251
Comparative example 6 580 2.29 269
Conclusion: the data in the table show that the epoxy glass fiber board prepared in the scheme has high strength and high shock resistance, and simultaneously has good heat dissipation performance. As can be seen from the data of comparative example 1, the interface adhesion is reduced due to the uncoated silica sol, the interface thermal resistance is increased, and the mechanical properties and heat dissipation properties are reduced. In comparative examples 2 to 4, the epoxy resin prepared with tannic acid was introduced so that the impact resistance was significantly superior to that of gallic acid due to the branched structure of tannic acid; the preparation temperature affects the viscosity of the material and the viscosity affects the dispersibility, so that in comparative example 3, the vinyl epoxy resin prepared after the temperature is increased, the impact resistance is lowered; in contrast, in comparative example 4, the double bonds were excessively introduced due to the increase in the introduced amount of phosphoric acid and glycidyl methacrylate, and the performance was lowered. In comparative example 5, since in the case of the scheme, a dual curing process is performed because a main body frame is formed by photo-curing in advance and then thermally curing, an interpenetration structure is formed, and if a magnetic field is provided in the thermal curing process, the dispersibility and the ordering of the filler are affected, thereby reducing the heat dissipation. In comparative example 6, since boron nitride was not introduced, heat dissipation was lowered.
Finally, it should be noted that: the foregoing is merely a preferred example of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (9)

1. A processing technology of a high-strength computer rear cover with a middle frame is characterized in that: cutting the epoxy glass fiber board to obtain a middle frame board and a cover board (2); milling a mounting cavity (3) from the middle frame plate to form a middle frame (1); welding the middle frame (1) and the cover plate (2) to obtain a high-strength computer rear cover;
the preparation of the epoxy glass fiber board comprises the following steps:
step 1: uniformly mixing 10-12 parts by weight of vinyl epoxy resin, 18-22 parts by weight of sulfhydryl filler and 50-60 parts by weight of solvent; adding 100 parts of epoxy resin, uniformly mixing, adding 0.5-0.8 part of photoinitiator, 25-30 parts of curing agent and 0.1-0.5 part of curing accelerator, and homogenizing to obtain a dipping solution;
step 2: cleaning the glass fiber cloth, coating silica sol on two surfaces, and drying to obtain glass fiber cloth A; coating the dipping solution on both sides, photo-curing and thermosetting to obtain a prepreg;
step 3: overlapping and hot-pressing N prepregs to obtain an epoxy glass fiber board;
the sulfhydryl filler is prepared by preparing composite filler by graphene oxide, ferric chloride and boron nitride by a hydrothermal method and then grafting and modifying the composite filler by a sulfhydryl-containing silane coupling agent.
2. The process for manufacturing the high-strength computer rear cover with the middle frame according to claim 1, wherein the process comprises the following steps of: in step 2, photo-curing conditions: the preset magnetic field is 0.2-0.5T; under 365nm ultraviolet light, the radiation intensity is 80-100 mW/cm 2 Photo-curing for 8-10 minutes; heat curing conditions: curing for 1-2 hours at 120-150 ℃.
3. The process for manufacturing the high-strength computer rear cover with the middle frame according to claim 1, wherein the process comprises the following steps of: in the step 2, the silica sol has a coating amount of 20-40 g/m 2 The method comprises the steps of carrying out a first treatment on the surface of the The coating amount of the dipping solution is 150-250 g/m 2 The method comprises the steps of carrying out a first treatment on the surface of the In step 3, hot pressing conditions: the pressure is 25 to 45kgf/cm 2 The temperature is 145-155 ℃ and the time is 4-6 minutes.
4. The process for manufacturing the high-strength computer rear cover with the middle frame according to claim 2, wherein the process comprises the following steps of: the preparation method of the vinyl epoxy resin comprises the following steps: s1: sequentially adding tannic acid and epoxy bromopropane into a reaction kettle, adding tetrabutylammonium bromide, and reacting for 30-40 minutes at the temperature of 50-60 ℃; cooling to room temperature, adding potassium hydroxide solution, continuing to react for 2-4 hours, washing and drying to obtain low-viscosity epoxy resin; s2: dispersing the low-viscosity epoxy resin in a solvent, adding phosphoric acid, uniformly mixing, setting the temperature to be 80-90 ℃, adding a mixed solution of glycidyl methacrylate and a polymerization inhibitor, reacting for 6-8 hours, washing and drying to obtain the vinyl epoxy resin.
5. The process for manufacturing the high-strength computer rear cover with the middle frame according to claim 4, wherein the process comprises the following steps of: the mass ratio of tannic acid, epoxybromopropane, tetrabutylammonium bromide and potassium hydroxide in potassium hydroxide solution is 1 (7-10): 0.1:0.3; the mass ratio of the low-viscosity epoxy resin to the phosphoric acid to the glycidyl methacrylate is 1 (0.08-0.12) to 0.25-0.35.
6. The process for manufacturing the high-strength computer rear cover with the middle frame according to claim 2, wherein the process comprises the following steps of: the preparation method of the sulfhydryl filler comprises the following steps: s1: dispersing graphene oxide in ethylene glycol, sequentially adding ferric chloride, anhydrous sodium acetate, polyvinylpyrrolidone and boron nitride, and uniformly stirring; transferring the obtained solution into a high-pressure reaction kettle, setting the temperature to be 180 ℃, and carrying out solvothermal reaction for 8 hours; washing and drying to obtain composite filler; s2: dispersing 3-mercaptopropyl trimethoxy silane in an organic solvent-water solvent, and regulating pH to be 5.6-6.0 by using acetic acid to hydrolyze to obtain silane hydrolysate; adding the composite filler, dispersing uniformly, and drying to obtain the sulfhydryl filler.
7. The process for manufacturing the high-strength computer rear cover with the middle frame according to claim 6, wherein the process comprises the following steps of: the mass ratio of the graphene oxide to the ferric chloride to the boron nitride is 1 (8-9) (0.5-0.6); the mass ratio of the composite filler to the 3-mercaptopropyl trimethoxy silane is 1 (1.5-2).
8. The process for manufacturing the high-strength computer rear cover with the middle frame according to claim 1, wherein the process comprises the following steps of: the preparation method of the silica sol comprises the following steps: according to the mol ratio of 1 (1-2), 40 (20-30), weighing tetraethyl silicate, 3- (2, 3-epoxypropoxy) propyl trimethoxy silane, ethanol and deionized water, uniformly mixing, dropwise adding acetic acid to adjust pH=2-3, and uniformly stirring to obtain silica sol.
9. The high-strength computer rear cover with a middle frame according to any one of claims 1 to 8.
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CN113715422A (en) * 2020-05-25 2021-11-30 杭州鸿禾电子科技有限公司 High-wear-resistance epoxy glass fiber cloth laminated board and preparation method thereof
CN114231228A (en) * 2021-11-01 2022-03-25 北京理工大学 Magnetorheological repairing material, preparation method thereof and oil pipeline repairing method

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CN109796728B (en) * 2019-01-30 2020-04-17 常州中英科技股份有限公司 Polyphenol-modified hydrocarbon composition-based prepreg and copper-clad plate prepared from same

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CN113715422A (en) * 2020-05-25 2021-11-30 杭州鸿禾电子科技有限公司 High-wear-resistance epoxy glass fiber cloth laminated board and preparation method thereof
CN113121959A (en) * 2021-04-14 2021-07-16 华南理工大学 Light-heat dual-curing modified nanocellulose-reinforced epoxy resin composite material and preparation method thereof
CN114231228A (en) * 2021-11-01 2022-03-25 北京理工大学 Magnetorheological repairing material, preparation method thereof and oil pipeline repairing method

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