CN117025146A - Organic silicon modified heat conduction adhesive film and preparation method thereof - Google Patents
Organic silicon modified heat conduction adhesive film and preparation method thereof Download PDFInfo
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- CN117025146A CN117025146A CN202310998200.XA CN202310998200A CN117025146A CN 117025146 A CN117025146 A CN 117025146A CN 202310998200 A CN202310998200 A CN 202310998200A CN 117025146 A CN117025146 A CN 117025146A
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- adhesive film
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- thermally conductive
- epoxy resin
- organic silicon
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- 239000002313 adhesive film Substances 0.000 title claims abstract description 56
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims description 20
- 229910052710 silicon Inorganic materials 0.000 title claims description 20
- 239000010703 silicon Substances 0.000 title claims description 20
- 239000000203 mixture Substances 0.000 claims description 29
- 239000003822 epoxy resin Substances 0.000 claims description 27
- 229920000647 polyepoxide Polymers 0.000 claims description 27
- 239000004020 conductor Substances 0.000 claims description 25
- 239000003607 modifier Substances 0.000 claims description 20
- 229920001296 polysiloxane Polymers 0.000 claims description 19
- 239000003795 chemical substances by application Substances 0.000 claims description 17
- 239000002904 solvent Substances 0.000 claims description 17
- 238000001816 cooling Methods 0.000 claims description 10
- 229920006267 polyester film Polymers 0.000 claims description 10
- 229920006264 polyurethane film Polymers 0.000 claims description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 6
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 claims description 6
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 5
- 238000010008 shearing Methods 0.000 claims description 5
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 claims description 3
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 claims description 3
- 239000003208 petroleum Substances 0.000 claims description 3
- 229940044654 phenolsulfonic acid Drugs 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 239000005051 trimethylchlorosilane Substances 0.000 claims description 3
- 125000000346 malonyl group Chemical group C(CC(=O)*)(=O)* 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 238000009472 formulation Methods 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
- C09J2475/006—Presence of polyurethane in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses an organosilicon modified heat-conducting adhesive film and a preparation method thereof, belonging to the technical field of heat-conducting adhesives.
Description
Technical Field
The invention relates to the technical field of heat-conducting adhesives, in particular to an organosilicon modified heat-conducting adhesive film and a preparation method thereof.
Background
The existing heat conducting materials have some problems in application, such as low heat transfer efficiency, heat conducting performance affected by temperature change, insufficient stability of adhesive film and the like. Therefore, the organic silicon modified heat-conducting adhesive film can effectively solve the problems and has better application prospect.
Disclosure of Invention
In order to solve the problems, the invention provides an organosilicon modified heat conduction adhesive film and a preparation method thereof, wherein the film can improve heat transfer efficiency, stability and temperature change resistance, has wider application prospect, and comprises the following specific contents:
the first object of the present invention is to provide a silicone modified heat conductive adhesive film, which is technically characterized by comprising, by weight, 80-120 parts of a silicone modifier, 180-220 parts of a heat conductive material, 20-30 parts of an epoxy resin, 20-30 parts of a solvent and 4-6 parts of a curing agent.
In order to better solve the technical problems, the heat conducting material in the formula system of the organic silicon modified heat conducting adhesive film is any one of graphene, alumina powder and silicon carbide.
In order to better solve the technical problems, the median particle size of the heat conducting material in the formula system of the organic silicon modified heat conducting adhesive film is 40-60 mu m.
In order to better solve the technical problems, the organosilicon modifier in the formula system of the organosilicon modified heat-conducting adhesive film is any one of trimethylchlorosilane, hexamethyldisilazane and hexamethyldisiloxane.
In order to better solve the technical problems, the epoxy resin in the formula system of the organic silicon modified heat-conducting adhesive film is at least one of malononic epoxy resin and phenolic epoxy resin.
In order to better solve the technical problems, the solvent in the formula system of the organic silicon modified heat-conducting adhesive film is at least one of petroleum ether, methanol and ethanol.
In order to better solve the technical problems, the curing agent in the formula system of the organosilicon modified heat-conducting adhesive film is at least one of toluene sulfonic acid, phenol sulfonic acid and phosphoric acid.
The second object of the invention is to provide a preparation method of an organosilicon modified heat conduction adhesive film, which is technically characterized by comprising the following steps:
uniformly mixing an organosilicon modifier, a heat conducting material, epoxy resin, a solvent and a curing agent to obtain a mixture;
step two, coating the mixture on the surface of a polyester film or a polyurethane film, and putting the polyester film or the polyurethane film into a high-temperature oven at 100-200 ℃ to bake for 2-4 hours;
and thirdly, taking out the baked film, cooling, naturally cooling to normal temperature at room temperature, and shearing into a required size to obtain the organosilicon modified heat-conducting adhesive film.
Compared with the prior art, the organic silicon modified heat conduction adhesive film and the preparation method thereof can achieve the following beneficial effects:
the organic silicon modified heat conduction adhesive film comprises an organic silicon modifier, a heat conduction material, epoxy resin, a solvent and a curing agent, wherein the organic silicon modifier in the formula system can improve the heat conduction efficiency and stability of the heat conduction film, so that the film has better high and low temperature resistance, the heat conduction material can improve the heat conduction performance of the film, the epoxy resin, the solvent and the curing agent are mixed to serve as an adhesive to enhance the adhesive force and stability of the film, and in a word, the organic silicon modified heat conduction adhesive film has better heat conduction performance, heat conduction efficiency and stability and wide application prospect.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below in connection with specific embodiments of the present invention. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
The organosilicon modified heat-conducting adhesive film comprises 100g of organosilicon modifier, 200g of heat-conducting material, 25g of epoxy resin, 25g of solvent and 5g of curing agent.
Further, the heat conducting material in the formula system of the organic silicon modified heat conducting adhesive film in the embodiment is graphene.
Further, the median particle diameter of the heat conductive material in the formulation system of the silicone modified heat conductive adhesive film of this embodiment is 50 μm.
Further, in the formulation system of the organosilicon modified heat-conducting adhesive film of the embodiment, the organosilicon modifier is trimethylchlorosilane.
Further, the epoxy resin in the formulation system of the organic silicon modified heat conductive adhesive film in this embodiment is a malonyl epoxy resin.
Further, the solvent in the formulation system of the organosilicon modified heat-conducting adhesive film in the embodiment is petroleum ether.
Further, the curing agent in the formulation system of the organosilicon modified heat-conducting adhesive film of the embodiment is toluene sulfonic acid
According to the above formulation, the second object of the present invention is to provide a method for preparing an organosilicon modified heat conductive adhesive film, which is technically characterized by comprising the following steps:
uniformly mixing an organosilicon modifier, a heat conducting material, epoxy resin, a solvent and a curing agent to obtain a mixture;
step two, coating the mixture on the surface of a polyester film or a polyurethane film, and putting the polyester film or the polyurethane film into a high-temperature oven at 150 ℃ to bake for 3 hours;
and thirdly, taking out the baked film, cooling, naturally cooling to normal temperature at room temperature, and shearing into a required size to obtain the organosilicon modified heat-conducting adhesive film.
Example 2
The organosilicon modified heat-conducting adhesive film comprises 80g of organosilicon modifier, 180g of heat-conducting material, 20g of epoxy resin, 20g of solvent and 4g of curing agent.
Further, the heat conducting material in the formula system of the organic silicon modified heat conducting adhesive film in the embodiment is alumina powder.
Further, the median particle diameter of the heat conductive material in the formulation system of the silicone modified heat conductive adhesive film of this embodiment is 40 μm.
Further, in the formulation system of the organosilicon modified heat-conducting adhesive film of the embodiment, the organosilicon modifier is hexamethyldisilazane.
Further, the epoxy resin in the formulation system of the silicone modified heat conductive adhesive film of the embodiment is phenolic epoxy resin.
Further, the solvent in the formulation system of the organosilicon modified heat-conducting adhesive film in this embodiment is methanol.
Further, the curing agent in the formula system of the organosilicon modified heat-conducting adhesive film in the embodiment is phenolsulfonic acid.
According to the above formulation, the second object of the present invention is to provide a method for preparing an organosilicon modified heat conductive adhesive film, which is technically characterized by comprising the following steps:
uniformly mixing an organosilicon modifier, a heat conducting material, epoxy resin, a solvent and a curing agent to obtain a mixture;
step two, coating the mixture on the surface of a polyester film or a polyurethane film, and putting the polyester film or the polyurethane film into a high-temperature oven at 100 ℃ to bake for 4 hours;
and thirdly, taking out the baked film, cooling, naturally cooling to normal temperature at room temperature, and shearing into a required size to obtain the organosilicon modified heat-conducting adhesive film.
Example 3
The organosilicon modified heat-conducting adhesive film comprises 120g of organosilicon modifier, 220g of heat-conducting material, 30g of epoxy resin, 30g of solvent and 6g of curing agent.
Further, the heat conductive material in the formulation system of the organic silicon modified heat conductive adhesive film in this embodiment is silicon carbide.
Further, the median particle diameter of the heat conductive material in the formulation system of the silicone modified heat conductive adhesive film of this embodiment is 60 μm.
Further, in the formulation system of the silicone modified heat conductive adhesive film of this embodiment, the silicone modifier is hexamethyldisiloxane.
Further, the epoxy resin in the formulation system of the silicone modified heat conductive adhesive film in this embodiment is a mixture of a malononic epoxy resin and a phenolic epoxy resin, wherein the weight ratio of the malononic epoxy resin to the phenolic epoxy resin is 1:1.
Further, in the formulation system of the organic silicon modified heat-conducting adhesive film in this embodiment, the solvent is ethanol.
Further, the curing agent in the formulation system of the organosilicon modified heat-conducting adhesive film in the embodiment is phosphoric acid.
According to the above formulation, the second object of the present invention is to provide a method for preparing an organosilicon modified heat conductive adhesive film, which is technically characterized by comprising the following steps:
uniformly mixing an organosilicon modifier, a heat conducting material, epoxy resin, a solvent and a curing agent to obtain a mixture;
step two, coating the mixture on the surface of a polyester film or a polyurethane film, and putting the polyester film or the polyurethane film into a high-temperature oven at 200 ℃ to bake for 2 hours;
and thirdly, taking out the baked film, cooling, naturally cooling to normal temperature at room temperature, and shearing into a required size to obtain the organosilicon modified heat-conducting adhesive film.
Comparative example 1
This comparative example was conducted in the same manner as in example 1 except that "100g of the silicone modifier and 200g of the heat conductive material" in example 1 were changed to "300g of the heat conductive material".
Comparative example 2
This comparative example "100g of silicone modifier," 200g of thermally conductive material, "was changed to" 50g of silicone modifier, "250 g of thermally conductive material," in example 1, the rest of the procedure being the same as in example 1
Test examples
To verify whether the above-mentioned organosilicon modified heat conductive adhesive film achieves beneficial effects, the detection indexes and results are shown in table 1 below:
TABLE 1
| Example 1 | Example 2 | Example 3 | Comparative example 1 | Comparative example 2 | |
| Thickness/mm | 0.19 | 0.21 | 0.23 | 0.30 | 0.25 |
| hardness/Shore A | 80 | 75 | 85 | 65 | 75 |
| Thermal conductivity/W/mk | 8.4 | 8.1 | 8.3 | 1.5 | 5.6 |
| Thermal resistance/. Degree.C. -in 2 /W | 0.25 | 0.24 | 0.23 | 1.6 | 0.8 |
The foregoing is merely exemplary of the present invention and is not intended to limit the present invention. Various modifications and variations of the present invention will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the invention are to be included in the scope of the claims of the present invention.
Claims (8)
1. The organic silicon modified heat conducting adhesive film is characterized by comprising, by weight, 80-120 parts of an organic silicon modifier, 180-220 parts of a heat conducting material, 20-30 parts of an epoxy resin, 20-30 parts of a solvent and 4-6 parts of a curing agent.
2. The silicone modified thermally conductive adhesive film of claim 1, wherein the thermally conductive material is any one of graphene, alumina powder and silicon carbide.
3. A silicone modified thermally conductive adhesive film according to any of claims 1 or 2, wherein the thermally conductive material has a median particle diameter of 40-60 μm.
4. The silicone modified thermally conductive adhesive film of claim 1, wherein the silicone modifier is any one of trimethylchlorosilane, hexamethyldisilazane, and hexamethyldisiloxane.
5. The silicone modified thermally conductive adhesive film of claim 1, wherein the epoxy resin is at least one of a malonyl epoxy resin and a phenolic epoxy resin.
6. The silicone modified thermally conductive adhesive film of claim 1, wherein the solvent is at least one of petroleum ether, methanol and ethanol.
7. The silicone modified thermally conductive adhesive film of claim 5 wherein the curing agent is at least one of toluene sulfonic acid, phenol sulfonic acid and phosphoric acid.
8. The preparation method of the organic silicon modified heat conduction adhesive film is characterized by comprising the following steps of:
uniformly mixing an organosilicon modifier, a heat conducting material, epoxy resin, a solvent and a curing agent to obtain a mixture;
step two, coating the mixture on the surface of a polyester film or a polyurethane film, and putting the polyester film or the polyurethane film into a high-temperature oven at 100-200 ℃ to bake for 2-4 hours;
and thirdly, taking out the baked film, cooling, naturally cooling to normal temperature at room temperature, and shearing into a required size to obtain the organosilicon modified heat-conducting adhesive film.
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| CN104004482A (en) * | 2014-06-13 | 2014-08-27 | 江苏悦达新材料科技有限公司 | Epoxy/organic silicon/graphene hybridization high heat conductivity adhesive and preparation method thereof |
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