KR101447258B1 - Thermal conductive epoxy composites and their applications for light emitting diode fixtures - Google Patents

Abstract

The present invention relates to an epoxy composite resin composition with heat conductivity and to a preparing method thereof. The epoxy composite resin composition of the present invention comprises multiple components wherein a multi-functional epoxy resin, a curing agent, graphite which is a filler, and a single or a combination of silicon carbide are included. The epoxy composite resin composition in the present invention has heat-dissipating rate which is higher than that of an existing heat-dissipating plate, so the epoxy composite resin composition in the present invention can be used in heat-dissipating structures as materials of coating the surface of the heat-dissipating plate.

Description

TECHNICAL FIELD [0001] The present invention relates to a thermally conductive epoxy composite resin composition,

The present invention relates to a thermoconductive epoxy composite resin composition and an LED lamp using the same.

Recently, due to the high performance, miniaturization and high performance of electronic devices including LED lighting, the amount of heat generated by the electronic components circuit is increased. As a result, the internal temperature of the device rises and malfunctions of the semiconductor devices, characteristics of the resistor components, Problems are occurring. Accordingly, various technologies have been developed as heat dissipation measures for solving such problems.

Conventionally developed heat dissipation measures include a method of installing a heat sink or a heat sink and a method of inserting a heat transfer material such as a thermal grease, a heat radiation pad, a heat radiation tape or the like between a heat source and a heat sink have.

However, in the conventional heat dissipating method, only the heat generated from the heat source is transferred to the heat sink, and the heat accumulated in the heat sink is not discharged into the air. Furthermore, in order to protect the heat source, the heat sink, and the heat sink of the electronic product, the liquid coating material is coated on the surface thereof. In this case, the coating film interferes with the heat emission of the object, .

On the other hand, the thermal conductivity of general epoxy resin is very low (0.15 ~ 0.3 W / mK) compared to metal and ceramic. For this reason, gas has been combined (formed into a foam) in a polymer matrix and used as a heat insulating material in various fields. However, attention has been focused on high thermal conductivity characteristics of polymer composite materials, focusing on electric insulation, moisture absorption, workability, corrosion resistance and other materials having excellent heat conduction characteristics.

The technology using epoxy resin is widely used in the field of electronic parts. The development of complex polymeric materials such as thermoconductive grease, thermally conductive adhesive, and thermally conductive sheet has been developed in order to lower the contact thermal resistance between the surface where the metal and the ceramic are in contact and the part where the electronic component is attached. The thermally conductive grease helps heat conduction of metal parts such as heat exchangers and the thermally conductive adhesive is mainly used for bonding the cooling fin to the metal as the main body. The heat conductive sheet is sandwiched between the power transistor and the substrate, . In recent years, electronic products such as notebook computers and mobile phones have become more highly integrated and have a tendency to have high output specifications. In addition, as the substrate is becoming smaller and smaller, a large amount of heat is generated during operation of the apparatus. Which is a significant influence on the performance. Therefore, the heat dissipation problem of advanced electronic devices is becoming an important issue in product development for increasing the stability and reliability of the device more and more.

Epoxy resins, which are one of the thermosetting resins used in matrix resins in various industries, are used in various ranges due to their excellent physical properties. In the conventional bisphenol type epoxy resins, diglycidyl ether of bisphenol-A , DGEBA) and diglycidyl ether of bisphenol-F (DGEBF) are commercially available and widely used in a wide range of fields.

However, these resins are limited in their use as high-performance materials due to problems inherent in high brittleness properties and weathering resistance, and it is difficult to use these resins as a structural material. Thus, development of an epoxy resin having new properties, It is an urgent necessity.

Korean Patent Publication No. 10-2013-0122478

Accordingly, the present invention has been made to solve the above-mentioned problems, and the present invention has been accomplished by developing a new epoxy composite material which can improve the low thermal conductivity of epoxy resin and is excellent in adhesion to metal or ceramic materials.

Accordingly, an object of the present invention is to provide an epoxy composite resin composition having improved thermal conductivity.

Another object of the present invention is to provide a method for producing the epoxy composite resin composition.

Another object of the present invention is to provide an LED lighting fixture comprising a heat dissipation layer formed by applying the epoxy composite resin composition.

Another object of the present invention is to provide a heat dissipation product comprising a heat dissipation layer formed by applying the epoxy composite resin composition.

Accordingly, the present invention provides an epoxy resin composition comprising: an epoxy resin; Curing agent; And a thermally conductive epoxy resin composition comprising a silicon carbide or graphite powder singly or a mixture thereof as an effective component.

In one embodiment of the present invention, the epoxy resin is selected from the group consisting of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, phenol novolac epoxy resin, cresol novolak epoxy resin, alkylphenol novolak epoxy And at least one selected from the group consisting of a resin, a bisphenol-type epoxy resin, a naphthalene-type epoxy resin, a dicyclopentadiene-type epoxy resin, a triglycidylisocyanate epoxy resin and an acyclic epoxy resin.

In one embodiment of the present invention, the curing agent is selected from the group consisting of benzyldimethylamine, triethanolamine, triethylenetetraamine, diethylenetriamine, triethylenamine, dimethylaminoethanol and tri (dimethylaminomethyl) And at least one selected from the group consisting of

In one embodiment of the present invention, the epoxy resin and the curing agent are characterized in that the epoxy resin and the curing agent are contained in a weight ratio of 8: 1.

In one embodiment of the present invention, when silicon carbide is used, the silicon carbide is included in an amount of 10 to 80% by weight based on the total weight of the epoxy resin, the curing agent and the silicon carbide.

In one embodiment of the present invention, when the graphite powder is used, the graphite powder is contained in an amount of 5 to 80% by weight based on the total weight of the epoxy resin, the curing agent and the graphite powder.

In one embodiment of the present invention, the graphite powder is characterized by being natural graphite and artificial graphite alone or a mixture thereof.

In one embodiment of the present invention, when silicon carbide and graphite powder are used together, the silicon carbide and graphite powder are mixed with a mixture of silicon carbide and graphite powder based on the total weight of epoxy resin, curing agent, silicon carbide and graphite powder Is contained in an amount of 40 to 60% by weight.

In one embodiment of the present invention, when silicon carbide and graphite powder are used together, silicon carbide is added in an amount of 30% by weight or more based on the total weight of the epoxy resin, the curing agent, the silicon carbide and the graphite powder, Is added so as to be less than 30% by weight.

Also, the present invention provides a method for producing a semiconductor device, comprising: dispersing a bisphenol-type resin, a graphite powder, and a silicon carbide; And a step of adding a curing agent and a solvent to the dispersed solution, agitating the mixture, and curing the mixture.

In one embodiment of the present invention, the bisphenol-type resin is bisphenol A epichlorohydrin, the curing agent is triethylenetetraamine, and the solvent is methyl ethyl ketone (MEK) and toluene (Toluene) do.

The present invention also provides an LED lighting fixture comprising a heat dissipation layer formed by applying a thermally conductive epoxy resin composition according to the present invention on a substrate surface.

In one embodiment of the present invention, the substrate is selected from the group consisting of copper, nickel, tin, aluminum, silver, chromium, CuW composite, alumina, AlN, ZnO and SiC.

The present invention also provides a heat radiation product comprising a heat radiation layer formed by applying a thermally conductive epoxy resin composition according to the present invention on a substrate surface.

In one embodiment of the present invention, the heat radiating article is selected from the group consisting of a heat radiating plate, a heat radiating pad, and a heat radiating tape.

The present invention can produce an epoxy composite material having improved thermal conductivity by adding graphite and SiC powder, which are additives having excellent thermal conductivity, to the epoxy resin having low insulating properties.

In addition, since the epoxy resin composite material is used as a surface coating material of a heat sink, it has a higher emissivity than conventional heat sinks and can be usefully used in heat-resisting products.

(B) SiC 5 wt%, (c) SiC 10 wt% (d) SiC 20 wt% (e) SiC 30 wt% (f) SiC 40 wt. % (g) SiC 50 wt%
(B) SiC 5wt%, (c) SiC 10wt% (d) SiC 20wt% (e) SiC 30wt% (f) SiC 40wt % (g) SiC 50 wt%.
(D) Gr 20wt%, (e) Gr 30wt%, (f) 3wt%, (b) Gr 5wt%, (c) Gr 10wt% (G) Gr 50wt%, (h) Gr 70wt%, (i) Gr 80wt%.
Figure 4 is a photograph of an aluminum heat sink coated with EpGr.
5 is a schematic diagram for measuring the heat radiation temperature of an aluminum heat sink (schematic model) (a. An uncoated aluminum heat sink, b. An EpGr-coated aluminum heat sink)
FIG. 6 schematically shows the structure of an LED lighting fixture to which an epoxy heat-dissipating composite material is applied.
7 is a cross-sectional view of an LED lighting fixture to which an epoxy heat-dissipating composite material is applied.
8 shows the types of actual LED luminaires.

The present invention relates to a technique for producing an epoxy composite material having improved thermal conductivity by adding graphite and SiC powder to an epoxy resin, and a method for applying the epoxy composite material as a heat dissipation material.

The present invention relates to an epoxy resin composition comprising an epoxy resin; Curing agent; And silicon carbide or graphite powder alone or a mixture thereof as an active ingredient.

In one embodiment of the present invention, the epoxy resin is an epoxy resin having an average of more than two epoxy groups per molecule of one of the resins having two or more epoxy groups in one molecule. Epoxy resins are thermosetting resins that are excellent in electrical insulation, heat resistance and chemical stability.

Preferably, the epoxy resin is selected from the group consisting of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, phenol novolac epoxy resin, cresol novolak epoxy resin, alkylphenol novolac epoxy resin, bisphenol epoxy At least one epoxy compound selected from resins, naphthalene type epoxy resins, dicyclopentadiene type epoxy resins, triglycidyl isocyanates and acyclic epoxy resins can be used, and a bisphenol-A type resin can be most preferably used .

The above epoxy resins such as bisphenol A type epoxy resin and bisphenol F type epoxy resin may be used in combination with one another such as methyl ethyl ketone (MEK), dimethyl formamide (DMF), methyl cellosolve (MCS), carbitol acetate, carbitol, PGMEA, PGME , Toluene, xylene, NMP, 2-methoxyethanol, etc. may be mixed and dissolved as a solvent.

In the present invention, usable epoxy resin curing agents are not particularly limited, and any curing agents conventionally used in epoxy compositions are not relevant. Preferably, the epoxy resin curing agent which can be used in the production of the epoxy resin composition of the present invention may be an amine type, imidazole type, acid anhydride type or a mixture thereof.

The amine-based curing agents usable in the present invention include linear amines, aliphatic amines, modified aliphatic amines, aromatic amines, secondary amines, and tertiary amines, and examples thereof include benzyldimethylamine, triethanolamine, triethylene Tetramine, diethylenetriamine, triethylenamine, dimethylaminoethanol, and tri (dimethylaminomethyl) phenol.

Examples of the imidazole-based curing agent include imidazole, isomimidazole, 2-methyl imidazole, 2-ethyl-4-methyl imidizole, 2,4-dimethyl imidizole, butyl imidizole, 2-methyldimidazole, 2-undecylidimidizole, 1-vinyl-2-methylimidizole, 2-n-heptadecylimidizole, 2- 2-methylimidizole, 1-propyl-2-methylimidizole, 1-cyanoethyl-2-methyl 1-cyanoethyl-2-ethyl-4-methylimidizole, 1-cyanoethyl-2-undecylimidizole, 1-cyanoethyl- 2-methylimidizole, an adduct of imidazole and methylimidizole, an adduct of imidazole and trimellitic acid, 2-n-heptadecyl-4-methylimidizole, phenylimidazole , Benzylimidizole, 2-methyl-4,5-diphenylimidizole, 2,3,5-triphenylimidizole, 2-styrylimidizole, 1- (dodecylbenzyl) -2- Methyl (2-hydroxy-4-t-butylphenyl) -4,5-diphenylimidazole, 2- (2-methoxyphenyl) (3-hydroxyphenyl) -4,5-diphenylimidazole, 2- (p-dimethyl-aminophenyl) -4,5-diphenylimidazole, 2- Diphenylimidazole, di (4,5-diphenyl-2-imidazole) -benzene-1,4,2-naphthyl-4,5-diphenylimidazole, 1-benzyl- -Methylimidizole and 2-p-methoxystyrylimidazole, and the like.

Examples of the acid anhydride-based curing agent include phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methyl nadic anhydride, nadic anhydride, And an anhydride-based curing agent. The acid anhydride-based curing agent is preferably used by mixing the curing agents as a catalyst, rather than being used alone.

In an embodiment of the present invention, the epoxy resin and the curing agent are added in an amount of 8: 1 by weight of the epoxy resin and the curing agent. When the content of the filler is 80% by weight or more, the mechanical properties of the composite composition are significantly deteriorated, It becomes.

In one embodiment of the present invention, the filler is used singly or in combination of silicon carbide (SiC) and graphite. When SiC is used alone, when the SiC filler is used in an amount exceeding 60 wt% The synergistic effect on the thermal conductivity characteristics of the resin composition is not so large and preferably 10 to 50 wt% based on the total weight of the epoxy resin, the curing agent and the silicon carbide is preferable.

In one embodiment of the present invention, when the filler is used alone as the graphite powder, 5 to 80% by weight may be used based on the total weight of the epoxy resin, the curing agent and the graphite powder, and the content of the graphite powder When the amount is more than 80% by weight, the mechanical properties of the composite composition are remarkably deteriorated and the structural stability is weakened.

In one embodiment of the present invention, the graphite powder may be natural graphite or artificial graphite alone or a mixture thereof.

In one embodiment of the present invention, when silicon carbide and graphite powder are used together as the filler, a mixture of the silicon carbide and the graphite powder, based on the total weight of the epoxy resin, the curing agent, the silicon carbide and the graphite powder, Preferably 40 to 60% by weight, more preferably 30% by weight or more, and graphite powder is preferably used in an amount of less than 30% by weight.

The method for producing an epoxy composite resin according to the present invention comprises: dispersing graphite powder and silicon carbide alone or in admixture in a bisphenol-type resin; And a step of adding a curing agent and a solvent to the dispersed solution, agitating the mixture, and curing the mixture.

In one embodiment of the present invention, the bisphenol-type resin is bisphenol A epichlorohydrin, the curing agent is triethylenetetramine, and the solvent uses methyl ethyl ketone (MEK) and toluene (Toluene).

Also, in an embodiment of the present invention, the solvent may be added with MEK / toluene at a v / v of 1/1 to 3/1.

Further, the epoxy composite resin composition of the present invention can be used for a heat radiation product including a heat radiation layer formed by applying the epoxy composite resin composition of the present invention on a surface of a base material. The heat radiation product can be used as a heat radiation plate, a heat radiation pad, and a heat radiation tape. Do not.

In one embodiment of the present invention, the substrate may be at least one selected from the group consisting of copper, nickel, tin, aluminum, silver, chromium, CuW composite, alumina, AlN, ZnO, SiC, Do not.

In an embodiment of the present invention, the epoxy composite resin composition of the present invention may be applied to an LED lamp including a substrate and a heat-radiating layer formed by coating the surface of the substrate (see FIG. 8).

Further, the heat radiation layer formed by applying the epoxy composite resin composition of the present invention to a surface of the base material and the substrate can be laminated between the Al metal plate of the LED lamp and the printed circuit board, and the heat generated can be easily released to the surface And Fig. 7).

In one embodiment of the present invention, the heat transferred to the surface of the heat sink can be easily released into the atmosphere due to the high emissivity effect of the epoxy composite resin composition when coating the surface of the heat sink.

EXAMPLES Hereinafter, the present invention will be described in more detail with reference to Examples. However, the following Examples are only the preferred embodiments of the present invention, and the present invention is not limited by the following Examples.

< Example  1>

Epoxy resin composite material composition manufacturing

<1-1> Silicon carbide ( SiC )of Acid treatment

The present inventors first performed SiC acid treatment on the basis of the method of Hummers for the production of an epoxy composite material excellent in thermal conductivity and adhesion. That is, ₄ g of SiC and 15 g of sodium nitrate (NaNO ₃ ) (99% Junsei Chemical Co.) in 200 mL of sulfuric acid (H ₂ SO ₄ ) (95%, Junsei Chemical Co.) Lt; / RTI &gt; and stirred. During the stirring, 24 g of potassium permanganate (KMnO ₄ ) (99%, Junsei Chemical Co.) was added for 90 minutes to react. After the ice bath was removed, the temperature of the reaction mixture was adjusted to 35 ± 3 ° C and maintained for 2 hours. Then, 160 mL of distilled water was slowly added over 45 minutes to dilute the reaction mixture. After dilution by further addition of 400mL water for reaction, the residual permanganate (MnO ₄ ^-), manganese dioxide (MnO ₂₎ the 30% aqueous hydrogen peroxide (H ₂ O ₂₎ to reduce use (30%, Junsei Chemical Co.) 20mL , And the oxidized SiC in the suspension was washed by centrifugation several times (3500 rpm, 15 min) until the pH of the waste water reached 6 to 7, and then dried by collection in a vacuum oven at 100 캜.

&Lt; 1-2 > Bisphenol A Epichlorohydrin ( Bisphenol  A epichlrohydrin ) And oxidized SiC Preparation of epoxy composite resin composition containing

3 to 50 wt% of the oxidized SiC powder prepared in <1-1> was added to 8 g of bisphenol A epichlohydrin (MW ≥ 700 Struers Epofix), and the mixture was ultrasonicated for 24 h to disperse evenly And then stirred in a 50 ° C oil bath for 24 hours using a mechanical straw.

1 g of triethyltetramine (hardener Struers Epofix) was added to the stirred reaction product and slowly stirred so as not to cause air bubbles. Then, the mixture was cured in an oven at 70 캜 for 2 hours to prepare an epoxy composite resin composition in which bisphenol A epichlohydrin and oxidized SiC were mixed. In order to facilitate the dispersion of the SiC filler added to the epoxy resin, the epoxy composite resin composition may be prepared by adding a small amount of a solvent (MEK (methyl ethyl ketone) / Toluene = 1/1 to 3/1 v / v) . The respective contents of SiC used for preparing the epoxy composite resin composition in which bisphenol A epichlohydrin and oxidized SiC are mixed as described above are shown in Table 1 below.

Mixture Composition of SiC Powder for Each Component and Content [(Epoxy + Curing Agent) = (8 + 1) g] for Preparation of Epoxy Composite Composition Mixed with Bisphenol A Epichlorohydrin and Oxidized SiC [ division SiC (g) Thermal Conductivity @ 25 ^o C (W / mK) Production Example 1 EpSiC-3 0.3 0.233 Production Example 2 EpSiC-5 0.5 0.253 Production Example 3 EpSiC-10 1.0 0.277 Production Example 4 EpSiC-20 2.3 0.335 Production Example 5 EpSiC-30 3.9 0.434 Production Example 6 EpSiC-40 6.0 0.516 Production Example 7 EpSiC-50 9.0 0.691

The surface of the epoxy composite resin composition thus prepared was observed through FE-SEM photographing, and the results are shown in FIG. 1 and FIG.

As a result of the analysis, when the composition of the SiC filler is used in an amount exceeding 60% by weight, the synergistic effect on the thermal conductivity of the composite resin composition is not significantly increased, and the mechanical properties and adhesion are relatively decreased, It was found to be vulnerable.

&Lt; 1-3 > Preparation of epoxy composite resin composition containing bisphenol A epichlrohydrin and graphite

The epoxy composite resin composition containing bisphenol A epichlrohydrin and graphite was prepared in the same manner as in Example <1-2> except that graphite powder was used in place of SiC. The graphite powder content was used as shown in Table 2 below.

The epoxy composite resin composition was prepared by adding a small amount of a solvent (MEK (methyl ethyl ketone) / Toluene = 1/1 to 3/1 v / v) to help disperse the graphite filler added to the epoxy resin.

Mixture Composition of Graphite Powder for Each Component and Content [(Epoxy + Curing Agent) = (8 + 1) g] for Preparation of Epoxy Composite Composition Mixed with Bisphenol A Epichlorohydrin and Graphite Powder [ division Graphite (g) Thermal Conductivity @ 25 ^o C (W / mK) density
(g / mL) Production Example 8 EpGr-3 0.3 0.263 1.143 Production Example 9 EpGr-5 0.5 0.322 1.195 Production Example 10 EpGr-10 1.0 0.443 1.201 Production Example 11 EpGr-20 2.3 0.574 1.263 Production Example 12 EpGr-30 3.9 0.780 1.332 Production Example 13 EpGr-40 6.0 1.015 1.425 Production Example 14 EpGr-50 9.0 2.188 1.538 Production Example 15 EpGr-60 13.5 2.762 1.629 Production Example 16 EpGr-70 21.0 3.337 1.698 Production Example 17 EpGr-80 36.0 3.995 1.740

The surface of the epoxy composite resin composition thus prepared was observed through FE-SEM photographing, and the results are shown in Fig.

As a result of the analysis, when the graphite powder was added in an amount exceeding the content corresponding to EpGr-70 as shown in Table 2, the mechanical properties and the adhesive strength of the composite resin composition were lowered, and thus the structural stability after curing Were also vulnerable. In addition, when the content of the graphite powder is 5 wt% or less, it is found that the thermal conductivity is low and the practical application possibility is low.

Also, when the graphite powder content is 10-30% by weight, it can be applied to applications such as a thermoconductive interfacial adhesive / pressure-sensitive adhesive. When the graphite powder content is 40-80% by weight, / Adhesive agent, which can be formed as a structural product having various heat conduction characteristics.

On the other hand, when the content of the graphite powder is more than 80% by weight, the mechanical properties of the composite composition are remarkably lowered and the structural stability is weakened.

&Lt; 1-4 > Preparation of an epoxy composite resin composition containing bisphenol A epichlrohydrin, silicon carbide and graphite

The procedure of Example 1-2 was followed except that the amounts of silicon carbide and graphite used were as described in Table 3 below.

In order to facilitate the dispersion of the graphite and the SiC filler to be added to the epoxy resin, a small amount of a solvent (MEK (methyl ethyl ketone) / Toluene = 1/1 to 3/1 v / v) .

Mixture Composition of Graphite and SiC Powder for Each Component and Content [(Epoxy + Curing Agent) = (8 + 1) g) for Preparation of Epoxy Composite Composition Mixed with Bisphenol A Epichlorohydrin, Silicon Carbide and Graphite Powder] division Graphite (g) SiC (g) Thermal Conductivity @ 25 ^o C (W / mK) Production Example 18 EpSiGr-10/30 1.5 4.5 0.776 Production Example 19 EpSiGr-10/40 1.8 7.2 1.051 Production example 20 EpSiGr-10/50 2.7 10.8 2.505 Production Example 21 EpSiGr-35/15 6.3 2.7 0.708

As can be seen from the results of the examples and the production examples, the thermal conductivity of the epoxy composite resin composition using the silicon carbide (SiC) filler alone did not exceed 0.7 W / mK even though it contained 9 g of SiC. However, when graphite and SiC were mixed with each other, it was found that thermal conductivity of 0.776 W / mK was obtained even when only 6 g of the two components were used (EpSiGr-10/30).

Also, as in the case of EpSiGr-10/40, the thermal conductivity of 1 W / mK or more was obtained by controlling the composition of the filler. When the filler content (that is, the content of SiC and graphite powder) was less than 40 wt% And the practical application possibility is low due to low properties. When the content of the filler exceeds 80% by weight, the mechanical properties of the composite composition are remarkably deteriorated and the structural stability is weakened.

Therefore, when the content of the filler used is 40 to 60% by weight based on the total weight of the epoxy, the curing agent and the filler, it is possible to apply a product having various thermal conductivity characteristics with excellent thermal conductivity and good interfacial adhesion.

Further, as shown in Table 3, it was found that when SiC and graphite powder were mixed, it was preferable to use SiC in an amount exceeding 30% by weight, and graphite powder in an amount of less than 30% by weight .

<Experimental Example 1>

Measurement of surface radiation temperature of aluminum heat sink

<1-1> Aluminum heat sink  Surface Coating

Al plate (40mm × 40mm, t = 10mm) was used as the heat sink material, Al6061. To coat the surface of Al 6061, a mixed solvent of MEK (methyl ethyl ketone) / Toluene was added to the epoxy composite resin composition of Production Example 17 of the above Example at a ratio of 1/1 to 3/1, v / v, A coating film was formed on the thin film by coating, and cured and dried at 50 ° C for 2 hours to surface-coat the aluminum heat sink (see FIG. 4).

<1-2> Evaluation of heat radiation temperature of aluminum heat sink

In order to measure the heat radiation temperature of the aluminum heat sink (Al3) coated with the surface of Experimental Example 1-1, an aluminum heat sink (Al1, Al2) not having a surface as shown in FIG. 5 was placed on a hot plate, After placing the coated aluminum heat sink (Al3), place the Teflon cylinder in place to prevent the sensitive temperature from reacting by convection and diffusion of heat on it, and place the thermocouple tip at a distance of 10mm from the surface, (T3) was measured (3 times).

In addition, in order to ensure the measurement of the same condition, the T1 temperature of the Al1 surface was set to 100 deg. C and a comparative example without the surface coating of Al3 was made as shown in Fig.

Measurement result: Coating thickness 47 탆 coating Uncoated ΔT (T3, C-T3, NC), ° C T3 (占 폚) 47.5 ± 0.3 46.8 ± 0.4 0.8 ± 0.2

Measurement result: Coating thickness 200 탆 coating Uncoated ΔT (T3, C-T3, NC), ° C T3 (占 폚) 48.0 ± 0.2 46.3 ± 0.3 1.78 + - 0.4

As a result of the analysis, it was confirmed that when the surface of the aluminum heat sink was coated with the epoxy composition according to the present invention, the T3 temperature was higher than that of the non-coated heat sink. Also, it was confirmed that when the thickness of the surface coating increases, the degree of temperature rise is further increased.

Thus, it can be seen that when the epoxy composite resin composition prepared in the present invention is used, the heat transferred to the surface of the aluminum heat sink can be easily released into the atmosphere.

The present invention has been described with reference to the preferred embodiments. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the disclosed embodiments should be considered in an illustrative rather than a restrictive sense. The scope of the present invention is indicated by the appended claims rather than by the foregoing description, and all differences within the scope of equivalents thereof should be construed as being included in the present invention.

Claims (15)

Bisphenol A epichlrohydrin, triethyltetramine and graphite powder as active ingredients;
Bisphenol A epichlorohydrin to triethylenetetramine in a weight ratio of 8: 1;
Wherein the graphite powder is contained in an amount of 50 to 70% by weight based on the total weight of the epoxy resin, the curing agent and the graphite powder. Bisphenol A epichlorohydrin, triethylenetetramine, graphite powder and silicon oxide carbide in a ratio of 8: 1: 2.7: 10.8. delete delete delete delete delete delete delete Stirring and keeping 200 ml of sulfuric acid (H ₂ SO ₄ ), ₄ g of 15 탆 silicon carbide, 4 g of sodium nitrate (NaNO ₃ ) and 24 g of potassium manganate (KMnO ₄ ) in an ice bath at 0 캜;
Removing the ice bath and maintaining the temperature of the reaction at 35 ° C;
30% hydrogen peroxide (H ₂ O ₂₎ using the residual permanganate 20mL (MnO ₄ ^-), the step of producing the oxide of silicon carbide reduces the manganese dioxide (MnO _2);
Centrifuging the silicon oxide carbide for 15 minutes at 3500 rpm until the waste water has a pH of 6 to 7 and drying in a vacuum oven at 100 캜 to produce silicon oxide carbide powder;
10.8 g of silicon oxide carbide powder, 8 g of bisphenol A epichlorohydrin, and 2.7 g of a solvent and graphite powder were added and mixed and sonicated for 24 hours to disperse evenly to prepare a reaction product; And
And 1 g of triethylenetetramine is added to the dispersed reactant to prepare an epoxy composite resin composition in which oxidized silicon carbide and graphite powder are mixed, thereby producing a thermally conductive epoxy resin composition. 11. The method of claim 10,
Wherein the solvent is a mixture of methyl ethyl ketone (MEK) and toluene (Toluene) in a volume ratio of 1: 3: 1. An LED lighting fixture comprising a heat-radiating layer formed by applying a thermally conductive epoxy resin composition according to any one of claims 1 to 3 on a substrate surface. 13. The method of claim 12,
Wherein the substrate is at least one selected from the group consisting of copper, nickel, tin, aluminum, silver, chromium, CuW composite, alumina, AlN, ZnO and SiC. A heat radiation article comprising a heat radiation layer formed by applying the thermally conductive epoxy resin composition according to any one of claims 1 to 3 on a surface of a substrate. 15. The method of claim 14,
Wherein the heat dissipation product is at least one selected from the group consisting of a heat dissipation plate, a heat dissipation pad, and a heat dissipation tape.

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