CN115284691A - High-pressure-resistance aluminum substrate and preparation method thereof - Google Patents

High-pressure-resistance aluminum substrate and preparation method thereof Download PDF

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Publication number
CN115284691A
CN115284691A CN202211045531.3A CN202211045531A CN115284691A CN 115284691 A CN115284691 A CN 115284691A CN 202211045531 A CN202211045531 A CN 202211045531A CN 115284691 A CN115284691 A CN 115284691A
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adhesive
aluminum substrate
parts
insulating layer
heat
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Inventor
郭小亮
郭登超
张海峰
黄群才
鲁洋
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Jiaozuo Kainuo Electronics Co ltd
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Jiaozuo Kainuo Electronics Co ltd
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Priority to CN202211045531.3A priority Critical patent/CN115284691A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/017—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of aluminium or an aluminium alloy, another layer being formed of an alloy based on a non ferrous metal other than aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/222—Magnesia, i.e. magnesium oxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

The invention discloses a high-pressure-resistance aluminum substrate and a preparation method thereof; relates to the technical field of aluminum substrates; the problem that the pressure resistance of an aluminum substrate is poor in the prior art is solved; the high voltage resistance aluminum substrate comprises a metal base layer, a heat conduction insulating layer and a circuit layer, wherein the heat conduction insulating layer is obtained by drying an adhesive, and the adhesive comprises the following components in parts by weight: 28-43 parts of bisphenol A type epoxy resin, 23-38 parts of phenolic aldehyde, 5-12 parts of silane coupling agent, 2-5 parts of dicyandiamide curing agent, 10-15 parts of heat-conducting filler particles, 41-60 parts of silicon dioxide, 15-25 parts of soft silicon and 30-40 parts of organic solvent, wherein the viscosity of the adhesive is 20-35min after coating 4# cup, and the thickness of the heat-conducting insulating layer is 120-190 microns; the aluminum substrate has good pressure resistance.

Description

High-pressure-resistance aluminum substrate and preparation method thereof
Technical Field
The invention belongs to the technical field of aluminum substrates, and particularly relates to a high-pressure-resistance aluminum substrate and a preparation method thereof.
Background
The aluminum substrate is a metal-based copper-clad plate with good heat dissipation function, and a single-sided board generally comprises a three-layer structure, namely a circuit layer (copper foil), an insulating layer and a metal base layer (aluminum plate). The high-end application is also designed to be a double-sided board, and the structure of the double-sided board is a circuit layer, an insulating layer, an aluminum base, an insulating layer and a circuit layer. The aluminum-based composite board is rarely used as a composite board and can be formed by laminating a common composite board, an insulating layer and an aluminum base.
A heat conduction and insulation layer is required between the aluminum substrate and the circuit layer to realize insulation and adhesion between the metal substrate and the circuit layer. For example, patent application document CN 111040701A discloses a high-temperature-resistant and high-toughness epoxy resin adhesive, which is prepared from a component a and a component B, wherein the component a is prepared from bisphenol a epoxy resin, a flexibilizer hyperbranched polyester compound, an active diluent, a silane coupling agent, heat-resistant filler micron-sized alumina powder, a thixotropic agent and an antifoaming agent, and the component B is prepared from a polyamide curing agent, an alicyclic amine curing agent, a silane coupling agent, heat-resistant filler micron-sized alumina powder, a thixotropic agent and an antifoaming agent; the invention also discloses a preparation method of the high-temperature-resistant and high-toughness epoxy resin adhesive, which comprises the steps of respectively preparing the component A and the component B by heating and stirring, and then mixing.
The heat conducting insulating layer in the prior art is mainly prepared by filling single alumina heat conducting particles with an organic resin material, so that the whole aluminum substrate has low pressure resistance. Therefore, there is a need for further improvement of the conventional aluminum substrate to improve the withstand voltage performance while maintaining good thermal conductivity.
Disclosure of Invention
Aiming at the technical problems in the prior art, the invention provides a high-voltage-resistance aluminum substrate and a preparation method thereof.
The technical scheme adopted by the invention is as follows:
a high pressure resistance aluminum substrate. The aluminum substrate comprises a metal base layer, a heat conduction insulating layer and a circuit layer, wherein the heat conduction insulating layer is obtained by drying an adhesive, and the adhesive comprises the following components in parts by weight:
Figure BDA0003821444390000021
the viscosity of the adhesive is 20-35min when the adhesive is coated on a No. 4 cup, and the thickness of the heat conduction insulating layer is 120-190 mu m.
By adopting the technical scheme, the bisphenol A type epoxy resin and the phenolic resin are compounded to serve as the organic resin matrix, and compared with single bisphenol A type epoxy resin, the pressure resistance of the aluminum substrate is favorably improved; in addition, the heat-conducting filler particles are added into the organic resin matrix of the heat-conducting insulating layer, so that the heat-conducting performance of the whole system can be improved; in addition, the silicon dioxide with higher hardness and the soft silicon with lower hardness are combined to be used as a carrier, so that the organic resin matrix is immersed into the carrier, the heat-conducting filler particles can be uniformly dispersed in the organic resin matrix, and the pressure resistance and the heat conductivity of the aluminum substrate can be further improved. Importantly, the consumption of organic solvent is reduced, the viscosity of the adhesive is properly increased, the thickness of the heat-conducting insulating layer is controlled within the range of 120-190 microns, and the pressure resistance of the aluminum substrate is greatly improved.
The bisphenol A type epoxy resin is a common adhesive organic resin material, but the consumption of the bisphenol A type epoxy resin is reduced, and only 28-43 parts of the bisphenol A type epoxy resin is adopted, so that the bisphenol A type epoxy resin is convenient to add and compound with the phenolic resin with proper content. Further, the amount of the bisphenol A type epoxy resin added is preferably 31 to 40 parts, more preferably 35 parts.
Phenolic resin is a synthetic plastic, colorless or yellowish brown transparent solid, is also commonly called bakelite because of more electric equipment, and has the advantages of excellent heat conductivity, flame resistance, water resistance and insulating property, better acid resistance, poor alkali resistance and good mechanical and electrical properties. The invention discovers that the pressure resistance of the aluminum substrate can be enhanced by compounding the bisphenol A type epoxy resin with the phenolic resin as the organic resin matrix. If the content of the phenolic resin is lower than 23 parts, the pressure resistance of the aluminum substrate is not obviously improved; if the content of the phenolic resin is more than 38 parts, the thermal conductivity is reduced, so that 23 to 38 parts of the phenolic resin is selected in the invention in consideration of the comprehensive performance of the aluminum substrate. Further, the amount of the phenolic resin added is preferably 27 to 34 parts, more preferably 30 parts.
Silica is a common dispersing support, but the invention uses a combination of ordinary silica and soft silica as a composite support. Silicon dioxide is an acidic oxide, silicic acid is used as a hydrate, and natural silicon dioxide existing on the earth accounts for about 12% of the mass of the earth crust, and the existing form of the silicon dioxide is crystalline and amorphous, and is generally called as silica. The silicon dioxide has higher hardness, and when the silicon dioxide is added into an organic resin material, the pressure resistance of the formed organic-inorganic composite material is also higher. The soft silicon is a novel silicon dioxide powder material, and the particle size can be controlled within the range of 0.1-30 mu m. The soft silicon has the characteristic of porous structure, the inner parts of pore channels are mutually connected, and the pore volume reaches 1cm 3 Per g, the specific surface area reaches 240m 2 The characteristics determine the excellent adsorption performance of the soft silicon, and the dispersion rate of the heat-conducting filler particles can be improved when the soft silicon is added into an organic resin material, so that the formed organic-inorganic composite material has high heat conductivity. In the invention, if the content of the silica is lower and the content of the soft silicon is higher, the whole pressure resistance of the aluminum substrate is influenced, and if the content of the silica is higher and the content of the soft silicon is lower, the whole heat conductivity of the aluminum substrate is influenced, so that the adding amount of the common silica and the soft silicon needs to be balanced, the adding amount of the silica is 41-60 parts, and the adding amount of the soft silicon is 15-25 parts. Further, the amount of silica added is preferably47 to 53 parts, and the addition amount of the soft silicon is preferably 18 to 22 parts. Further, the amount of silica added was 50 parts, and the amount of soft silicon added was 20 parts.
In the present invention, the type of the organic solvent is not particularly limited as long as a uniform adhesive slurry can be formed, and for example, DMF, ethyl acetate, acetone, or the like can be used. The amount of organic solvent added is critical to the present invention because of the viscosity of the adhesive and the thickness of the final thermally conductive and electrically insulating layer. If the addition amount of the organic solvent is less than 30 parts, the viscosity of the adhesive is higher than that of a coating 4# cup for 35min, the coating film is uneven in thickness and poor in smoothness, and the punching and shearing resistance is easily deteriorated due to the excessive thickness, so that the conditions of layering and edge burst can be caused; if the adding amount of the organic solvent is more than 40 parts, the viscosity of the adhesive is lower than that of a 4# cup for 20min, a heat conduction insulating layer with the thickness of 120-190 mu m cannot be formed on the circuit layer, and the pressure resistance is greatly reduced, so that the adding amount of the organic solvent is 30-40 parts. The amount of the organic solvent added is 33 to 37 parts, and the amount of the organic solvent added is 35 parts.
Because a heat conduction insulating layer is required between the aluminum substrate and the circuit layer, the metal substrate and the circuit layer are insulated and bonded. The existing heat-conducting insulating layer is mainly prepared by filling heat-conducting particles with an organic resin material. At present, however, the heat-conducting particle filler generally adopts single Al 2 O 3 But of single Al 2 O 3 The lower filling rate directly restricts the heat transfer performance of the aluminum base line. According to the invention, different types of fillers are mixed for use, so that the heat conducting property of the aluminum substrate is greatly improved, and specifically, the heat conducting filler particles are the combination of one or more of calcium oxide, zirconium oxide, magnesium oxide and mica and aluminum oxide.
Further, the thermally conductive filler particles were composed of 50% of alumina, 30% of magnesia, and 20% of mica. The heat-conducting performance of the heat-conducting insulating layer can be better improved by mixing the three fillers.
Furthermore, fillers with different particle diameters are combined for use to form a reticular space distribution of 'large particles-medium particles-small particles', and a plurality of heat conduction passages formed by effectively stacking 'large particles-medium particles-small particles' are formed, so that the heat conduction performance of the heat conduction insulating layer is greatly improved. Specifically, the particle size of the alumina is 300-500nm, the particle size of the magnesia is 110-150nm, and the particle size of the mica is 60-80nm.
In addition, the invention also provides a preparation method of the high-pressure-resistance aluminum substrate. The preparation method comprises the following steps:
(1) Weighing and uniformly mixing all components of the adhesive according to a ratio;
(2) Coating the adhesive on the surface of the circuit layer by a roller;
(3) Covering the metal base layer on the surface of the adhesive to form an aluminum substrate semi-finished product;
(4) And thermally pressing the semi-finished product of the aluminum substrate to form the aluminum substrate.
Compared with the prior art, the invention has the beneficial effects that:
(1) The adhesive adopts bisphenol A type epoxy resin and phenolic resin to be compounded as an organic resin matrix, and is favorable for improving the pressure resistance of the aluminum substrate compared with single bisphenol A type epoxy resin;
(2) The adhesive can improve the heat-conducting property of the whole system by adding heat-conducting filler particles into an organic resin matrix;
(3) The adhesive combines the silicon dioxide with higher hardness and the soft silicon with lower hardness as a carrier, so that the organic resin matrix is immersed into the carrier, and the heat-conducting filler particles can be more uniformly dispersed in the organic resin matrix, thereby further improving the pressure resistance and the heat conductivity of the aluminum substrate;
(4) The adhesive reasonably allocates the amount of the organic solvent, and properly increases the viscosity of the adhesive, so that the thickness of the heat-conducting insulating layer is controlled within the range of 120-190 μm, and the pressure resistance of the aluminum substrate is greatly improved.
Detailed Description
The following examples illustrate the present invention in more detail. The present invention is not limited to the following examples.
Example 1
A high pressure resistance aluminum substrate. The aluminum substrate comprises a metal base layer, a heat conduction insulating layer and a circuit layer, wherein the heat conduction insulating layer is obtained by drying an adhesive, and the adhesive comprises the following components in parts by weight:
Figure BDA0003821444390000051
the viscosity of the adhesive is 25min when the adhesive is coated on a No. 4 cup, the thickness of the heat conduction insulating layer is 160 mu m,
the heat conductive filler particles are composed of 50% of alumina having a particle size of 300-500nm, 30% of magnesia having a particle size of 110-150nm, and 20% of mica having a particle size of 60-80nm.
The preparation method of the aluminum substrate comprises the following steps:
(1) Weighing and uniformly mixing all components of the adhesive according to a ratio;
(2) Coating the adhesive on the surface of the circuit layer by a roller;
(3) Covering the metal base layer on the surface of the adhesive to form an aluminum substrate semi-finished product;
(4) And thermally pressing the semi-finished product of the aluminum substrate to form the aluminum substrate.
Example 2
A high pressure resistance aluminum substrate. The aluminum substrate comprises a metal base layer, a heat conduction insulating layer and a circuit layer, wherein the heat conduction insulating layer is obtained by drying an adhesive, and the adhesive comprises the following components in parts by weight:
Figure BDA0003821444390000061
the viscosity of the adhesive is 35min after coating 4# cup, the thickness of the heat conduction insulating layer is 160 mu m,
the heat conductive filler particles are composed of 50% of alumina having a particle size of 300-500nm, 30% of magnesia having a particle size of 110-150nm, and 20% of mica having a particle size of 60-80nm.
The preparation method of the aluminum substrate comprises the following steps:
(1) Weighing and uniformly mixing the components of the adhesive according to a proportion;
(2) Coating the adhesive on the surface of the circuit layer by a roller;
(3) Covering the metal base layer on the surface of the adhesive to form an aluminum substrate semi-finished product;
(4) And carrying out hot-pressing on the semi-finished product of the aluminum substrate to form the aluminum substrate.
Example 3
A high pressure resistance aluminum substrate. The aluminum substrate comprises a metal base layer, a heat conduction insulating layer and a circuit layer, wherein the heat conduction insulating layer is obtained by drying an adhesive, and the adhesive comprises the following components in parts by weight:
Figure BDA0003821444390000062
Figure BDA0003821444390000071
the viscosity of the adhesive is 20min after coating 4# cup, the thickness of the heat conduction insulating layer is 120 mu m,
the heat conductive filler particles are composed of 50% of alumina having a particle size of 300-500nm, 30% of magnesia having a particle size of 110-150nm, and 20% of mica having a particle size of 60-80nm.
The preparation method of the aluminum substrate comprises the following steps:
(1) Weighing and uniformly mixing the components of the adhesive according to a proportion;
(2) Coating the adhesive on the surface of the circuit layer by a roller;
(3) Covering the metal base layer on the surface of the adhesive to form an aluminum substrate semi-finished product;
(4) And thermally pressing the semi-finished product of the aluminum substrate to form the aluminum substrate.
Comparative example 1
A high pressure resistance aluminum substrate. The aluminum substrate comprises a metal base layer, a heat conduction insulating layer and a circuit layer, wherein the heat conduction insulating layer is obtained by drying an adhesive, and the adhesive comprises the following components in parts by weight:
Figure BDA0003821444390000072
the viscosity of the adhesive is 25min after coating 4# cup, the thickness of the heat conduction insulating layer is 160 mu m,
the heat conductive filler particles are composed of 50% of alumina having a particle size of 300-500nm, 30% of magnesia having a particle size of 110-150nm, and 20% of mica having a particle size of 60-80nm.
The preparation method of the aluminum substrate comprises the following steps:
(1) Weighing and uniformly mixing the components of the adhesive according to a proportion;
(2) Coating the adhesive on the surface of the circuit layer by a roller;
(3) Covering the metal base layer on the surface of the adhesive to form an aluminum substrate semi-finished product;
(4) And thermally pressing the semi-finished product of the aluminum substrate to form the aluminum substrate.
Comparative example 2
A high pressure resistance aluminum substrate. The aluminum substrate comprises a metal base layer, a heat conduction insulating layer and a circuit layer, wherein the heat conduction insulating layer is obtained by drying an adhesive, and the adhesive comprises the following components in parts by weight:
Figure BDA0003821444390000081
the viscosity of the adhesive is 10min when the adhesive is coated on a No. 4 cup, the thickness of the heat conduction insulating layer is 100 mu m,
the heat conductive filler particles are composed of 50% of alumina having a particle size of 300-500nm, 30% of magnesia having a particle size of 110-150nm, and 20% of mica having a particle size of 60-80nm.
The preparation method of the aluminum substrate comprises the following steps:
(1) Weighing and uniformly mixing the components of the adhesive according to a proportion;
(2) Coating the adhesive on the surface of the circuit layer by a roller;
(3) Covering the metal base layer on the surface of the adhesive to form an aluminum substrate semi-finished product;
(4) And thermally pressing the semi-finished product of the aluminum substrate to form the aluminum substrate.
The pressure resistance test data and the heat conductivity test data of examples 1 to 3 and comparative examples 1 to 2 above are shown in table 1.
TABLE 1 pressure resistance and thermal conductivity of examples 1 to 3 and comparative examples 1 to 2
Breakdown voltage (KV) Coefficient of thermal conductivity W/(m.k)
Example 1 9 2.2
Example 2 7 2.2
Example 3 5 2.2
Comparative example 1 4 2.2
Comparative example 2 3 1.8
As can be seen from Table 1, the pressure resistance of examples 2 to 3 was lower than that of example 1. The adhesive of example 2 has a slightly higher viscosity than that of example 1, and the film formation is not good as the adhesive of example 1, and therefore the thickness is slightly decreased, resulting in a decrease in breakdown voltage. On the other hand, the adhesive of example 3 has a lower viscosity than that of example 1, and a thicker uniform coating film cannot be formed, which also results in a decrease in breakdown voltage.
The adhesive of the comparative example 1 adopts bisphenol A type epoxy resin, although the viscosity and the thickness are the same as those of the adhesive of the example 1, the breakdown voltage is obviously reduced, and the combination of the bisphenol A type epoxy resin and the phenolic resin is proved to greatly improve the pressure resistance of the aluminum substrate.
The adhesive of comparative example 2 does not use silica and soft silicon as a carrier, resulting in non-uniform bonding of the organic resin material and the thermally conductive filler particles, and also greatly reduced pressure resistance and thermal conductivity.

Claims (7)

1. The high voltage resistance aluminum substrate comprises a metal base layer, a heat conduction insulating layer and a circuit layer, wherein the heat conduction insulating layer is obtained by drying an adhesive, and the high voltage resistance aluminum substrate is characterized in that the adhesive consists of the following components in parts by weight:
Figure FDA0003821444380000011
the viscosity of the adhesive is 20-35min when the adhesive is coated on a No. 4 cup, and the thickness of the heat conduction insulating layer is 120-190 mu m.
2. The high pressure-resistant aluminum substrate according to claim 1, wherein the adhesive comprises the following components in parts by weight:
Figure FDA0003821444380000012
the viscosity of the adhesive is 20-35min when the adhesive is coated on a No. 4 cup, and the thickness of the heat conduction insulating layer is 120-190 mu m.
3. The high pressure-resistant aluminum substrate according to claim 2, wherein the adhesive comprises the following components in parts by weight:
Figure FDA0003821444380000021
the viscosity of the adhesive is 25min for coating a No. 4 cup, and the thickness of the heat-conducting insulating layer is 160 mu m.
4. A high voltage tolerant aluminum substrate according to claim 1, wherein the heat conductive filler particles are a combination of one or more of calcium oxide, zirconium oxide, magnesium oxide, mica and aluminum oxide.
5. A high withstand voltage aluminum substrate according to claim 4, wherein the thermal conductive filler particles are composed of 50% of alumina, 30% of magnesia and 20% of mica.
6. A high voltage tolerant aluminum substrate according to claim 4, wherein the particle size of said aluminum oxide is 300-500nm, the particle size of said magnesium oxide is 110-150nm, and the particle size of said mica is 60-80nm.
7. A method for manufacturing a high voltage tolerant aluminum substrate according to any one of claims 1-6, comprising the steps of:
(1) Weighing and uniformly mixing the components of the adhesive according to a proportion;
(2) Coating the adhesive on the surface of the circuit layer by a roller;
(3) Covering the metal base layer on the surface of the adhesive to form an aluminum substrate semi-finished product;
(4) And thermally pressing the semi-finished product of the aluminum substrate to form the aluminum substrate.
CN202211045531.3A 2022-08-29 2022-08-29 High-pressure-resistance aluminum substrate and preparation method thereof Pending CN115284691A (en)

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Application publication date: 20221104